CN104404475A - Method for enhancing adhesive property between poly-p-xylylene thin film and metal layer - Google Patents
Method for enhancing adhesive property between poly-p-xylylene thin film and metal layer Download PDFInfo
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- CN104404475A CN104404475A CN201410541559.5A CN201410541559A CN104404475A CN 104404475 A CN104404475 A CN 104404475A CN 201410541559 A CN201410541559 A CN 201410541559A CN 104404475 A CN104404475 A CN 104404475A
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- parylene film
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Abstract
A method for enhancing adhesive property between a poly-p-xylylene thin film and a metal layer comprises following steps: (1) preparing a to-be-deposit substrate; (2) growing the poly-p-xylylene thin film on the substrate; (3) enabling a fluff-like nano structure to be formed on a surface of the poly-p-xylylene thin film in an oxygen-reactive ion etching manner; (4) depositing metal on the poly-p-xylylene thin film having the fluff-like nano structure formed thereon to complete the preparation. Through the oxygen-reactive ion etching technology, surface modification is carried out to form the fluff-like nano structure on the surface of the poly-p-xylylene thin film so that a surface energy of the poly-p-xylylene thin film is improved, thereby enhancing an adhesive strength between the poly-p-xylylene thin film and the metal layer.
Description
Technical field
The present invention relates to technical field of micro and nano fabrication, particularly one strengthens parylene film and the adhering method of metal level.
Background technology
In recent years, printed electronic research becomes one of current study hotspot.Printed electronic (English: printed electronics) utilizes the many methods manufacturing electron device on flexible substrates of printing.Polyphenylene ethyl (i.e. Dichloro-[2.2]-paracyc lophane, be abbreviated as Parylene) as a kind of conventional flexible base material, have the advantages such as transparent, good insulating, in polyphenylene ethyl substrate, evapontte ie meti yer is prepared flexible device and to be absolutely necessary link.Adhesivity between parylene film and metal level directly affects practicality and the reliability of device.
Parylene film material surface energy is low, unreactiveness and adhesiveproperties poor, be in general difficult to formed bonding reliably with metal level.Along with polyphenylene ethyl in the expansion of the field application such as printed electronic, micro-fluidic, biomedical micro-system and deeply, particularly as flexible electrode substrate, researchist urgently wishes to realize adhesive capacity superpower between parylene film and metal level.
At present, industry adopts chemical conversion treatment (surface chemical modification) method to strengthen the adhesivity between parylene film and metal level to adhesivity between parylene film and metal level usually.Its general step is (Fig. 1):
Step 1: by polyphenylene ethyl performed polymer, uses vacuum vapor deposition technique, forms the polymer thin film coating 101 applying shape completely at substrate surface;
Step 2: silanization or plasma clarify process 102 are carried out to the surface of parylene film;
Step 3: at the surface deposition metal level 103 through silanization or the peace and quiet parylene film of plasma.
This kind of technique to make and mainly realizes both combinations by increasing one deck silane coupling agent, i.e. above-mentioned bonding coat between polyphenylene ethyl and metal.This transition layer, compared with polyphenylene ethyl, is easily subject to the erosion generation sex change of air or solution, then occurs peeling off between parylene film and metal level coming off, and directly affects yield rate and the reliability of manufacture craft.For this reason, the present invention proposes a kind of processing method of improvement, does not use silane coupling agent, but by strengthening the adhesivity between parylene film and metal level to polyphenylene ethyl surface treatment.
Summary of the invention
For above-mentioned the deficiencies in the prior art, the object of the invention is to propose a kind of enhancing parylene film and the adhering method of metal level, surface modification is carried out by oxygen reactive ion etching process, villous nanostructure is formed on the surface of parylene film, improve the surface energy of parylene film, thus strengthen the cohesive strength between parylene film and metal level.
The invention provides a kind of enhancing parylene film and the adhering method of metal level, comprise the steps:
Step 1: get a substrate to be deposited;
Step 2: at Grown parylene film;
Step 3: adopt oxygen reactive ion etching process, the surface of parylene film is prepared into fine hair shape nanostructure;
Step 4: metal refining on the parylene film being prepared into fine hair shape nanostructure, completes preparation.
The invention has the beneficial effects as follows: use oxygen reactive ion etching process to carry out surface modification, adhesivity between parylene film and metal level is greatly improved, not easily peel off between parylene film and metal level in follow-up process engineering and come off, thus improve yield rate and the reliability of manufacture craft.
Accompanying drawing explanation
In order to be illustrated more clearly in technology contents of the present invention, be described in detail as follows below in conjunction with embodiment and accompanying drawing, wherein:
Fig. 1 is the processing method of tradition depositing metal layers on parylene film;
Fig. 2 is for strengthening adhering technical process between parylene film and metal level.
Embodiment
Refer to shown in Fig. 2, the invention provides a kind of enhancing parylene film and the adhering method of metal level, comprise the steps:
Step 1: get a substrate to be deposited;
Step 2: at Grown parylene film;
Step 3: adopt oxygen reactive ion etching process, the surface of parylene film is prepared into fine hair shape nanostructure;
Step 4: metal refining on the parylene film being prepared into fine hair shape nanostructure, completes preparation.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described.The vacuum phase deposition equipment that embodiment adopts is the PDS2010 type depositing device of SCS company of the U.S.; Parylene polymer performed polymer used is purchased from SCS company; The reaction and plasma etching apparatus used is the RIE-1D type that Beijing wound micro-nano company produces.
Adhering processing method step between enhancing parylene film provided by the invention and metal level is set forth below in conjunction with accompanying drawing 2.
Step 1 (Fig. 2 a): prepare the silicon chip 21 that a thickness is 250 microns;
Step 2 (Fig. 2 b): growth thickness is the parylene film 22 of 3 microns on silicon chip 21;
Step 3 (Fig. 2 c): the processing parameter controlling oxygen reactive ion etching equipment, utilizes oxygen, carry out physics and chemistry process to the surface of parylene film, forms villous nanostructure 23 on parylene film surface;
Further, the processing parameter of the reactive ion etching equipment of oxygen described in step 3 comprises, and pressure is 1 × 10
-6pa-1 × 10
-5pa, gas flow is 20sccm, and radio frequency power is 100-300W.The object of the control of processing parameter forms the villous nanostructure 23 of one deck.
Further, use oxygen described in step 3, the time passed into is 28 minutes.Use oxygen, physical and chemical reaction can be carried out to polyphenylene ethyl solid surface simultaneously.Wherein, energetic plasma carries out physical treatment to polyphenylene ethyl surface; And this plasma body can carry out complicated chemical reaction equally, at polyphenylene ethyl Surface Creation polymeric film, thus realize chemical treatment.Meanwhile, use the time of oxygen plasma etching unsuitable long, also unsuitable too short.Time is too short, and etching effect does not reach villous nanostructure; Overlong time, parylene film may be etched completely.
Further, parylene film surface described in step 3 forms villous nanostructure 23, by the control of processing parameter, deep reaction ion etching 1 microns is carried out to the surface of parylene film 22, form villous nanostructure 23, can obtain having the polyphenylene ethyl film structure strengthening metallic adhesion, wherein the monomer height of fine hair shape nanostructure 23 is 50nm ~ 200nm.This fine hair nanostructure 23, in follow-up deposition process, can adsorb the metal level of deposition firmly.
Step 4 (Fig. 2 d): forming the surface evaporation of parylene film 22 or the method depositing metal layers 24 of sputtering of fine hair shape nanostructure 23, prepared polyphenylene ethyl sample has extremely strong adhesivity, and after long-term placement, adhesion characteristics is still stablized.
Reference Fig. 2, Fig. 2 are adhering process flow sheet between enhancing parylene film of the present invention and metal level.
Between a kind of enhancing parylene film based on nanostructure provided the embodiment of the present invention above and metal level, adhering processing method is described in detail, apply specific case herein to set forth principle of the present invention and embodiment, the explanation of above embodiment just understands method of the present invention and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (4)
1. strengthen parylene film and the adhering method of metal level, comprise the steps:
Step 1: get a substrate to be deposited;
Step 2: at Grown parylene film;
Step 3: adopt oxygen reactive ion etching process, the surface of parylene film is prepared into fine hair shape nanostructure;
Step 4: metal refining on the parylene film being prepared into fine hair shape nanostructure, completes preparation.
2. enhancing parylene film according to claim 1 and the adhering method of metal level, the wherein oxygen reactive ion etching process of step 3, the surface of parylene film is prepared into fine hair shape nanostructure, do not need to add other jointing material, utilize this fluff structures, in follow-up deposition process, adsorb the metal level of deposition firmly.
3. enhancing parylene film according to claim 1 and the adhering method of metal level, wherein metal is the technique preparation adopting evaporation or sputtering.
4. enhancing parylene film according to claim 3 and the adhering method of metal level, the parylene film as substrate in the technique preparation process of wherein said evaporation or sputtering does not heat.
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104694879A (en) * | 2015-04-08 | 2015-06-10 | 吴子豹 | Vacuum electroplating technology free of paint spraying |
CN111874861A (en) * | 2020-05-20 | 2020-11-03 | 北京协同创新研究院 | Method for enhancing adhesion of parylene film and silicon |
CN112327116A (en) * | 2020-11-05 | 2021-02-05 | 北京理工大学 | Discharge detection system and method based on parylene film and charged particles |
CN114133611A (en) * | 2021-11-02 | 2022-03-04 | 北京大学 | Method for preparing nano cilium structure on surface of polymer material |
WO2023070864A1 (en) * | 2021-11-01 | 2023-05-04 | 中国科学院深圳先进技术研究院 | Flexible stretchable gold film electrode based on reactive ion etching and preparation method therefor |
CN117187773A (en) * | 2023-11-03 | 2023-12-08 | 上海锐畅医疗科技有限公司 | Hydrophilic coating for interventional medical instrument and preparation method thereof |
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WO2013152068A1 (en) * | 2012-04-03 | 2013-10-10 | Gvd Corporation | Adhesion promotion of vapor deposited films |
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WO2013152068A1 (en) * | 2012-04-03 | 2013-10-10 | Gvd Corporation | Adhesion promotion of vapor deposited films |
Non-Patent Citations (2)
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E DAYSS ETAL.: "Surface modification for improved adhesion of a polymer-metal compound", 《SURFACE AND COATINGS TECHNOLOGY》 * |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104694879A (en) * | 2015-04-08 | 2015-06-10 | 吴子豹 | Vacuum electroplating technology free of paint spraying |
CN111874861A (en) * | 2020-05-20 | 2020-11-03 | 北京协同创新研究院 | Method for enhancing adhesion of parylene film and silicon |
CN112327116A (en) * | 2020-11-05 | 2021-02-05 | 北京理工大学 | Discharge detection system and method based on parylene film and charged particles |
WO2023070864A1 (en) * | 2021-11-01 | 2023-05-04 | 中国科学院深圳先进技术研究院 | Flexible stretchable gold film electrode based on reactive ion etching and preparation method therefor |
CN114133611A (en) * | 2021-11-02 | 2022-03-04 | 北京大学 | Method for preparing nano cilium structure on surface of polymer material |
CN114133611B (en) * | 2021-11-02 | 2023-02-07 | 北京大学 | Method for preparing nano cilium structure on surface of polymer material |
CN117187773A (en) * | 2023-11-03 | 2023-12-08 | 上海锐畅医疗科技有限公司 | Hydrophilic coating for interventional medical instrument and preparation method thereof |
CN117187773B (en) * | 2023-11-03 | 2024-03-08 | 上海锐畅医疗科技有限公司 | Hydrophilic coating for interventional medical instrument and preparation method thereof |
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