CN104356886A - Ultraviolet-curable high-temperature-resistant insulating coating for printed circuit board - Google Patents
Ultraviolet-curable high-temperature-resistant insulating coating for printed circuit board Download PDFInfo
- Publication number
- CN104356886A CN104356886A CN201410584887.3A CN201410584887A CN104356886A CN 104356886 A CN104356886 A CN 104356886A CN 201410584887 A CN201410584887 A CN 201410584887A CN 104356886 A CN104356886 A CN 104356886A
- Authority
- CN
- China
- Prior art keywords
- temperature
- circuit board
- resistant insulating
- printed circuit
- ultraviolet light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
Abstract
The invention relates to the field of coatings, in particular to an ultraviolet-curable high-temperature-resistant insulating coating for a printed circuit board. The ultraviolet-curable coating is characterized in that the coating is prepared from the following raw materials in percentage by mass: 50 to 70 percent of mixture of bisphenol A epoxy diacrylic ester, polyester methacrylate and organosilicone acrylate, 3 to 5 percent of graphitized carbon nanofibers, 5 to 12 percent of an initiator, 1 to 3 percent of a surface auxiliary, 5 to 10 percent of a co-solvent and 10 to 20 percent of a reactive diluent. The ultraviolet-curable high-temperature-resistant insulating coating is resistant to high temperature, good insulation effects can be achieved at high temperature, and a sensitive part on a plastic circuit board is protected from being damaged. In addition, influence on the other physical properties of the ultraviolet-curable high-temperature-resistant insulating coating is avoided, and the ultraviolet-curable high-temperature-resistant insulating coating even has higher salt fog resistance, aging resistance, weather resistance, adhesive power and cold shock resistance.
Description
Technical field
The present invention relates to paint field, particularly relate to a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint.
Background technology
Ultraviolet-curing paint is since appearance, because it has the feature of 5E, i.e. efficient (Efficient), applicable wide (Enabling), economic (Economical), energy-conservation (Energy Saying), environmental friendliness (Environmental-friendly).In the prior art, ultraviolet-curing paint is widely used in and closely bound up field of living by people, to play the effect beautifying object and protection object.
Along with the fast development of information industry, photocuring is extensively because being used in the protection of printed circuit board (PCB), and after paint spay-coating to the surface of circuit card, elder generation reaches surface drying fast under uviolizing, can play good protection circuit plate effect after solidification.But at present in some board application fields, need circuit card at high temperature to carry out operation, circuit card top layer at high temperature will reach good insulation effect simultaneously.
Summary of the invention
The object of the invention is to address the deficiencies of the prior art, a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint is provided, while the present invention possesses high-temperature insulation, also there is higher salt fog resistance, ageing resistance, weathering resistance, sticking power, anti-cold shock ability.
For realizing the object of the invention, the technical solution used in the present invention is as follows:
A kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint, is characterized in that: be prepared from by the raw material of following mass percent:
Bisphenol A epoxy diacrylate, polyester methylpropionate and organic silicon acrylic ester mixture: 50% ~ 70%;
Graphitization nano carbon fiber: 3-5%;
Initiator: 5% ~ 12%;
Surface modifier: 1% ~ 3%;
Solubility promoter: 5% ~ 10%;
Reactive thinner: 10% ~ 20%.
Further, described a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint is prepared from by the raw material of following mass percent:
Bisphenol A epoxy diacrylate, polyester methylpropionate and organic silicon acrylic ester mixture: 60%;
Graphitization nano carbon fiber: 5%;
Initiator: 8%;
Surface modifier: 1.5%;
Solubility promoter: 7.5%;
Reactive thinner: 18%.
Further, described bisphenol A epoxy diacrylate, polyester methylpropionate and organic silicon acrylic ester mixture, in mass fraction, for bisphenol A epoxy diacrylate 2 ~ 4 parts, polyester methylpropionate 1 ~ 3 part, organic silicon acrylic ester 1 part, preferred mass is than being 2:1.5:1.
Further, the preparation method of described a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint, comprises the following steps:
(1) bisphenol A epoxy diacrylate, polyester methylpropionate are mixed with initiator with organic silicon acrylic ester mixture, spray into vaporific end hydrogen silicone oil while stirring, mix placement 3 ~ 4 hours;
(2) by the mixing of materials that graphitization nano carbon fiber, surface modifier, solubility promoter, reactive thinner and (1) step obtain, be warming up to 60 ~ 80 DEG C, stir 25 ~ 30 minutes under 1000 ~ 1200 revs/min, to obtain final product.
Further, described reactive thinner is iso-bornyl acrylate and diacrylate ester mixture, and mass ratio is 1.5 ~ 2.5:1.
Further, described initiator is benzophenone, methyl phenyl ketone or said mixture.
Further, described surface modifier is silicone based, organic fluorine class or said mixture.
Further, described solubility promoter is alcohol ether solvents.
The invention provides a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint, beneficial effect is as follows:
What a kind of use in printed circuit board ultraviolet light polymerization of the present invention high-temperature-resistant insulating paint not only can meet that coating has completely beautifies and defencive function; can also be high temperature resistant and at high temperature play good insulation effect, on protection plastic circuit board, susceptible device susceptor does not suffer damage.Meanwhile, the present invention also has splendid flame-retarding characteristic, and protection circuit plate is not by temperatures involved.In addition, other physical propertiess of the present invention are unaffected, even also have higher salt fog resistance, ageing resistance, weathering resistance, sticking power, anti-cold shock ability.
Embodiment
Below in conjunction with embodiment, the present invention will be further described.
Embodiment 1:
Described a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint is prepared from by the raw material of following mass percent:
Bisphenol A epoxy diacrylate, polyester methylpropionate and organic silicon acrylic ester mixture: 60%;
Graphitization nano carbon fiber: 5%;
Benzophenone: 8%;
Organic fluorine class: 1.5%;
Glycol ether: 7.5%;
Iso-bornyl acrylate, diacrylate ester mixture: 18%;
Wherein, bisphenol A epoxy diacrylate, polyester methylpropionate are 2:1.5:1 with organic silicon acrylic ester mixture quality ratio; Iso-bornyl acrylate, diacrylate mixture quality are than being 2:1.
Embodiment 2:
Described a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint is prepared from by the raw material of following mass percent:
Bisphenol A epoxy diacrylate, polyester methylpropionate and organic silicon acrylic ester mixture: 57%;
Graphitization nano carbon fiber: 4%;
Methyl phenyl ketone: 10%;
Silicone based: 2%;
Glycol ether: 9%;
Iso-bornyl acrylate, diacrylate ester mixture: 18%;
Wherein, bisphenol A epoxy diacrylate, polyester methylpropionate are 3:2:1 with organic silicon acrylic ester mixture quality ratio; Iso-bornyl acrylate, diacrylate mixture quality are than being 2.5:1.
Embodiment 3:
Described a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint is prepared from by the raw material of following mass percent:
Bisphenol A epoxy diacrylate, polyester methylpropionate and organic silicon acrylic ester mixture: 60%;
Graphitization nano carbon fiber: 3%;
Benzophenone, methyl phenyl ketone mixture: 12%;
Silicone based, organic fluorine class mixture: 3%;
Glycol ether: 10%;
Iso-bornyl acrylate, diacrylate ester mixture: 12%;
Wherein, bisphenol A epoxy diacrylate, polyester methylpropionate are 4:3:1 with organic silicon acrylic ester mixture quality ratio; Benzophenone, methyl phenyl ketone mixture quality are than being 2.2:1; Iso-bornyl acrylate, diacrylate mixture quality are than being 1.8:1.
Claims (8)
1. a use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint, is characterized in that: be prepared from by the raw material of following mass percent:
Bisphenol A epoxy diacrylate, polyester methylpropionate and organic silicon acrylic ester mixture: 50% ~ 70%;
Graphitization nano carbon fiber: 3-5%;
Initiator: 5% ~ 12%;
Surface modifier: 1% ~ 3%;
Solubility promoter: 5% ~ 10%;
Reactive thinner: 10% ~ 20%.
2. a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint according to claim 1, is characterized in that: described a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint is prepared from by the raw material of following mass percent:
Bisphenol A epoxy diacrylate, polyester methylpropionate and organic silicon acrylic ester mixture: 60%;
Graphitization nano carbon fiber: 5%;
Initiator: 8%;
Surface modifier: 1.5%;
Solubility promoter: 7.5%;
Reactive thinner: 18%.
3. a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint according to claim 1 and 2, it is characterized in that: described bisphenol A epoxy diacrylate, polyester methylpropionate and organic silicon acrylic ester mixture, in mass fraction, for bisphenol A epoxy diacrylate 2 ~ 4 parts, polyester methylpropionate 1 ~ 3 part, organic silicon acrylic ester 1 part.
4. a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint according to claim 1 and 2, is characterized in that: the preparation method of described a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint, comprises the following steps:
(1) bisphenol A epoxy diacrylate, polyester methylpropionate are mixed with initiator with organic silicon acrylic ester mixture, spray into vaporific end hydrogen silicone oil while stirring, mix placement 3 ~ 4 hours;
(2) by the mixing of materials that graphitization nano carbon fiber, surface modifier, solubility promoter, reactive thinner and (1) step obtain, be warming up to 60 ~ 80 DEG C, stir 25 ~ 30 minutes under 1000 ~ 1200 revs/min, to obtain final product.
5. a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint according to claim 1 and 2, is characterized in that: further, and described reactive thinner is iso-bornyl acrylate and diacrylate ester mixture, and mass ratio is 1.5 ~ 2.5:1.
6. a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint according to claim 1 and 2, it is characterized in that: further, described initiator is benzophenone, methyl phenyl ketone or said mixture.
7. a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint according to claim 1 and 2, is characterized in that: described surface modifier is silicone based, organic fluorine class or said mixture.
8. a kind of use in printed circuit board ultraviolet light polymerization high-temperature-resistant insulating paint according to claim 1 and 2, is characterized in that: described solubility promoter is alcohol ether solvents.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410584887.3A CN104356886A (en) | 2014-10-28 | 2014-10-28 | Ultraviolet-curable high-temperature-resistant insulating coating for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410584887.3A CN104356886A (en) | 2014-10-28 | 2014-10-28 | Ultraviolet-curable high-temperature-resistant insulating coating for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104356886A true CN104356886A (en) | 2015-02-18 |
Family
ID=52524208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410584887.3A Pending CN104356886A (en) | 2014-10-28 | 2014-10-28 | Ultraviolet-curable high-temperature-resistant insulating coating for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104356886A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101397410A (en) * | 2007-12-03 | 2009-04-01 | 三棵树涂料股份有限公司 | Water ultraviolet cured paint |
| CN102020911A (en) * | 2010-10-12 | 2011-04-20 | 广州贝特新材料有限公司 | Low-volatilization photocoagulation dipping insulating paint |
| CN102234480A (en) * | 2010-04-20 | 2011-11-09 | 东莞市佩琦涂料有限公司 | Ultraviolet light solidified antibiosis paint |
| CN103834291A (en) * | 2014-02-13 | 2014-06-04 | 芜湖市宝艺游乐科技设备有限公司 | High strength anti-pollution UV curable paint and preparation method thereof |
-
2014
- 2014-10-28 CN CN201410584887.3A patent/CN104356886A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101397410A (en) * | 2007-12-03 | 2009-04-01 | 三棵树涂料股份有限公司 | Water ultraviolet cured paint |
| CN102234480A (en) * | 2010-04-20 | 2011-11-09 | 东莞市佩琦涂料有限公司 | Ultraviolet light solidified antibiosis paint |
| CN102020911A (en) * | 2010-10-12 | 2011-04-20 | 广州贝特新材料有限公司 | Low-volatilization photocoagulation dipping insulating paint |
| CN103834291A (en) * | 2014-02-13 | 2014-06-04 | 芜湖市宝艺游乐科技设备有限公司 | High strength anti-pollution UV curable paint and preparation method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150218 |