CN104356601A - Shrinkage-free epoxy grouting material and preparation method thereof - Google Patents

Shrinkage-free epoxy grouting material and preparation method thereof Download PDF

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CN104356601A
CN104356601A CN201410694287.2A CN201410694287A CN104356601A CN 104356601 A CN104356601 A CN 104356601A CN 201410694287 A CN201410694287 A CN 201410694287A CN 104356601 A CN104356601 A CN 104356601A
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parts
epoxy resin
type epoxy
grouting material
silicon
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CN104356601B (en
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牛传凯
杨彪
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The Fifth People's Hospital of Qidong
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JINAN MAIHABO METALLURGICAL TECHNOLOGY DEVELOPMENT Co Ltd
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Abstract

The invention discloses a shrinkage-free epoxy grouting material and a preparation method thereof. The shrinkage-free epoxy grouting material disclosed by the invention is prepared by the following steps: mixing organic silicon modified bisphenol A epoxy resin with glycidyl ether epoxy resin at a proper ratio, and adding a certain ratio of filler and curing agent to mix. The shrinkage-free epoxy grouting material prepared by adopting the composition ratio and the preparation method is moderate in material viscosity, has relatively good injection property, and is easy to grout and construct. Various fillers disclosed by the invention can be evenly distributed in epoxy resin by collocation in proper proportions, and can play relatively good filling and bonding roles; and the shrinkage-free epoxy grouting material disclosed by the invention is suitable for construction in various complicated environments, has excellent acid and alkali resistance, does not accumulate water or infiltrate after grouting construction, is firm and dense to block off, and is high in compressive strength.

Description

A kind of ungauged regions epoxy grouting material and preparation method thereof
Technical field
The present invention relates to building material field, be specifically related to a kind of ungauged regions epoxy grouting material and preparation method thereof.
Background technology
Injection material injects the crack of ground or cavity to reinforce or the injection material of waterproof effect to obtain, if the Performance Ratio of injection material is poor, easily causing buildings to produce crack, affecting the attractive in appearance of buildings, if do not processed the work-ing life that also may affect buildings.In chemical grouting, be mainly epoxy resin grouting material, but epoxide resin grouting material mainly exists following problem: epoxy resin viscosity is excessive, filling process is not easy to inject; When epoxy resin adds other filler additives as water glass, filler is strong to the adsorptive power of epoxy resin, and filler distribution is irregular, can not reach uniform filling and cohesive action, easily causes the intensity of grouting lower, and bounding force reduces, and easily produces crack; Grouting is in implementation process, and the impact being subject to environment is larger, and easily produce the dry and cracked phenomenon after sclerosis, epoxy resin produces ponding, infiltration after grouting, and shutoff is insecure, the problem that ultimate compression strength is low.
Summary of the invention
For solving the problem, the object of the invention is to provide one and controls ungauged regions epoxy grouting material and preparation method thereof.
The present invention for achieving the above object, is achieved through the following technical solutions:
A kind of ungauged regions epoxy grouting material, with parts by weight, consist of the following composition: organic-silicon-modified bisphenol A type epoxy resin 90 ~ 100 parts, glycidyl ether type epoxy resin 15 ~ 25 parts, amine modified firming agent 10 ~ 30 parts, fibrous magnesium silicate 5 ~ 8 parts, cement 10 ~ 15 parts, high-calcium fly ass 3 ~ 6 parts, carboxymethyl cellulose 2 ~ 5 parts, 10 ~ 15 parts, aluminum oxide and stone flour 5 ~ 10 parts; Described organic-silicon-modified bisphenol A type epoxy resin is bisphenol A type epoxy resin and the organosilane condensation gained containing end group chlorine, and the described organosilane containing end group chlorine is the one in a chlorine trimethyl silane, chloropropyl triethoxysilane or dimethyldichlorosilane(DMCS); Described glycidyl ether type epoxy resin is the one in polyethyleneglycol diglycidylether, polypropylene glycol diglycidyl ether, butylglycidyl ether or BDDE; Described amine modified firming agent is the one in 590 solidifying agent, 593 solidifying agent or T31 solidifying agent.
For realizing object of the present invention further, can also by the following technical solutions:
Preferred scheme, the organosilane containing end group chlorine is dimethyldichlorosilane(DMCS).
Preferred scheme, a kind of ungauged regions epoxy grouting material, with parts by weight, consist of the following composition: organic-silicon-modified bisphenol A type epoxy resin 95 parts, polyethyleneglycol diglycidylether 20 parts, 593 25 parts, solidifying agent, fibrous magnesium silicate 6 parts, cement 12 parts, high-calcium fly ass 5 parts, carboxymethyl cellulose 4 parts, 13 parts, aluminum oxide and stone flour 8 parts; Described organic-silicon-modified bisphenol A type epoxy resin is bisphenol A type epoxy resin and dimethyldichlorosilane(DMCS) condensation gained.
The present invention also comprises a kind of preparation method of ungauged regions epoxy grouting material, comprises the following steps:
(1) preparation of organic-silicon-modified bisphenol A type epoxy resin: be that the bisphenol A type epoxy resin and adding in toluene containing the organosilane of end group chlorine of 4:1 ~ 2 dissolves by mol ratio, obtain mixed solution, triethylamine is dripped in mixed solution, the temperature of reaction controlled when dripping triethylamine is 20 ~ 40 DEG C, dropwise and react 1 hour at 25 ~ 30 DEG C, obtain reaction solution, by reaction solution distilled water flushing, underpressure distillation reaction solution, obtains flaxen organic-silicon-modified bisphenol A type epoxy resin; Triethylamine is 3 ~ 4:1 with the organosilane mol ratio containing end group chlorine; The volume ratio of distilled water and reaction solution is 5 ~ 10:1; The described organosilane containing end group chlorine is the one in a chlorine trimethyl silane, chloropropyl triethoxysilane or dimethyldichlorosilane(DMCS);
(2) will with the fibrous magnesium silicate of parts by weight 5 ~ 8 parts, the cement of 10 ~ 15 parts, high-calcium fly ass 3 ~ 6 parts, carboxymethyl cellulose 2 ~ 5 parts, the stone flour of the aluminum oxide of 10 ~ 15 parts and 5 ~ 10 parts is uniformly mixed in the glycidyl ether type epoxy resin of organic-silicon-modified bisphenol A type epoxy resin and 15 ~ 25 parts joining step (1) gained 90 ~ 100 parts, mix the component A obtaining ungauged regions epoxy grouting material, stand-by; Described glycidyl ether type epoxy resin is the one in polyethyleneglycol diglycidylether, polypropylene glycol diglycidyl ether, butylglycidyl ether or BDDE;
(3) the amine modified firming agent 10 ~ 30 parts with parts by weight is joined in the component A of step (2) gained ungauged regions epoxy grouting material, stir, obtain ungauged regions epoxy grouting material.
The preparation method of preferred a kind of ungauged regions epoxy grouting material, comprises the following steps:
(1) preparation of organic-silicon-modified bisphenol A type epoxy resin: be that the bisphenol A type epoxy resin of 2:1 and dimethyldichlorosilane(DMCS) add in toluene and dissolve by mol ratio, obtain mixed solution, triethylamine is dripped in mixed solution, the temperature of reaction controlled when dripping triethylamine is 25 DEG C, dropwise and react 1 hour at 25 DEG C, obtain reaction solution, by reaction solution distilled water flushing, underpressure distillation reaction solution, obtains flaxen organic-silicon-modified bisphenol A type epoxy resin; Triethylamine is 3:1 with the organosilane mol ratio containing end group chlorine; The volume ratio of distilled water and reaction solution is 8:1;
(2) by with the fibrous magnesium silicate of parts by weight 6 parts, the cement of 12 parts, high-calcium fly ass 5 parts, carboxymethyl cellulose 4 parts, the stone flour of the aluminum oxide of 13 parts and 8 parts be uniformly mixed organic-silicon-modified bisphenol A type epoxy resin and 20 parts joining step (1) gained 95 parts polyethyleneglycol diglycidylether, mix, obtain the component A of ungauged regions epoxy grouting material, stand-by;
(3) 25 parts, 593 solidifying agent with parts by weight is joined in the component A of step (2) gained ungauged regions epoxy grouting material, stir, obtain ungauged regions epoxy grouting material.
The invention has the advantages that:
Ungauged regions epoxy grouting material of the present invention adopts organic-silicon-modified bisphenol A type epoxy resin and glycidyl ether type epoxy resin through the mixing of suitable proportion, adds a certain proportion of filler and solidifying agent mixes; Adopt ungauged regions epoxy grouting material proportion of composing of the present invention and preparation method's gained ungauged regions epoxy grouting material modest viscosity of the present invention, there is good injectivity, easy pouring construction, various filler of the present invention is through the collocation of suitable proportion, can be uniformly distributed in the epoxy, play and fill preferably and cohesive action; Construct under ungauged regions epoxy grouting material of the present invention is adapted at various complex environment, there is excellent anti acid alkali performance energy, after grouting construction not ponding, do not seep water, shutoff is firmly closely knit, and ultimate compression strength is high.
Embodiment
A kind of ungauged regions epoxy grouting material, with parts by weight, consist of the following composition: organic-silicon-modified bisphenol A type epoxy resin 90 ~ 100 parts, glycidyl ether type epoxy resin 15 ~ 25 parts, amine modified firming agent 10 ~ 30 parts, fibrous magnesium silicate 5 ~ 8 parts, cement 10 ~ 15 parts, high-calcium fly ass 3 ~ 6 parts, carboxymethyl cellulose 2 ~ 5 parts, 10 ~ 15 parts, aluminum oxide and stone flour 5 ~ 10 parts; Described organic-silicon-modified bisphenol A type epoxy resin is bisphenol A type epoxy resin and the organosilane condensation gained containing end group chlorine, and the described organosilane containing end group chlorine is the one in a chlorine trimethyl silane, chloropropyl triethoxysilane or dimethyldichlorosilane(DMCS); Described glycidyl ether type epoxy resin is the one in polyethyleneglycol diglycidylether, polypropylene glycol diglycidyl ether, butylglycidyl ether or BDDE; Described amine modified firming agent is the one in 590 solidifying agent, 593 solidifying agent or T31 solidifying agent.
For realizing object of the present invention further, can also by the following technical solutions:
Preferred scheme, the organosilane containing end group chlorine is dimethyldichlorosilane(DMCS).
Preferred scheme, a kind of ungauged regions epoxy grouting material, with parts by weight, consist of the following composition: organic-silicon-modified bisphenol A type epoxy resin 95 parts, polyethyleneglycol diglycidylether 20 parts, 593 25 parts, solidifying agent, fibrous magnesium silicate 6 parts, cement 12 parts, high-calcium fly ass 5 parts, carboxymethyl cellulose 4 parts, 13 parts, aluminum oxide and stone flour 8 parts; Described organic-silicon-modified bisphenol A type epoxy resin is bisphenol A type epoxy resin and dimethyldichlorosilane(DMCS) condensation gained.
The present invention also comprises a kind of preparation method of ungauged regions epoxy grouting material, comprises the following steps:
(1) preparation of organic-silicon-modified bisphenol A type epoxy resin: be that the bisphenol A type epoxy resin and adding in toluene containing the organosilane of end group chlorine of 4:1 ~ 2 dissolves by mol ratio, obtain mixed solution, triethylamine is dripped in mixed solution, the temperature of reaction controlled when dripping triethylamine is 20 ~ 40 DEG C, dropwise and react 1 hour at 25 ~ 30 DEG C, obtain reaction solution, by reaction solution distilled water flushing, underpressure distillation reaction solution, obtains flaxen organic-silicon-modified bisphenol A type epoxy resin; Triethylamine is 3 ~ 4:1 with the organosilane mol ratio containing end group chlorine; The volume ratio of distilled water and reaction solution is 5 ~ 10:1; The described organosilane containing end group chlorine is the one in a chlorine trimethyl silane, chloropropyl triethoxysilane or dimethyldichlorosilane(DMCS);
(2) will with the fibrous magnesium silicate of parts by weight 5 ~ 8 parts, the cement of 10 ~ 15 parts, high-calcium fly ass 3 ~ 6 parts, carboxymethyl cellulose 2 ~ 5 parts, the stone flour of the aluminum oxide of 10 ~ 15 parts and 5 ~ 10 parts is uniformly mixed in the glycidyl ether type epoxy resin of organic-silicon-modified bisphenol A type epoxy resin and 15 ~ 25 parts joining step (1) gained 90 ~ 100 parts, mix the component A obtaining ungauged regions epoxy grouting material, stand-by; Described glycidyl ether type epoxy resin is the one in polyethyleneglycol diglycidylether, polypropylene glycol diglycidyl ether, butylglycidyl ether or BDDE;
(3) the amine modified firming agent 10 ~ 30 parts with parts by weight is joined in the component A of step (2) gained ungauged regions epoxy grouting material, stir, obtain ungauged regions epoxy grouting material.
The preparation method of preferred a kind of ungauged regions epoxy grouting material, comprises the following steps:
(1) preparation of organic-silicon-modified bisphenol A type epoxy resin: be that the bisphenol A type epoxy resin of 2:1 and dimethyldichlorosilane(DMCS) add in toluene and dissolve by mol ratio, obtain mixed solution, triethylamine is dripped in mixed solution, the temperature of reaction controlled when dripping triethylamine is 25 DEG C, dropwise and react 1 hour at 25 DEG C, obtain reaction solution, by reaction solution distilled water flushing, underpressure distillation reaction solution, obtains flaxen organic-silicon-modified bisphenol A type epoxy resin; Triethylamine is 3:1 with the organosilane mol ratio containing end group chlorine; The volume ratio of distilled water and reaction solution is 8:1;
(2) by with the fibrous magnesium silicate of parts by weight 6 parts, the cement of 12 parts, high-calcium fly ass 5 parts, carboxymethyl cellulose 4 parts, the stone flour of the aluminum oxide of 13 parts and 8 parts be uniformly mixed organic-silicon-modified bisphenol A type epoxy resin and 20 parts joining step (1) gained 95 parts polyethyleneglycol diglycidylether, mix, obtain the component A of ungauged regions epoxy grouting material, stand-by;
(3) 25 parts, 593 solidifying agent with parts by weight is joined in the component A of step (2) gained ungauged regions epoxy grouting material, stir, obtain ungauged regions epoxy grouting material.
Embodiment 1
A kind of ungauged regions epoxy grouting material, with parts by weight, consist of the following composition: organic-silicon-modified bisphenol A type epoxy resin 90 parts, polyethyleneglycol diglycidylether 15 parts, 590 10 parts, solidifying agent, fibrous magnesium silicate 5 parts, cement 10 parts, high-calcium fly ass 3 parts, carboxymethyl cellulose 2 parts, 10 parts, aluminum oxide and stone flour 5 parts; Described organic-silicon-modified bisphenol A type epoxy resin is bisphenol A type epoxy resin and a chlorine trimethyl silane condensation gained.
Embodiment 2
A kind of ungauged regions epoxy grouting material, with parts by weight, consist of the following composition: organic-silicon-modified bisphenol A type epoxy resin 100 parts, polypropylene glycol diglycidyl ether 25 parts, 593 30 parts, solidifying agent, fibrous magnesium silicate 8 parts, cement 15 parts, high-calcium fly ass 6 parts, carboxymethyl cellulose 5 parts, 15 parts, aluminum oxide and stone flour 10 parts; Described organic-silicon-modified bisphenol A type epoxy resin is bisphenol A type epoxy resin and chloropropyl triethoxysilane condensation gained.
Embodiment 3
A kind of ungauged regions epoxy grouting material, with parts by weight, consist of the following composition: organic-silicon-modified bisphenol A type epoxy resin 92 parts, butylglycidyl ether 18 parts, 15 parts, T31 solidifying agent, fibrous magnesium silicate 6 parts, cement 12 parts, high-calcium fly ass 4 parts, carboxymethyl cellulose 3 parts, 14 parts, aluminum oxide and stone flour 8 parts; Described organic-silicon-modified bisphenol A type epoxy resin is bisphenol A type epoxy resin and dimethyldichlorosilane(DMCS) condensation gained.
Embodiment 4
A kind of ungauged regions epoxy grouting material, with parts by weight, consist of the following composition: organic-silicon-modified bisphenol A type epoxy resin 98 parts, BDDE 22 parts, 590 24 parts, solidifying agent, fibrous magnesium silicate 7 parts, cement 14 parts, high-calcium fly ass 5 parts, carboxymethyl cellulose 4 parts, 12 parts, aluminum oxide and stone flour 6 parts; Described organic-silicon-modified bisphenol A type epoxy resin is bisphenol A type epoxy resin and a chlorine trimethyl silane condensation gained.
Embodiment 5
A kind of ungauged regions epoxy grouting material, with parts by weight, consist of the following composition: organic-silicon-modified bisphenol A type epoxy resin 94 parts, polypropylene glycol diglycidyl ether 23 parts, 18 parts, T31 solidifying agent, fibrous magnesium silicate 8 parts, cement 13 parts, high-calcium fly ass 4 parts, carboxymethyl cellulose 3 parts, 13 parts, aluminum oxide and stone flour 9 parts; Described organic-silicon-modified bisphenol A type epoxy resin is bisphenol A type epoxy resin and chloropropyl triethoxysilane condensation gained.
Embodiment 6
A kind of ungauged regions epoxy grouting material, with parts by weight, consist of the following composition: organic-silicon-modified bisphenol A type epoxy resin 95 parts, polyethyleneglycol diglycidylether 20 parts, 593 25 parts, solidifying agent, fibrous magnesium silicate 6 parts, cement 12 parts, high-calcium fly ass 5 parts, carboxymethyl cellulose 4 parts, 13 parts, aluminum oxide and stone flour 8 parts; Described organic-silicon-modified bisphenol A type epoxy resin is bisphenol A type epoxy resin and dimethyldichlorosilane(DMCS) condensation gained.
Embodiment 7
Be grouped into the preparation method of a kind of ungauged regions epoxy grouting material of gained according to the one-tenth of embodiment 1, comprise the following steps:
(1) preparation of organic-silicon-modified bisphenol A type epoxy resin: be that the bisphenol A type epoxy resin of 4:1 and a chlorine trimethyl silane add in toluene and dissolve by mol ratio, obtain mixed solution, triethylamine is dripped in mixed solution, the temperature of reaction controlled when dripping triethylamine is 20 DEG C, dropwise and react 1 hour at 25 DEG C, obtain reaction solution, by reaction solution distilled water flushing, underpressure distillation reaction solution, obtains flaxen organic-silicon-modified bisphenol A type epoxy resin; The mol ratio of triethylamine and a chlorine trimethyl silane is 3:1; The volume ratio of distilled water and reaction solution is 5:1;
(2) by with the fibrous magnesium silicate of parts by weight 5 parts, the cement of 10 parts, high-calcium fly ass 3 parts, carboxymethyl cellulose 2 parts, the stone flour of the aluminum oxide of 10 parts and 5 parts is uniformly mixed in the polyethyleneglycol diglycidylether of organic-silicon-modified bisphenol A type epoxy resin and 15 parts joining step (1) gained 90 parts, mix the component A obtaining ungauged regions epoxy grouting material, stand-by;
(3) 10 parts, 590 solidifying agent with parts by weight is joined in the component A of step (2) gained ungauged regions epoxy grouting material, stir, obtain ungauged regions epoxy grouting material.
Embodiment 8
Be grouped into the preparation method of a kind of ungauged regions epoxy grouting material of gained according to the one-tenth of embodiment 2, comprise the following steps:
(1) preparation of organic-silicon-modified bisphenol A type epoxy resin: be that the bisphenol A type epoxy resin of 4:1.5 and chloropropyl triethoxysilane add in toluene and dissolve by mol ratio, obtain mixed solution, triethylamine is dripped in mixed solution, the temperature of reaction controlled when dripping triethylamine is 25 DEG C, dropwise and react 1 hour at 30 DEG C, obtain reaction solution, by reaction solution distilled water flushing, underpressure distillation reaction solution, obtains flaxen organic-silicon-modified bisphenol A type epoxy resin; Triethylamine is 4:1 with the organosilane mol ratio containing end group chlorine; The volume ratio of distilled water and reaction solution is 10:1;
(2) by with the fibrous magnesium silicate of parts by weight 8 parts, the cement of 15 parts, high-calcium fly ass 6 parts, carboxymethyl cellulose 5 parts, the stone flour of the aluminum oxide of 15 parts and 10 parts is uniformly mixed in the polypropylene glycol diglycidyl ether of organic-silicon-modified bisphenol A type epoxy resin and 25 parts joining step (1) gained 100 parts, mix the component A obtaining ungauged regions epoxy grouting material, stand-by;
(3) 30 parts, 593 solidifying agent with parts by weight is joined in the component A of step (2) gained ungauged regions epoxy grouting material, stir, obtain ungauged regions epoxy grouting material.
Embodiment 9
Be grouped into the preparation method of a kind of ungauged regions epoxy grouting material of gained according to the one-tenth of embodiment 3, comprise the following steps:
(1) preparation of organic-silicon-modified bisphenol A type epoxy resin: be that the bisphenol A type epoxy resin of 2:1 and dimethyldichlorosilane(DMCS) add in toluene and dissolve by mol ratio, obtain mixed solution, triethylamine is dripped in mixed solution, the temperature of reaction controlled when dripping triethylamine is 35 DEG C, dropwise and react 1 hour at 28 DEG C, obtain reaction solution, by reaction solution distilled water flushing, underpressure distillation reaction solution, obtains flaxen organic-silicon-modified bisphenol A type epoxy resin; Triethylamine is 3.5:1 with the organosilane mol ratio containing end group chlorine; The volume ratio of distilled water and reaction solution is 6:1;
(2) by with the fibrous magnesium silicate of parts by weight 6 parts, the cement of 12 parts, high-calcium fly ass 4 parts, carboxymethyl cellulose 3 parts, the stone flour of the aluminum oxide of 14 parts and 8 parts is uniformly mixed in the butylglycidyl ether of organic-silicon-modified bisphenol A type epoxy resin and 18 parts joining step (1) gained 92 parts, mix the component A obtaining ungauged regions epoxy grouting material, stand-by;
(3) 15 parts, the T31 solidifying agent with parts by weight is joined in the component A of step (2) gained ungauged regions epoxy grouting material, stir, obtain ungauged regions epoxy grouting material.
Embodiment 10
Be grouped into the preparation method of a kind of ungauged regions epoxy grouting material of gained according to the one-tenth of embodiment 4, comprise the following steps:
(1) preparation of organic-silicon-modified bisphenol A type epoxy resin: be that the bisphenol A type epoxy resin of 3:1 and a chlorine trimethyl silane add in toluene and dissolve by mol ratio, obtain mixed solution, triethylamine is dripped in mixed solution, the temperature of reaction controlled when dripping triethylamine is 25 DEG C, dropwise and react 1 hour at 26 DEG C, obtain reaction solution, by reaction solution distilled water flushing, underpressure distillation reaction solution, obtains flaxen organic-silicon-modified bisphenol A type epoxy resin; Triethylamine and a chlorine trimethyl silane mol ratio are 4:1; The volume ratio of distilled water and reaction solution is 9:1;
(2) by with the fibrous magnesium silicate of parts by weight 7 parts, the cement of 14 parts, high-calcium fly ass 5 parts, carboxymethyl cellulose 4 parts, the stone flour of the aluminum oxide of 12 parts and 6 parts is uniformly mixed and joins the organic-silicon-modified bisphenol A type epoxy resin of step (1) gained 98 parts and 22 parts 1, in 4-butanediol diglycidyl ether, mix the component A obtaining ungauged regions epoxy grouting material, stand-by;
(3) 24 parts, 590 solidifying agent with parts by weight is joined in the component A of step (2) gained ungauged regions epoxy grouting material, stir, obtain ungauged regions epoxy grouting material.
Embodiment 11
Be grouped into the preparation method of a kind of ungauged regions epoxy grouting material of gained according to the one-tenth of embodiment 5, comprise the following steps:
(1) preparation of organic-silicon-modified bisphenol A type epoxy resin: be that the bisphenol A type epoxy resin of 4:1 and chloropropyl triethoxysilane add in toluene and dissolve by mol ratio, obtain mixed solution, triethylamine is dripped in mixed solution, the temperature of reaction controlled when dripping triethylamine is 38 DEG C, dropwise and react 1 hour at 28 DEG C, obtain reaction solution, by reaction solution distilled water flushing, underpressure distillation reaction solution, obtains flaxen organic-silicon-modified bisphenol A type epoxy resin; Triethylamine is 4:1 with the organosilane mol ratio containing end group chlorine; The volume ratio of distilled water and reaction solution is 7:1;
(2) by with the fibrous magnesium silicate of parts by weight 8 parts, the cement of 13 parts, high-calcium fly ass 4 parts, carboxymethyl cellulose 3 parts, the stone flour of the aluminum oxide of 13 parts and 9 parts is uniformly mixed in the polypropylene glycol diglycidyl ether of organic-silicon-modified bisphenol A type epoxy resin and 23 parts joining step (1) gained 94 parts, mix the component A obtaining ungauged regions epoxy grouting material, stand-by;
(3) 18 parts, the T31 solidifying agent with parts by weight is joined in the component A of step (2) gained ungauged regions epoxy grouting material, stir, obtain ungauged regions epoxy grouting material.
Embodiment 12
Be grouped into the preparation method of a kind of ungauged regions epoxy grouting material of gained according to the one-tenth of embodiment 6, comprise the following steps:
(1) preparation of organic-silicon-modified bisphenol A type epoxy resin: be that the bisphenol A type epoxy resin of 2:1 and dimethyldichlorosilane(DMCS) add in toluene and dissolve by mol ratio, obtain mixed solution, triethylamine is dripped in mixed solution, the temperature of reaction controlled when dripping triethylamine is 25 DEG C, dropwise and react 1 hour at 25 DEG C, obtain reaction solution, by reaction solution distilled water flushing, underpressure distillation reaction solution, obtains flaxen organic-silicon-modified bisphenol A type epoxy resin; Triethylamine is 3:1 with the organosilane mol ratio containing end group chlorine; The volume ratio of distilled water and reaction solution is 8:1;
(2) by with the fibrous magnesium silicate of parts by weight 6 parts, the cement of 12 parts, high-calcium fly ass 5 parts, carboxymethyl cellulose 4 parts, the stone flour of the aluminum oxide of 13 parts and 8 parts be uniformly mixed organic-silicon-modified bisphenol A type epoxy resin and 20 parts joining step (1) gained 95 parts polyethyleneglycol diglycidylether, mix, obtain the component A of ungauged regions epoxy grouting material, stand-by;
(3) 25 parts, 593 solidifying agent with parts by weight is joined in the component A of step (2) gained ungauged regions epoxy grouting material, stir, obtain ungauged regions epoxy grouting material.
The performance of ungauged regions epoxy grouting material prepared by 7 ~ 12 embodiments is as shown in table 1:
The performance detection data of ungauged regions epoxy grouting material prepared by table 17 ~ 12 embodiment
Surface drying time/min Viscosity/centipoise (25 DEG C) Shrinking percentage/% Ultimate compression strength/MPa Shock strength/kJm -2 With the cohesive strength/MPa of mortar
Embodiment 7 60 30 1.2 120 16.2 6.7
Embodiment 8 65 31 1.3 121 17.3 6.8
Embodiment 9 70 32 1.4 124 19.1 6.9
Embodiment 10 70 32 1.2 126 19.8 7.0
Embodiment 11 75 31 1.4 130 20.7 7.5
Embodiment 12 75 34 1.3 135 21.5 8.2
In table 1 surface drying time refer to slurries from be cured to surface tack-free time, ultimate compression strength, shock strength are all that material records after 28 days in maintenance; Wet surface cohesive strength is that fragment of brick soaks 6h in water, and the water stain rear ungauged regions epoxy grouting material bonding of the present invention on surface dried by taking-up cotton yarn, and maintenance recorded after three days.
Can be obtained by the data of table one, ungauged regions epoxy grouting material modest viscosity of the present invention, have good injectivity, easy pouring construction, surface drying time is short, shrinking percentage is little, construct under being adapted at various complex environment, there is excellent anti acid alkali performance energy, after grouting construction not ponding, do not seep water, shutoff is firmly closely knit, and ultimate compression strength is high.

Claims (5)

1. a ungauged regions epoxy grouting material, it is characterized in that: with parts by weight, consist of the following composition: organic-silicon-modified bisphenol A type epoxy resin 90 ~ 100 parts, glycidyl ether type epoxy resin 15 ~ 25 parts, amine modified firming agent 10 ~ 30 parts, fibrous magnesium silicate 5 ~ 8 parts, cement 10 ~ 15 parts, high-calcium fly ass 3 ~ 6 parts, carboxymethyl cellulose 2 ~ 5 parts, 10 ~ 15 parts, aluminum oxide and stone flour 5 ~ 10 parts; Described organic-silicon-modified bisphenol A type epoxy resin is bisphenol A type epoxy resin and the organosilane condensation gained containing end group chlorine, and the described organosilane containing end group chlorine is the one in a chlorine trimethyl silane, chloropropyl triethoxysilane or dimethyldichlorosilane(DMCS); Described glycidyl ether type epoxy resin is the one in polyethyleneglycol diglycidylether, polypropylene glycol diglycidyl ether, butylglycidyl ether or BDDE; Described amine modified firming agent is the one in 590 solidifying agent, 593 solidifying agent or T31 solidifying agent.
2. a kind of ungauged regions epoxy grouting material according to claim 1, is characterized in that: the organosilane containing end group chlorine is dimethyldichlorosilane(DMCS).
3. a kind of ungauged regions epoxy grouting material according to claim 1 and 2, it is characterized in that: with parts by weight, consist of the following composition: organic-silicon-modified bisphenol A type epoxy resin 95 parts, polyethyleneglycol diglycidylether 20 parts, 593 25 parts, solidifying agent, fibrous magnesium silicate 6 parts, cement 12 parts, high-calcium fly ass 5 parts, carboxymethyl cellulose 4 parts, 13 parts, aluminum oxide and stone flour 8 parts; Described organic-silicon-modified bisphenol A type epoxy resin is bisphenol A type epoxy resin and dimethyldichlorosilane(DMCS) condensation gained.
4. the preparation method of a kind of ungauged regions epoxy grouting material according to claim 1, is characterized in that: comprise the following steps:
The preparation of organic-silicon-modified bisphenol A type epoxy resin: be that the bisphenol A type epoxy resin and adding in toluene containing the organosilane of end group chlorine of 4:1 ~ 2 dissolves by mol ratio, obtain mixed solution, triethylamine is dripped in mixed solution, the temperature of reaction controlled when dripping triethylamine is 20 ~ 40 DEG C, dropwise and react 1 hour at 25 ~ 30 DEG C, obtain reaction solution, by reaction solution distilled water flushing, underpressure distillation reaction solution, obtains flaxen organic-silicon-modified bisphenol A type epoxy resin; Triethylamine is 3 ~ 4:1 with the organosilane mol ratio containing end group chlorine; The volume ratio of distilled water and reaction solution is 5 ~ 10:1; The described organosilane containing end group chlorine is the one in a chlorine trimethyl silane, chloropropyl triethoxysilane or dimethyldichlorosilane(DMCS);
Will with the fibrous magnesium silicate of parts by weight 5 ~ 8 parts, the cement of 10 ~ 15 parts, high-calcium fly ass 3 ~ 6 parts, carboxymethyl cellulose 2 ~ 5 parts, 10 ~ 15 parts, aluminum oxide, the stone flour of the aluminum oxide of 10 ~ 15 parts and 5 ~ 10 parts is uniformly mixed in the glycidyl ether type epoxy resin of organic-silicon-modified bisphenol A type epoxy resin and 15 ~ 25 parts joining step (1) gained 90 ~ 100 parts, mixes the component A obtaining ungauged regions epoxy grouting material, stand-by; Described glycidyl ether type epoxy resin is the one in polyethyleneglycol diglycidylether, polypropylene glycol diglycidyl ether, butylglycidyl ether or BDDE;
Amine modified firming agent 10 ~ 30 parts with parts by weight is joined in the component A of step (2) gained ungauged regions epoxy grouting material, stirs, obtain ungauged regions epoxy grouting material.
5. the preparation method of a kind of ungauged regions epoxy grouting material according to claim 4, is characterized in that: comprise the following steps:
(1) preparation of organic-silicon-modified bisphenol A type epoxy resin: be that the bisphenol A type epoxy resin of 2:1 and dimethyldichlorosilane(DMCS) add in toluene and dissolve by mol ratio, obtain mixed solution, triethylamine is dripped in mixed solution, the temperature of reaction controlled when dripping triethylamine is 20 ~ 40 DEG C, dropwise and react 1 hour at 25 ~ 30 DEG C, obtain reaction solution, by reaction solution distilled water flushing, underpressure distillation reaction solution, obtains flaxen organic-silicon-modified bisphenol A type epoxy resin; Triethylamine is 3:1 with the organosilane mol ratio containing end group chlorine; The volume ratio of distilled water and reaction solution is 8:1;
(2) by with the fibrous magnesium silicate of parts by weight 6 parts, the cement of 12 parts, high-calcium fly ass 5 parts, carboxymethyl cellulose 4 parts, the stone flour of the aluminum oxide of 13 parts and 8 parts be uniformly mixed organic-silicon-modified bisphenol A type epoxy resin and 20 parts joining step (1) gained 95 parts polyethyleneglycol diglycidylether, mix, obtain the component A of ungauged regions epoxy grouting material, stand-by;
(3) 25 parts, 593 solidifying agent with parts by weight is joined in the component A of step (2) gained ungauged regions epoxy grouting material, stir, obtain ungauged regions epoxy grouting material.
CN201410694287.2A 2014-11-27 2014-11-27 A kind of ungauged regions epoxy grouting material and preparation method thereof Active CN104356601B (en)

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Cited By (4)

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Publication number Priority date Publication date Assignee Title
CN106221133A (en) * 2016-09-07 2016-12-14 芜湖桑乐金电子科技有限公司 High-intensity resin plate and preparation method thereof
CN107746550A (en) * 2017-11-09 2018-03-02 陈晨特 A kind of Thief zone ungauged regions epoxy grouting material
CN108587061A (en) * 2017-12-04 2018-09-28 张芸 A kind of preparation method of low-temperature fast-curing composite grouting material
CN111117158A (en) * 2019-12-23 2020-05-08 科化新材料泰州有限公司 Low-cost low-stress epoxy composition and preparation method thereof

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CN101484623A (en) * 2006-07-06 2009-07-15 名古屋油化株式会社 Acoustic fiber sheet and shaped article utilizing the same
CN101801725A (en) * 2007-09-20 2010-08-11 名古屋油化株式会社 Buffering and sound-absorbing member

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Publication number Priority date Publication date Assignee Title
CN101484623A (en) * 2006-07-06 2009-07-15 名古屋油化株式会社 Acoustic fiber sheet and shaped article utilizing the same
CN101801725A (en) * 2007-09-20 2010-08-11 名古屋油化株式会社 Buffering and sound-absorbing member

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106221133A (en) * 2016-09-07 2016-12-14 芜湖桑乐金电子科技有限公司 High-intensity resin plate and preparation method thereof
CN107746550A (en) * 2017-11-09 2018-03-02 陈晨特 A kind of Thief zone ungauged regions epoxy grouting material
CN107746550B (en) * 2017-11-09 2020-09-15 邢台茂森泡沫塑料有限公司 High-permeability non-shrinkage epoxy grouting material
CN108587061A (en) * 2017-12-04 2018-09-28 张芸 A kind of preparation method of low-temperature fast-curing composite grouting material
CN111117158A (en) * 2019-12-23 2020-05-08 科化新材料泰州有限公司 Low-cost low-stress epoxy composition and preparation method thereof

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