CN104347778A - 一种荧光粉涂覆方法和一种led灯及其支架 - Google Patents

一种荧光粉涂覆方法和一种led灯及其支架 Download PDF

Info

Publication number
CN104347778A
CN104347778A CN201310326867.1A CN201310326867A CN104347778A CN 104347778 A CN104347778 A CN 104347778A CN 201310326867 A CN201310326867 A CN 201310326867A CN 104347778 A CN104347778 A CN 104347778A
Authority
CN
China
Prior art keywords
led lamp
silica gel
lamp holder
fluorescent powder
transparent silica
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310326867.1A
Other languages
English (en)
Inventor
刘华基
王峰
曾昌景
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUIZHOU FORYOU OPTOELECTRONICS TECHNOLOGY Co Ltd
Original Assignee
HUIZHOU FORYOU OPTOELECTRONICS TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HUIZHOU FORYOU OPTOELECTRONICS TECHNOLOGY Co Ltd filed Critical HUIZHOU FORYOU OPTOELECTRONICS TECHNOLOGY Co Ltd
Priority to CN201310326867.1A priority Critical patent/CN104347778A/zh
Publication of CN104347778A publication Critical patent/CN104347778A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开了一种LED灯的荧光粉涂覆方法，用于COB、集成产品LED灯的封装，包括：步骤1）在安装晶片后的LED灯支架上均匀的设置荧光粉层；步骤2）对所述荧光粉层进行烘烤；步骤3）在所述荧光粉的上面点涂透明硅胶；步骤4）对所述透明硅胶进行烘烤成型。整个过程中，将荧光粉和透明硅胶分两步投放，先涂覆荧光粉，然后点上透明硅胶，这样，就可以解决荧光粉沉淀不一，色温偏差大的问题。而且，先进行荧光粉层涂覆，然后再进行点透明硅胶，避免了LED灯支架在与透明硅胶结合时气体的残留而产生气泡。本发明还公开了一种LED灯及其支架。

Description

一种荧光粉涂覆方法和一种LED灯及其支架
技术领域
本发明涉及荧光粉涂覆技术领域，尤其涉及一种荧光粉涂覆方法应用和一种LED灯及其支架。
背景技术
LED灯的中文名称为发光二极管，英文全称为Light-Emitting Diode，由于其光效好，应用越来越广泛。
目前在COB、集成等大面积产品LED灯中需要荧光粉涂覆，以提高产品颜色一致及提高产品外量子效应，COB的英文名称为chip On board，中文名称为板上芯片封装。
其中，在荧光粉涂覆时，首先将荧光粉与胶水混合均匀，然后直接点入LED灯支架中，最后脱泡、烘烤成型。由于荧光胶层较厚，生产时易造成荧光粉沉淀不一，色温飘移大现象。同时胶体与LED灯支架结合时，气体难排除，易产生气泡不良。
因此，如何提供一种荧光粉涂覆方法，以解决荧光粉沉淀不一，色温偏差大的问题，是目前本领域技术人员亟待解决的技术问题。
发明内容
有鉴于此，本发明的目的在于提供一种荧光粉涂覆方法，以解决COB、集成产品LED灯的封装中荧光粉沉淀不一，色温偏差大的问题，本发明还提供一种LED灯及其支架。
为了达到上述目的，本发明提供如下技术方案：
一种荧光粉涂覆方法，用于COB、集成产品LED灯的封装，包括：步骤1）在安装晶片后的LED灯支架上均匀的涂覆荧光粉层；步骤2）对所述荧光粉层进行烘烤；步骤3）在所述荧光粉的上面点涂透明硅胶；步骤4）对所述透明硅胶进行烘烤成型。
优选的，上述步骤1）具体为喷涂所述荧光粉层。
优选的，上述步骤3）具体为所述透明硅胶的高度与所述LED灯支架上的边框的高度齐平。
本发明还提供一种LED灯支架，包括间隔的设置在所述LED灯支架的底部的晶片，还包括设置在所述晶片的上面和所述晶片的间隔中露出所述LED灯支架的底部的上面的荧光粉层，所述荧光粉层的上面设置有透明硅胶层。
优选的，上述的LED灯支架还包括设置在四周的边框，所述透明硅胶层的高度与所述LED灯支架上的边框的高度齐平。
本发明还提供一种LED灯，包括如上述的LED灯支架。
本发明提供的荧光粉涂覆方法，用于COB、集成产品LED灯的封装，包括：步骤1）在安装晶片后的LED灯支架上均匀的涂覆荧光粉层；步骤2）对所述荧光粉层进行烘烤；步骤3）在所述荧光粉的上面点涂透明硅胶；步骤4）对所述透明硅胶进行烘烤成型。整个过程中，将荧光粉层和透明硅胶分两步投放，先涂覆荧光粉层，然后点上透明硅胶，这样，就可以解决荧光粉沉淀不一，色温偏差大的问题。而且，先进行荧光粉层涂覆，然后再进行点透明硅胶，避免了LED灯支架在与透明硅胶结合时气体的残留而产生气泡。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的LED灯支架的结构示意图。
上图1中：
荧光粉层1、透明硅胶层2、LED灯支架3、晶片4。
具体实施方式
本发明实施例提供了一种荧光粉涂覆方法，以解决COB、集成产品LED灯的封装中的荧光粉沉淀不一，色温偏差大的问题。
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参考图1，图1为本发明实施例提供的LED灯支架的结构示意图。
本发明实施例提供的荧光粉涂覆方法，用于COB、集成产品LED灯的封装，包括：步骤1）在安装晶片4后的LED灯支架3上均匀的涂覆荧光粉层1；步骤2）对荧光粉层1进行烘烤；步骤3）在荧光粉层1的上面点涂透明硅胶；步骤4）对透明硅胶进行烘烤成型。整个过程中，将荧光粉层1和透明硅胶分两步投放，先涂覆荧光粉层1，然后点上透明硅胶，这样，就可以解决荧光粉沉淀不一，色温偏差大的问题。而且，先进行荧光粉层1涂覆，然后再进行点透明硅胶，避免了LED灯支架在与透明硅胶结合时气体的残留而产生气泡。
其中，COB的英文名称为chip On board，中文名称为板上芯片封装，是一种大面积的产品，本发明实施例提供的荧光粉涂覆方法适用于该种大面积的产品的LED灯的封装。集成产品的LED灯也是一种大面积的产品，本发明实施例提供的荧光粉涂覆方法也适用于该种大面积的产品的LED灯的封装。
其中，步骤1）中在具体的涂覆荧光粉时，具体为喷涂方式，以实现荧光粉的涂覆更加均匀。在涂覆完荧光粉之后，步骤2）对荧光粉层1进行烘烤固定，防止荧光粉与透明硅胶混合，并且使得荧光粉充分激发，提高出光效率。
其中，步骤3）具体为透明硅胶的高度与LED灯支架3上的边框的高度齐平，以保证较好的美观以及便于后续的封装。
本发明实施例还提供一种LED灯支架3，包括间隔的设置在LED灯支架3的底部的晶片4，还包括设置在晶片4的上面和晶片4的间隔中露出LED灯支架3的底部的上面的荧光粉层1，荧光粉层1的上面设置有透明硅胶层2。
荧光粉层1与透明硅胶层2是分开的，先涂覆荧光粉层1，然后点上透明硅胶，形成透明硅胶层2，那么就可以解决荧光粉沉淀不一，色温偏差大的问题。而且，先进行荧光粉层1涂覆，然后再进行点透明硅胶，避免了LED灯支架在与透明硅胶结合时气体的残留而产生气泡。
为了保证较好的美观以及便于后续的封装，LED灯支架3还包括设置在四周的边框，透明硅胶层2的高度与LED灯支架3上的边框的高度齐平。
本发明实施例还提供一种LED灯，包括如上述任意一项实施例所述的LED灯支架3，解决了现有技术中的LED灯支架上荧光粉沉淀不一，色温偏差大的问题。而且，先进行荧光粉层1涂覆，然后再进行点透明硅胶，避免了LED灯支架在与透明硅胶结合时气体的残留而产生气泡。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (6)

1.一种荧光粉涂覆方法，用于COB、集成产品LED灯的封装，其特征在于，包括：
步骤1）在安装晶片（4）后的LED灯支架（3）上均匀的涂覆荧光粉层；
步骤2）对所述荧光粉层（1）进行烘烤；
步骤3）在所述荧光粉层（1）的上面点涂透明硅胶；
步骤4）对所述透明硅胶进行烘烤成型。
2.根据权利要求1所述的荧光粉涂覆方法，其特征在于，所述步骤1）具体为喷涂方法实现所述荧光粉层1。
3.根据权利要求1所述的荧光粉涂覆方法，其特征在于，所述步骤3）具体为所述透明硅胶的高度与所述LED灯支架（3）上的边框的高度齐平。
4.一种LED灯支架，包括间隔的设置在所述LED灯支架（3）的底部的晶片（4），其特征在于，还包括设置在所述晶片（4）的上面和所述晶片（4）的间隔中露出所述LED灯支架（3）的底部的上面的荧光粉层（1），所述荧光粉层（1）的上面设置有透明硅胶层（2）。
5.根据权利要求4所述的LED灯支架，其特征在于，还包括设置在四周的边框，所述透明硅胶层2的高度与所述LED灯支架（3）上的边框的高度齐平。
6.一种LED灯，其特征在于，包括如上述权利要求4和权利要求5任意一项所述的LED灯支架（3）。
CN201310326867.1A 2013-07-30 2013-07-30 一种荧光粉涂覆方法和一种led灯及其支架 Pending CN104347778A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310326867.1A CN104347778A (zh) 2013-07-30 2013-07-30 一种荧光粉涂覆方法和一种led灯及其支架

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310326867.1A CN104347778A (zh) 2013-07-30 2013-07-30 一种荧光粉涂覆方法和一种led灯及其支架

Publications (1)

Publication Number Publication Date
CN104347778A true CN104347778A (zh) 2015-02-11

Family

ID=52502952

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310326867.1A Pending CN104347778A (zh) 2013-07-30 2013-07-30 一种荧光粉涂覆方法和一种led灯及其支架

Country Status (1)

Country Link
CN (1) CN104347778A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105161610A (zh) * 2015-09-25 2015-12-16 南京吉山光电科技有限公司 一种cob光源及其制备工艺

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105161610A (zh) * 2015-09-25 2015-12-16 南京吉山光电科技有限公司 一种cob光源及其制备工艺
CN105161610B (zh) * 2015-09-25 2017-08-25 南京吉山光电科技有限公司 一种cob光源及其制备工艺

Similar Documents

Publication Publication Date Title
CN109155346A (zh) 用于将磷光体施加至发光二极管的方法以及其设备
CN107077028A (zh) 用于颜色转换的基板、其制造方法以及包括其的显示装置
CN104393154A (zh) 一种led芯片级白光光源的晶圆级封装方法
US20150188005A1 (en) Light emitting diode package and method of manufacturing same
JP2015528209A (ja) Ｌｅｄモジュールの蛍光パウダーのスクリーン印刷技法
CN111063784A (zh) Led灯珠制备方法
CN103165039A (zh) 高对比度led显示模组及其制造方法
JP2013140965A (ja) ステンシル印刷によるダイ上部への蛍光体の堆積
GB0816788D0 (en) Package method and structure for a light emitting diode multi-layer
US20130161673A1 (en) Light emitting diode package having fluorescent film directly coated on light emitting diode die and method for manufacturing the same
JP6535965B2 (ja) 発光ダイオードの色変換用基板及びその製造方法
KR101641205B1 (ko) 발광각도 조절이 가능한 형광필름이 구비된 led 조명 모듈 제조 방법
CN104347778A (zh) 一种荧光粉涂覆方法和一种led灯及其支架
JP2015164234A (ja) Ｌｅｄ発光装置とその製造方法
US10276762B2 (en) Optoelectronic component
CN107331737B (zh) 一种led封装方法
CN104300067B (zh) 可挠式led封装
CN109638137A (zh) 倒装led芯片及直下式背光模组
CN105336835A (zh) 一种led封装结构及其封装方法
KR20120018605A (ko) Ｌｅｄ 패키지 및 그 제조 방법
US20170077363A1 (en) Method for manufacturing light-emitting diode package
CN105161606A (zh) 一种led封装方法
CN203910853U (zh) 一种smd led的封装结构
CN203859150U (zh) 发光元件及具有该发光元件的发光装置
JP2014212279A (ja) オプトデバイスの製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150211

WD01 Invention patent application deemed withdrawn after publication