CN104347457A - Chip peeling device applicable to fast replacement of ejector pin - Google Patents
Chip peeling device applicable to fast replacement of ejector pin Download PDFInfo
- Publication number
- CN104347457A CN104347457A CN201410477815.9A CN201410477815A CN104347457A CN 104347457 A CN104347457 A CN 104347457A CN 201410477815 A CN201410477815 A CN 201410477815A CN 104347457 A CN104347457 A CN 104347457A
- Authority
- CN
- China
- Prior art keywords
- thimble
- ejector pin
- jack
- clamp axis
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a chip peeling device applicable to fast replacement of an ejector pin. The chip peeling device comprises an ejector pin head mechanism, a transmission mechanism, an ejection driving mechanism, a Z-direction ascending and descending mechanism and a two-freedom-degree position regulating mechanism, wherein the ejector pin head mechanism is arranged on the transmission mechanism in a matched way and can realize the fast replacement of the ejector pin, the transmission mechanism is arranged on the ejection driving mechanism, is used for transmitting the ejector pin ejection driving force and is simultaneously matched with the ejection pin head mechanism to realize the vacuum degree of an inner cavity of an ejection pin cover, the ejection driving mechanism is arranged on the Z-direction ascending and descending mechanism, and is used for providing the driving force for ejecting and peeling a chip by the ejector pin and carrying out feedback control on the ejection height of the ejector pin, the Z-direction ascending and descending mechanism is arranged on the two-freedom-degree position regulating mechanism, the X and Y-direction position regulation is executed, and then, other assemblies arranged onto the Z-direction ascending and descending mechanism are simultaneously regulated to ascend to a work position. According to the chip peeling device, the fast replacement of the ejector pin can be realized through the plugging and the unplugging of the ejector pin head mechanism, and meanwhile, the ejection height of the ejector pin can be conveniently, automatically and precisely controlled.
Description
Technical field
The invention belongs to semiconductor die package equipment technical field, more specifically, relate to one and be suitable for the quick-replaceable chip peeling apparatus of thimble.
Background technology
Along with the development of circuit integration technique, more and more higher requirement is proposed to the packaging technology of electronic device.In electronic-packaging processes, the stripping pick process of chip is an important processing step, especially for chip from the blue film of wafer to the transfer first of pick-up head, be ensure that the key that subsequent technique process is normally carried out ensures.And in order to realize being separated of the blue film of chip and wafer smoothly, inevitably need to use chip peeling apparatus in electronic-packaging processes.
Type of action when stripping off device is peeled off by chip is divided into jack-up stripping type and vacuum stripping formula, and wherein the stripping of thimble jack-up adopts more chip to peel off mode in current RFID sealed in unit.But existing all kinds of stripping off device easily occurs wear phenomenon after thimble long-term work, cause pitch of enters to change and to cause chip to be peeled off insufficient and can not be picked, be thus difficult to meet the actual demand reducing the aspect such as turnover rate and quick-replaceable.
Such as, a kind of chip peeling apparatus is disclosed in the CN102074458A that inventor submits in early days, wherein by adopting thimble clamping and moving component and rotary driving part realizes integral elevating and chip is peeled off, but further research shows, control precision and the reliability aspect of said mechanism have much room for improvement, particularly when changing thimble, formality is loaded down with trivial details, need to turn on clamp nut, take off thimble outer cover, unclamp the lock-screw of thimble holder, take out multiple steps such as thimble, and be difficult to the jack-up height accurately controlling thimble; In addition, the thimble jack-up mode in CN102074458A and CN203631491U all adopts cam mechanism, and this mode makes the jack-up action of thimble relatively fixing, is namely difficult to meet the demands after thimble mild wear jack-up highly changes; CN102074458A and CN103311159A, in thimble jack-up process, highly there is no feedback procedure to the jack-up of thimble, thus highly accurately cannot control the jack-up of thimble.
Summary of the invention
For above defect or the Improvement requirement of prior art, the invention provides one and be suitable for the quick-replaceable chip peeling apparatus of thimble, wherein by its key component as the self structure of the parts such as thimble head, transmission mechanism, jack-up driving mechanism and Z-direction elevating mechanism and mutually set-up mode improve, namely the replacing to thimble should be able to be completed mutually at short notice, and be suitable for independently highly performing accurately control to the jack-up of thimble, advantages such as possessing compact conformation simultaneously, be convenient to manipulate, the high and reliability of operation precision is strong.
For achieving the above object, according to the present invention, provide one and be suitable for the quick-replaceable chip peeling apparatus of thimble, this device comprises thimble head mechanism, jack-up driving mechanism, transmission mechanism, Z-direction elevating mechanism and two degrees of freedom position adjusting mechanism, it is characterized in that:
Described thimble head mechanism comprises thimble cover, linear bearing, thimble clamp axis, thimble grip slipper, thimble and flexible member, and wherein linear bearing runs through and is arranged in thimble cover, and passing hole back-up ring performs axial restraint; The inside of thimble clamp axis is processed with mount along its axial direction, is then set in the inner ring of described linear bearing from upside entirety, and can makes relative to this linear axis and move axially; Thimble grip slipper is in the cartridge structure matched with thimble clamp axis, and its lower end is fixedly installed in this thimble clamp axis by screw-threaded engagement mode, and be in equally described linear axis to inner ring in; Thimble is fixedly mounted on the upper end of thimble grip slipper along vertical direction, aligns with the pore of thimble cover roof; Flexible member is then arranged between the upper surface of thimble grip slipper and the roof of thimble cover, thus when providing bounce to described thimble clamp axis after the work of thimble jack-up; In addition, have the air flue with thimble cover intracavity inter-connection in the interior of thimble cover, and be processed with cannelure in the sidewall surfaces of bottom;
Described jack-up driving mechanism comprises installation base plate, voice coil motor and grating scale, and wherein voice coil motor is arranged on installation base plate, and is horizontally installed with guide plate at its output; Grating scale is mounted on the side of described guide plate, and is detected in real time via the movement of grating scale read head to guide plate;
Described transmission mechanism comprises guide rod base, transmission base, guide rod, C nibs back-up ring and vacuum gas-tpe fitting, and wherein guide rod base is in bottom and described guide plate is connected, and together moves with it under the driving of guide plate; Transmission base is in top cooperation and is placed on described installation base plate, and described linear bearing is installed for holding equally in its inside; The lower end of guide rod is fixedly installed in described guide rod base, and its upper end then can be set in the inner ring of described linear bearing relatively movably, and comes in contact with described thimble clamp axis; C nibs back-up ring is arranged on the top of transmission base for matching with described cannelure, thus whole thimble head mechanism is removably installed in transmission mechanism; Vacuum gas-tpe fitting is arranged on the top-side of transmission base, and is connected with the air flue of described thimble head mechanism, produces suction-operated thus to the described pore of thimble cover roof;
The integral installation of described Z-direction elevating mechanism on described two degrees of freedom position adjusting mechanism, and its drive under realize X to on Y-direction direction position adjustment; This Z-direction elevating mechanism is also connected with described installation base plate by contiguous block, thus for jack-up driving mechanism and the transmission mechanism arranged on it and thimble head mechanism are together adjusted to service position along vertical direction, make thimble head mechanism near blue film, for jack-up chip is ready.
As further preferably, described Z-direction elevating mechanism comprises bracing frame, drive motors, lifting shaft and feed screw nut, and wherein drive motors is laterally arranged on bracing frame outside, and is provided with motor bevel gear on its output shaft; Lifting shaft is arranged on the inside of bracing frame along vertical direction, and its lower end is provided with the lifting shaft bevel gear be meshed with described motor bevel gear, thus the rotary motion of drive motors output shaft is converted to the rotary motion of lifting shaft; In addition, matching with described feed screw nut and connect in the upper end of lifting shaft, converts the rotary motion of lifting shaft to feed screw nut moving up and down thus, and then drive the described contiguous block be connected with this feed screw nut together to move around along vertical direction.
As further preferably, described thimble grip slipper after inversion equally in the cartridge structure matched with described thimble clamp axis, thus by regulate the extension elongation of thimble on this thimble grip slipper realize thimble change before and after high consistency.
As further preferably, the bottom of described thimble clamp axis is cambered surface, and and in arc surface point cantact between described guide rod; In addition, the top of this thimble clamp axis and the bottom connection of described flexible member (11) touch.
As further preferably, between described guide rod and transmission base, be provided with the first sealing ring, and the both sides being up and down positioned at described vacuum gas-tpe fitting at transmission base top are provided with the second sealing ring, guarantee the suction-operated to thimble cover top plenum thus.
As further preferably, be processed with screwed hole at the top of described transmission base, and have hole circlip groove in the inner side with this screwed hole same level height, then the square-section seal groove of annular is set separately in these circlip groove both sides, hole.
In general, the above technical scheme conceived by the present invention compared with prior art, mainly possesses following technical characteristic:
1, by improving the structure of thimble head mechanism, transmission mechanism and these key elements of jack-up driving mechanism and set-up mode thereof, can along linear bearing actuating force precisely transmitted with by thimble jack-up to desired location, realize the reliable contacts of thimble clamp axis and guide rod by means of the bounce of flexible member simultaneously;
2, installed by coordinating between the cannelure of thimble cover and the C nibs back-up ring of transmission mechanism, be convenient to the quick-replaceable performing thimble header structure, significantly improve operating efficiency; In addition, by designing the respective outer side edges between thimble grip slipper and thimble clamp axis, be also suitable for independently highly performing the jack-up of thimble in Renewal process accurately controlling;
3, because thimble head mechanism forms seal cavity jointly by vacuum air pipe structure, the first potted component and the second potted component etc. in the air flue of thimble cover and transmission mechanism, air-flow can produce suction-operated to the pore at thimble cover top fast in the seal cavity that this is relatively little, can vacuum be set up at short notice thus, improve the handling of chip stripping;
4, by increasing grating scale and grating ruler reading head and improve its set-up mode on jack-up driving mechanism, position feedback control can be provided in real time for voice coil motor, improve control precision further thus; In addition, by adopting the mode of Bevel Gear Transmission and screw nut driving to design Z-direction elevating mechanism, can realize moving the Z-direction of thimble head in less installing space, possessing the advantages such as operation precision is high, reliability is strong simultaneously.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram according to the chip peeling apparatus constructed by the preferred embodiment of the present invention;
Fig. 2 is the structure cutaway view of the head of thimble shown in Fig. 1 mechanism;
Fig. 3 is for showing the head of thimble shown in Fig. 2 mechanism for adjusting structural representation during pitch of enters;
Fig. 4 is the structural representation of transmission mechanism shown in Fig. 1;
Fig. 5 is that the driving mechanism of jack-up shown in Fig. 1 removes the structural representation after installing cover plate;
Fig. 6 is the overall structure schematic diagram of the lifting structure of Z-direction shown in Fig. 1;
Fig. 7 is the STRUCTURE DECOMPOSITION schematic diagram of the lifting structure of Z-direction shown in Fig. 1;
In all of the figs, identical Reference numeral is used for representing identical element or structure, wherein:
11 - plunger head 2 - transmission mechanism 3 - jacking driving mechanism 4 - Z to the lifting mechanism 5-2 degrees of freedom position adjusting mechanism 10 - thimble 11 - elastic element 12 - thimble clamping block 13 - linear bearing 14 - thimble clamping shaft 15 - thimble cover 16 - ring groove 17 - hole with ring 18 and airway 19 - porosity 20 - guide base 21 - guide 22 - drive base 23 - the first ring 24 - vacuum tube connectors 25 - the second seal 26 - C hole with ring 30 - voice coil motor 31- Guide plate 32 - sensor block slice 33 - extreme position transducer 34 - Grating ruler reading head 35 - Grating ruler reading head installed base 36 - grating ruler 37 - Rail stopper 38- mounting board 39- install the cover 40- motor 41- lifting mechanism of the support frame 42- earings 43- lifting shaft 44- screw nut 45- connecting block 46- bearing outer ring block 47- lifting shaft bevel gear 48- motor bevel gear 49- slide guide
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.In addition, if below in described each execution mode of the present invention involved technical characteristic do not form conflict each other and just can mutually combine.
Fig. 1 is the overall structure schematic diagram according to the chip peeling apparatus constructed by the preferred embodiment of the present invention.As shown in fig. 1, this chip peeling apparatus mainly comprises the assemblies such as thimble head mechanism 1, jack-up driving mechanism 3, transmission mechanism 2, Z-direction elevating mechanism 4 and two degrees of freedom position adjusting mechanism 5, wherein thimble head mechanism 1 cooperation is arranged on transmission mechanism 2, and the elementary cell as thimble replacing realizes the quick-replaceable function of thimble; Transmission mechanism 2 is arranged on jack-up driving mechanism 3, for transmitting thimble jack-up actuating force, matching simultaneously realize the vacuum degree of thimble cover inner chamber with thimble header structure 1; Jack-up driving mechanism 3 integral installation is on Z-direction elevating mechanism 4, and basic function is as thimble provides jack-up to peel off the actuating force of chip, and highly performs FEEDBACK CONTROL to the jack-up of thimble; Z-direction elevating mechanism 4 to be arranged on two degrees of freedom position adjusting mechanism 5 and to perform X by it, after the position of Y-direction adjusts, again the jack-up driving mechanism and other assemblies that are installed on self are together adjusted and rise to service position, make thimble head mechanism near blue film, for jack-up chip is ready.
Illustrate one by one according to each assembly above-mentioned of the present invention below with reference to Fig. 2-Fig. 7.
First, with reference to Fig. 2, show and analyse and observe state according to the structure of the thimble head mechanism constructed by the preferred embodiment of the present invention.As shown in Figure 2, this thimble head mechanism 1 comprises the elements such as thimble 10, flexible member 11, thimble grip slipper 12, linear bearing 13, thimble clamp axis 14, thimble cover 15, hole back-up ring 17, the wherein shell structure of thimble cover 15 inside in hollow, and have the air flue 18 with its intracavity inter-connection in its interior, and cannelure 16 is processed with in the sidewall surfaces of bottom, this cannelure 16 can coordinate with the C nibs back-up ring 26 in transmission mechanism 5, facilitate thimble head mechanism 1 to plug thus, realize the quick-replaceable of thimble 10.In thimble cover 15, run through and linear bearing 13 is installed, and passing hole back-up ring 17 performs axial restraint to it; Thimble clamp axis 14 is set to the inner ring of this linear bearing 13 from upside entirety cover, and can move axially relative to linear bearing 13, and in addition, the inside of this thimble clamp axis 14 is processed with mount along its axial direction, installs thimble grip slipper 12 for engaging; Thimble grip slipper 12 is the cartridge structure matched with thimble clamp axis 14, its lower end is fixedly installed in this thimble clamp axis by screw-threaded engagement mode, and be in the inner ring of described linear bearing 13 equally, in this way, as shown in exemplary in Fig. 3, the corresponding mode that thimble grip slipper 12 can be adopted to be upside down in thimble clamp axis 14, regulates thimble 10 to stretch out height in mode simple and easy to control thus, accurately realizes the high consistency that front and back changed by thimble 10 simultaneously.Thimble 10 is for example fixedly mounted on the upper end of thimble grip slipper 12 along vertical direction by holding screw, and align with the pore 19 of thimble cover 15 roof; Flexible member 11 is then provided with between the upper surface of thimble grip slipper 12 and the roof of thimble cover 15, thus when provide bounce can to after the work of thimble jack-up described thimble clamp axis 14, and then ensure the reliable contacts between thimble clamp axis 14 and the guide rod 21 mentioned below.
See Fig. 4, show the agent structure of the transmission mechanism according to the preferred embodiment of the present invention.As shown in Figure 4, this transmission mechanism comprises the elements such as guide rod base 20, guide rod 21, transmission base 22, vacuum gas-tpe fitting 24 and C nibs back-up ring 26, the guide plate 31 that wherein guide rod base 20 is in bottom and jack-up driving mechanism 3 is connected, and together moves with it under the driving of guide plate; Transmission base 22 is in top and for example lays on installation base plate 38 by the mode of cylindrical fit, and described linear bearing 13 is installed for holding equally in its inside; The lower end of guide rod 21 is fixedly installed in guide rod base 20, and its upper end then can be set in the inner ring of linear bearing 13 equally relatively movably, and comes in contact with thimble clamp axis 14; C nibs back-up ring 26 is arranged on the top of transmission base 22 for matching with described cannelure 16, thus whole thimble head mechanism 1 is removably installed in transmission mechanism 2; Vacuum gas-tpe fitting 24 is arranged on the top-side of transmission base 22, and is connected with the air flue 18 of thimble head mechanism 1, produces suction-operated thus to the pore 19 of thimble cover 15 roof.In addition, first sealing ring 23 can also be set in the middle of guide rod 21 and transmission base 22, and the both sides being up and down positioned at vacuum gas-tpe fitting 24 at transmission base 22 top arrange the second sealing ring 25, air flue 18 in such thimble head mechanism 1, the vacuum gas-tpe fitting 24 of transmission mechanism 2, the second sealing ring 25 of both sides and first sealing ring 23 etc. at guide rod place can form seal cavity jointly, air-flow produces suction-operated to the pore 19 at thimble cover 15 top fast by vacuum gas-tpe fitting 24 and air flue 18, and it is short to set up vacuum time.
See Fig. 5, show and remove the agent structure after installing cover plate according to the jack-up driving mechanism of the preferred embodiment of the present invention.As illustrated specifically in fig. 5, this jack-up driving mechanism mainly comprises installation base plate 38, voice coil motor 30 and grating scale 36 etc., and wherein voice coil motor 30 is arranged on installation base plate 38, and is horizontally installed with guide plate 31 at its output; Grating scale 36 is mounted on the side of this guide plate 31, and is detected in real time via the movement of grating scale read head 34 pairs of guide plates, should be able to perform the drive feedback to voice coil motor and control mutually.More specifically, this jack-up driving mechanism can also comprise transducer catch 32, limit level sensor 33, grating scale read head mounting base 35, guide track block 37 and install the elements such as cover plate 39, such as be provided with slide block guide rail 49 at installation base plate 38 inwall, guide track block 37 is arranged on anti-limited slip block below two side rails separately and falls; A pair limit level sensor 33 to be arranged on the left of installation base plate 38 etc.
See Fig. 6 and Fig. 7, in the present invention, also further research and improvement are done to the concrete structure of Z-direction elevating mechanism 4.Except the functional structure of the realized Z-direction movement of routine, drive motors 40, elevating mechanism bracing frame 41, bearing 42, lifting shaft 43, feed screw nut 44, contiguous block 45, bearing outer ring block 46, lifting shaft bevel gear 47, motor bevel gear 48 etc. can be comprised according to the Z-direction elevating mechanism 4 of the preferred embodiment of the present invention; Wherein drive motors 40 is arranged on elevating mechanism bracing frame 41 outside, motor bevel gear 48 is arranged on motor output shaft, lifting shaft bevel gear 47 is arranged on lifting shaft 43 by holding screw, by the cooperation that bevel gear is right, the rotary motion of motor 40 output shaft is converted to the rotary motion of lifting shaft 43; Match with feed screw nut 44 in lifting shaft 43 top, slide block guide rail 49 is connected with feed screw nut 45, play the guiding role to feed screw nut 45, makes the rotary motion of lifting shaft 43 convert moving up and down of feed screw nut 44 to; Contiguous block 45 is arranged on feed screw nut 44 front, realizes the connection with jack-up driving mechanism 3; Lay bearing 42 between the middle part of lifting shaft 43 and elevating mechanism bracing frame 41, the outer ring of this bearing 42 lower end contacts with bearing outer ring block 46, and bearing outer ring block 46 is fixedly mounted in elevating mechanism bracing frame 41; Lay bearing 42 between the top of lifting shaft 43 and elevating mechanism bracing frame 41, bearing 42 upper end has shaft block ring to be arranged on lifting shaft 43, carries out position limitation to bearing 42.
Below by the course of work of specific explanations according to said chip stripping off device of the present invention.
First, before strip operation, Z-direction elevating mechanism 4 is in down position, by regulating X, the Y-direction degree of freedom of two degrees of freedom position adjusting mechanism 5, can make chip center's position alignment on thimble 10 center and wafer;
Then, the motor 40 of Z-direction elevating mechanism 4 is opened, and drives thimble head mechanism 1 to rise to suitable service position.When starting to perform strip operation, voice coil motor 30 can drive guide rod 21 to move up and down, and due to guide rod 21 and the reliable contacts of thimble clamp axis 14, makes thimble 10 jack-up peel off chip, completes chip stripping process.In thimble 10 jack-up process, grating scale read head 34 pairs of grating scales 36 carry out reading, and are controlled voice coil motor 30 according to reading, realize the FEEDBACK CONTROL to thimble 10 jack-up height.
In addition, when thimble 10 excessive wear needs to change, make device be in state before work, directly manually pull out thimble head mechanism 1, and plug new thimble head mechanism 1, finally realize the quick-replaceable of thimble 10.In the thimble head mechanism 1 be replaced, for the height that stretches out of thimble 10 before and after ensureing to change is consistent, thimble grip slipper 12 can be adopted to be upside down in mode in thimble clamp axis 14 thimble 10 stretched out that highly to carry out adjustment fastening.
Those skilled in the art will readily understand; the foregoing is only preferred embodiment of the present invention; not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. be suitable for the quick-replaceable chip peeling apparatus of thimble, this device comprises thimble head mechanism, jack-up driving mechanism, transmission mechanism, Z-direction elevating mechanism and two degrees of freedom position adjusting mechanism, it is characterized in that:
Described thimble head mechanism (1) comprises thimble cover (15), linear bearing (13), thimble clamp axis (14), thimble grip slipper (12), thimble (10) and flexible member (11), wherein linear bearing (13) runs through and is arranged in thimble cover (15), and passing hole back-up ring (17) performs axial restraint; The inside of thimble clamp axis (14) is processed with mount along its axial direction, is then set in the inner ring of described linear bearing (13) from upside entirety, and can make relative to this linear axis and move axially; Thimble grip slipper (12) is the cartridge structure matched with thimble clamp axis (14), and its lower end is fixedly installed in this thimble clamp axis by screw-threaded engagement mode, and is in the inner ring of described linear bearing (13) equally; Thimble (10) is fixedly mounted on the upper end of thimble grip slipper (12) along vertical direction, align with the pore (19) of thimble cover (15) roof; Flexible member (11) is then arranged between the upper surface of thimble grip slipper (12) and the roof of thimble cover (15), thus when providing bounce to described thimble clamp axis (14) after the work of thimble jack-up; In addition, have and the air flue of thimble cover intracavity inter-connection (18) in the interior of thimble cover (15), and in the sidewall surfaces of bottom, be processed with cannelure (16);
Described jack-up driving mechanism (3) comprises installation base plate (38), voice coil motor (30) and grating scale (36), wherein voice coil motor (30) is arranged on installation base plate (38), and is horizontally installed with guide plate (31) at its output; Grating scale (36) is mounted on the side of described guide plate (31), and is detected in real time via grating scale read head (34) movement to guide plate;
Described transmission mechanism (2) comprises guide rod base (20), transmission base (22), guide rod (21), C nibs back-up ring (26) and vacuum gas-tpe fitting (24), wherein guide rod base (20) is in bottom and described guide plate (31) is connected, and together moves with it under the driving of guide plate; Transmission base (22) is in top cooperation and is placed on described installation base plate (38), and described linear bearing (13) is installed for holding equally in its inside; The lower end of guide rod (21) is fixedly installed in described guide rod base (20), its upper end then can be set in the inner ring of described linear bearing (13) relatively movably, and comes in contact with described thimble clamp axis (14); The top that C nibs back-up ring (26) is arranged on transmission base (22) is used for matching with described cannelure (16), thus whole thimble head mechanism (1) is removably installed in transmission mechanism (2); Vacuum gas-tpe fitting (24) is arranged on the top-side of transmission base (22), and be connected with the air flue (18) of described thimble head mechanism (1), thus suction-operated is produced to the described pore (19) of thimble cover (15) roof;
The integral installation of described Z-direction elevating mechanism (4) on described two degrees of freedom position adjusting mechanism (5), and its drive under realize X to on Y-direction direction position adjustment; This Z-direction elevating mechanism (4) is also connected with described installation base plate (38) by contiguous block (45), thus for jack-up driving mechanism (3) and the transmission mechanism (2) arranged on it and thimble head mechanism (1) are together adjusted to service position along vertical direction, make thimble head mechanism near blue film, for jack-up chip is ready.
2. chip peeling apparatus as claimed in claim 1, it is characterized in that, described Z-direction elevating mechanism (4) preferably includes bracing frame (41), drive motors (40), lifting shaft (43) and feed screw nut (44), wherein drive motors (40) is laterally arranged on bracing frame (41) outside, and on its output shaft, be provided with motor bevel gear (48); Lifting shaft (43) is arranged on the inside of bracing frame (41) along vertical direction, its lower end is provided with the lifting shaft bevel gear (47) be meshed with described motor bevel gear (48), thus the rotary motion of drive motors output shaft is converted to the rotary motion of lifting shaft; In addition, match with described feed screw nut (44) and connect in the upper end of lifting shaft (43), convert the rotary motion of lifting shaft to feed screw nut moving up and down thus, and then drive the described contiguous block (45) be connected with this feed screw nut together to move around along vertical direction.
3. chip peeling apparatus as claimed in claim 1 or 2, it is characterized in that, described thimble grip slipper (12) is same is after inversion the cartridge structure matched with described thimble clamp axis (14), the high consistency thus by regulating thimble (10) extension elongation on this thimble grip slipper to realize thimble replacing front and back.
4. the chip peeling apparatus as described in claim 1-3 any one, is characterized in that, the bottom of described thimble clamp axis (14) is cambered surface, and and in arc surface point cantact between described guide rod; In addition, the top of this this thimble clamp axis and the bottom connection of described flexible member (11) touch.
5. the chip peeling apparatus as described in claim 1-4 any one, it is characterized in that, the first sealing ring (23) is provided with between described guide rod (21) and transmission base (22), and the both sides being up and down positioned at described vacuum gas-tpe fitting (24) at transmission base (22) top are provided with the second sealing ring (25), guarantee the suction-operated to thimble cover (15) top plenum (19) thus.
6. chip peeling apparatus as claimed in claim 5, it is characterized in that, screwed hole is processed with at the top of described transmission base (22), and have hole circlip groove in the inner side with this screwed hole same level height, then the square-section seal groove of annular is set separately in these circlip groove both sides, hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410477815.9A CN104347457B (en) | 2014-09-17 | 2014-09-17 | Chip peeling device applicable to fast replacement of ejector pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410477815.9A CN104347457B (en) | 2014-09-17 | 2014-09-17 | Chip peeling device applicable to fast replacement of ejector pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104347457A true CN104347457A (en) | 2015-02-11 |
| CN104347457B CN104347457B (en) | 2017-01-11 |
Family
ID=52502796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410477815.9A Active CN104347457B (en) | 2014-09-17 | 2014-09-17 | Chip peeling device applicable to fast replacement of ejector pin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104347457B (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107552970A (en) * | 2017-10-31 | 2018-01-09 | 郭文英 | A kind of cooling device of laser engraving machine |
| CN107818941A (en) * | 2016-09-12 | 2018-03-20 | 捷进科技有限公司 | The manufacture method of semiconductor- fabricating device and semiconductor devices |
| CN108133907A (en) * | 2017-12-28 | 2018-06-08 | 北京中电科电子装备有限公司 | A kind of chip peeling apparatus |
| CN108243577A (en) * | 2018-02-09 | 2018-07-03 | 东莞市南部佳永电子有限公司 | Intelligent general-purpose PCB push pin device |
| CN109244018A (en) * | 2018-10-27 | 2019-01-18 | 中山市良泽精密模具有限公司 | Portable lossless blue membrane DNA chip mechanism for stripping |
| CN109935545A (en) * | 2019-01-22 | 2019-06-25 | 厦门市三安集成电路有限公司 | A kind of thimble mould group for provoking different wafer sizes |
| CN110596211A (en) * | 2019-10-22 | 2019-12-20 | 南方科技大学 | Vibration flat plate electrode connector |
| CN111398312A (en) * | 2020-02-19 | 2020-07-10 | 深圳市海铭德科技有限公司 | Thimble test head structure |
| CN112349648A (en) * | 2020-10-26 | 2021-02-09 | 北京北方华创微电子装备有限公司 | Lift needle mechanism and semiconductor process equipment |
| CN112885766A (en) * | 2021-03-23 | 2021-06-01 | 成都储翰科技股份有限公司 | Blue membrane chip ejecting device |
| CN113228244A (en) * | 2018-10-15 | 2021-08-06 | 贝思瑞士股份公司 | Tube core ejector |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3602113A (en) * | 1969-10-22 | 1971-08-31 | Blaw Knox Co | Automatic crowning system for pavers |
| EP0428792A2 (en) * | 1989-11-24 | 1991-05-29 | Fico B.V. | Single strip molding apparatus |
| US20030020509A1 (en) * | 2001-07-25 | 2003-01-30 | Integrated Device Technology, Inc. | Lead formation, assembly strip test, and singulation system |
| KR20080097903A (en) * | 2007-05-03 | 2008-11-06 | (주)제이티 | Transferring device for transferring substrate strip |
| CN103633006A (en) * | 2013-12-11 | 2014-03-12 | 中国电子科技集团公司第二研究所 | Wafer chip jacking mechanism |
-
2014
- 2014-09-17 CN CN201410477815.9A patent/CN104347457B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3602113A (en) * | 1969-10-22 | 1971-08-31 | Blaw Knox Co | Automatic crowning system for pavers |
| EP0428792A2 (en) * | 1989-11-24 | 1991-05-29 | Fico B.V. | Single strip molding apparatus |
| US20030020509A1 (en) * | 2001-07-25 | 2003-01-30 | Integrated Device Technology, Inc. | Lead formation, assembly strip test, and singulation system |
| KR20080097903A (en) * | 2007-05-03 | 2008-11-06 | (주)제이티 | Transferring device for transferring substrate strip |
| CN103633006A (en) * | 2013-12-11 | 2014-03-12 | 中国电子科技集团公司第二研究所 | Wafer chip jacking mechanism |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107818941A (en) * | 2016-09-12 | 2018-03-20 | 捷进科技有限公司 | The manufacture method of semiconductor- fabricating device and semiconductor devices |
| CN107818941B (en) * | 2016-09-12 | 2021-08-27 | 捷进科技有限公司 | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device |
| CN107552970B (en) * | 2017-10-31 | 2019-04-16 | 新昌县彭诚农业科技有限公司 | A kind of cooling device of laser engraving machine |
| CN107552970A (en) * | 2017-10-31 | 2018-01-09 | 郭文英 | A kind of cooling device of laser engraving machine |
| CN108133907B (en) * | 2017-12-28 | 2020-05-01 | 北京中电科电子装备有限公司 | Chip stripping off device |
| CN108133907A (en) * | 2017-12-28 | 2018-06-08 | 北京中电科电子装备有限公司 | A kind of chip peeling apparatus |
| CN108243577A (en) * | 2018-02-09 | 2018-07-03 | 东莞市南部佳永电子有限公司 | Intelligent general-purpose PCB push pin device |
| CN108243577B (en) * | 2018-02-09 | 2024-01-12 | 东莞市南部佳永电子有限公司 | Intelligent universal PCB thimble device |
| CN113228244A (en) * | 2018-10-15 | 2021-08-06 | 贝思瑞士股份公司 | Tube core ejector |
| CN109244018A (en) * | 2018-10-27 | 2019-01-18 | 中山市良泽精密模具有限公司 | Portable lossless blue membrane DNA chip mechanism for stripping |
| CN109935545A (en) * | 2019-01-22 | 2019-06-25 | 厦门市三安集成电路有限公司 | A kind of thimble mould group for provoking different wafer sizes |
| CN110596211A (en) * | 2019-10-22 | 2019-12-20 | 南方科技大学 | Vibration flat plate electrode connector |
| CN111398312A (en) * | 2020-02-19 | 2020-07-10 | 深圳市海铭德科技有限公司 | Thimble test head structure |
| CN112349648A (en) * | 2020-10-26 | 2021-02-09 | 北京北方华创微电子装备有限公司 | Lift needle mechanism and semiconductor process equipment |
| CN112349648B (en) * | 2020-10-26 | 2023-12-22 | 北京北方华创微电子装备有限公司 | Needle lifting mechanism and semiconductor process equipment |
| CN112885766A (en) * | 2021-03-23 | 2021-06-01 | 成都储翰科技股份有限公司 | Blue membrane chip ejecting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104347457B (en) | 2017-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104347457A (en) | Chip peeling device applicable to fast replacement of ejector pin | |
| CN204130501U (en) | One is suitable for the quick-replaceable chip peeling apparatus of thimble | |
| CN104057273B (en) | Fiber adapter Automated assembly mechanical hand | |
| CN106794582B (en) | Suction nozzle | |
| CN104900757A (en) | Device and method for automatically cleaving battery pieces | |
| CN107486701B (en) | Rotor press-fitting system and press-fitting method | |
| CN102244208B (en) | Manufacturing method and equipment of metal battery shell | |
| CN214477372U (en) | Radiating cover mounting equipment | |
| CN219457558U (en) | Deviation rectifying mechanism for wafer transmission | |
| CN206292312U (en) | Soft arranging wire contraposition adjustment test platform based on optical alignment | |
| CN210818353U (en) | Assembly line for switching and secondary material conveying mechanism comprising same | |
| CN210147384U (en) | Automatic net pasting mechanism | |
| JP2020186122A (en) | Transfer device of work transport pallet | |
| CN216271899U (en) | Carrying and abutting-pressing integrated equipment | |
| CN209868633U (en) | Power starting device for workpiece machining clamp | |
| CN109699123A (en) | A kind of automatic scoreboard method | |
| CN102645715B (en) | Production equipment for assembling filter lens in BOSA (Bidi Optical Sub Assembly) | |
| CN210174182U (en) | Telescopic manipulator and bending machine comprising same | |
| CN210098642U (en) | Sheet stamping device | |
| CN114012024A (en) | Mechanical device for realizing automatic feeding and press mounting of porous multi-position aluminum profile | |
| CN110370789B (en) | Linear screen printer | |
| CN110191595B (en) | Automatic plugging device | |
| CN108963714B (en) | Jack body conveying mechanism and socket assembling machine | |
| CN213413250U (en) | Screen printing machine | |
| CN215470769U (en) | Device suitable for circular product positioning |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |