CN104347457B - Chip peeling device applicable to fast replacement of ejector pin - Google Patents
Chip peeling device applicable to fast replacement of ejector pin Download PDFInfo
- Publication number
- CN104347457B CN104347457B CN201410477815.9A CN201410477815A CN104347457B CN 104347457 B CN104347457 B CN 104347457B CN 201410477815 A CN201410477815 A CN 201410477815A CN 104347457 B CN104347457 B CN 104347457B
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- thimble
- ejector pin
- jack
- axle
- guide rod
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a chip peeling device applicable to fast replacement of an ejector pin. The chip peeling device comprises an ejector pin head mechanism, a transmission mechanism, an ejection driving mechanism, a Z-direction ascending and descending mechanism and a two-freedom-degree position regulating mechanism, wherein the ejector pin head mechanism is arranged on the transmission mechanism in a matched way and can realize the fast replacement of the ejector pin, the transmission mechanism is arranged on the ejection driving mechanism, is used for transmitting the ejector pin ejection driving force and is simultaneously matched with the ejection pin head mechanism to realize the vacuum degree of an inner cavity of an ejection pin cover, the ejection driving mechanism is arranged on the Z-direction ascending and descending mechanism, and is used for providing the driving force for ejecting and peeling a chip by the ejector pin and carrying out feedback control on the ejection height of the ejector pin, the Z-direction ascending and descending mechanism is arranged on the two-freedom-degree position regulating mechanism, the X and Y-direction position regulation is executed, and then, other assemblies arranged onto the Z-direction ascending and descending mechanism are simultaneously regulated to ascend to a work position. According to the chip peeling device, the fast replacement of the ejector pin can be realized through the plugging and the unplugging of the ejector pin head mechanism, and meanwhile, the ejection height of the ejector pin can be conveniently, automatically and precisely controlled.
Description
Technical field
The invention belongs to semiconductor die package equipment technical field, be suitable to more particularly, to one
The quick-replaceable chip peeling apparatus of thimble.
Background technology
Along with the development of circuit integration technique, the packaging technology of electronic device is proposed more and more higher
Requirement.In electronic-packaging processes, the stripping pick process of chip is an important processing step,
Especially for chip from the transfer first of wafer indigo plant film to pick-up head, it is to ensure that subsequent technique process is normally entered
The crucial guarantee of row.And separate with wafer indigo plant film to realize chip smoothly, in electronic-packaging processes
Inevitably need to use chip peeling apparatus.
Model of action when stripping off device is peeled off by chip is divided into jack-up stripping type and vacuum stripping formula, wherein
It is to use more chip to peel off mode in current RFID sealed in unit that thimble jack-up is peeled off.But, existing
All kinds of stripping off devices having easily occur wear phenomenon after thimble long-term work, cause thimble height to produce and become
Change and cause chip peel off insufficient and can not be picked, thus be difficult to meet and reduce turnover rate and quickly the most more
The actual demand of aspect such as change.
Such as, the CN102074458A that inventor submits in early days discloses a kind of chip peeling apparatus,
Wherein by using thimble clamping to realize integral elevating and core with moving component and rotary driving part
Sheet is peeled off, but further investigations have shown that, control accuracy and the reliability aspect of said mechanism need to be carried
Height, particularly when changing thimble, formality is loaded down with trivial details, needs to turn on clamp nut, takes off thimble outer housing, pine
Drive the lock-screw of thimble holder, take out multiple steps such as thimble, and be difficult to accurately control thimble
Jack-up height；Additionally, the thimble jack-up mode in CN102074458A and CN203631491U all uses
Cam mechanism, this mode makes the jack-up action of thimble be relatively fixed, high thimble mild wear jack-up
Degree is i.e. difficult to meet requirement after producing change；CN102074458A and CN103311159A is thimble jack-up
During, the jack-up of thimble highly be there is no feedback procedure, thus the jack-up of thimble highly cannot be carried out
Accurately control.
Summary of the invention
For disadvantages described above or the Improvement requirement of prior art, the invention provides one, to be suitable to thimble fast
The chip peeling apparatus that speed is changed, wherein by its key component such as thimble head, drive mechanism, top
The self structure and the mutually set-up mode thereof that play the parts such as drive mechanism and Z-direction elevating mechanism improve,
Should be able to the most i.e. complete the replacing to thimble mutually, and be suitable to the autonomous jack-up height to thimble
Perform accurately to control, be provided simultaneously with compact conformation, to be easy to manipulation, operation precision high and highly reliable etc.
Advantage.
For achieving the above object, it is proposed, according to the invention, provide one and be suitable to the quick-replaceable chip of thimble
Stripping off device, this device includes thimble head mechanism, jack-up drive mechanism, drive mechanism, Z-direction elevator
Structure and two degrees of freedom position adjusting mechanism, it is characterised in that:
Described thimble head mechanism include thimble cover, linear bearing, thimble clamping axle, thimble grip slipper,
Thimble and flexible member, during wherein linear bearing is installed through thimble cover, and held by hole back-up ring
Row axial restraint；The inside of thimble clamping axle is machined with mount along its axial direction, then from upside
Entirety is set in the inner ring of described linear bearing, and can make relative to this linear axis and move axially；
Thimble grip slipper is in the cartridge structure matched with thimble clamping axle, and its lower end is by screw-threaded engagement mode
It is fixedly installed in this thimble clamping axle, and is similarly in the inner ring that described straight line is axial；Thimble along
Vertical direction is fixedly mounted on the upper end of thimble grip slipper, aligns with the pore of thimble cover roof；Bullet
Property element is then arranged between the upper surface of thimble grip slipper and the roof of thimble cover, thus when thimble top
Bounce is provided to described thimble clamping axle after playing work；Additionally, the interior at thimble cover has
With the air flue of thimble cover intracavity inter-connection, and in the sidewall surfaces of bottom, it is machined with cannelure；
Described jack-up drive mechanism includes installation base plate, voice coil motor and grating scale, wherein voice coil motor
It is arranged on installation base plate, and is horizontally installed with guide plate at its outfan；Grating scale is mounted on described
The side of guide plate, and via grating scale read head, the movement of guide plate is detected in real time；
Described drive mechanism includes guide rod base, transmission base, guide rod, c-type hole back-up ring and vacuum gas
Pipe joint, wherein guide rod base is in bottom and is connected with described guide plate, and in the driving of guide plate
Under together move with it；Transmission base is in top and coordinates and be placed on described installation base plate, it interior
Portion is equally used for accommodating installs described linear bearing；The lower end of guide rod is fixedly installed in described guide rod base,
Its upper end then can be set in the inner ring of described linear bearing relatively movably, and presss from both sides with described thimble
Hold axle to come in contact；C-type hole back-up ring is arranged on the top of transmission base for matching with described cannelure
Close, thus whole thimble head mechanism is removably installed in drive mechanism；Vacuum gas-tpe fitting is arranged
In the top-side of transmission base, and it is connected, thus to thimble with the air flue of described thimble head mechanism
The described pore of cover roof produces adsorption；
Described Z-direction elevating mechanism integral installation is on described two degrees of freedom position adjusting mechanism, and at it
Realize under driving X to the position adjustment on Y-direction direction；This Z-direction elevating mechanism is also by contiguous block
Be connected with described installation base plate, be consequently for jack-up drive mechanism and the drive mechanism that is arranged on and
Thimble head mechanism is together adjusted to operating position along vertical direction, make thimble head mechanism near blue film,
Ready for jack-up chip.
As it is further preferred that described Z-direction elevating mechanism includes bracing frame, drives motor, lifting
Axle and feed screw nut, wherein drive motor to be transversely mounted on outside bracing frame, and set on its output shaft
It is equipped with motor bevel gear；Lifting shaft is placed in the vertical direction the inside at bracing frame, its lower end peace
Equipped with the lifting shaft bevel gear being meshed with described motor bevel gear, thus motor output shaft will be driven
Rotary motion is converted into the rotary motion of lifting shaft；Additionally, the upper end of lifting shaft and described feed screw nut
Match connection, and the rotary motion of lifting shaft is thus converted into the up and down motion of feed screw nut, and then
The described contiguous block being connected with this feed screw nut is driven together to move back and forth along vertical direction.
As it is further preferred that described thimble grip slipper clamps in described thimble after inversion equally
The cartridge structure that axle matches, comes from there through regulation thimble extension elongation on this thimble grip slipper
Realize the high consistency before and after thimble is changed.
As it is further preferred that described thimble clamping axle bottom be cambered surface, and with described guide rod it
Between in arc surface point cantact；Additionally, the top of this thimble clamping axle and described flexible member (11)
Bottom connection touches.
As it is further preferred that be provided with the first sealing ring between described guide rod and transmission base,
And the both sides up and down being positioned at described vacuum gas-tpe fitting at transmission base top are provided with the second sealing ring,
Therefore ensure that the adsorption to thimble cover top plenum.
As it is further preferred that be threaded hole at the top of described transmission base, and with this
The inner side of screwed hole same level height has hole circlip groove, then each in these circlip groove both sides, hole
From the square-section seal groove arranging annular.
In general, by the contemplated above technical scheme of the present invention compared with prior art, mainly
Possess following technical characteristic:
1, by thimble head mechanism, drive mechanism and the structure of jack-up these key elements of drive mechanism
And set-up mode improves, it is possible to precisely transmitted to push up along linear bearing by driving force
Pin jack-up is to desired location, and the bounce by means of flexible member realizes thimble clamping axle and guide rod simultaneously
Reliable contacts；
2, by coordinating installation between the cannelure of thimble cover and the c-type hole back-up ring of drive mechanism,
It is easy to perform the quick-replaceable of thimble header structure, significantly improves operating efficiency；Additionally, by thimble
Respective outer side edges design between grip slipper and thimble clamping axle, is further adapted for autonomous to top in Renewal process
The jack-up of pin highly performs accurately control；
3, can be tied by the vacuum trachea in the air flue of thimble cover and drive mechanism due to thimble head mechanism
Structure, the first potted component and the second potted component etc. collectively form sealing space, and air-flow can be in this phase
Quickly the pore at thimble cover top is produced adsorption, thus in short-term in less sealing space
Interior vacuum of can setting up, it is handling that raising chip is peeled off；
4, by increasing grating scale and grating ruler reading head in jack-up drive mechanism and to its set-up mode
Improve, it is possible to position feedback control is provided in real time for voice coil motor, improves control the most further
Precision；Lift additionally, design Z-direction by the way of using Bevel Gear Transmission and screw nut driving
Mechanism, it is possible to realize the Z-direction of thimble head is moved in less installing space, be provided simultaneously with action
The advantages such as precision is high, highly reliable.
Accompanying drawing explanation
Fig. 1 is to illustrate according to the overall structure of the chip peeling apparatus constructed by the preferred embodiment of the present invention
Figure；
Fig. 2 is the structure sectional view of the mechanism of thimble head shown in Fig. 1；
Fig. 3 is that structure during for showing the mechanism of thimble head shown in Fig. 2 for adjusting thimble height is shown
It is intended to；
Fig. 4 is the structural representation of drive mechanism shown in Fig. 1；
Fig. 5 is the structural representation that jack-up drive mechanism shown in Fig. 1 removes after installing cover plate；
Fig. 6 is the overall structure schematic diagram of Z-direction lifting structure shown in Fig. 1；
Fig. 7 is the STRUCTURE DECOMPOSITION schematic diagram of Z-direction lifting structure shown in Fig. 1；
In all of the figs, identical reference is used for representing identical element or structure, wherein:
1-thimble head mechanism 2-drive mechanism 3-jack-up drive mechanism 4-Z is to elevating mechanism 5-
Position adjusting mechanism 10-thimble 11-flexible member 12-thimble grip slipper 13-is straight for two degrees of freedom
Bobbin holds 14-thimble clamping axle 15-thimble cover 16-cannelure 17-hole back-up ring 18-gas
Road 19-pore 20-guide rod base 21-guide rod 22-transmission base 23-the first sealing ring
24-vacuum gas-tpe fitting 25-the second sealing ring 26-C type hole back-up ring 30-voice coil motor 31-
Guide plate 32-sensor catch 33-limit level sensor 34-grating scale read head 35-grating scale
Read head is installed pedestal 36-grating scale 37-guide track block 38-installation base plate 39-and is installed cover plate
40-motor 41-elevating mechanism bracing frame 42-bearing 43-lifting shaft 44-feed screw nut 45-
Contiguous block 46-bearing outer ring block 47-lifting shaft bevel gear 48-motor bevel gear 49-slide block
Guide rail
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing
And embodiment, the present invention is further elaborated.Should be appreciated that described herein specifically
Embodiment only in order to explain the present invention, is not intended to limit the present invention.Additionally, it is disclosed below
Just may be used as long as technical characteristic involved in each embodiment of the present invention does not constitutes conflict each other
To be mutually combined.
Fig. 1 is to illustrate according to the overall structure of the chip peeling apparatus constructed by the preferred embodiment of the present invention
Figure.As shown in fig. 1, this chip peeling apparatus mainly includes thimble head mechanism 1, jack-up drive mechanism
3, the assembly such as drive mechanism 2, Z-direction elevating mechanism 4 and two degrees of freedom position adjusting mechanism 5, wherein
Thimble head mechanism 1 coordinates and is arranged on drive mechanism 2, and the elementary cell changed as thimble realizes
The quick-replaceable function of thimble；Drive mechanism 2 is arranged in jack-up drive mechanism 3, is used for transmitting top
Pin jack-up driving force, matches with thimble header structure 1 simultaneously and realizes the vacuum of thimble cover inner chamber；Top
Rise drive mechanism 3 integral installation on Z-direction elevating mechanism 4, basic function be for thimble provide top
Act the driving force peeling off chip, and the jack-up of thimble is highly performed feedback control；Z-direction elevating mechanism 4
After being then arranged on two degrees of freedom position adjusting mechanism 5 and be executed by the position adjustment of X, Y-direction,
Again the jack-up drive mechanism and other assemblies that are installed on self are together adjusted and rise to operating position, make
The close blue film of thimble head mechanism, ready for jack-up chip.
Each assembly above-mentioned according to the present invention is illustrated one by one below with reference to Fig. 2-Fig. 7.
First, with reference to Fig. 2, it is shown that according to the thimble head mechanism constructed by the preferred embodiment of the present invention
Structure section view state.As shown in Figure 2, this thimble head mechanism 1 include thimble 10, flexible member 11,
Thimble grip slipper 12, linear bearing 13, thimble clamping axle 14, thimble cover 15, hole back-up ring 17 etc.
Element, the wherein internal shell structure in hollow of thimble cover 15, and have and it in its interior
The air flue 18 of intracavity inter-connection, and in the sidewall surfaces of bottom, it is machined with cannelure 16, this cannelure
16 can coordinate with the c-type hole back-up ring 26 in drive mechanism 5, thus facilitate thimble head mechanism 1 to carry out
Plug, it is achieved the quick-replaceable of thimble 10.In thimble cover 15, run through and linear bearing 13 be installed,
And by hole back-up ring 17, it is performed axial restraint；Thimble clamping axle 14 is set to from upside entirety set
In the inner ring of this linear bearing 13, and can move axially relative to linear bearing 13, additionally, should
The inside of thimble clamping axle 14 is machined with mount along its axial direction, is used for engaging installation thimble clamping
Seat 12；Thimble grip slipper 12 is in the cartridge structure matched with thimble clamping axle 14, and its lower end is passed through
Screw-threaded engagement mode is fixedly installed in this thimble clamping axle, and is similarly in the interior of described linear bearing 13
In circle, in this way, as shown in exemplary in Fig. 3, thimble grip slipper 12 can be used accordingly to fall
Put the mode at thimble clamping axle 14, in the way of simple and easy to control, thus regulate thimble 10 stretch out height,
Accurately realize the high consistency before and after thimble 10 is changed simultaneously.Thimble 10 such as passes through holding screw
Be fixedly mounted on the upper end of thimble grip slipper 12 along vertical direction, and with the gas of thimble cover 15 roof
Hole 19 aligns；Bullet then it is provided with between upper surface and the roof of thimble cover 15 of thimble grip slipper 12
Property element 11, thus when thimble jack-up work after can give described thimble clamping axle 14 bounce be provided,
And then ensure the reliable contacts between thimble clamping axle 14 and the guide rod 21 mentioned below.
See Fig. 4, it is shown that according to the agent structure of the drive mechanism of the preferred embodiment of the present invention.Such as figure
Shown in 4, this drive mechanism includes guide rod base 20, guide rod 21, transmission base 22, vacuum trachea
Joint 24 and the c-type hole elements such as back-up ring 26, wherein guide rod base 20 is in bottom and drives with jack-up
The guide plate 31 of motivation structure 3 is connected, and together moves with it under the driving of guide plate；Transmission base
Seat 22 is in top and such as lays by the way of cylindrical fit on installation base plate 38, and its inside is same
Sample is used for accommodating the described linear bearing 13 of installation；The lower end of guide rod 21 is fixedly installed in guide rod base 20,
Its upper end then can be set in the inner ring of linear bearing 13 the most relatively movably, and clamps with thimble
Axle 14 comes in contact；C-type hole back-up ring 26 be arranged on the top of transmission base 22 for described ring
Shape groove 16 matches, and thus whole thimble head mechanism 1 is removably installed in drive mechanism 2；Very
Air hose joint 24 is arranged on the top-side of transmission base 22, and with the air flue of thimble head mechanism 1
18 are connected, and thus the pore 19 of thimble cover 15 roof are produced adsorption.Further, it is also possible to
In the middle of guide rod 21 and transmission base 22, the first sealing ring 23 is set, and in position, transmission base 22 top
Second sealing ring 25 is set in the both sides up and down of vacuum gas-tpe fitting 24, in such thimble head mechanism 1
Air flue 18, the vacuum gas-tpe fitting 24 of drive mechanism 2, the second sealing ring 25 and guide rod of both sides
First sealing ring 23 etc. at place can be collectively forming sealing space, and air-flow passes through vacuum gas-tpe fitting 24
Quickly the pore 19 at thimble cover 15 top is produced adsorption with air flue 18, and when setting up vacuum
Between short.
See Fig. 5, it is shown that remove installation cover plate according to the jack-up drive mechanism of the preferred embodiment of the present invention
After agent structure.As illustrated specifically in fig. 5, this jack-up drive mechanism mainly includes installation base plate
38, voice coil motor 30 and grating scale 36 etc., wherein voice coil motor 30 is arranged on installation base plate 38,
And it is horizontally installed with guide plate 31 at its outfan；Grating scale 36 is mounted on the side of this guide plate 31,
And via grating scale read head 34, the movement of guide plate is detected in real time, it is able to carry out voice coil loudspeaker voice coil accordingly
The drive feedback of motor and control.More specifically, this jack-up drive mechanism can also include that sensor keeps off
Sheet 32, limit level sensor 33, grating scale read head are installed pedestal 35, guide track block 37 and install lid
Plate 39 element such as grade, such as, be provided with slide block guide rail 49 at installation base plate 38 inwall, and guide track block 37 is each
Self installation anti-limited slip block below two side rails falls；A pair limit level sensor 33 is arranged on installation base
On the left of plate 38 etc..
See Fig. 6 and Fig. 7, the concrete structure of Z-direction elevating mechanism 4 has also been made further by the present invention
Research and improvement.In addition to the functional structure that conventional realized Z-direction moves, according to the present invention
The Z-direction elevating mechanism 4 of preferred embodiment can include driving motor 40, elevating mechanism bracing frame 41, axle
Hold 42, lifting shaft 43, feed screw nut 44, contiguous block 45, bearing outer ring block 46, lifting axial cone
Gear 47, motor bevel gear 48 etc.；Motor 40 is wherein driven to be arranged on outside elevating mechanism bracing frame 41
Portion, motor bevel gear 48 is arranged on motor output shaft, and lifting shaft bevel gear 47 passes through holding screw
It is arranged on lifting shaft 43, by the cooperation of bevel gear pair, by the rotary motion of motor 40 output shaft
It is converted into the rotary motion of lifting shaft 43；Match with feed screw nut 44 in lifting shaft 43 top, slide block
Guide rail 49 is connected with feed screw nut 45, play the guiding role feed screw nut 45 so that lifting shaft 43
Rotary motion be converted into the up and down motion of feed screw nut 44；Contiguous block 45 is arranged on feed screw nut 44
Front, it is achieved with the connection of jack-up drive mechanism 3；The middle part of lifting shaft 43 and elevating mechanism bracing frame
Laying bearing 42 between 41, the outer ring of this bearing 42 lower end contacts with bearing outer ring block 46,
Bearing outer ring block 46 is fixedly mounted in elevating mechanism bracing frame 41；The top of lifting shaft 43 and liter
Laying bearing 42 between descending mechanism bracing frame 41, bearing 42 upper end has shaft block ring to be arranged on lifting
On axle 43, bearing 42 is carried out position limitation.
Will be explained in the work process of the said chip stripping off device according to the present invention below.
First, before strip operation, Z-direction elevating mechanism 4 is in down position, can be by regulation
The X of two degrees of freedom position adjusting mechanism 5, Y-direction degree of freedom so that thimble 10 center and core on wafer
Sheet center is directed at；
Then, the motor 40 of Z-direction elevating mechanism 4 is opened, and drives thimble head mechanism 1 to rise to suitable
Operating position.When starting to perform strip operation, voice coil motor 30 can drive guide rod 21 to move up and down,
Due to the reliable contacts of guide rod 21 with thimble clamping axle 14, make thimble 10 jack-up peel off chip, complete
Chip stripping process.During thimble 10 jack-up, grating scale 36 is read by grating scale read head 34
Number, and according to reading, voice coil motor 30 is controlled by, it is achieved the feedback to thimble 10 jack-up height
Control.
Additionally, when thimble 10 excessive wear needs to change, make device be in state before work, directly
Manually pull out thimble head mechanism 1, and plug new thimble head mechanism 1, finally realize thimble 10
Quick-replaceable.In the thimble head mechanism 1 being replaced, for ensureing the height that before and after changing, thimble 10 stretches out
Degree is consistent, and thimble grip slipper 12 can be used to be upside down in the mode on thimble clamping axle 14 to thimble 10
Stretch out and be highly adjusted fastening.
As it will be easily appreciated by one skilled in the art that and the foregoing is only presently preferred embodiments of the present invention,
Not in order to limit the present invention, all made within the spirit and principles in the present invention any amendment, etc.
With replacement and improvement etc., should be included within the scope of the present invention.
Claims (6)
1. be suitable to the quick-replaceable chip peeling apparatus of thimble, this device include thimble head mechanism,
Jack-up drive mechanism, drive mechanism, Z-direction elevating mechanism and two degrees of freedom position adjusting mechanism, its feature
It is:
Described thimble head mechanism (1) includes that thimble cover (15), linear bearing (13), thimble clamp
Axle (14), thimble grip slipper (12), thimble (10) and flexible member (11), wherein this is straight
Bobbin holds (13) and is installed through in described thimble cover (15), and is held by hole back-up ring (17)
Row axial restraint；The inside of this thimble clamping axle (14) is machined with mount along its axial direction, so
After be set in the inner ring of described linear bearing (13) from upside entirety, and can be relative to this linear axis
Make and move axially；This thimble grip slipper (12) clamps what axle (14) matched in described thimble
Cartridge structure, its lower end is fixedly installed in this thimble clamping axle by screw-threaded engagement mode, and locates equally
In the inner ring of described linear bearing (13)；This thimble (10) is fixedly mounted on along vertical direction
The upper end of described thimble grip slipper (12), with pore (19) phase of described thimble cover (15) roof
Alignment；This flexible member (11) is then arranged on the upper surface of described thimble grip slipper (12) with described
Between the roof of thimble cover (15), clamp axle thus to after described thimble jack-up works described thimble
(14) bounce is provided；Additionally, the interior at this thimble cover (15) has and this thimble cover
The air flue (18) of intracavity inter-connection, and in the sidewall surfaces of bottom, it is machined with cannelure (16)；
Described jack-up drive mechanism (3) includes installation base plate (38), voice coil motor (30) and grating
Chi (36), wherein this voice coil motor (30) is arranged on described installation base plate (38), and at it
Outfan is horizontally installed with guide plate (31)；This grating scale (36) is mounted on described guide plate (31)
Side, and via grating scale read head (34), the movement of this guide plate is detected in real time；
Described drive mechanism (2) include guide rod base (20), transmission base (22), guide rod (21),
C-type hole back-up ring (26) and vacuum gas-tpe fitting (24), wherein this guide rod base (20) is in down
Portion is connected with described guide plate (31), and together moves with it under the driving of this guide plate；Should
Transmission base (22) is in top cooperation and is placed on described installation base plate (38), and its inside is same
Sample is used for accommodating the described linear bearing of installation (13)；The lower end of this guide rod (21) is fixedly installed in institute
Stating guide rod base (20), its upper end then can be set in described linear bearing (13) relatively movably
Inner ring in, and with described thimble clamping axle (14) come in contact；This c-type hole is with back-up ring (26)
It is arranged on the top of described transmission base (22) for matching, thus with described cannelure (16)
Whole described thimble head mechanism (1) is removably installed in described drive mechanism (2)；This vacuum
Gas-tpe fitting (24) is arranged on the top-side of described transmission base (22), and with described thimble head
The described air flue (18) of mechanism (1) is connected, thus described to described thimble cover (15) roof
Pore (19) produces adsorption；
The integral installation of described Z-direction elevating mechanism (4) is described two degrees of freedom position adjusting mechanism (5)
On, and its drive under realize X to the position adjustment on Y-direction direction；This Z-direction elevating mechanism (4)
It is connected with described installation base plate (38) also by contiguous block (45), is consequently for driving described jack-up
Motivation structure (3) and the described drive mechanism (2) being arranged on and described thimble head mechanism (1) along
Vertical direction is together adjusted to operating position, makes this close blue film of thimble head mechanism, does for jack-up chip
Good preparation.
2. chip peeling apparatus as claimed in claim 1, it is characterised in that described Z-direction elevator
Structure (4) includes bracing frame (41), drives motor (40), lifting shaft (43) and feed screw nut (44),
Wherein this driving motor (40) is transversely mounted on support frame as described above (41) outside, and at its output shaft
On be provided with motor bevel gear (48)；This lifting shaft (43) is placed in the vertical direction at described
The inside of support (41), its lower end is provided with the liter being meshed with described motor bevel gear (48)
Fall shaft bevel gears (47), is thus converted into described liter by the rotary motion of described driving motor output shaft
The rotary motion of fall axle；Additionally, the upper end of this lifting shaft (43) and described feed screw nut (44) phase
Coordinate and couple, thus the rotary motion of this lifting shaft is converted into the up and down motion of this feed screw nut, enters
And drive the described contiguous block (45) being connected with this feed screw nut together to move back and forth along vertical direction.
3. chip peeling apparatus as claimed in claim 1 or 2, it is characterised in that described thimble presss from both sides
Hold seat (12) after inversion equally in the cartridge structure matched with described thimble clamping axle (14),
Thimble is realized more from there through regulating the described thimble (10) extension elongation on this thimble grip slipper
High consistency before and after changing.
4. chip peeling apparatus as claimed in claim 1 or 2, it is characterised in that described thimble presss from both sides
The bottom holding axle (14) is cambered surface, and and described guide rod between in arc surface point cantact；Additionally, should
The top of thimble clamping axle is touched with the bottom connection of described flexible member (11).
5. chip peeling apparatus as claimed in claim 1 or 2, it is characterised in that at described guide rod
(21) and be provided with the first sealing ring (23) between described transmission base (22), and in this transmission
Pedestal (22) top is positioned at the both sides up and down of described vacuum gas-tpe fitting (24) and is provided with the second sealing
Circle (25), therefore ensures that the absorption of the described pore (19) to described thimble cover (15) roof is made
With.
6. chip peeling apparatus as claimed in claim 5, it is characterised in that in described transmission base
(22) top is threaded hole, and has hole in the inner side with this screwed hole same level height
With circlip groove, then the square-section seal groove of annular is each set in these circlip groove both sides, hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410477815.9A CN104347457B (en) | 2014-09-17 | 2014-09-17 | Chip peeling device applicable to fast replacement of ejector pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410477815.9A CN104347457B (en) | 2014-09-17 | 2014-09-17 | Chip peeling device applicable to fast replacement of ejector pin |
Publications (2)
| Publication Number | Publication Date |
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| CN104347457A CN104347457A (en) | 2015-02-11 |
| CN104347457B true CN104347457B (en) | 2017-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410477815.9A Active CN104347457B (en) | 2014-09-17 | 2014-09-17 | Chip peeling device applicable to fast replacement of ejector pin |
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| Country | Link |
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| CN (1) | CN104347457B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6637397B2 (en) * | 2016-09-12 | 2020-01-29 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
| CN107552970B (en) * | 2017-10-31 | 2019-04-16 | 新昌县彭诚农业科技有限公司 | A kind of cooling device of laser engraving machine |
| CN108133907B (en) * | 2017-12-28 | 2020-05-01 | 北京中电科电子装备有限公司 | Chip stripping off device |
| CN108243577B (en) * | 2018-02-09 | 2024-01-12 | 东莞市南部佳永电子有限公司 | Intelligent universal PCB thimble device |
| CH715447B1 (en) * | 2018-10-15 | 2022-01-14 | Besi Switzerland Ag | chip ejector. |
| CN109244018A (en) * | 2018-10-27 | 2019-01-18 | 中山市良泽精密模具有限公司 | Portable lossless blue membrane DNA chip mechanism for stripping |
| CN109935545B (en) * | 2019-01-22 | 2022-03-18 | 厦门市三安集成电路有限公司 | Thimble module for picking up wafers with different sizes |
| CN110596211B (en) * | 2019-10-22 | 2024-07-02 | 南方科技大学 | Vibration flat plate electrode connector |
| CN111398312A (en) * | 2020-02-19 | 2020-07-10 | 深圳市海铭德科技有限公司 | Thimble test head structure |
| CN112349648B (en) * | 2020-10-26 | 2023-12-22 | 北京北方华创微电子装备有限公司 | Needle lifting mechanism and semiconductor process equipment |
| CN112885766A (en) * | 2021-03-23 | 2021-06-01 | 成都储翰科技股份有限公司 | Blue membrane chip ejecting device |
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| US6720786B2 (en) * | 2001-07-25 | 2004-04-13 | Integrated Device Technology, Inc. | Lead formation, assembly strip test, and singulation system |
| KR100924963B1 (en) * | 2007-05-03 | 2009-11-06 | (주)제이티 | Transferring Device for Transferring Substrate Strip |
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| US3602113A (en) * | 1969-10-22 | 1971-08-31 | Blaw Knox Co | Automatic crowning system for pavers |
| EP0428792A2 (en) * | 1989-11-24 | 1991-05-29 | Fico B.V. | Single strip molding apparatus |
| CN103633006A (en) * | 2013-12-11 | 2014-03-12 | 中国电子科技集团公司第二研究所 | Wafer chip jacking mechanism |
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| CN104347457A (en) | 2015-02-11 |
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