CN104344200A - Composite board and manufacturing method thereof - Google Patents
Composite board and manufacturing method thereof Download PDFInfo
- Publication number
- CN104344200A CN104344200A CN201410524449.8A CN201410524449A CN104344200A CN 104344200 A CN104344200 A CN 104344200A CN 201410524449 A CN201410524449 A CN 201410524449A CN 104344200 A CN104344200 A CN 104344200A
- Authority
- CN
- China
- Prior art keywords
- plate body
- joining portion
- bump
- notch portion
- composite board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 33
- 239000011324 bead Substances 0.000 claims abstract description 13
- 238000005304 joining Methods 0.000 claims description 96
- 238000003825 pressing Methods 0.000 claims description 26
- 238000003466 welding Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 16
- 238000004080 punching Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000001186 cumulative effect Effects 0.000 description 4
- 239000002360 explosive Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Abstract
A composite board and a manufacturing method thereof comprise a first board body and a second board body. The first plate body is made of a first material and has a first heat conduction coefficient, and the first plate body is provided with a first joint part; the second plate body is made of a second material and has a second heat conduction coefficient, and the second plate body is provided with a second joint part; the first joint and the second joint are correspondingly spliced, a weld bead is formed at the splicing position of the first joint and the second joint, and the first heat conduction coefficient is larger than the second heat conduction coefficient. The composite board and the manufacturing method thereof provided by the invention combine the board bodies made of two different materials, can maintain the necessary heat conduction performance, and the splicing mode of the board bodies does not increase the thickness additionally at the joint and does not increase the material cost excessively.
Description
[technical field]
The present invention relates to the combination of foreign material, particularly in conjunction with composite board and the manufacture method thereof of two kinds of plate bodys.
[background technique]
Usually can arrange high heating element in electronic equipment, such as high-power die or light-emitting diode (LED) module, aforementioned high heating element needs good cooling measure, could maintain the running of high heating element.
For light-emitting diode (LED) module, light-emitting diode (LED) module is fixed on a high-thermal conductive metal plate usually, uses the external loss of heat that light-emitting diode (LED) module produces through sheet metal heat conduction.
Aforesaid sheet metal is also the important feature assembly of electronic equipment usually, the backboard of such as LED backlight module.The metallic material being the most often applied to heat conduction is then copper, if make the large-area backboard of full wafer with copper (or other high-thermal conductive metals), the cost of material of backboard will be made excessively to improve.
For workout cost problem, aforementioned backboard can adopt the mode of composite board to make.But light-emitting diode (LED) module can be arranged on the high sheet metal of the less thermal conductivity of a slice area, and high-thermal conductive metal plate is further combined with in the lower-cost sheet metal of another sheet material, and in conjunction with the complete backboard of formation one.
The combination of aforementioned two sheet metals, is all make two sheet metal local superimposed usually, then through modes such as screw, riveted joint, stickers, is engaged by lap material.
Aforesaid juncture, screw, riveted joint have excessive zero assembly Cost Problems, and assembling mode relative complex; And adopt sticker laminating type that the capacity of heat transmission can be caused to decline.
In addition, two sheet metal superimposed meetings in local make local thickness increase, simultaneously because the thermal expansion coefficient of different materials is different, lamination portion easily produces warpage and the problem such as locality is concavo-convex, makes material produce unnecessary distortion and reduces the heat conduction efficiency between two sheet metals.
[summary of the invention]
For solving the problem, the invention provides a kind of composite board and manufacture method thereof, is the plate body made in conjunction with two kinds of different materials, and the mode of plate body splicing additionally can not increase thickness at junction point.
A kind of composite board provided by the present invention, comprises the first plate body and the second plate body.First plate body is made up of the first material has the first thermal conductivity, and the first plate body is provided with the first joining portion; Second plate body is made up of the second material has the second thermal conductivity, and the second plate body is provided with the second joining portion.
Aforementioned first joining portion is corresponding with the second joining portion splices, and the first joining portion and the second stitching portion, joining portion are formed with welding bead, and the first thermal conductivity is greater than the second thermal conductivity.
Further, at least one embodiment of the present invention, the first joining portion is provided with at least one bump, and the second joining portion is provided with at least one notch portion, and bump is corresponding with notch portion to be spliced.
Further, at least one embodiment of the present invention, the first joining portion is provided with at least one notch portion, and the second joining portion is provided with at least one bump, and notch portion is corresponding with bump splices.
Further, in at least one embodiment of the present invention, first joining portion is provided with multiple bump and multiple notch portion, second joining portion is also provided with multiple notch portion and multiple bump, multiple notch portion at corresponding second joining portion of multiple bumps at the first joining portion, multiple bumps at corresponding second joining portion of multiple notch portion at the first joining portion.
Further, at least one embodiment of the present invention, bump and notch portion are wedge shape.
Further, at least one embodiment of the present invention, the first joining portion and the second joining portion are provided with pressing part.
Moreover, a kind of method for manufacturing composite boards provided by the present invention, its manufacturing step is:
Step 1: provide the first plate body, the first plate body is made up of the first material to have the first thermal conductivity, and the first plate body is provided with the first joining portion.
Step 2: provide the second plate body, the second plate body is made up of the second material to have the second thermal conductivity, and the second plate body is provided with the second joining portion.
Step 3: the first joining portion of the first plate body and the second joining portion of the second plate body are spliced; And engage in a welding manner with the second stitching portion, joining portion at the first joining portion, form composite board.
Step 4: punching press is carried out to the pressing part of the first plate body and/or the pressing part of the second plate body.
Composite board proposed by the invention and manufacture method thereof, in conjunction with the plate body that two kinds of different materials are made, can maintain necessary heat-conductive characteristic, and don't excessively can increase cost of material.Meanwhile, the combining structure between the first plate body of the present invention and the second plate body is the form adopting plane scarf (in-plane), and junction can not increase thickness because plate body is overlapping, but still can maintain effective combination force.Meanwhile, the combining form of plane scarf (in-plane), thermal expansion can make the close-fitting effect between bump and notch portion strengthen on the contrary, and avoids because thermal expansion coefficient difference causes unexpected distortion.
[accompanying drawing explanation]
Fig. 1 is the explosive view of first embodiment of the invention.
Fig. 2 is the stereogram of first embodiment of the invention.
Fig. 3 is the explosive view of second embodiment of the invention.
Fig. 4 is the stereogram of second embodiment of the invention.
Fig. 5 is the explosive view of third embodiment of the invention.
Fig. 6 is the stereogram of third embodiment of the invention.
Fig. 7 is the stereogram of a change case of first embodiment of the invention.
Fig. 8 is in second embodiment of the invention, the explosive view of a change case of the first plate body and the second plate body.
Fig. 9 is the implementation step flow chart of method for manufacturing composite boards of the present invention.
[component symbol explanation]
Composite board 10
Welding bead 10a
First plate body 100
First joining portion 110
First bump 112
First notch portion 114
Endothermic section 130
First pressing part 140
Second plate body 200
Second joining portion 210
Second bump 212
Second notch portion 214
Second pressing part 240
Thermal source 300
Composite board manufacturing step S01, S02, S03, S04
[embodiment]
The present invention mainly discloses a kind of composite board and manufacture method thereof, and the basic principle of wherein welding known by those skilled in the technology concerned, therefore with explanation hereinafter, no longer finishs whole description to welding process.Meanwhile, with hereinafter contrasted graphic, mainly express the structural representation relevant with feature of the present invention, also do not need the complete drafting of foundation actual size, formerly illustrate.
Please refer to shown in Fig. 1 and Fig. 2, a kind of composite board 10 disclosed by first embodiment of the invention, comprise the first plate body 100 and the second plate body 200.First plate body 100 and the second plate body 200 are in order to be spliced into the relatively large composite board of area 10.
Further, the first plate body 100 is made up of the first material has the first thermal conductivity, and the first plate body 100 is provided with the first joining portion 110; Second plate body 200 is made up of the second material has the second thermal conductivity, and the second plate body 200 is provided with the second joining portion 210.
Please refer to shown in Fig. 2, first bump 112 at the first joining portion 110 splices the second notch portion 214 in the second joining portion 210, make the first close contact second joining portion, joining portion 110 210 and form welding bead 10a (as shown in Figure 2), with for welding first joining portion 110 and the second joining portion 210.In like manner, also the first notch portion (in figure non-tabular form) can be set by the first joining portion 110 and splice the second bump (in figure non-tabular form) in the second joining portion 210, make the first close contact second joining portion, joining portion 110 210 and form welding bead 10a, with for welding first joining portion 110 and the second joining portion 210.
Aforesaid welding manner can be have the welding of solder or solderless welding, and the first plate body 100 and the second plate body 200 welding manner the best are laser bonding; In addition, the combination of first bump 112 at the first joining portion 110 and second notch portion 214 at the second joining portion 210, can extend welding bead 10a, and provide extra close-fitting combination force, and strengthen the combination between the first plate body 100 and the second plate body 200.
Further, in a specific embodiment, first plate body 100 is made up of the first material to be had the first thermal conductivity and the second plate body 200 and to be made up of the second material that to have the second thermal conductivity different, such as the first plate body 100 is copper, and the second plate body 200 is aluminium, the first thermal conductivity is made to be greater than the second thermal conductivity.Thus, first plate body 100 has comparatively excellent heat-conductive characteristic relative to the second plate body 200, thermal source 300 (such as high-power die, light-emitting diode (LED) module etc.) can be installed in the limit that first plate body 100 is different from the first joining portion 110, and can pass through the first plate body 100 and carry out quick conductive, avoid the first plate body 100 to contact hot spot region that thermal source 300 place forms high temperature.In Fig. 1 and Fig. 2, first plate body 100 can also include an endothermic section 130, endothermic section 130 can by the first plate body 100 install thermal source 300 while be bent to form, heat trnasfer to the first plate body 100 that thermal source 300 can produce by endothermic section 130, then diffuse to the second plate body 200 to dispel the heat by the first plate body 100 by welding bead 10a.
In actual mechanical process, the second plate body 200 can make by the relatively low material of user cost, thus reduces the fabricating cost of composite board 10, makes the fabricating cost of composite board 10 can lower than the sheet material using the first plate body 100 to make completely.
Please refer to shown in Fig. 3 and Fig. 4, a kind of composite board 10 disclosed by second embodiment of the invention, comprise the first plate body 100 and the second plate body 200.
In a second embodiment, the first joining portion 110 is provided with multiple first bump 112, second joining portion 210 and is provided with multiple second notch portion 214, first bump 112 and is formed corresponding with the position that the second notch portion 214 is arranged; Naturally, when the first joining portion 110 is provided with multiple first bump 112, the first notch portion 114 can be formed between first bump 112, in like manner, when second joining portion 210 arranges multiple second notch portion 214, can form multiple second bump 212 between second notch portion 214, and the first notch portion 114 forms with the position of the second bump 214 corresponding; By this, the first joining portion 110 can mutually correspondingly be spliced with the second joining portion 210, makes the first close contact second joining portion, joining portion 110 210 and forms welding bead 10a.By the combination of multiple first bump 112, multiple first notch portion 114, multiple second bump 212, multiple second notch portion 214, effectively can extend the length of welding bead 10a, and reduce the thermal contact resistance between the first plate body 100 and the second plate body 200.Particularly the first bump 112 extends towards the intermediate portion to the second plate body 200, and the second bump 212 extends towards the intermediate portion of the first plate body 100, the heat exchange between the first plate body 100 and the second plate body 120 can be strengthened, make the heat of thermal source can be passed to the second plate body 200 by the first plate body 100 rapidly, avoid heat to continue to concentrate on the first plate body 100.
Please refer to shown in Fig. 5 and Fig. 6, a kind of composite board 10 disclosed by third embodiment of the invention, comprise the first plate body 100 and the second plate body 200.
In the third embodiment, first joining portion 110 arranges multiple first bump 112 and multiple first notch portion 114, the position of corresponding first bump 112 in the second joining portion 210 and the first notch portion 114 arranges multiple second notch portion 214 and multiple second bump 212, first bump 112 and the second notch portion 214 and the first notch portion 114 and the second bump 212 and may correspond to splicing.In the present embodiment, the width of each first bump 112 is cumulative with outward extending length, and the width of the second bump 212 is cumulative with outward extending length; The width of each first notch portion 114 is cumulative with the length of indent, and the width of the second notch portion 214 is cumulative with the length of indent; Specifically, each first bump 112, each first notch portion 114, each second bump 212 and each second notch portion 214 form the shape of wedge shape, can extend the length of welding bead 10a further, and strengthen close-fitting combination force.The prolongation of welding bead 10a length, too increases the area of contact between the first plate body 100 and the second plate body 200 simultaneously, thus further reduces the thermal contact resistance between the first plate body 100 and the second plate body 200.In like manner, multiple bump that first joining portion 110 and the second joining portion 210 are formed or multiple notch portion are not limited only to wedge shape, can be square or trapezoidal, even can be laciniation, main purpose is the length increasing the rear welding bead 10a of splicing, strengthens the engaging force between the first plate body 100 and the second plate body 200 and heat-conducting effect.
Please refer to shown in Fig. 7 and Fig. 8, under another enforcement state, the first joining portion 110 of the first plate body 100 can arrange the first pressing part 140 further, and in particular, the first pressing part 140 is located on the first bump 112, in order to be stamped; In like manner, the second joining portion 210 of the second plate body 200 also can be provided with the second pressing part 240, second pressing part 240 and be located on the second bump 212, equally can in order to be stamped.In specific operation process, the first pressing part 140 only can be set or the second pressing part 240 is only set, the first pressing part 140 and the second pressing part 240 also can be set simultaneously.When the first bump 112 splices in the second notch portion 214, and the first pressing part 140 is stamped during distortion, the edge of the first bump 112 can expand outwardly, and makes the edge of the first bump 112 contact the edge of the second notch portion 214 more closely; In like manner, when the second bump 212 splices in the first notch portion 114, and the second pressing part 240 is stamped during distortion, the edge of the second bump 212 can expand outwardly, the edge of the second bump 212 is made to contact the edge of the first notch portion 114 more closely, by this, strengthen close-fitting combination force, and reduce thermal contact resistance.
Please refer to shown in Fig. 9, a kind of method for manufacturing composite boards provided by the present invention, the steps include:
Step 1S01: provide the first plate body, the first plate body is made up of the first material to have the first thermal conductivity, and the first plate body is provided with the first joining portion.
Step 2S02: provide the second plate body, the second plate body is made up of the second material to have the second thermal conductivity, and the second plate body is provided with the second joining portion.
Wherein the first plate body is made up of the first material and is had the first thermal conductivity and the second plate body and to be made up of the second material that to have the second thermal conductivity different, such as the first plate body is copper, and the second plate body is aluminium, the first thermal conductivity is made to be greater than the second thermal conductivity.Thus, first plate body has comparatively excellent heat-conductive characteristic relative to the second plate body, thermal source (such as high-power die, light-emitting diode (LED) module etc.) can be installed in the limit that first plate body is different from the first joining portion, and can quick conductive, avoid the first plate body contact thermal source place to form the hot spot region of high temperature.
Step 3S03: the first joining portion of the first plate body and the second joining portion of the second plate body are spliced; And engage in a welding manner with the second stitching portion, joining portion at the first joining portion, form composite board.
Further, first joining portion can arrange one or more first bump and the first notch portion, second joining portion also may correspond to and is provided with one or more second bump and the second notch portion, and each first bump, each first notch portion, each second bump and each second notch portion can be wedge shape, the shape such as square or trapezoidal.
Step 4S04: punching press is carried out to the pressing part of the first plate body and/or the pressing part of the second plate body; First plate body can be provided with the first pressing part further, and the first pressing part is located on the first bump, and in order to be stamped, the second plate body also can be provided with the second pressing part, and the second pressing part is located on the second bump, equally in order to be stamped.
When the first bump splices after the second notch portion, to the first pressing part carry out punching press make it be out of shape time, the edge of the first bump can expand outwardly, and makes the edge of the first bump contact the edge of the second notch portion more closely; In like manner, when the second bump splices in the first notch portion, to the second pressing part carry out punching press make it be out of shape time, the edge of the second bump can expand outwardly, and makes the edge of the second bump contact the edge of the first notch portion more closely, by this, strengthen close-fitting combination force, and reduce thermal contact resistance.
By composite board provided by the present invention and manufacture method thereof, be the plate body made in conjunction with two kinds of different materials, necessary heat-conductive characteristic can be maintained, and don't excessively can increase cost of material.Meanwhile, the combining structure between the first plate body of the present invention and the second plate body is the form adopting plane scarf (in-plane), and junction can not increase thickness because plate body is overlapping, but still can maintain effective combination force.
The foregoing is only the present invention's preferably mode of execution, and be not used to limit interest field of the present invention; Simultaneously above description, for correlative technology field, special personage should understand and implement, and therefore other equivalences completed under not departing from disclosed spirit change or modify, and all should comprise in the claims.
Claims (10)
1. a composite board, comprises the first plate body and the second plate body, it is characterized in that:
Described first plate body is made up of the first material has the first thermal conductivity, and described first plate body is provided with the first joining portion;
Described second plate body is made up of the second material has the second thermal conductivity, and described second plate body is provided with the second joining portion;
Described first joining portion is corresponding with described second joining portion splices, and described first joining portion and described second stitching portion, joining portion are formed with welding bead, and described first thermal conductivity is greater than described second thermal conductivity.
2. composite board according to claim 1, is characterized in that: described first joining portion is provided with at least one bump, and described second joining portion is provided with at least one notch portion, and described bump is corresponding with described notch portion to be spliced.
3. composite board according to claim 1, is characterized in that: described first joining portion is provided with at least one notch portion, and described second joining portion is provided with at least one bump, and described notch portion is corresponding with described bump splices.
4. composite board according to claim 1, it is characterized in that: described first joining portion is provided with multiple bump and multiple notch portion, described second joining portion is also provided with multiple notch portion and multiple bump, described multiple notch portion at corresponding described second joining portion of described multiple bumps at described first joining portion, multiple bumps at corresponding described second joining portion of multiple notch portion at described first joining portion.
5. the composite board according to any one of claim 2,3 or 4, is characterized in that: described bump and described notch portion are wedge shape.
6. the composite board according to any one of claim 2,3 or 4, is characterized in that: described first joining portion and described second joining portion are provided with pressing part.
7. a method for manufacturing composite boards, is characterized in that comprising the following step:
Step 1: the first plate body is provided, described first plate body is made up of the first material has the first thermal conductivity, and described first plate body has the first joining portion;
Step 2: the second plate body is provided, described second plate body is made up of the second material has the second thermal conductivity, and described second plate body has the second joining portion; Described first thermal conductivity is greater than described second thermal conductivity;
Step 3: described first joining portion and described second joining portion are spliced, and carry out in a welding manner engaging forming described composite board with described second stitching portion, joining portion at described first joining portion.
8. method for manufacturing composite boards according to claim 7, it is characterized in that: described first joining portion and described second joining portion have bump and notch portion separately respectively, the described bump at described first joining portion and described notch portion corresponding with described notch portion with the described bump at described second joining portion.
9. method for manufacturing composite boards according to claim 7, is characterized in that: described first joining portion and described second joining portion are provided with pressing part further.
10. method for manufacturing composite boards according to claim 9, is characterized in that: include step 4 further, described step 4 is for carry out punching press to described pressing part.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103206690U TWM493071U (en) | 2014-04-17 | 2014-04-17 | Composite sheet |
| TW103206690 | 2014-04-17 | ||
| TWTW103206690 | 2014-04-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104344200A true CN104344200A (en) | 2015-02-11 |
| CN104344200B CN104344200B (en) | 2017-06-13 |
Family
ID=52500401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410524449.8A Active CN104344200B (en) | 2014-04-17 | 2014-10-08 | Composite board and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104344200B (en) |
| TW (1) | TWM493071U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106891070A (en) * | 2017-02-23 | 2017-06-27 | 深圳市科达利实业股份有限公司 | A kind of copper-aluminum composite board, pole connecting board structure and battery |
| CN108526691A (en) * | 2018-03-27 | 2018-09-14 | 大族激光科技产业集团股份有限公司 | Method for laser welding |
| CN110340527A (en) * | 2019-07-16 | 2019-10-18 | 西南交通大学 | Engagement tabs sheet welding method based on galvanometer laser |
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| DE4143387A1 (en) * | 1991-10-09 | 1993-06-24 | Rockwool Mineralwolle | Mfg.mineral fibre building insulating slabs - assembles fibre strips with different fibre patterns and machines edges to form tongue-and-groove joints |
| CN101187439A (en) * | 2006-11-23 | 2008-05-28 | C.劳勃汉默斯坦两合有限公司 | Adjustment device in an automotive vehicle with a movable adjustment part |
| CN102374500A (en) * | 2011-11-18 | 2012-03-14 | 深圳市华星光电技术有限公司 | Back frame and backlight system |
| CN102376217A (en) * | 2011-11-18 | 2012-03-14 | 深圳市华星光电技术有限公司 | Flat-panel display device and stereoscopic display device |
| CN102401288A (en) * | 2011-11-18 | 2012-04-04 | 深圳市华星光电技术有限公司 | Backlight system |
| CN102425769A (en) * | 2011-11-18 | 2012-04-25 | 深圳市华星光电技术有限公司 | Back frame, manufacture method thereof and backlight system |
| CN102588908A (en) * | 2012-03-13 | 2012-07-18 | 深圳市华星光电技术有限公司 | Combined back plate and backlight module using same |
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2014
- 2014-04-17 TW TW103206690U patent/TWM493071U/en unknown
- 2014-10-08 CN CN201410524449.8A patent/CN104344200B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4143387A1 (en) * | 1991-10-09 | 1993-06-24 | Rockwool Mineralwolle | Mfg.mineral fibre building insulating slabs - assembles fibre strips with different fibre patterns and machines edges to form tongue-and-groove joints |
| CN101187439A (en) * | 2006-11-23 | 2008-05-28 | C.劳勃汉默斯坦两合有限公司 | Adjustment device in an automotive vehicle with a movable adjustment part |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106891070A (en) * | 2017-02-23 | 2017-06-27 | 深圳市科达利实业股份有限公司 | A kind of copper-aluminum composite board, pole connecting board structure and battery |
| CN106891070B (en) * | 2017-02-23 | 2023-11-07 | 深圳市科达利实业股份有限公司 | Copper-aluminum composite board, pole connecting plate structure and battery |
| CN108526691A (en) * | 2018-03-27 | 2018-09-14 | 大族激光科技产业集团股份有限公司 | Method for laser welding |
| CN110340527A (en) * | 2019-07-16 | 2019-10-18 | 西南交通大学 | Engagement tabs sheet welding method based on galvanometer laser |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104344200B (en) | 2017-06-13 |
| TWM493071U (en) | 2015-01-01 |
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