CN104332449A - TO-126 type package component - Google Patents
TO-126 type package component Download PDFInfo
- Publication number
- CN104332449A CN104332449A CN201410616736.1A CN201410616736A CN104332449A CN 104332449 A CN104332449 A CN 104332449A CN 201410616736 A CN201410616736 A CN 201410616736A CN 104332449 A CN104332449 A CN 104332449A
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- substrate
- packaging part
- type package
- chip
- area
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Abstract
The invention relates to a TO-126 type package component. The TO-126 type package component comprises a substrate; a circular-arc-shaped hole is formed in the substrate and a chip mounting region is formed on the substrate; the area of the circular-arc-shaped hole is greater than the rear of a semicircle, and the center of the hole is located in the substrate. The area of the chip mounting region on the TO-126 type package is twice or above the area of a chip mounting region adopted in the past.
Description
Technical field
The present invention relates to IC manufacturing field, be specifically related to a kind of TO-126 type packaging part.
Background technology
TO-126 type packaging part is a kind of flange-cooled middle power package.Fig. 1, Fig. 2 are the common packing forms of TO-126, and wherein Fig. 1 is cut-away view, Fig. 2 be packaged after finished figure.As seen from the figure, encapsulation unit forms primarily of a screw hole 1 and chip installation area 2, screw hole 1 is on whole substrate, remove a complete circle as seen from the figure, the area of the chip installation area 2 of below is just extruded to a very little space, and the chip installation area in figure is of a size of the high 2.82 ± 0.1mm of wide 5.07 ± 0.1mm*.Can find out the packaging part of this design, its chip installing space is limited, and for oversize chip, this kind of packaging part can not meet installation requirements.
Because above-mentioned defect, the design people, actively in addition research and innovation, to founding a kind of novel TO-126 frame structure, making its chip mounting area become large, having met the installation of large size chip.
Summary of the invention
For solving the problems of the technologies described above, the object of this invention is to provide a kind of TO-126 type packaging part can installing large-size chip.
For realizing above order ground, technical scheme of the present invention is as follows:
A kind of TO-126 type packaging part, comprise substrate, the circular arc hole that substrate top is left, its subtended angle is greater than 180 °.
Further, chip installation area is of a size of wide 5.07 ± 0.1mm, high 5.76 ± 0.2mm.
By such scheme, the invention has the beneficial effects as follows:
By this programme, to make on TO-126 packaging part the area of chip to improve more than twice, large size chip can be installed, meet needs of production.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of specification, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present invention.
Accompanying drawing explanation
The structure vertical view of packaging part in Fig. 1 background technology
The finished product structure vertical view of packaging part in Fig. 2 background technology
The vertical view of Fig. 3 internal structure of the present invention
Fig. 4 finished product vertical view of the present invention
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
As shown in Fig. 3, Fig. 4, a kind of TO-126 packaging part, comprises substrate 1, the screw hole 2 of perforate on substrate 1 and design chip installation area 3 on substrate 1.The material of substrate 1 is metallic copper, screw hole 2 remove on substrate 1 top one round-formed, the circular arc subtended angle stayed is greater than 180 °, and when can make installation like this, nut is greater than the area of half for fixing packaging part, better can ensure the stability of packaging part.Fig. 4 is the packaging part manufactured, and in figure, circular recess 21 is the circular arc type cell body formed on screw hole 2 after plastic packaging, and its degree of depth is looked package requirements institute and determine, and groove 21 also has two long and narrow grooves 211, fixes for convenience of screw installation.Chip installation area 3 is in the below of screw hole 2, and it is of a size of wide 5.07 ± 0.1mm, high 5.76 ± 0.2mm.Middle muscle 4 connects three pins, and it is and middle pin 6 both sides also have end muscle 5 to connect each pin bottom packaging part that middle pin 6 is positioned at connection substrate 1, two side pipe religions 7 in the middle of three pins.
When concrete encapsulation manufactures, packaging technology flow process is as follows:
1, some solders (are added): by a certain amount of high temperature slicken solder (adding) some TO-126 lead frame;
2, load: chip has at high temperature been contained on the lead frame of (adding) some solder;
3, bonding: with metal aluminum filament, pin corresponding with lead frame for the electrode of chip surface is coupled together;
4, plastic packaging: use epoxy resin, injects and improves TO-126 plastic package die, form the TO-126 device of whole row;
5, clean: remove the overlap between whole row TO-126 pin;
6, muscle is cut: by connecting muscle and the excision of end muscle between TO-126 unit pin, form single TO-126 device;
7, test: according to the electrical property of each TO-126 device, carry out stepping;
8, pack: the TO-126 device after test is protected, convenient transport.
The above is only the preferred embodiment of the present invention; be not limited to the present invention; should be understood that; for those skilled in the art; under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and modification, these improve and modification also should be considered as protection scope of the present invention.
Claims (3)
1. a TO-126 type packaging part, comprises substrate, on substrate making circular hole formed circular arc hole and substrate on chip installation area, it is characterized in that: described circular arc type hole is positioned at described substrate top.
2. type packaging part according to claim 1, is characterized in that: described circular arc subtended angle is greater than 180 °.
3. type packaging part according to claim 1, is characterized in that: chip installation area is of a size of wide 5.07 ± 0.1mm, high 5.76 ± 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410616736.1A CN104332449A (en) | 2014-11-05 | 2014-11-05 | TO-126 type package component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410616736.1A CN104332449A (en) | 2014-11-05 | 2014-11-05 | TO-126 type package component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104332449A true CN104332449A (en) | 2015-02-04 |
Family
ID=52407151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410616736.1A Pending CN104332449A (en) | 2014-11-05 | 2014-11-05 | TO-126 type package component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104332449A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2805101Y (en) * | 2005-07-07 | 2006-08-09 | 黄虎钧 | LED structure with broad application |
| CN101640178A (en) * | 2008-07-30 | 2010-02-03 | 三洋电机株式会社 | Semiconductor device, method for manufacturing semiconductor device, and lead frame |
| US20110073999A1 (en) * | 2009-09-30 | 2011-03-31 | Zhi Qiang Niu | Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method |
-
2014
- 2014-11-05 CN CN201410616736.1A patent/CN104332449A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2805101Y (en) * | 2005-07-07 | 2006-08-09 | 黄虎钧 | LED structure with broad application |
| CN101640178A (en) * | 2008-07-30 | 2010-02-03 | 三洋电机株式会社 | Semiconductor device, method for manufacturing semiconductor device, and lead frame |
| US20110073999A1 (en) * | 2009-09-30 | 2011-03-31 | Zhi Qiang Niu | Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150204 |
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| RJ01 | Rejection of invention patent application after publication |