CN104332134B

CN104332134B - A kind of LED shows module system

Info

Publication number: CN104332134B
Application number: CN201410578351.0A
Authority: CN
Inventors: 薛斌; 杨华; 卢鹏志; 于飞; 刘立莉; 李璟; 伊晓燕; 王军喜; 李晋闽
Original assignee: Institute of Semiconductors of CAS
Current assignee: Institute of Semiconductors of CAS
Priority date: 2014-10-24
Filing date: 2014-10-24
Publication date: 2016-08-10
Anticipated expiration: 2034-10-24
Also published as: CN104332134A

Abstract

The invention discloses a kind of LED and show module system, it includes；Driving module, it is used for driving light source module；Light source module, it includes intermediary layer and fixing LED array on the interposer, and described LED array is luminous under the driving driving module；Optical module, it includes light collecting element and battery of lens, and the light for sending light source module exports to display module after carrying out optically focused, light splitting；Display module, it includes being optically isolated chamber and imaging screen, described in be optically isolated chamber and be formed on imaging screen, be filled with fluorescence transition material in it；Each pixel on described imaging screen includes that multiple chamber that is optically isolated, described fluorescence transition material carry out full-color display under the irradiation of light.

Description

A kind of LED shows module system

Technical field

The invention belongs to technical field of semiconductors, particularly relate to a kind of LED and show module system.

Background technology

Along with the development of LED technology, LED range of application is also constantly being expanded, and is based particularly on LED The light source of array, is not used only for making lighting and LCD backlight, in special lighting field (such as Animals and plants cultivate), actively Display Technique, projection light source, adjustable spectral illumination and visible light communication etc. Field is the most gradually applied.In order to meet different occasion needs, give full play to the characteristic of LED, Promote output spectrum and the degree of freedom of light intensity of LED array light source, need to realize LED array Pointwise is modulated.Simultaneously along with technological progress, the encapsulation needing LED array light source is the most integrated, Miniaturization, and packaging technology and step are optimized, reduce product cost, simplify production technology.

The most common LED actively shows that product is by by the most packaged surface-mount type LED unit is fixed on external substrate and prepares, and each unit comprises one or more different output wavelengths LED, substantial amounts of surface welded LED unit be fixed on substrate formation LED array, such as Leah LED flat plate display unit and production method that moral Photoelectric Co., Ltd. proposed in 2012 (are awarded Power notification number CN101783099B).On the other hand, it is also possible to utilize flip-chip technology, by LED Chip pressure welding forms LED array on substrate.Along with improving constantly and market pair of Display Technique The demand of high definition resolution LED actively Display Technique, needs the Pixel Dimensions in LED array and picture Vegetarian refreshments spacing constantly reduces.Surface-mount type encapsulation is limited by LED module size and splicing, as Vegetarian refreshments size and spacing are difficult to reduce further.Although and using the LED array that flip chip technology realizes Its pixel size and gap ratio Surface Mount sheet encapsulation technology reduce further, but its processing step is more Loaded down with trivial details, reduce production yield, improve maintenance difficulties and the cost in later stage.

Summary of the invention

For problems of the prior art, it is an object of the invention to provide a kind of LED and show Module system.

A kind of LED that the present invention proposes shows module system, and it includes；

Driving module, it is used for driving light source module；

Light source module, it includes intermediary layer and fixing LED array on the interposer, described LED Array is luminous under the driving driving module；

Optical module, it includes light collecting element and battery of lens, carries out for the light sending light source module Export to display module after optically focused, light splitting；

Display module, it includes being optically isolated chamber and imaging screen, described in be optically isolated chamber and be formed at into As, on screen, being filled with fluorescence transition material in it；Each pixel on described imaging screen includes many The individual chamber that is optically isolated, described fluorescence transition material carries out full-color display under the irradiation of light.

In order to meet the market demand to high definition resolution LED actively Display Technique, the present invention utilizes Light source module based on LED array, exports the light of light source module the light splitting through optical module and adjusts System, is incident upon and includes fluorescence transition material, is optically isolated chamber and the display module of imaging screen, is formed Image.In order to promote image resolution ratio, it is not necessary to reduce the Pixel Dimensions in LED array and spacing again, But by optimizing optical module and display module, therefore enormously simplify technique, reduce into This.

Turn by adjusting every output wavelength of LEDs chip and the fluorescence of display module in light source module Conversion materials, adds flexibility ratio and the degree of freedom of display, meets different occasion to LED actively display The demand of technology, serves facilitation for playing the feature of LED actively Display Technique further.

Accompanying drawing explanation

In order to the particular content of the present invention is described, describe in detail such as below in conjunction with specific embodiment and accompanying drawing After, wherein:

Fig. 1 is the frame structure schematic diagram of LED display module system in the present invention；

Fig. 2 is the frame structure schematic diagram driving module in the present invention；

Fig. 3 a is the frame structure schematic diagram of LED chip die bond front light-source module in the present invention；

Fig. 3 b is the frame structure schematic diagram of light source module after LED chip die bond in the present invention；

Fig. 4 is the frame structure schematic diagram of display module in the present invention.

Detailed description of the invention

For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with concrete real Execute example, and referring to the drawings, the present invention is described in further detail.

Referring to shown in Fig. 1 to Fig. 4, the present invention provides a kind of LED to show module system, Fig. 1 Show the frame construction drawing of described LED display module system.As it is shown in figure 1, comprising:

Drive module 10, light source module 11, optical module 12 and display module 13；

Module 10 is wherein driven to include substrate 101 and fixing driving element 102 on the substrate 101, See Fig. 2, use active or passive drive technology according to display demand simultaneously；

Light source module 11, including intermediary layer 14 and the LED array 111 being fixed on intermediary layer 14, Described LED array is luminous under the driving driving module；Described LED array 111 is by array distribution Multiple LED chip 112 constitute, each LED chip 112 can by drive module 10 realize Pointwise controls；See Fig. 3 b；

The preparation of intermediary layer 14 surface has metal pad 141, conductive through hole 142, metallic circuit 143, Additionally, conductive through hole 142 is electrically connected with driving module 10.The position sum of metal pad 141 Measure corresponding with the LED chip 112 in LED array 111, to have planar structure (p, n-electrode At homonymy) LED as a example by, each LED chip 112 by bond technology or scaling powder with corresponding Metal pad be connected and fixed on middle-class 14, formed LED array 111, as shown in Figure 3 a.

Connected by metallic circuit 143 between pad 141, connect the pad 141 that principle is colleague and go here and there Connection, is ultimately connected to be positioned on a metal throuth hole 142 of intermediary layer 14 side；The pad of same column 141 series connection, are ultimately connected to be positioned on a metal throuth hole 142 of middle-class 14 opposite side.

Intermediary layer 14 can be glass substrate, ceramic substrate or the silicon substrate through insulation processing, institute State conductive through hole 142 for circular hole or groove, it is possible to use chemical attack, etching, laser, machine drilling Etc. technique or and process combination process, that fills in conductive through hole 142 has a conductive material, gold Belong to circuit 143 surface through protectiveness coating processing, it is to avoid be subject to machinery, steam, dust and be harmful to The intrusion of gas, such as cover silicon dioxide, polyimides or insulating cement or and combinations thereof, with Time, any two metallic traces 143 intersection regions preparation have insulating barrier, as coating polyimide, Silicon dioxide etc., it is to avoid any the two of the short-circuit or of the same race polarity of any two metallic traces of opposed polarity Metallic traces connects；

Module 10 is driven by the metal pad 141 on intermediary layer 14 and to plant ball with light source module 11 Technique realizes being electrically connected with；

LED chip 112, through die bond technique, is fixed on two metal pads of correspondence of intermediary layer 14 On 141, and it is electrically connected with conductive through hole 142 by metal pad 141 and metallic circuit 143；

LED array 111, can be made up of monochromatic light or polychromatic light LED chip 112, LED battle array The spacing of LED chip 112, output in row 111 can adjust, described LED chip 112 Can be vertical, formal dress or inverted structure, and according to above-mentioned three kinds of different structure kinds, by LED Chip 112 is connected on corresponding metal pad 141 by pressure welding, ball-bonding process, or by gold Belong to and on pad 141, prepare anisotropic-electroconductive adhesive, it is achieved be electrically connected with；

Optical module 12, including light collecting element and battery of lens, described optical module 12 can realize gathering Light, light splitting function, export the light of described light source module and be proportionally distributed to display module 13；

Display module 13, sees Fig. 4, including fluorescence transition material 131, is optically isolated chamber 132 and Imaging screen 133, is filled with fluorescence transition material 131 in being wherein optically isolated chamber 132, optics every Can be printed by compression moulding or 3D from chamber 132 and be formed on imaging screen 133, its effect is to avoid Fluorescence packing material 131 is excited by unnecessary, causes imaging interference, make on imaging screen 133 The region that should not be lit is lit.Each pixel in imaging screen 133 comprises multiple being optically isolated Chamber 132, owing to the LED array 111 in light source module 11 can realize pointwise modulation control, can The output light of LED array 111 is delivered to optical module 12, through optical module 12 optically focused and Light-splitting processing, distributes brought into optical separate cavities 132 as required by output light, excites and be filled in optics Fluorescence transition material 131 in separate cavities 132, realizes fine full-color display through imaging screen 133；

LED shows module system, may act as single display screen, it is also possible to by splicing, Form large-area display screen.

Particular embodiments described above, is carried out the purpose of the present invention, technical scheme and beneficial effect Further describe it should be understood that the foregoing is only the specific embodiment of the present invention, Be not limited to the present invention, all within the spirit and principles in the present invention, any amendment of being made, Equivalent, improvement etc., should be included within the scope of the present invention.

Claims

1. LED shows a module system, and it includes；

Driving module, it is used for driving light source module；

2. the system as claimed in claim 1, wherein, the preparation of described intermediary layer surface has metal welding Dish, conductive through hole and metallic circuit, conductive through hole electrically connects with described driving module, metal pad pair The position of LED chip in described LED array should be formed at, and electrically connect with LED chip；Described Metallic circuit is used for connecting described metal pad.

3. system as claimed in claim 2, wherein, the described metal pad of colleague is by described Metallic circuit is connected to be positioned on a metal throuth hole of intermediary layer side；The metal pad of same column It is connected to be positioned on a metal throuth hole of described intermediary layer opposite side by described metallic circuit.

4. the system as described in any one of claim 1-3, wherein, described intermediary layer be glass substrate, Ceramic substrate or through the silicon substrate of insulation processing.

5. the system as described in any one of claim 2-3, wherein, described conductive through hole be circular hole or Groove, is filled with conductive material in it.

6. the system as claimed in claim 1, wherein, described optical module passes through optically focused and light splitting Process, different for output light distribution importing are optically isolated intracavity.

7. the system as claimed in claim 1, wherein, described LED array is by monochromatic light or many Color LED chips is constituted.