CN104330277A - Refrigeration chip type heat pipe performance testing device - Google Patents

Refrigeration chip type heat pipe performance testing device Download PDF

Info

Publication number
CN104330277A
CN104330277A CN201410641048.0A CN201410641048A CN104330277A CN 104330277 A CN104330277 A CN 104330277A CN 201410641048 A CN201410641048 A CN 201410641048A CN 104330277 A CN104330277 A CN 104330277A
Authority
CN
China
Prior art keywords
cooling
copper billet
heat
thermopair
testing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410641048.0A
Other languages
Chinese (zh)
Other versions
CN104330277B (en
Inventor
蔡少辉
刘建平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN HYB RADIATOR Co Ltd
Original Assignee
KUNSHAN HYB RADIATOR Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN HYB RADIATOR Co Ltd filed Critical KUNSHAN HYB RADIATOR Co Ltd
Priority to CN201410641048.0A priority Critical patent/CN104330277B/en
Publication of CN104330277A publication Critical patent/CN104330277A/en
Application granted granted Critical
Publication of CN104330277B publication Critical patent/CN104330277B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The invention discloses a refrigeration chip type heat pipe performance testing device which is characterized by comprising a heating device (2), a cooling device (3) and a control device (4), wherein the heating device (2), the cooling device (3) and the control device (4) are arranged on an operation platform (1). The cooling device (3) is externally connected with two refrigerators (5), and comprises a cooling plate (6), a refrigeration chip (7) and a cooling copper block (8), wherein the cooling plate (6) is used for being communicated with the refrigerators (5), the cooling copper block (8) is used for placing the cooling end of a heat pipe to be tested, and the refrigeration chip (7) is arranged between the cooling copper block (8) and the cooling plate (6). The refrigeration chip type heat pipe performance testing device has the advantages of high temperature control accuracy and testing efficiency, energy conservation and environment protection, and good stability, and is suitable for popularization and application.

Description

A kind of cooling chip formula properties of hot pipe testing apparatus
Technical field
The present invention relates to a kind of cooling chip formula properties of hot pipe testing apparatus, particularly relate to a kind of performance test apparatus being applicable to the copper water heat pipe of the field application such as computer heat radiation, LED heat radiation, semiconductor heat-dissipating, this performance test apparatus can be used for production line, also can be used for laboratory.
Background technology
Along with the develop rapidly of Power Electronic Technique, high-power, large scale, high heat flux electronic devices and components get more and more, and heating power consumption is increasing, and heat dissipation problem becomes one of its key factor further developed of restriction.Heat pipe is a kind of effective heat conduction components and parts, has been widely used in the heat radiation in the field such as notebook computer, desktop computer, LED, IGBT in recent years.The manufacture craft more complicated of heat pipe, the Fabrication parameter affecting properties of hot pipe is a lot, and in order to ensure that the properties of hot pipe often propping up production can meet request for utilization, heat pipe all will carry out performance test after production completes.And traditional properties of hot pipe testing apparatus only leans on refrigeration machine by cold drawing to heat-pipe refrigerating, every platform equipment is all furnished with a refrigeration machine, and such configuration exists following problem: one is that when directly freezing with refrigeration machine, cooling velocity is comparatively slow, and production efficiency is not high; Two is that the refrigeration machine that needs is also more when using multiple stage testing apparatus, and because needing heating when refrigeration machine freeze, therefore between test carriage, environment temperature is higher, bad environments, needs the temperature that extra increase air-conditioning keeps between test carriage, consumes energy more; Three is types of cooling that traditional properties of hot pipe test machine only has cold drawing+chilled water, and the temperature fluctuation of cold drawing is comparatively large, causes the consistance of test poor; Four is that traditional type of cooling cooling effect is poor, and the time that heat pipe reaches equilibrium state is long, therefore the test duration is long; Five is modes that traditional properties of hot pipe test machine adopts merely bosh to freeze, and bosh is in running order for a long time, and water temperature raises gradually, and therefore failure rate is higher.
Summary of the invention
Technical matters to be solved by this invention is, thering is provided a kind of adopts the new type of cooling (i.e. the type of cooling of cooling chip+cold drawing+chilled water) to cool heat pipe, cold plate temperature remains at design temperature, temperature-controlled precision is high, makes the properties of hot pipe testing apparatus that the consistance of test result and stability are all higher; Further, the present invention can make heat pipe reach equilibrium state fast, effectively saves the test duration, to improve production test efficiency; Further, refrigeration machine of the present invention can be hung on outdoor outward, and the heat that the work of refrigeration machine is produced directly is drained, and does not affect test environment temperature, also maintains indoor test environment temperature without the need to additional air-conditioning, greatly reduces the testing cost of heat pipe test; The present invention also can organize performance test apparatus more and share a refrigeration machine, and this configuration greatly reduces the usage quantity of refrigeration machine, also can reduce the heat radiation of refrigeration machine, make test environment more comfortable, also extend serviceable life of the present invention, and cost significantly reduces, all right economize energy; Further, the mode that the present invention adopts two-stage to freeze, cold drawing adopts refrigerating chip freeze, in the two group refrigeration machine refrigeration of outdoor employing, refrigeration machine configuration dual stage water circulating pump, drastically increases the reliability that the present invention uses.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
A kind of cooling chip formula properties of hot pipe testing apparatus, it is characterized in that: comprising: be arranged at the heating arrangement on operator's console, cooling device and control device, external at least two refrigeration machines of described cooling device, described cooling device comprises cold drawing, cooling chip and the cooling copper billet for placing heat pipe colling end to be measured for being connected with described refrigeration machine, and described cooling chip is arranged between described cooling copper billet and cold drawing.
Described cold drawing is an inner circulation structure, is provided with inlet and liquid outlet, fills cool cycles liquid in described cold drawing and refrigeration machine.
Described cool cycles liquid comprises water, alcohol or liquid coolant.
Described cooling chip is a kind of ceramic chip utilizing Peltier effect to make, fill with heat-conducting silicone grease or heat-conducting pad between the lower surface of described refrigerating chip and described cold drawing, fill with heat-conducting silicone grease or heat-conducting pad between the upper surface of described cooling chip and the lower surface of described cooling copper billet, the upper surface of described cooling copper billet is processed with the shape that adapts with heat pipe to be measured to place described heat pipe to be measured, described cooling copper billet inside is provided with secondary heater, the surface of contact of described secondary heater and described cooling copper billet is all coated with heat-conducting silicone grease, the upper surface of described cooling copper billet is fixed with the thermometric line of the second thermopair, the lower surface of described refrigerating chip is pyrogenicity face, and the upper surface of described cooling chip is refrigeration face.
Its feature of ceramic chip is, after passing to corresponding electricity to this cooling chip, one surface temperature declines rapidly, and another side temperature raises.
Described heating arrangement comprises the heating copper billet for placing heat pipes heat end to be measured, the primary heater being arranged at described heating copper billet inside, power supply unit and power meter, and described power supply unit is connected with primary heater with described power meter by wire; The surface of contact of described primary heater and described heating copper billet is all coated with heat-conducting silicone grease, described heating copper billet upper surface is processed with the shape that adapts with heat pipe to be measured to place described heat pipe to be measured, and described heating copper billet upper surface is fixed with the thermometric line of the first thermopair.
The number of described heating arrangement is at least 1.
Described secondary heater is connected with power supply unit by wire, and described secondary heater is also connected with another power meter by wire.
Described control device comprises thermopair, temperature controller, data acquisition unit and work computer, the three thermocouple that described thermopair comprises described first thermopair be arranged on described heating copper billet, is arranged in described second thermopair on described cooling copper billet and is arranged on described heat pipe to be measured; Described temperature controller comprises the first temperature controller be connected with described first thermopair and the second temperature controller be connected with described second thermopair, and described first thermopair is connected with described first temperature controller, then is connected with described work computer; Described second thermopair is connected with described second temperature controller, then is connected with described work computer; Described three thermocouple is connected with described data acquisition unit, then is connected with described work computer.
Described operator's console comprises support, be arranged at the turning worktable on described support, the some Magnetic gauge stands on described turning worktable are fixed on by magnetic force, described heating arrangement and cooling device are arranged on described Magnetic gauge stand all actively, the top of described heating copper billet and cooling copper billet is provided with briquetting, the cylinders that the upper surface of described briquetting and Vertical dimension are arranged, all to be fixed on described Magnetic gauge stand for regulating described heating arrangement and the height adjuster of the height of cooling device and to be connected with cooling device with described heating arrangement respectively, described briquetting is arranged on described Magnetic gauge stand actively, action button for controlling the lifting of described cylinder is arranged at described support, described support is also fixed with described temperature controller, work computer and power meter.
The flip angle of described turning worktable is 0 ~ 90 °.
Described refrigeration machine comprises compression refrigerating machine or cooling tower, and at least two described refrigeration machines are all equipped with water circulating pump, and described refrigeration machine is arranged in indoor or outdoors.
Described operator's console is arranged heating arrangement described in some groups, cooling device and control device, heating arrangement, cooling device and control device described in some groups form a multistation cooling chip formula properties of hot pipe testing apparatus, described multistation cooling chip formula properties of hot pipe testing apparatus is connected with a described refrigeration machine, and the group number of described heating arrangement, cooling device and control device is at least 6 groups.
Testing process of the present invention is as follows:
1) heating arrangement is regulated: regulate heating power by power supply unit, watt level shows on power meter, by primary heater heating heating copper billet;
2) setting cooling copper billet temperature: the temperature of setting makes heat pipe to be measured remain on certain temperature range;
3) GM Refrigerator Working flow and temperature is set;
4) on heat pipe to be measured, smear heat-conducting silicone grease, heat pipe to be measured is put on the invention (heat pipes heat end to be measured is placed on heating copper billet, and heat pipe colling end to be measured is placed on cooling copper billet), press testing button and start test;
5) data acquisition unit gathers the temperature of three thermocouple automatically, and analyzes, and temp controlled meter can gather the temperature of heating copper billet and cooling copper billet automatically, can stop heating when exceeding design temperature;
6) test duration set, when arriving, stop test, work computer showed the test result of heat pipe to be measured.
A kind of cooling chip formula properties of hot pipe testing apparatus provided by the invention, adding of cooling chip, make the present invention adopt the type of cooling of cooling chip+cold drawing+chilled water, cold plate temperature remains at design temperature, the temperature fluctuation of cold drawing is less, and the consistance of test result and stability are all higher; And cooling chip refrigeration speed is fast, and heat pipe to be measured can reach balance fast, and the test duration is short, and compared with traditional properties of hot pipe test machine, the test duration of the present invention can save more than 20%; Refrigeration machine can be arranged at outdoor design, the heat that test is cooled can not directly be discharged in workshop, effectively can improve the comfort level of workshop condition, without the need to establishing refrigeration air-conditioner newly to maintain the test environment temperature needed in test cabinet, the expense of configuration air-conditioning and the electricity charge needed for air-conditioning unlatching are saved, saved cost and the energy, the life-span of the present invention have also been obtained large increase simultaneously; The mode that the present invention also adopts two-stage to freeze, cold drawing adopts cooling chip freeze, in the two group refrigeration machine refrigeration of outdoor employing, refrigeration machine configuration dual stage water circulating pump, drastically increases the reliability that the present invention uses.A kind of cooling chip formula properties of hot pipe testing apparatus provided by the invention, have that temperature-controlled precision is high, testing efficiency is high, energy-conserving and environment-protective, good stability advantage, be applicable to wide popularization and application.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the enlarged drawing of part A in Fig. 1.
Embodiment
Below in conjunction with accompanying drawing, the present invention is further described.
As shown in Figure 1-2, a kind of cooling chip formula properties of hot pipe testing apparatus, it is characterized in that: comprising: be arranged at the heating arrangement 2 on operator's console 1, cooling device 3 and control device 4, external two refrigeration machines 5 of described cooling device 3, described cooling device 3 comprises cold drawing 6, cooling chip 7 and the cooling copper billet 8 for placing heat pipe colling end to be measured for being connected with described refrigeration machine 5, and described cooling chip 7 is arranged between described cooling copper billet 8 and cold drawing 6.
Described cold drawing 6 is inner circulation structures, is provided with inlet and liquid outlet, fills cool cycles liquid in described cold drawing 6 and refrigeration machine 5.
Described cool cycles liquid comprises water, alcohol or liquid coolant.
Described cooling chip 7 is a kind of ceramic chip utilizing Peltier effect to make, fill with heat-conducting silicone grease or heat-conducting pad between the lower surface of described refrigerating chip 7 and described cold drawing 6, fill with heat-conducting silicone grease or heat-conducting pad between the upper surface of described cooling chip 7 and the lower surface of described cooling copper billet 8, the upper surface of described cooling copper billet 8 is processed with the shape that adapts with heat pipe to be measured to place described heat pipe to be measured, described cooling copper billet 8 inside is provided with secondary heater, the surface of contact of described secondary heater and described cooling copper billet 8 is all coated with heat-conducting silicone grease, the upper surface of described cooling copper billet 8 is fixed with the thermometric line of the second thermopair, the lower surface of described refrigerating chip 7 is pyrogenicity face, and the upper surface of described cooling chip 7 is refrigeration face.
Described heating arrangement 2 comprises the heating copper billet 9 for placing heat pipes heat end to be measured, the primary heater being arranged at described heating copper billet 9 inside, power supply unit and power meter 10, and described power supply unit is connected with primary heater with described power meter 10 by wire; The surface of contact of described primary heater and described heating copper billet 9 is all coated with heat-conducting silicone grease, described heating copper billet 9 upper surface is processed with the shape that adapts with heat pipe to be measured to place described heat pipe to be measured, and described heating copper billet 9 upper surface is fixed with the thermometric line of the first thermopair.
Described control device 4 comprises thermopair, temperature controller 11, data acquisition unit and work computer 12, the three thermocouple that described thermopair comprises described first thermopair be arranged on described heating copper billet 9, is arranged in described second thermopair on described cooling copper billet 8 and is arranged on described heat pipe to be measured; Described temperature controller 11 comprises the first temperature controller be connected with described first thermopair and the second temperature controller be connected with described second thermopair, and described first thermopair is connected with described first temperature controller, then is connected with described work computer 12; Described second thermopair is connected with described second temperature controller, then is connected with described work computer 12; Described three thermocouple is connected with described data acquisition unit, then is connected with described work computer 12.
Described operator's console 1 comprises support 13, be arranged at the turning worktable 14 on described support 13, the some Magnetic gauge stands 15 on described turning worktable 14 are fixed on by magnetic force, described heating arrangement 2 and cooling device 3 are arranged on described Magnetic gauge stand 15 all actively, the top of described heating copper billet 9 and cooling copper billet 8 is provided with briquetting 16, the cylinder 17 that upper surface and the Vertical dimension of described briquetting 16 are arranged is connected, all to be fixed on described Magnetic gauge stand 15 for regulating described heating arrangement 2 and the height adjuster 18 of the height of cooling device 3 and to be connected with cooling device 3 with described heating arrangement 2 respectively, described briquetting 16 is arranged on described Magnetic gauge stand 15 actively, action button 19 for controlling the lifting of described cylinder 17 is arranged at described support 13, described support 13 is also fixed with described temperature controller 11, work computer 12 and power meter 10.
The flip angle of described turning worktable 14 is 0 ~ 90 °.
Described refrigeration machine 5 comprises compression refrigerating machine or cooling tower, and two described refrigeration machines 5 are all equipped with water circulating pump, and described refrigeration machine 5 is arranged in indoor or outdoors.
Described operator's console 1 is arranged heating arrangement 2 described in some groups, cooling device 3 and control device 4, heating arrangement 2, cooling device 3 and control device 4 described in some groups form a multistation cooling chip formula properties of hot pipe testing apparatus, described multistation cooling chip formula properties of hot pipe testing apparatus is connected with a described refrigeration machine 5, and the group number of described heating arrangement 2, cooling device 3 and control device 4 is 6 groups.
The above is only the preferred embodiment of the present invention; be noted that for those skilled in the art; under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.

Claims (10)

1. a cooling chip formula properties of hot pipe testing apparatus, it is characterized in that: comprising: be arranged at the heating arrangement (2) on operator's console (1), cooling device (3) and control device (4), external at least two refrigeration machines (5) of described cooling device (3), described cooling device (3) comprises cold drawing (6), cooling chip (7) and the cooling copper billet (8) for placing heat pipe colling end to be measured for being connected with described refrigeration machine (5), and described cooling chip (7) is arranged between described cooling copper billet (8) and cold drawing (6).
2. a kind of cooling chip formula properties of hot pipe testing apparatus according to claim 1, is characterized in that: described cold drawing (6) is an inner circulation structure, is provided with inlet and liquid outlet, fills cool cycles liquid in described cold drawing (6) and refrigeration machine (5).
3. a kind of cooling chip formula properties of hot pipe testing apparatus according to claim 2, is characterized in that: described cool cycles liquid comprises water, alcohol or liquid coolant.
4. a kind of cooling chip formula properties of hot pipe testing apparatus according to claim 1, it is characterized in that: described cooling chip (7) is a kind of ceramic chip utilizing Peltier effect to make, fill with heat-conducting silicone grease or heat-conducting pad between the lower surface of described refrigerating chip (7) and described cold drawing (6), fill with heat-conducting silicone grease or heat-conducting pad between the upper surface of described cooling chip (7) and the lower surface of described cooling copper billet (8), the upper surface of described cooling copper billet (8) is processed with the shape that adapts with heat pipe to be measured to place described heat pipe to be measured, described cooling copper billet (8) inside is provided with secondary heater, the surface of contact of described secondary heater and described cooling copper billet (8) is all coated with heat-conducting silicone grease, the upper surface of described cooling copper billet (8) is fixed with the thermometric line of the second thermopair, the lower surface of described refrigerating chip (7) is pyrogenicity face, and the upper surface of described cooling chip (7) is refrigeration face.
5. a kind of cooling chip formula properties of hot pipe testing apparatus according to claim 1, it is characterized in that: described heating arrangement (2) comprises the heating copper billet (9) for placing heat pipes heat end to be measured, the primary heater being arranged at described heating copper billet (9) inside, power supply unit and power meter (10), and described power supply unit is connected with primary heater with described power meter (10) by wire; The surface of contact of described primary heater and described heating copper billet (9) is all coated with heat-conducting silicone grease, described heating copper billet (9) upper surface is processed with the shape that adapts with heat pipe to be measured to place described heat pipe to be measured, and described heating copper billet (9) upper surface is fixed with the thermometric line of the first thermopair.
6. a kind of cooling chip formula properties of hot pipe testing apparatus according to claim 5, it is characterized in that: described control device (4) comprises thermopair, temperature controller (11), data acquisition unit and work computer (12), the three thermocouple that described thermopair comprises described first thermopair be arranged on described heating copper billet (9), is arranged in described second thermopair on described cooling copper billet (8) and is arranged on described heat pipe to be measured; Described temperature controller (11) comprises the first temperature controller be connected with described first thermopair and the second temperature controller be connected with described second thermopair, and described first thermopair is connected with described first temperature controller, then is connected with described work computer (12); Described second thermopair is connected with described second temperature controller, then is connected with described work computer (12); Described three thermocouple is connected with described data acquisition unit, then is connected with described work computer (12).
7. a kind of cooling chip formula properties of hot pipe testing apparatus according to claim 6, it is characterized in that: described operator's console (1) comprises support (13), be arranged at the turning worktable (14) on described support (13), the some Magnetic gauge stands (15) on described turning worktable (14) are fixed on by magnetic force, described heating arrangement (2) and cooling device (3) are arranged on described Magnetic gauge stand (15) all actively, the top of described heating copper billet (9) and cooling copper billet (8) is provided with briquetting (16), the cylinder (17) that the upper surface of described briquetting (16) is arranged with Vertical dimension is connected, all be fixed on described Magnetic gauge stand (15) for regulating described heating arrangement (2) and the height adjuster (18) of the height of cooling device (3) go up and be connected with cooling device (3) with described heating arrangement (2) respectively, described briquetting (16) is arranged on described Magnetic gauge stand (15) actively, the action button (19) be elevated for controlling described cylinder (17) is arranged at described support (13), described support (13) is also fixed with described temperature controller (11), work computer (12) and power meter (10).
8. a kind of cooling chip formula properties of hot pipe testing apparatus according to claim 7, is characterized in that: the flip angle of described turning worktable (14) is 0 ~ 90 °.
9. a kind of cooling chip formula properties of hot pipe testing apparatus according to claim 1, it is characterized in that: described refrigeration machine (5) comprises compression refrigerating machine or cooling tower, at least two described refrigeration machines (5) are all equipped with water circulating pump, and described refrigeration machine (5) is arranged in indoor or outdoors.
10. a kind of cooling chip formula properties of hot pipe testing apparatus according to claim 1, it is characterized in that: described operator's console (1) is arranged heating arrangement described in some groups (2), cooling device (3) and control device (4), heating arrangement (2) described in some groups, cooling device (3) and control device (4) composition multistation cooling chip formula properties of hot pipe testing apparatus, described multistation cooling chip formula properties of hot pipe testing apparatus is connected with a described refrigeration machine (5), described heating arrangement (2), the group number of cooling device (3) and control device (4) is at least 6 groups.
CN201410641048.0A 2014-11-14 2014-11-14 Refrigeration chip type heat pipe performance testing device Active CN104330277B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410641048.0A CN104330277B (en) 2014-11-14 2014-11-14 Refrigeration chip type heat pipe performance testing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410641048.0A CN104330277B (en) 2014-11-14 2014-11-14 Refrigeration chip type heat pipe performance testing device

Publications (2)

Publication Number Publication Date
CN104330277A true CN104330277A (en) 2015-02-04
CN104330277B CN104330277B (en) 2017-02-08

Family

ID=52405048

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410641048.0A Active CN104330277B (en) 2014-11-14 2014-11-14 Refrigeration chip type heat pipe performance testing device

Country Status (1)

Country Link
CN (1) CN104330277B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113960446A (en) * 2021-10-10 2022-01-21 北京工业大学 Temperature-controllable SiC chip power cycle experimental device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1862254A (en) * 2005-05-14 2006-11-15 富准精密工业(深圳)有限公司 Method and apparatus for detecting heat conducting pipe performance
US20070047614A1 (en) * 2005-08-24 2007-03-01 Yeh-Chiang Technology Corp. Measuring system and screening method for thermal conductive efficiencies of thermal conductive devices
CN101299030A (en) * 2007-05-02 2008-11-05 致惠科技股份有限公司 Heat pipe measuring system and method
CN201159725Y (en) * 2008-01-14 2008-12-03 致惠科技股份有限公司 Improved structure of heat pipe test platform
CN201397309Y (en) * 2009-03-05 2010-02-03 上海威特力热管散热器有限公司 Testing device for heat transferring performance of single heat pipe
CN201688621U (en) * 2010-04-15 2010-12-29 致惠科技股份有限公司 Structure of temperature controlled testing device
CN201897577U (en) * 2010-11-10 2011-07-13 致惠科技股份有限公司 Heat pipe testing device
CN103353465A (en) * 2012-11-30 2013-10-16 上海裕达实业公司 Testing device for isothermality of heat pipe
CN204177595U (en) * 2014-11-14 2015-02-25 昆山海益博散热器有限公司 A kind of cooling chip formula properties of hot pipe testing apparatus

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1862254A (en) * 2005-05-14 2006-11-15 富准精密工业(深圳)有限公司 Method and apparatus for detecting heat conducting pipe performance
US20070047614A1 (en) * 2005-08-24 2007-03-01 Yeh-Chiang Technology Corp. Measuring system and screening method for thermal conductive efficiencies of thermal conductive devices
CN101299030A (en) * 2007-05-02 2008-11-05 致惠科技股份有限公司 Heat pipe measuring system and method
CN201159725Y (en) * 2008-01-14 2008-12-03 致惠科技股份有限公司 Improved structure of heat pipe test platform
CN201397309Y (en) * 2009-03-05 2010-02-03 上海威特力热管散热器有限公司 Testing device for heat transferring performance of single heat pipe
CN201688621U (en) * 2010-04-15 2010-12-29 致惠科技股份有限公司 Structure of temperature controlled testing device
CN201897577U (en) * 2010-11-10 2011-07-13 致惠科技股份有限公司 Heat pipe testing device
CN103353465A (en) * 2012-11-30 2013-10-16 上海裕达实业公司 Testing device for isothermality of heat pipe
CN204177595U (en) * 2014-11-14 2015-02-25 昆山海益博散热器有限公司 A kind of cooling chip formula properties of hot pipe testing apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113960446A (en) * 2021-10-10 2022-01-21 北京工业大学 Temperature-controllable SiC chip power cycle experimental device
CN113960446B (en) * 2021-10-10 2023-10-10 北京工业大学 SiC chip power cycle experimental apparatus of controllable temperature

Also Published As

Publication number Publication date
CN104330277B (en) 2017-02-08

Similar Documents

Publication Publication Date Title
CN204157201U (en) A kind of intermediate water loop server cabinet cooling system
CN104320953A (en) Secondary water-loop server cabinet cooling system
CN109843025B (en) Immersed cooling device
CN208063653U (en) A kind of Electric Power Automation Equipment heat sink
CN103175706A (en) Air cooled heating pump test system
EP3534681B1 (en) Centralized cooling system for data center computer rooms
CN106383562A (en) Chilling plate water-cooling radiating device
CN204795958U (en) High -efficient coolant tank
TWM578928U (en) Coolant distribution unit
CN205193716U (en) Extremely fast notebook computer radiator of cold temperature formula
CN204177595U (en) A kind of cooling chip formula properties of hot pipe testing apparatus
CN203101160U (en) Semiconductor pathological paraffin embedded refrigerator
CN104330277A (en) Refrigeration chip type heat pipe performance testing device
CN205003610U (en) Display card liquid cooling ware of control by temperature change induction type
CN204131372U (en) A kind of mine-used frequency-converter cooling device
CN203657280U (en) Cooling head of temperature-adjustable cooling device
CN204693882U (en) Full working scope scope compound many temperature feed flow refrigeration unit
CN211090397U (en) Liquid immersion type server cabinet and cooling system thereof
CN104252187A (en) Control method for heat dissipation system of secondary water loop server cabinet
CN211090398U (en) Liquid immersion type server cabinet and cooling system thereof
CN204305546U (en) A kind of high-power heater members group cooling device
CN201518479U (en) Liquid cooling device for digital television transmitter
CN203521890U (en) Double-circulation-waterway semiconductor laser refrigerating system
CN204272578U (en) A kind of novel immersion heat abstractor
CN104411147A (en) Novel liquid immersion cooling device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant