CN201688621U - Structure of temperature control testing device - Google Patents
Structure of temperature control testing device Download PDFInfo
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- CN201688621U CN201688621U CN2010201859382U CN201020185938U CN201688621U CN 201688621 U CN201688621 U CN 201688621U CN 2010201859382 U CN2010201859382 U CN 2010201859382U CN 201020185938 U CN201020185938 U CN 201020185938U CN 201688621 U CN201688621 U CN 201688621U
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- temperature control
- heat dissipation
- temperature
- testing arrangement
- cooling
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- 238000012360 testing method Methods 0.000 title claims abstract description 21
- 238000001816 cooling Methods 0.000 claims abstract description 35
- 239000003507 refrigerant Substances 0.000 claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 239000013068 control sample Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 34
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005057 refrigeration Methods 0.000 abstract 2
- 230000000630 rising effect Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000005457 ice water Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
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Abstract
Description
技术领域technical field
本实用新型涉及电气类,特别涉及一种温控测试装置的结构,尤指一种具有更宽广的温控范围、解热能力高、温控速度快的温控测试装置的结构。The utility model relates to electrics, in particular to a structure of a temperature control test device, especially a structure of a temperature control test device with a wider temperature control range, high heat-dissolving ability and fast temperature control speed.
背景技术Background technique
一般致冷芯片常被用于升温及降温,并且搭配套装的设备即可达到有效控制温度的效果,而此其中必定具备散热机构来控制温控平台的温控能力,且为温控范围的主要组件之一,而以目前散热机构最常见的设计分为两大种,一是气冷式,另一是水冷式,如附图1所示,为已有气冷式温控平台机构的平面示意图,由图中可清楚看出,该温控平台机构10包括一可供放置欲进行温控样品11的平台12;一与该平台12底部121相贴附的致冷芯片13;一贴附于该致冷芯片13底部131的散热机构14,该散热机构14由散热金属鳍片141及风扇142所构成,当温控样品11欲降温时,即改变该致冷芯片13的电流,通过该致冷芯片13将平台12上的热能抽离,并由该散热金属鳍片141利用风扇142的散热吹动方式将热能带走,其优点为结构简单,也因此成本较低,然而,因本身散热机构即为空气的温度,无法达到更低的温控范围。Generally, cooling chips are often used to heat up and cool down, and can achieve effective temperature control with a set of equipment, and there must be a heat dissipation mechanism to control the temperature control capability of the temperature control platform, and it is the main temperature control range. One of the components, and the most common design of the heat dissipation mechanism is divided into two types, one is air-cooled, the other is water-cooled, as shown in Figure 1, which is the plane of the existing air-cooled temperature control platform mechanism Schematic diagram, as can be clearly seen from the figure, the temperature
而另一已有技术则改进了上述已有的温控技术的缺点,如附图2所示,为另一已有水冷式温控平台机构的平面示意图,由图中可清楚看出,该温控平台机构20包括一可供放置欲进行温控样品21的平台22;一与该平台22底部221相贴附的致冷芯片23;一贴附于该致冷芯片23底部231的散热机构24,该散热机构24由一冰水机241连接一水循环管路242所构成,当温控样品21欲降温时,即改变该致冷芯片23的电流,通过该致冷芯片23将平台22上的热能抽离,并由该水循环管路242内的冰水溶性液体25将热能带离,进而由冰水溶性液体25达到更有效、更低温的降温效果,然而,此种方式虽能有效达到降温功效,但因必须使用冰水机241,使得成本增高,且若冰水溶性液体25的冰点未达到标准值,则必须花更长时间等待其达到标准值方可继续进行降温,而另一缺点是若水循环管路242破裂而引发漏水,则非常麻烦。Another existing technology improves the shortcomings of the above-mentioned existing temperature control technology. As shown in Figure 2, it is a schematic plan view of another existing water-cooled temperature control platform mechanism. It can be clearly seen from the figure that the The temperature control platform mechanism 20 includes a platform 22 for placing the desired temperature control sample 21; a cooling chip 23 attached to the bottom 221 of the platform 22; a cooling mechanism attached to the bottom 231 of the cooling chip 23 24. The heat dissipation mechanism 24 is composed of a chiller 241 connected to a water circulation pipeline 242. When the temperature-controlled sample 21 wants to cool down, the current of the cooling chip 23 is changed, and the cooling chip 23 passes through the cooling chip 23. The heat energy is extracted, and the heat energy is taken away by the ice-water soluble liquid 25 in the water circulation pipeline 242, and then a more effective and lower temperature cooling effect is achieved by the ice-water soluble liquid 25. However, although this method can effectively achieve Cooling effect, but because of the necessity to use the ice water machine 241, the cost is increased, and if the freezing point of the ice-water soluble liquid 25 does not reach the standard value, it must take a longer time to wait for it to reach the standard value before continuing to cool down, and another The disadvantage is that if the water circulation pipeline 242 breaks and causes water leakage, it will be very troublesome.
实用新型内容Utility model content
本实用新型的目的在于提供一种温控测试装置的结构,弥补上述两种散热机构的缺点。The purpose of this utility model is to provide a structure of a temperature control testing device to make up for the shortcomings of the above two heat dissipation mechanisms.
一种温控测试装置的结构,其包括一供放置欲进行温控样品的平台,该平台底部贴附一致冷芯片,而该致冷芯片设于一散热机构上,其中,该散热机构主要包括:A structure of a temperature control test device, which includes a platform for placing samples to be subjected to temperature control, a cooling chip is attached to the bottom of the platform, and the cooling chip is arranged on a heat dissipation mechanism, wherein the heat dissipation mechanism mainly includes :
一与该致冷芯片相贴附的散热基座,该散热基座内设有冷媒管;A heat dissipation base attached to the cooling chip, and a refrigerant pipe is arranged in the heat dissipation base;
一连接于该散热基座底部的散热鳍片组;及a heat dissipation fin set connected to the bottom of the heat dissipation base; and
至少一设于该散热鳍片组与该散热基座连接处另一侧的风扇;at least one fan disposed on the other side of the connection between the heat dissipation fin set and the heat dissipation base;
该冷媒管连接一压缩机、一冷媒冷凝器、一膨胀阀及一蒸发器;The refrigerant pipe is connected to a compressor, a refrigerant condenser, an expansion valve and an evaporator;
该冷媒管内充满冷媒;the refrigerant pipe is filled with refrigerant;
该温控测试装置电性连接一供控制该温控测试装置进行升温或降温调节的控制单元。The temperature control test device is electrically connected to a control unit for controlling the temperature control test device to adjust the temperature up or down.
本实用新型的优点在于:其兼具气冷式及水冷式的优点,由冷媒管可使低温范围值更低,以及由风扇达到高温范围值更高,且高低温控制改变时,系统热容小,反应速度快,成本低,无漏水问题。The utility model has the advantages of: it has the advantages of both air-cooled and water-cooled, the low-temperature range can be made lower by the refrigerant pipe, and the high-temperature range by the fan is higher, and when the high and low temperature control is changed, the heat capacity of the system Small, fast response, low cost, no water leakage problem.
附图说明Description of drawings
图1为已有气冷式温控平台机构的平面示意图。FIG. 1 is a schematic plan view of an existing air-cooled temperature control platform mechanism.
图2为另一已有水冷式温控平台机构的平面示意图。FIG. 2 is a schematic plan view of another existing water-cooled temperature control platform mechanism.
图3为本实用新型较佳实施例的平面示意图。Fig. 3 is a schematic plan view of a preferred embodiment of the present invention.
图4为本实用新型较佳实施例的实施示意图。Fig. 4 is a schematic diagram of implementation of a preferred embodiment of the present invention.
图5为本实用新型较佳实施例的作动示意图一。FIG. 5 is the first schematic diagram of the operation of the preferred embodiment of the present invention.
图6为本实用新型较佳实施例的作动示意图二。Fig. 6 is the second schematic diagram of the operation of the preferred embodiment of the present invention.
具体实施方式Detailed ways
如附图3所示,为本实用新型较佳实施例的平面示意图,由图中可清楚看出本实用新型温控测试装置30包括一供放置欲进行温控样品40的平台31,该平台31底部311贴附一致冷芯片32,而该致冷芯片32设于一散热机构33上,该散热机构33主要包括一与该致冷芯片32相贴附的散热基座34,该散热基座34内设有冷媒管35,该冷媒管35连接一压缩机351、一冷媒冷凝器352、一膨胀阀353及一蒸发器354,并且该冷媒管35内充满冷媒,而该散热基座34底部341连接一散热鳍片组36,并且该散热鳍片组36与该散热基座34连接处的另一侧设有至少一风扇37。As shown in accompanying drawing 3, it is a schematic plan view of a preferred embodiment of the present invention, and it can be clearly seen from the figure that the temperature
由上述的结构、组成设计,就本实用新型的使用情形说明如下,如附图3至附图6所示,为本实用新型较佳实施例的平面示意图、实施示意图、作动示意图一、二,由图中可清楚看出,该温控测试装置30电性连接一控制单元50,以供控制该温控测试装置30进行升温或降温,欲对置于该平台31上的样品40进行测试时,首先通过该控制单元50进行对该温控测试装置30的联机控制,若欲测试该样品40于低温时的相关特性时,则马达(图未示出)启动该压缩机351,将低压低温的气态冷媒60压缩成高压高温的气态冷媒60,再由冷媒冷凝器352将高压高温的气态冷媒60,经冷却介质(空气、水)冷却成高压中温的液态冷媒60,此后再通过一冷媒控制器(图未示出)将高压中温液态冷媒60降压成低压中温的液态冷媒60,降压的目的是配合蒸发器354蒸发,使冷媒60在低压下能低温蒸发,最后再通过蒸发器354将低压中温液态冷媒60蒸发吸热成低温低压的气压冷媒60,即形成冷媒60,并且该冷媒60充满该冷媒管35内,以达到直接对散热基座34降温,同时致冷芯片32通过散热基座34将致冷芯片32样品面所传导的热能70进行排解,使平台31达到更低的温度,反之,若欲对样品40进行高温测试时,停止压缩机351运作,即停止冷媒60运作,而后启动风扇37产生风能71,使散热基座34达到室温,同时该散热基座34抽取热能70由致冷芯片32传导至样品面,使平台31温度达到更高范围,因此,该样品得以直接通过该平台31来达到降温及升温目的。Based on the above-mentioned structure and composition design, the usage of the present utility model is described as follows, as shown in accompanying drawings 3 to 6, which are schematic plan views, schematic diagrams of implementation, and schematic diagrams of operation of preferred embodiments of the present utility model. , it can be clearly seen from the figure that the temperature
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102520742A (en) * | 2011-11-10 | 2012-06-27 | 致茂电子(苏州)有限公司 | Temperature regulation and control system for detecting platform |
CN104281177A (en) * | 2013-07-03 | 2015-01-14 | 致茂电子股份有限公司 | Wide area temperature control device |
CN104330277A (en) * | 2014-11-14 | 2015-02-04 | 昆山海益博散热器有限公司 | Refrigeration chip type heat pipe performance testing device |
CN104503508A (en) * | 2014-12-18 | 2015-04-08 | 上海市计量测试技术研究院 | Temperature control system and temperature control method of solar cell test bed |
US9494353B2 (en) | 2013-07-03 | 2016-11-15 | Chroma Ate Inc. | Temperature control equipment |
CN106168843A (en) * | 2016-07-05 | 2016-11-30 | 九江学院 | A kind of intelligent computer of automatic cooling |
CN110749783A (en) * | 2018-07-24 | 2020-02-04 | 致茂电子股份有限公司 | High-low temperature test equipment and test method thereof |
CN111308321A (en) * | 2020-03-12 | 2020-06-19 | 苏州艾方芯动自动化设备有限公司 | Multi-chip multifunctional test system |
CN112066592A (en) * | 2020-08-25 | 2020-12-11 | 武汉理工大学 | A transient cooling method for ultrathin thermoelectric films applied to chips |
-
2010
- 2010-04-15 CN CN2010201859382U patent/CN201688621U/en not_active Expired - Fee Related
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102520742A (en) * | 2011-11-10 | 2012-06-27 | 致茂电子(苏州)有限公司 | Temperature regulation and control system for detecting platform |
CN104281177A (en) * | 2013-07-03 | 2015-01-14 | 致茂电子股份有限公司 | Wide area temperature control device |
US9494353B2 (en) | 2013-07-03 | 2016-11-15 | Chroma Ate Inc. | Temperature control equipment |
CN104330277A (en) * | 2014-11-14 | 2015-02-04 | 昆山海益博散热器有限公司 | Refrigeration chip type heat pipe performance testing device |
CN104503508A (en) * | 2014-12-18 | 2015-04-08 | 上海市计量测试技术研究院 | Temperature control system and temperature control method of solar cell test bed |
CN104503508B (en) * | 2014-12-18 | 2016-08-24 | 上海市计量测试技术研究院 | A kind of solar cell testboard temperature control system and temp. control method |
CN106168843A (en) * | 2016-07-05 | 2016-11-30 | 九江学院 | A kind of intelligent computer of automatic cooling |
CN110749783A (en) * | 2018-07-24 | 2020-02-04 | 致茂电子股份有限公司 | High-low temperature test equipment and test method thereof |
CN110749783B (en) * | 2018-07-24 | 2022-05-10 | 致茂电子股份有限公司 | High and low temperature test equipment and its test method |
CN111308321A (en) * | 2020-03-12 | 2020-06-19 | 苏州艾方芯动自动化设备有限公司 | Multi-chip multifunctional test system |
CN112066592A (en) * | 2020-08-25 | 2020-12-11 | 武汉理工大学 | A transient cooling method for ultrathin thermoelectric films applied to chips |
CN112066592B (en) * | 2020-08-25 | 2022-01-25 | 武汉理工大学 | Transient refrigeration method of ultrathin thermoelectric film applied to chip |
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