CN204202236U - A kind of semiconductor cooling device measuring undercooling point or freezing point - Google Patents
A kind of semiconductor cooling device measuring undercooling point or freezing point Download PDFInfo
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- CN204202236U CN204202236U CN201420581286.2U CN201420581286U CN204202236U CN 204202236 U CN204202236 U CN 204202236U CN 201420581286 U CN201420581286 U CN 201420581286U CN 204202236 U CN204202236 U CN 204202236U
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Abstract
The utility model discloses a kind of semiconductor cooling device measuring undercooling point or freezing point, provide a kind of good portability, cost is low, device easy to use.Comprise by the metal sample box of conduction cooling, semiconductor refrigerating module and water-cooling heat radiating system, semiconductor refrigerating module comprises the first liquid cooling water plate, the first semiconductor chilling plate and conduction cooling plate, the hot junction of the first semiconductor chilling plate contacts with the upper surface of the first liquid cooling water plate, the cold junction of the first semiconductor chilling plate contacts with conduction cooling plate, the lower surface of the first liquid cooling water plate contacts with air, and the liquid-inlet of the first liquid cooling water plate and liquid outlet are connected with the liquid outlet of water-cooling heat radiating system and liquid-inlet respectively; Sample box is positioned on conduction cooling plate.Measurement mechanism of the present utility model can measure undercooling point or the freezing point of article at short notice, and good portability, cost are low, Measuring Time is short, easy-to-use.
Description
Technical field
The utility model relates to refrigeration technology field, particularly relates to a kind of semiconductor cooling device measuring undercooling point or freezing point.
Background technology
Freezing point is the storage critical point of all cryopreservation things, and it is for determining that corresponding storage technology has decisive action, therefore becomes freezing to the research of repertory freezing point, one of focus in refrigeration research field.
The method commonly used when pre-test freezing point has traditional freezing process and dsc measurement method these two kinds.DSC method, mainly in temperature-fall period, by the comparison with object of reference, draws temperature drop curve, and costly, in use consumptive material is larger for equipment, and operating cost is high; Freezing rule is draw temperature variation curve by direct cool-down method, needs the Cryo Equipment that fixing, and volume is large, and portability is poor, and applicable situation is few.Measurement mechanism all underactions of these two kinds of methods, inconvenience is mobile, and cost is higher, and determination period is longer, which limits use occasion.
Utility model content
The purpose of this utility model is the technological deficiency for existing in prior art, and provides a kind of good portability, and cost is low, measurement article undercooling point easy to use or the semiconductor cooling device of freezing point.
The technical scheme adopted for realizing the purpose of this utility model is:
A kind of semiconductor cooling device measuring undercooling point or freezing point, comprise by the metal sample box of conduction cooling, semiconductor refrigerating module and water-cooling heat radiating system, described semiconductor refrigerating module comprises the first liquid cooling water plate, first semiconductor chilling plate and conduction cooling plate, the hot junction of described first semiconductor chilling plate contacts with the upper surface of described first liquid cooling water plate, the cold junction of described first semiconductor chilling plate contacts with described conduction cooling plate, the lower surface of described first liquid cooling water plate contacts with air, the liquid-inlet of described first liquid cooling water plate and liquid outlet are connected with the liquid outlet of described water-cooling heat radiating system and liquid-inlet respectively, described sample box is positioned on described conduction cooling plate, is placed with testing sample in described sample box, and described testing sample is provided with thermocouple, and described thermocouple is connected with data handling machine by data collecting instrument.
Described water-cooling heat radiating system comprises the first water-cooled module, described first water-cooled module comprises the first water tank, the first water pump, the second semiconductor chilling plate and the second liquid cooling water plate, the cold junction of described second semiconductor chilling plate contacts with described second liquid cooling water plate, and the hot junction of described second semiconductor chilling plate contacts with air or connects with the second water-cooled module; The delivery port of described first water tank is connected with the water inlet of described first water pump, the delivery port of described first water pump is connected with the liquid-inlet of described first liquid cooling water plate, the liquid outlet of described first liquid cooling water plate is connected with the liquid-inlet of described second liquid cooling water plate, and the liquid outlet of described second liquid cooling water plate is connected with the import of described first water tank.
Described second water-cooled module comprises the 3rd liquid cooling water plate, water-filled radiator, the second water tank and the second water pump, the liquid outlet of described 3rd liquid cooling water plate is connected with the water inlet of described water-filled radiator, the delivery port of described water-filled radiator is connected by the import of described second water tank with described second water pump, and the delivery port of described second water pump is connected with the liquid-inlet of described 3rd liquid cooling water plate.
The first heat conduction lipid layer is coated with respectively between the hot junction of described first semiconductor chilling plate and described first liquid cooling water plate and between the cold junction of described first semiconductor chilling plate and described conduction cooling plate.
The second heat conduction lipid layer is coated with respectively between described second semiconductor chilling plate and the second liquid cooling water plate and between described second semiconductor chilling plate and described 3rd liquid cooling water plate.
Described conduction cooling plate is aluminium sheet, and sample box is made up of copper coin.
Described sample box outside is coated with the first heat-insulation layer.
Described second liquid cooling water plate outside is coated with the second heat-insulation layer.
Described first semiconductor chilling plate, conduction cooling plate and the first liquid cooling water plate are fixedly connected with.
Described second semiconductor chilling plate, the second liquid cooling water plate and the 3rd liquid cooling water plate are fixedly connected with.
Compared with prior art, the beneficial effects of the utility model are:
1, device of the present utility model adopts semiconductor refrigerating module and water-cooling system composition, freezed to conduction cooling plate by semiconductor chilling plate, by conduction cooling plate, cold is passed to sample box again, sample is lowered the temperature in sample box, and water-cooling heat radiating system is used for taking away the heat in semiconductor chilling plate hot junction in whole process.Good portability, cost are low, Measuring Time is short.Can per sample concrete physical property sample from bottom sample box between suitably add different heat-conducting mediums, carry out the rate of temperature fall of Quality control, easy to use.
2, device of the present utility model only has the sound of water-filled radiator fan in measuring process, and noise is minimum, and whole measurement mechanism is flexibly small and exquisite, and structure is simple, and operation is convenient.
Accompanying drawing explanation
Figure 1 shows that the utility model measures the structural representation of the semiconductor cooling device of undercooling point or freezing point;
Figure 2 shows that the structural representation of semiconductor refrigerating module.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
The utility model measures the schematic diagram of the semiconductor cooling device of undercooling point or freezing point as depicted in figs. 1 and 2, comprise by the metal sample box 9 of conduction cooling, semiconductor refrigerating module I and water-cooling heat radiating system, described semiconductor refrigerating module I comprises the first liquid cooling water plate 1, first semiconductor chilling plate 4 and conduction cooling plate 6, the hot junction of described first semiconductor chilling plate 4 contacts with the upper surface of described first liquid cooling water plate 1, the cold junction of described first semiconductor chilling plate 4 contacts with described conduction cooling plate 6, the lower surface of described first liquid cooling water plate 1 contacts with air, the liquid-inlet of described first liquid cooling water plate 1 and liquid outlet are connected with the liquid outlet of described water-cooling heat radiating system and liquid-inlet respectively, described sample box 9 is positioned on described conduction cooling plate 6, testing sample is placed with in described sample box, the cold junction of the semiconductor chilling plate 4 in described semiconductor refrigerating module I is used for sample box cooling, also suitably can mate one-level, secondary, the semiconductor chilling plates such as three grades in described semiconductor refrigerating module I as required.The medium that different thermal conductivity can be placed in the bottom of sample box 9 carrys out the rate of temperature fall of Quality control.The heat in the hot junction of described semiconductor chilling plate 4 is absorbed by water-cooling heat radiating system.Described testing sample is provided with thermocouple, and described thermocouple is connected with data handling machine by data collecting instrument.Utilize semiconductor refrigerating fast cooling, accurately obtained undercooling point and the freezing point of sample by the temperature lowering curve of sample.In the present embodiment, described first semiconductor chilling plate 4, conduction cooling plate 6 and liquid cooling water plate 1 are fixedly connected with buckle 2 by bolt 8, nut 7.In the present embodiment, described conduction cooling plate 6 is aluminium sheet, and sample box is made up of copper coin.In order to prevent the loss of cold, described sample box 9 outside is coated with the first heat-insulation layer 5.
Described water-cooling heat radiating system comprises the first water-cooled module II, described first water-cooled module II comprises the first water tank 10, first water pump 11, second semiconductor chilling plate 12 and the second liquid cooling water plate 16, the cold junction of described second semiconductor chilling plate 12 contacts with described second liquid cooling water plate 16, the hot junction of described second semiconductor chilling plate 12 contacts with air or connects with the second water-cooled module III, according to measuring tempeature need select, when temperature required lower time, increase the use of the second water-cooled module III.The delivery port of described first water tank 10 is connected with the water inlet of described first water pump 11, the delivery port of described first water pump 11 is connected with the liquid-inlet of described first liquid cooling water plate 1, the liquid outlet of described first liquid cooling water plate 1 is connected with the liquid-inlet of described second liquid cooling water plate 16, and the liquid outlet of described second liquid cooling water plate 16 is connected with the import of described first water tank 10.In order to prevent the loss of cold, described second liquid cooling water plate 16 outside is coated with the second heat-insulation layer 17.
Described second water-cooled module III comprises the 3rd liquid cooling water plate 19, water-filled radiator 20, second water tank 21 and the second water pump 22, the liquid outlet of described 3rd liquid cooling water plate 19 is connected with the water inlet of described water-filled radiator 20, the delivery port of described water-filled radiator 20 is connected by the import of described second water tank 21 with described second water pump 22, and the delivery port of described second water pump 22 is connected with the liquid-inlet of described 3rd liquid cooling water plate 19.
In order to accelerate the conduction of heat or cold, between the hot junction of described first semiconductor chilling plate 4 and described first liquid cooling water plate and between the cold junction of described first semiconductor chilling plate 4 and described conduction cooling plate 6, be coated with the first heat conduction lipid layer 3 respectively.
Between described second semiconductor chilling plate 12 and the second liquid cooling water plate 16 and be coated with the second heat conduction lipid layer 18 respectively between described second semiconductor chilling plate 12 and described 3rd liquid cooling water plate 19.
Wherein, described second semiconductor chilling plate 12, second liquid cooling water plate 16 and the 3rd liquid cooling water plate 19 are fixedly connected with buckle 15 by bolt 13, nut 14.
Bolt in described semiconductor refrigerating module and water-cooling heat radiating system, nut are distributed in the outside of sample box, and are sealed by heat-insulation layer.
First start runs to be needed to inject enough cold water in first water tank and the second water tank of described water-cooling heat radiating system, sufficient with the water yield in system operation.
For avoiding cold bridge phenomenon, being used for fastening bolt, nut, liquid cooling water board in semiconductor refrigerating module and water-cooling heat radiating system thereof buckles and all passes through effective heat insulation process, and the first semiconductor chilling plate cold junction and around the effective heat-insulating and sealing of relevant position heat-insulation layer.
In described semiconductor refrigerating module I, when first semiconductor chilling plate 4 works, cold is passed to conduction cooling plate 6 and freezes by cold junction, by conduction cooling plate 6, cold is passed to sample box 9 again, sample is lowered the temperature in sample box 9, and water-cooling heat radiating system is used for taking away the heat in the first semiconductor chilling plate 4 hot junction in whole process.In whole water-cooling heat radiating system, after water in first liquid cooling water plate 1 absorbs the heat in the first semiconductor chilling plate 4 hot junction by heat conduction, enter in the second liquid cooling water plate 16, water in second liquid cooling water plate 16 is again via after the second semiconductor chilling plate 12 cold-side cooling, enter in the first water tank 10, enter into the first water pump 11 from the first water tank 10 again, then get back to the heat continuing absorption first semiconductor chilling plate 4 hot junction in the first liquid cooling water plate 1; The cold junction of the second semiconductor chilling plate 12 lowers the temperature to the second liquid cooling water plate 16, and the heat that hot junction produces is absorbed by the water in the 3rd liquid cooling water plate 19, by water, heat is taken in water-filled radiator 20 again, pass through wind cooling temperature lowering, water after cooling enters in the second water tank 21 again, then get back in the 3rd liquid cooling water plate 19 via the second water pump 22, continue to lower the temperature to the hot junction of the second semiconductor chilling plate 12 by the 3rd liquid cooling water plate 19 heat conduction.System completes whole circulation thus.
Described testing sample can be the even juice after the blocks of solid of suitable size or filtered through gauze, be connected with thermocouple after being placed in the appropriate location of sample box 9, then insulation end cover is covered, be connected with data collecting instrument, data handling machine the temperature lowering curve gathering and obtain sample by the thermocouple other end, temperature drop process and corresponding undercooling point, freezing point and the whole phase transition process of measured sample can be clear that thus.
The above is only preferred embodiment of the present utility model; it should be noted that; for those skilled in the art; under the prerequisite not departing from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (10)
1. measure the semiconductor cooling device of undercooling point or freezing point for one kind, it is characterized in that, comprise by the metal sample box of conduction cooling, semiconductor refrigerating module and water-cooling heat radiating system, described semiconductor refrigerating module comprises the first liquid cooling water plate, first semiconductor chilling plate and conduction cooling plate, the hot junction of described first semiconductor chilling plate contacts with the upper surface of described first liquid cooling water plate, the cold junction of described first semiconductor chilling plate contacts with described conduction cooling plate, the lower surface of described first liquid cooling water plate contacts with air, the liquid-inlet of described first liquid cooling water plate and liquid outlet are connected with the liquid outlet of described water-cooling heat radiating system and liquid-inlet respectively, described sample box is positioned on described conduction cooling plate, is placed with testing sample in described sample box, and described testing sample is provided with thermocouple, and described thermocouple is connected with data handling machine by data collecting instrument.
2. the semiconductor cooling device of measurement undercooling point according to claim 1 or freezing point, it is characterized in that, described water-cooling heat radiating system comprises the first water-cooled module, described first water-cooled module comprises the first water tank, the first water pump, the second semiconductor chilling plate and the second liquid cooling water plate, the cold junction of described second semiconductor chilling plate contacts with described second liquid cooling water plate, and the hot junction of described second semiconductor chilling plate contacts with air or connects with the second water-cooled module; The delivery port of described first water tank is connected with the water inlet of described first water pump, the delivery port of described first water pump is connected with the liquid-inlet of described first liquid cooling water plate, the liquid outlet of described first liquid cooling water plate is connected with the liquid-inlet of described second liquid cooling water plate, and the liquid outlet of described second liquid cooling water plate is connected with the import of described first water tank.
3. the semiconductor cooling device of measurement undercooling point according to claim 2 or freezing point, it is characterized in that, described second water-cooled module comprises the 3rd liquid cooling water plate, water-filled radiator, the second water tank and the second water pump, the liquid outlet of described 3rd liquid cooling water plate is connected with the water inlet of described water-filled radiator, the delivery port of described water-filled radiator is connected by the import of described second water tank with described second water pump, and the delivery port of described second water pump is connected with the liquid-inlet of described 3rd liquid cooling water plate.
4. the measurement undercooling point according to any one of claim 1-3 or the semiconductor cooling device of freezing point, it is characterized in that, between the hot junction of described first semiconductor chilling plate and described first liquid cooling water plate and between the cold junction of described first semiconductor chilling plate and described conduction cooling plate, be coated with the first heat conduction lipid layer respectively.
5. the semiconductor cooling device of measurement undercooling point according to claim 3 or freezing point, it is characterized in that, between described second semiconductor chilling plate and the second liquid cooling water plate and between described second semiconductor chilling plate and described 3rd liquid cooling water plate, be coated with the second heat conduction lipid layer respectively.
6. the semiconductor cooling device of measurement undercooling point according to claim 4 or freezing point, is characterized in that, described conduction cooling plate is aluminium sheet, and sample box is made up of copper coin.
7. the semiconductor cooling device of measurement undercooling point according to claim 5 or freezing point, is characterized in that, described sample box outside is coated with the first heat-insulation layer.
8. the semiconductor cooling device of measurement undercooling point according to claim 5 or freezing point, is characterized in that, described second liquid cooling water plate outside is coated with the second heat-insulation layer.
9. the semiconductor cooling device of measurement undercooling point according to claim 4 or freezing point, is characterized in that, described first semiconductor chilling plate, conduction cooling plate and the first liquid cooling water plate are fixedly connected with.
10. the semiconductor cooling device of measurement undercooling point according to claim 3 or freezing point, is characterized in that, described second semiconductor chilling plate, the second liquid cooling water plate and the 3rd liquid cooling water plate are fixedly connected with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420581286.2U CN204202236U (en) | 2014-10-10 | 2014-10-10 | A kind of semiconductor cooling device measuring undercooling point or freezing point |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420581286.2U CN204202236U (en) | 2014-10-10 | 2014-10-10 | A kind of semiconductor cooling device measuring undercooling point or freezing point |
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| Publication Number | Publication Date |
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| CN204202236U true CN204202236U (en) | 2015-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420581286.2U Expired - Fee Related CN204202236U (en) | 2014-10-10 | 2014-10-10 | A kind of semiconductor cooling device measuring undercooling point or freezing point |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104236158A (en) * | 2014-10-10 | 2014-12-24 | 天津商业大学 | Semiconductor refrigerating device capable of measuring undercooling point and freezing point |
| CN107449794A (en) * | 2017-06-06 | 2017-12-08 | 长安大学 | The active liquid-solid-phase changeable temperature detection device and method of a kind of semiconductor refrigerating |
-
2014
- 2014-10-10 CN CN201420581286.2U patent/CN204202236U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104236158A (en) * | 2014-10-10 | 2014-12-24 | 天津商业大学 | Semiconductor refrigerating device capable of measuring undercooling point and freezing point |
| CN107449794A (en) * | 2017-06-06 | 2017-12-08 | 长安大学 | The active liquid-solid-phase changeable temperature detection device and method of a kind of semiconductor refrigerating |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150311 Termination date: 20151010 |
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| EXPY | Termination of patent right or utility model |