CN104297319A - Novel sheet-type oxygen sensor - Google Patents
Novel sheet-type oxygen sensor Download PDFInfo
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- CN104297319A CN104297319A CN201310298960.6A CN201310298960A CN104297319A CN 104297319 A CN104297319 A CN 104297319A CN 201310298960 A CN201310298960 A CN 201310298960A CN 104297319 A CN104297319 A CN 104297319A
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Abstract
Disclosed is a novel sheet-type oxygen sensor including, in a top-to-bottom successively arranging manner, a sensitive element layer, an air path layer and a heating layer, wherein the heating layer is composed of a heating substrate layer and a heating electrode insulating layer arranged above the heating substrate layer. The heating electrode insulating layer comprises an upper insulating sheet and a lower insulating sheet and a heating electrode clamped therebetween. An upper transition layer is arranged above the upper insulating sheet and a lower transition layer is arranged below the lower insulating sheet. In the sheet-type oxygen sensor, the insulation layers and the transition layers are added so that drying times during printing are reduced and processing time is saved. Meanwhile, a problem of drying crack caused by overmuch printing layers is solved. By means of the addition of the transition layers, a binding property between the insulating layers and zirconium oxide layers are enhanced so that deformation and cracking due to different thermal-expansion coefficients of the two different materials during sintering, thereby greatly improving product yield.
Description
Technical field
The present invention relates to a kind of sensor, especially for the chip oxygen sensor of the oxygen concentration detected in automotive exhaust.
Background technology
Along with motor vehicle exhaust emission environmental pollution is day by day serious, the pollution of saving fuel oil and minimizing vehicle exhaust is just becoming current major issue.At present, mainly realize motor-vehicle tail-gas oxygen concentration by lambda sensor and detect and combustion case judgement, thus reach the object of the discharge of saving fuel oil and minimizing tail gas.
Lambda sensor mainly contains tubular type and chip two kinds of structures, because the advantages such as the slice structure response time is fast become the principal mode of current lambda sensor development.Current slice structure is mainly made up of three layers of zirconia sheet, one deck is sensitive element layer above, upper and lower surface is dispersed with external electrode and interior electrode, middle one deck is air duct layer, one deck is the zone of heating containing heater circuit and insulation course below, play heating function, last three stacked forcing together are sintered to one.Zone of heating is that present zirconium oxide substrate prints a layer insulating slurry by serigraphy, prints one deck heating electrode in the above again, and then dry after oven dry, a printing layer insulating again.But typography is more complicated, the more difficult control of effect, and there will be the dry and cracked phenomenon of insulation course.
Summary of the invention
The object of the invention is to solve the problem that insulation course is dry and cracked and printing is inconvenient, technique greatly simplifies, and properties of product are good.
To achieve these goals, the technical solution adopted for the present invention to solve the technical problems is: a kind of Novel chip-type oxygen sensor, comprise the sensitive element layer, air duct layer and the zone of heating that from up to down set gradually, described zone of heating is made up of heated substrate layer and the heating electrode insulation course be located at above heated substrate layer, the heating electrode that described heating electrode insulation course comprises upper and lower insulating trip and is located between upper and lower insulating trip, also be provided with transition bed above described upper insulating trip, below described lower insulating trip, be also provided with lower transition bed.
As a further improvement on the present invention, described sensitive element layer is made up of sensitive element layer body, external electrode and interior electrode, described external electrode is located at the upper surface of sensitive element layer body, described interior electrode is located at the lower surface of sensitive element layer body, and the pin one of electrode is located at the upper surface of sensitive element layer body in connecting, described pin one is provided with interior electrode through hole.
As a further improvement on the present invention, described air duct layer comprises air duct layer body, and is provided with plenum chamber in described air duct layer body.
As a further improvement on the present invention, described heated substrate layer comprises heated substrate layer body, and the pin two connecting heating electrode is located at the lower surface of heated substrate layer body, and pin two is provided with heating electrode through hole.
As a further improvement on the present invention, described sensitive element layer body upper surface is positioned at pin one surrounding print and is provided with porous protective layer, and described heated substrate layer body lower surface is positioned at pin two surrounding print and is provided with insulation course.
As a further improvement on the present invention, described sensitive element layer body, air duct layer body and heated substrate layer body all adopt zirconia material curtain coating to obtain, and the physical dimension of three is identical, and its length is 70-80mm, width is for being 6-7mm, and thickness is 0.6-0.8mm.
As a further improvement on the present invention, described upper and lower insulating trip adopts aluminium oxide to be prepared by main slurry curtain coating, and its length is 70-80mm, and width is 6-7mm, and thickness is 30-70 μm.
As a further improvement on the present invention, rectangles one different sized by the xsect of described plenum chamber and rectangle two form, and the length of described rectangle one is 8-12mm, and wide is 1.1-1.5mm; The length of described rectangle two is 60-70mm, and wide is 0.6-1.0mm.
Advantage of the present invention and effect are: the present invention introduces insulation course and transition bed in chip oxygen sensor, decrease printing and dry number of times, save the process time, decrease because print the too much dry and cracked phenomenon of the number of plies simultaneously, the introducing of transition bed adds the cohesiveness between insulation course and zirconia layer, the distortion that when alleviating sintering, two-layer different materials brings due to thermal expansivity difference and cracking phenomena, substantially increase finished product rate.
Accompanying drawing explanation
Fig. 1 is the side view of structure of the present invention;
Fig. 2 is the vertical view of structure of the present invention;
Fig. 3 is the upward view of structure of the present invention;
Fig. 4 is the heating electrode structural drawing of structure of the present invention;
Fig. 5 is the air duct Rotating fields figure of structure of the present invention;
Indicate in figure: 1-sensitive element layer; 2-air duct layer; 3-zone of heating; 4-heated substrate layer; 5-heating electrode insulation course; 11-sensitive element layer body; 12-external electrode; Electrode in 13-; 14-pin one; Electrode through hole in 15-; 16-porous protective layer; 21-air duct layer body; 22-plenum chamber; 23-rectangle one; 24-rectangle two; 41-heated substrate layer body; 43-pin two; 44-heating electrode through hole; 45-insulation course; The upper insulating trip of 51-; Insulating trip under 52-; 53-heating electrode; The upper transition bed of 54-; Transition bed under 55-.
Embodiment
In order to deepen the understanding of the present invention, below in conjunction with embodiment and accompanying drawing, the invention will be further described, and this embodiment only for explaining the present invention, does not form limiting the scope of the present invention.
Fig. 1-Fig. 3 shows a kind of embodiment of a kind of Novel chip-type oxygen sensor of the present invention: comprise the sensitive element layer 1, air duct layer 2 and the zone of heating 3 that from up to down set gradually, described zone of heating 3 is made up of heated substrate layer 4 and the heating electrode insulation course 5 be located at above heated substrate layer 4, the heating electrode 53 that described heating electrode insulation course 5 comprises upper and lower insulating trip 51,52 and is located between upper and lower insulating trip 51,52, also be provided with transition bed 54 above described upper insulating trip 51, below described lower insulating trip 52, be also provided with lower transition bed 55; Described sensitive element layer 1 is made up of sensitive element layer body 11, external electrode 12 and interior electrode 13, described external electrode 12 is located at the upper surface of sensitive element layer body 1, described interior electrode 13 is located at the lower surface of sensitive element layer body 1, and the pin 1 of electrode 13 is located at the upper surface of sensitive element layer body 1 in connecting, described pin 1 is provided with interior electrode through hole 15, as shown in Figure 2.
Described air duct layer 2 comprises air duct layer body 21, and be provided with plenum chamber 22 in described air duct layer body 21, rectangles 1 different sized by the xsect of described plenum chamber 22 and rectangle 2 24 form, and the length of described rectangle 1 is 8-12mm, and wide is 1.1-1.5mm; The length of described rectangle 2 24 is 60-70mm, and wide is 0.6-1.0mm, as shown in Figure 5.
Described heated substrate layer 4 comprises heated substrate layer body 41, and as shown in Figure 4, the pin 2 43 connecting heating electrode 53 is located at the lower surface of heated substrate layer body 41, and pin 2 43 is provided with heating electrode through hole 44, as shown in Figure 3.
Described sensitive element layer body 11 upper surface is positioned at pin 1 surrounding print and is provided with porous protective layer 16, and described heated substrate layer body 41 lower surface is positioned at pin 2 43 surrounding print and is provided with insulation course 45.
This 41 body of described sensitive element layer body 11, air duct layer body 21 and heated substrate layer all adopt zirconia material curtain coating to obtain, and the physical dimension of three is identical, and its length is 70-80mm, and width is for being 6-7mm, and thickness is 0.6-0.8mm.
Described upper and lower insulating trip 51,52 adopts aluminium oxide to be prepared by main slurry curtain coating, and its length is 70-80mm, and width is 6-7mm, and thickness is 30-70 μm.
The chip oxygen sensor of the present embodiment is made usually in the following ways:
The zirconia material curtain coating of 0-8% mole of yttrium content is utilized to prepare zirconia cast sheet;
Aluminium oxide is utilized to obtain aluminium oxide cast sheet by the tape casting for main slurry;
Sensitive element layer body 11, air duct body 21, heated substrate layer body 41 and upper and lower insulating trip 51,52 is obtained by cutting or impact style;
Be distributed on sensitive element layer body 11 and heated substrate layer body 41 by mechanical punch pattern and go out interior electrode through hole 15 and heating electrode through hole 44;
Transition bed 54 is printed respectively, lower transition bed 55 on upper and lower insulating trip 51,52 surface by screen printing technique;
And then on another surface (not printing the one side of transition bed) of upper and lower insulating trip 51,52, by screen printing technique printing heating electrode 53;
Overlapped together by upper and lower for the above-mentioned insulating trip prepared insulating trip 51,52, the heating electrode 53 of printing is being clipped in the middle, the upper transition bed 54 of printing, and the two sides of lower transition bed 55, at outermost layer, obtains heating electrode insulation course 5;
Heated substrate layer body 41 lower surface prints pin 2 43 successively and insulation course 45 obtains heated substrate layer 4;
Heating electrode insulation course 5 and heated substrate layer 4 being laminated, by injecting platinum slurry so that UNICOM's heating electrode 53 and pin 2 43 to the heating electrode through hole 44 of pin 2 43, obtaining zone of heating 3.
External electrode 12 and pin 1 and porous protective layer 16 is printed successively at sensitive element layer body 11 upper surface by screen printing technique, electrode 13 in lower surface printing, inject platinum slurry by inside electrode pin through hole 15 so that electrode 13 and pin 1 in UNICOM, obtain sensitive element layer 1;
Above-mentioned prepared sensitive element layer 1, air duct layer 2, zone of heating 3 are aligned successively in order and stack, by 50-80 DEG C of lamination hot pressing integrally;
Lamination entirety is put into high temperature and first carries out binder removal, then sinter by technique, finally obtain this product.
Above-mentioned insulation casting slurry is for main interpolation organic solvent preparation obtains with aluminium oxide.Organic solvent mainly contains PVB, terpinol, dibutyl phthalate, castor oil, with the addition of small amounts silicon, calcium oxide and magnesium oxide in addition;
Above-mentioned porous protective layer 16 slurry is mainly containing MgAl
2o
4, ZrO2 and pore creating material, organism has terpinol, ethyl cellulose, dibutyl phthalate, PVB and polyglycol.
Above-mentioned interior electrode 13, external electrode 12, heating electrode 53 are all prepared by serigraphy with platinum slurry.
Claims (8)
1. a Novel chip-type oxygen sensor, comprise the sensitive element layer (1) from up to down set gradually, air duct layer (2) and zone of heating (3), it is characterized in that: described zone of heating (3) is by heated substrate layer (4), and be located at heating electrode insulation course (5) composition of heated substrate layer (4) top, described heating electrode insulation course (5) comprises, lower insulating trip (51, 52) and be located in, lower insulating trip (51, 52) heating electrode (53) between, transition bed (54) is also provided with above described upper insulating trip (51), lower transition bed (55) is also provided with below described lower insulating trip (52).
2. a kind of Novel chip-type oxygen sensor according to claim 1, it is characterized in that: described sensitive element layer (1) is by sensitive element layer body (11), external electrode (12) and interior electrode (13) composition, described external electrode (12) is located at the upper surface of sensitive element layer body (1), described interior electrode (13) is located at the lower surface of sensitive element layer body (1), and the pin one (14) of electrode (13) is located at the upper surface of sensitive element layer body (1) in connecting, described pin one (14) is provided with interior electrode through hole (15).
3. a kind of Novel chip-type oxygen sensor according to claim 1, it is characterized in that: described air duct layer (2) comprises air duct layer body (21), and be provided with plenum chamber (22) in described air duct layer body (21).
4. a kind of Novel chip-type oxygen sensor according to claim 1, it is characterized in that: described heated substrate layer (4) comprises heated substrate layer body (41), the pin two (43) connecting heating electrode (53) is located at the lower surface of heated substrate layer body (41), and pin two (43) is provided with heating electrode through hole (44).
5. a kind of Novel chip-type oxygen sensor according to claim 2 or 4; it is characterized in that: described sensitive element layer body (11) upper surface is positioned at print around pin one (14) and is provided with porous protective layer (16), described heated substrate layer body (41) lower surface is positioned at print around pin two (43) and is provided with insulation course (45).
6. a kind of Novel chip-type oxygen sensor according to claim 1,2 or 4, it is characterized in that: described sensitive element layer body (11), air duct layer body (21) and heated substrate layer body (41) all adopt zirconia material curtain coating to obtain, and the physical dimension of three is identical, its length is 70-80mm, width is for being 6-7mm, and thickness is 0.6-0.8mm.
7. a kind of Novel chip-type oxygen sensor according to claim 1, it is characterized in that: described upper and lower insulating trip (51,52) adopts aluminium oxide to be prepared by main slurry curtain coating, its length is 70-80mm, and width is 6-7mm, and thickness is 30-70 μm.
8. a kind of Novel chip-type oxygen sensor according to claim 3, it is characterized in that: rectangles one (23) different sized by the xsect of described plenum chamber (22) and rectangle two (24) form, the length of described rectangle one (23) is 8-12mm, and wide is 1.1-1.5mm; The length of described rectangle two (24) is 60-70mm, and wide is 0.6-1.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310298960.6A CN104297319A (en) | 2013-07-17 | 2013-07-17 | Novel sheet-type oxygen sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310298960.6A CN104297319A (en) | 2013-07-17 | 2013-07-17 | Novel sheet-type oxygen sensor |
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| CN104297319A true CN104297319A (en) | 2015-01-21 |
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| CN201310298960.6A Pending CN104297319A (en) | 2013-07-17 | 2013-07-17 | Novel sheet-type oxygen sensor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111855747A (en) * | 2020-07-27 | 2020-10-30 | 江苏联电电子科技有限公司 | Insulating layer for oxygen sensor chip and preparation method thereof |
| CN111855746A (en) * | 2020-07-27 | 2020-10-30 | 江苏联电电子科技有限公司 | Transition layer-containing insulating layer for oxygen sensor chip and preparation method thereof |
| CN113203784A (en) * | 2021-05-20 | 2021-08-03 | 中国科学技术大学先进技术研究院 | Variable frequency oxygen sensor |
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| CN102109488A (en) * | 2009-12-25 | 2011-06-29 | 比亚迪股份有限公司 | Chip type oxygen sensor and preparation method thereof |
| CN102235994A (en) * | 2010-04-23 | 2011-11-09 | 比亚迪股份有限公司 | Plate oxygen sensor and preparation method thereof |
| CN102798653A (en) * | 2012-08-16 | 2012-11-28 | 宁波大学 | Automobile sheet-structured oxygen sensor and its preparation method |
| CN103018283A (en) * | 2012-12-25 | 2013-04-03 | 珠海市香之君电子有限公司 | Chip type oxygen sensor |
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2013
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Patent Citations (6)
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| JP2004325196A (en) * | 2003-04-23 | 2004-11-18 | Kyocera Corp | Oxygen sensor element |
| CN101000320A (en) * | 2006-12-25 | 2007-07-18 | 杨世养 | Chip oxygen sensor and its preparation method |
| CN102109488A (en) * | 2009-12-25 | 2011-06-29 | 比亚迪股份有限公司 | Chip type oxygen sensor and preparation method thereof |
| CN102235994A (en) * | 2010-04-23 | 2011-11-09 | 比亚迪股份有限公司 | Plate oxygen sensor and preparation method thereof |
| CN102798653A (en) * | 2012-08-16 | 2012-11-28 | 宁波大学 | Automobile sheet-structured oxygen sensor and its preparation method |
| CN103018283A (en) * | 2012-12-25 | 2013-04-03 | 珠海市香之君电子有限公司 | Chip type oxygen sensor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111855747A (en) * | 2020-07-27 | 2020-10-30 | 江苏联电电子科技有限公司 | Insulating layer for oxygen sensor chip and preparation method thereof |
| CN111855746A (en) * | 2020-07-27 | 2020-10-30 | 江苏联电电子科技有限公司 | Transition layer-containing insulating layer for oxygen sensor chip and preparation method thereof |
| CN113203784A (en) * | 2021-05-20 | 2021-08-03 | 中国科学技术大学先进技术研究院 | Variable frequency oxygen sensor |
| CN113203784B (en) * | 2021-05-20 | 2022-10-18 | 安徽中科国瓷新型元器件有限公司 | Variable frequency oxygen sensor |
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Application publication date: 20150121 |