CN104253296A - Filter harmonic oscillator, manufacturing method of filter harmonic oscillator, filter device and electromagnetic equipment - Google Patents
Filter harmonic oscillator, manufacturing method of filter harmonic oscillator, filter device and electromagnetic equipment Download PDFInfo
- Publication number
- CN104253296A CN104253296A CN201310256998.7A CN201310256998A CN104253296A CN 104253296 A CN104253296 A CN 104253296A CN 201310256998 A CN201310256998 A CN 201310256998A CN 104253296 A CN104253296 A CN 104253296A
- Authority
- CN
- China
- Prior art keywords
- rete
- filter resonance
- dieelctric sheet
- conduction geometry
- filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
The invention relates to the technical field of filters, and discloses a filter harmonic oscillator, a manufacturing method of the filter harmonic oscillator, a filter device and electromagnetic equipment. The manufacturing method comprises the following steps of providing film layers, forming conductive geometric structures on the film layers, providing dielectric slabs, adhering the film layers on the surfaces of the dielectric slabs, and arranging the film layers and the dielectric slabs in a laminated manner to obtain the filter harmonic oscillator. In a manufacturing process of the harmonic oscillator, the conductive geometric structures are formed on the film layers, so that operation such as electroplating and etching on the dielectric slabs is avoided, use equipment is reduced, and the harmonic oscillator is convenient to manufacture, high in production efficiency and low in cost, and is suitable for batch production; the conductive geometric structures are directly formed on the film layers and two-sided copper plating on the dielectric slabs is avoided, so that incomplete etching or loss of the conductive geometric structures is avoided; and in addition, the film layers are connected with the dielectric slabs in an adhesion manner, so that black glue is not required to be directly printed on the dielectric slabs, and crushing of the dielectric slabs is avoided.
Description
Technical field
The present invention relates to the technical field of filter, particularly relate to filter resonance and manufacture method thereof, comprise the filtering device of filter resonance and comprise the electromagnetic equipment of this filtering device.
Background technology
Harmonic oscillator is the important component part in filter, and in prior art, the manufacture method of the harmonic oscillator of filter is as follows:
1), on dieelctric sheet copper electroplating layer, then by PCB production line, etching conduction geometry in the layers of copper of dieelctric sheet;
2) by mode that steel mesh prints on the dieelctric sheet, in step 1), black glue is printed on dieelctric sheet, again multiple above-mentioned etching there is is conduction geometry and to be printed with the dieelctric sheet of black glue sequentially stacking layer by layer, and put into insulating box and carry out high-temperature baking, thus shaping filter harmonic oscillator.
Filter resonance that above-mentioned manufacture method is formed, it comprises the sequentially stacked dieelctric sheet of multilayer, with the conduction geometry that layers of copper etching is formed on dieelctric sheet, by black glue bond between adjacent dieelctric sheet.
The manufacture method of prior art filter resonance, it has following defect:
1), dieelctric sheet passes through copper electroplating layer, etching forms conduction geometry again, due in the fabrication process, whole dieelctric sheet is needed to drop in electroplate liquid, like this, for single dieelctric sheet, it easily forms electrodeposited coating, but for batch production, then need to adopt tool to work in coordination with dieelctric sheet plating; Dieelctric sheet is fixed on tool, so that dieelctric sheet can bear the concuss inside heavy copper or plating cylinder, prevents dieelctric sheet from falling in plating cylinder, cannot give for change, like this, then make the copper facing of dieelctric sheet process and comparatively bother, increase equipment, reduce production efficiency, it increases production cost;
2), dieelctric sheet in the process of plating, its two-sided easily all plated with copper, but dieelctric sheet only needs form conduction geometry at a surface thereof, like this, then can etch in the process of conduction geometry, then easily occur etching sordid problem;
3), on dieelctric sheet, etch conduction geometry, because the live width spacing of conduction geometry is less, therefore in the process of etching, easily occur the phenomenon of the conduction geometry disappearance on dieelctric sheet;
4), on dieelctric sheet directly printing forms black glue, makes, like this, in operation, easily occur the problem that dieelctric sheet is crushed because dieelctric sheet mostly is ceramic material.
Summary of the invention
The object of the present invention is to provide the manufacture method of filter resonance, be intended to solve the problem that the existence of filter resonance of the prior art sub-manufacture method is difficult to batch production, cost is high, efficiency is low, etching is clean, conduction geometry lacks and dieelctric sheet is easily crushed.
The present invention is achieved in that the manufacture method of filter resonance, as follows:
Rete is provided, on described rete, forms conduction geometry;
There is provided dieelctric sheet, adhere on the surface of described dieelctric sheet by the rete being formed with described conduction geometry, described rete and described dieelctric sheet form layered laminate and arrange, obtain filter resonance.
Present invention also offers a kind of filter resonance, comprise dieelctric sheet and stick to the rete on the surface of described dieelctric sheet, described rete is formed with conduction geometry, described rete and described dieelctric sheet are that layered laminate is arranged.
Present invention also offers a kind of filtering device, it harmonic oscillator comprising resonant cavity and be positioned at described resonant cavity, described harmonic oscillator is above-mentioned filter resonance.
Present invention also offers a kind of electromagnetic equipment, it comprises signal emission module, signal receiving module and above-mentioned filtering device, and the input of described filtering device is connected with described signal emission module, and output is connected with signal receiving module.
Compared with prior art, the manufacture method of harmonic oscillator provided by the invention, it directly can form conduction geometry on rete, thus avoid electroplating dieelctric sheet and the operation such as etching, reduce use equipment, make this harmonic oscillator easily manufactured, be applicable to batch production, production efficiency is high and cost is low; Owing to directly forming conduction geometry on rete, avoid in the two-sided copper-plated phenomenon of dieelctric sheet, thus avoid conduction geometry to etch phenomenon that is clean or conduction geometry disappearance; In addition, be connected by adhering between rete with dieelctric sheet, thus do not need directly on dieelctric sheet, to print black glue, avoid the phenomenon occurring that dieelctric sheet is crushed.
Accompanying drawing explanation
Fig. 1 is the exploded isometric schematic diagram of filter resonance that the embodiment of the present invention provides;
Fig. 2 is the assembling schematic perspective view of filter resonance that the embodiment of the present invention provides;
Fig. 3 is the longitudinally cutting schematic diagram of filter resonance that the embodiment of the present invention provides;
Fig. 4 is the A place enlarged diagram in figure.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Below in conjunction with specific embodiment, realization of the present invention is described in detail.
As shown in figures 1-4, be a preferred embodiment provided by the invention.
The manufacture method of the harmonic oscillator 1 that the present embodiment provides is as follows:
There is provided rete 15, rete 15 is processed, make the surface of rete 15 forms conduction geometry 13, certainly, the specific design of this conduction geometry 13, can be decided according to the actual requirements, and its structure is not unique;
There is provided dieelctric sheet 11, the rete 15 surface in above-mentioned with conduction geometry 13 sticks on dieelctric sheet 11, like this, makes to form layered laminate between rete 15 and dieelctric sheet 11, thus obtains filter resonance 1.
Adopt above-mentioned manufacture method to manufacture harmonic oscillator 1, it has the following advantages:
1), in its process manufactured, do not need directly on dieelctric sheet 11, to carry out electroplating operations, it directly forms conduction geometry 13 on rete 15, thus do not need to utilize equipment such as employing plating cylinder and fixed jig etc., manufacture process is simple, be applicable to batch production, and greatly improve its production efficiency, reduce production cost further;
2), due on the surface of rete 15, directly can be processed to form conduction geometry 13, avoid in prior art, the two-sided plated with copper of dieelctric sheet 11 of existence, so that the phenomenon that etching is unclean and conduction geometry 13 lacks;
3), between dieelctric sheet 11 with rete 15 be connected by adherent fashion, thus do not need to print glue-line on dieelctric sheet 11, avoid dieelctric sheet 11 in printing process, occur crushed phenomenon.
In above-mentioned manufacture method, according to the change of relation between rete 15 and dieelctric sheet 11, the difference of such as quantitative relation and position relationship etc., refinement can go out multiple different manufacture, and form multiple different structure, specific as follows:
The first situation:
The rete 15 providing two panels above-mentioned, and on the surface of two retes 15, be formed with conduction geometry 13 respectively;
The dieelctric sheet 11 that one above-mentioned is provided, and two above-mentioned retes 15 are sticked in the both side surface of this dieelctric sheet 11 respectively, thus define filter resonance 1 of three multilayer laminated structure.
The second situation:
The rete 15 providing a slice above-mentioned, the surface of this rete 15 is formed with above-mentioned conduction geometry 13;
There is provided the dieelctric sheet 11 that two above-mentioned, rete 15 is placed in the middle of two dieelctric sheets 11, and its two surface sticks on the surface of connected two dieelctric sheets 11 respectively, thus obtains filter resonance 1 of three multilayer laminated structure.
The third situation:
There is provided the rete 15 that at least two panels is above-mentioned, the rete 15 namely more than two panels or two panels, the surface of each rete 15 is formed with conduction geometry 13;
The dieelctric sheet 11 that at least three above-mentioned is provided, the namely dieelctric sheet 11 of more than three or three, and, above-mentioned rete 15 is at least placed between two adjacent dieelctric sheets 11, two surfaces of rete 15 stick on the surface of connected two adjacent dieelctric sheets 11 respectively, thus obtain at least five filter resonance 1 folded layer by layer.
In the present embodiment, adhered to by glue-line 12 such as solid-state glue-line between rete 15 with dieelctric sheet 11 and be connected, like this, in the process connected, directly glue-line 12 is coated on the surface that dieelctric sheet 11 or rete 15 need connection, and then directly rete 15 being connected then passable with dieelctric sheet 11, it is easy and simple to handle.Certainly, also can be that other multiple glue-line connects, be not limited to the glue-line 12 in the present embodiment.
In above-mentioned manufacture process, the concrete operation step that the surface of rete 15 is formed conduction geometry 13 is as follows:
1), on the surface of rete 15 form conductive layer, conductive layer can select the materials such as copper, silver, gold, palladium to make;
2), to the conductive layer on the surface of rete 15 carry out processing and remove material, common as operations such as laser engraving, etching, ion quarters, make the conductive layer stayed on the surface of rete 15 form above-mentioned conduction geometry 13.
Above-mentioned middle etching operation can adopt various processing equipment to obtain, and generally, the PCB apparatus for production line that adopts etches the conductive layer on rete 15 more.
In the present embodiment, above-mentioned rete 15 is low-loss soft base plate, and it can be made by the material such as preferably polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, polyamide, epoxy resin.
After rete 15 with dieelctric sheet 11 stick operation, shaping filter harmonic oscillator 1, need to be cured process to this filter resonance 1, its step is as follows:
1), one or more filter resonance is placed in fixture;
2), adjusting described fixture makes it compress described filter resonance.
Preferably, step is specially:
1), one or more filter resonance 1 is placed in fixture;
2), two cushions that utilize fixture to have are pressed on the both sides of filter resonance 1 respectively, and certainly, this cushion can be made for multiple material, comparatively commonly, silica gel can be adopted to make;
3), recycling fixture on nut tighten, two cushions are reduced the distance respectively further, are pressed on the both sides of filter resonance 1.
In above-mentioned fixture, between nut and cushion, can also plain cushion be provided with, to accelerate the solidification of stacked structure, and prevent filter resonance 1 to be out of shape in solidification processing procedure.
In above-mentioned solidification processing procedure, fixture is in the environment of certain curing temperature, and in the present embodiment, the solidification process of filter resonance 1 is in the temperature range of 70 DEG C ~ 300 DEG C.
Below enumerate the manufacture process of four kinds of different harmonic oscillators 1, the structure of harmonic oscillator 1 to be described and performance test illustrates:
The first harmonic oscillator 1:
Select the rete 15 that 12 μm thick, it is toroidal, adopts the conductive layer on PCB etching machines etching soft base plate, makes conductive layer be formed with conduction geometry 13;
Solid-state glue is struck out circular glue-line 12, and its thickness is 50 μm;
Select three's potsherd as dieelctric sheet 11, its thickness is 2mm, 1mm and 4mm tri-kinds of specifications respectively;
According on the fixture of design, press potsherd+silica gel cushion+plain cushion+nut heap poststack that the thick potsherd+glue-line 12+1mm of the thick potsherd of silica gel cushion+2mm+glue-line 12+ be with the thick potsherd+glue-line 12+ of the rete 15+ glue-line 12+1mm of conduction geometry 13 to be with the thick potsherd+glue-line 12+ of the rete 15+ glue-line 12+4mm of conduction geometry 13 to be with potsherd+glue-line 12+1mm that the rete 15+ glue-line 12+1mm of conduction geometry 13 is thick is thick from top to bottom, utilize nut to be tightened by stacked structure, and be cured in the curing temperature of 170 DEG C;
After the cooling of above-mentioned stacked structure, remove silica gel cushion, plain cushion, nut, the harmonic oscillator 1 of stacked structure is put into standard resonator build-in test Q value, test result is: Q value: 5132, centre frequency: 2.115GHz, bandwidth: 412KHz.
The second harmonic oscillator 1:
Select the rete 15 of 25 μm, it is circular, and in the inside of annulus, logical region is in " ten " word shape, adopts the conductive layer on PCB etching machines etching soft base plate, makes conductive layer be formed with conduction geometry 13;
Solid-state glue is struck out circular glue-line 12, and its thickness is 25 μm;
Select three's potsherd as dieelctric sheet 11, its thickness is 2mm, 1mm and 4mm tri-kinds of specifications respectively;
According on the fixture of design, press potsherd+silica gel cushion+plain cushion+nut heap poststack that the thick potsherd+glue-line 12+1mm of the thick potsherd of silica gel cushion+2mm+glue-line 12+ be with the thick potsherd+glue-line 12+ of the rete 15+ glue-line 12+1mm of conduction geometry 13 to be with the thick potsherd+glue-line 12+ of the rete 15+ glue-line 12+4mm of conduction geometry 13 to be with potsherd+glue-line 12+1mm that the rete 15+ glue-line 12+1mm of conduction geometry 13 is thick is thick from top to bottom, utilize nut to be tightened by stacked structure, and be cured in the curing temperature of 170 DEG C;
After the cooling of above-mentioned stacked structure, remove silica gel cushion, plain cushion, nut, the harmonic oscillator 1 of stacked structure is put into standard resonator build-in test Q value, test result is: Q value: 4036, centre frequency: 2.06GHz, bandwidth: 510KHz.
The third harmonic oscillator 1:
Select the rete 15 of 25 μm, it is circular, and in the inside of annulus, logical region is in " one " word shape, adopts the conductive layer on PCB etching machines etching soft base plate, makes conductive layer be formed with conduction geometry 13;
Solid-state glue is struck out circular glue-line 12, and its thickness is 25 μm;
Select three's potsherd as dieelctric sheet 11, its thickness is 2mm, 1mm and 4mm tri-kinds of specifications respectively;
According on the fixture of design, press potsherd+silica gel cushion+plain cushion+nut heap poststack that the thick potsherd+glue-line 12+1mm of the thick potsherd of silica gel cushion+2mm+glue-line 12+ be with the thick potsherd+glue-line 12+ of the rete 15+ glue-line 12+1mm of conduction geometry 13 to be with the thick potsherd+glue-line 12+ of the rete 15+ glue-line 12+4mm of conduction geometry 13 to be with potsherd+glue-line 12+1mm that the rete 15+ glue-line 12+1mm of conduction geometry 13 is thick is thick from top to bottom, utilize nut to be tightened by stacked structure, and be cured in the curing temperature of 170 DEG C;
After the cooling of above-mentioned stacked structure, remove silica gel cushion, plain cushion, nut, the harmonic oscillator 1 of stacked structure is put into standard resonator build-in test Q value, test result is: Q value: 4025, centre frequency: 2.059GHz, bandwidth: 511KHz.
4th kind of harmonic oscillator 1:
Select the rete 15 of 25 μm, it is circular, adopts the conductive layer on PCB etching machines etching soft base plate, makes conductive layer be formed with conduction geometry 13;
Solid-state glue is struck out circular glue-line 12, and its thickness is 50 μm;
Select three's potsherd as dieelctric sheet 11, its thickness is 2mm, 1mm and 4mm tri-kinds of specifications respectively;
According on the fixture of design, press potsherd+silica gel cushion+plain cushion+nut heap poststack that the thick potsherd+glue-line 12+1mm of the thick potsherd of silica gel cushion+2mm+glue-line 12+ be with the thick potsherd+glue-line 12+ of the rete 15+ glue-line 12+1mm of conduction geometry 13 to be with the thick potsherd+glue-line 12+ of the rete 15+ glue-line 12+4mm of conduction geometry 13 to be with potsherd+glue-line 12+1mm that the rete 15+ glue-line 12+1mm of conduction geometry 13 is thick is thick from top to bottom, utilize nut to be tightened by stacked structure, and be cured in the curing temperature of 170 DEG C;
After the cooling of above-mentioned stacked structure, remove silica gel cushion, plain cushion, nut, the harmonic oscillator 1 of stacked structure is put into standard resonator build-in test Q value, test result is: Q value: 4028, centre frequency: 2.107GHz, bandwidth: 414.8KHz.
According to above-mentioned manufacture method, the present embodiment additionally provides the structure of filter resonance 1.
Filter resonance 1 in the present embodiment comprises rete 15 and dieelctric sheet 11, the surface of rete 15 is formed with conduction geometry 13, and rete 15 adheres on the surface with dieelctric sheet 11, thus forms layered laminate between rete 15 and dieelctric sheet 11.
In above-mentioned filter resonance 1, its rete 15 directly can be formed conduction geometry 13, therefore do not need directly on dieelctric sheet 11, to carry out electroplating operations, do not need to utilize and adopt equipment such as plating cylinder and fixed jig etc., manufacture process is simple, be applicable to batch production, and greatly improve its production efficiency, reduce production cost further; Can avoid etching phenomenon that is clean and conduction geometry 13 disappearance; Adopt between rete 15 with dieelctric sheet 11 to adhere to and be connected, do not need to print glue-line on dieelctric sheet 11, avoid dieelctric sheet 11 in printing process, occur crushed phenomenon.
Certainly, in the structure of above-mentioned filter resonance 1, according to the quantity of rete 15, the quantity of dieelctric sheet 11 and between rete 15 from dieelctric sheet 11 mutual alignment different, can a variety of concrete structure of refinement, specific as follows:
The first structure:
The both side surface of dieelctric sheet 11 is stained with rete 15 respectively, and like this, can be a dieelctric sheet 11, the both side surface of dieelctric sheet 11 be all stained with rete 15, also can be multiple dieelctric sheets 11, and the both side surface of each dieelctric sheet 11 is stained with rete 15 all respectively.
The second structure:
Dieelctric sheet 11 has two at least, or two or more, and at least wherein accompanies rete 15 in two adjacent dieelctric sheets 11, and like this, the both side surface of rete 15 then sticks on the surface of adjacent connected two dieelctric sheets 11 respectively.
Above two kinds of structures are concrete two kinds, certainly, can also be other various structures forms, as long as rete 15 sticks on dieelctric sheet 11, and form layered laminate between rete 15 and dieelctric sheet 11 and then can.
Filter resonance 1 that the present embodiment provides is cylindrical shape, wherein be provided with the through hole 14 of up/down perforation, thus be convenient to tuning plug and insert in this through hole 14, the resonance frequency of harmonic oscillator 1 is finely tuned, accordingly, dieelctric sheet 11, rete 15 and glue-line 12 then form annular respectively.
Certainly, the profile of harmonic oscillator 1 is not limited to above-mentioned cylindrical shape, it can also be the various shape such as square tube and different in nature tubular, can as long as be wherein formed with the through hole 14 plugging tuning plug, now, the respective shapes of dieelctric sheet 11, rete 15 and glue-line 12 also the side of being annular etc. various correspondingly-shaped.
In the present embodiment, dieelctric sheet 11 can adopt the material that any dielectric constant is greater than air (dielectric constant of air is 1 substantially), loss tangent is less than 0.1.Because dielectric constant is higher, the resonant cavity that harmonic oscillator 1 is used is when realizing identical resonance frequency, and volume can be less, and loss tangent is less, then the Q value of harmonic oscillator 1 then can be higher, therefore, preferred dielectric constant is relatively higher, and loss tangent is lower, such as, dielectric constant is greater than 10, loss tangent is less than 0.01, and more preferably, dielectric constant is greater than 30, loss tangent is less than 0.001.Therefore, dieelctric sheet 11 can be made by preferably ceramic material, and its thickness range is between 0.5mm ~ 40mm.Certainly, metal material also can be selected to make.
In the present embodiment, the thickness range of glue-line 12 is between 5 μm ~ 40 μm.
In the present embodiment, above-mentioned rete 15 is low-loss soft base plate, and it can be made by the material such as preferably polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, polyamide, epoxy resin.Conduction geometry 13 on rete 15 is formed for conductive layer, by etching conductive layer, thus makes the conductive layer stayed on the surface of rete 15 form conduction geometry 13.
The present embodiment additionally provides filtering device, and it comprises resonant cavity and above-mentioned filter resonance 1.This filtering device can be cavity body filter, also can be duplexer.
The present embodiment additionally provides electromagnetic equipment, it comprises signal emission module, signal receiving module and above-mentioned filtering device, the input of described filtering device is connected with described signal emission module, and output is connected with signal receiving module, thus realizes filter function.Particularly, this electromagnetic equipment can be communication system, navigation system, navigation system, tracing system or measuring system, such as base station, aircraft, ship, car, radar or satellite.Certainly, can also be other multiple equipment needing to use filtering device.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (17)
1. the manufacture method of filter resonance, is characterized in that,
Rete is provided, on described rete, forms conduction geometry;
There is provided dieelctric sheet, adhere on the surface of described dieelctric sheet by the rete being formed with described conduction geometry, described rete and described dieelctric sheet form layered laminate and arrange, obtain filter resonance.
2. the manufacture method of filter resonance according to claim 1, is characterized in that,
Rete described in two is provided, forms described conduction geometry respectively on each described rete;
Dieelctric sheet described in one is provided, by be formed described conduction geometry two described in rete stick to respectively in the both side surface of described dieelctric sheet, obtain filter resonance.
3. the manufacture method of filter resonance according to claim 1, is characterized in that,
Rete described in one is provided, on described rete, forms described conduction geometry;
Dieelctric sheet described in two is provided, the rete being formed with described conduction geometry is sandwiched in described in two between dieelctric sheet, and two surfaces of described rete stick on the surface of two dieelctric sheets contacted with it respectively, obtain filter resonance.
4. the manufacture method of filter resonance according to claim 1, is characterized in that,
At least rete described in two panels is provided, on each described rete, forms described conduction geometry;
There is provided at least three and sequentially stacking described dieelctric sheet, be formed with the rete of conduction geometry described in accompanying between two at least adjacent dieelctric sheets, two surfaces of described rete stick on the surface of described adjacent two dieelctric sheets respectively, obtain filter resonance.
5. the manufacture method of filter resonance according to any one of Claims 1-4, is characterized in that, described in be formed conduction geometry rete adhered on the surface of described dieelctric sheet by glue-line.
6. the manufacture method of filter resonance according to claim 5, is characterized in that, after obtaining described filter resonance, is cured process to described filter resonance.
7. the manufacture method of filter resonance according to any one of Claims 1 to 4, is characterized in that, the step forming described conduction geometry on described rete comprises:
1), on the surface of described rete, conductive layer is formed;
2), to described conductive layer carry out processing and remove material, make the conductive layer stayed on the surface of described rete form described conduction geometry.
8. the manufacture method of filter resonance according to claim 6, is characterized in that, comprises the step that described filter resonance is cured process:
1), described one or more filter resonance is placed in fixture;
2), adjusting described fixture makes it compress described filter resonance.
9. the manufacture method of filter resonance according to claim 6, is characterized in that, in the temperature range of 70 DEG C ~ 300 DEG C, is cured process to described filter resonance.
10. filter resonance, is characterized in that, comprise dieelctric sheet and stick to the rete on the surface of described dieelctric sheet, the surface of described rete is formed with conduction geometry, described rete and described dieelctric sheet are that layered laminate is arranged.
11. filter resonance according to claim 10, is characterized in that, the both side surface of described dieelctric sheet is stained with described rete respectively.
12. filter resonance according to claim 10, it is characterized in that, described dieelctric sheet has two or more, at least wherein accompanies described rete between dieelctric sheet described in adjacent two, and two surfaces of described rete adhere on the surface of connected described adjacent two dieelctric sheets respectively.
13. according to claim 10 to filter resonance described in 12 any one, and it is characterized in that having glue-line between the surface of described rete and described dieelctric sheet, described rete adheres on the surface of described dieelctric sheet by described glue-line.
14. 1 kinds of filtering devices, is characterized in that, comprise resonant cavity and the harmonic oscillator being positioned at described resonant cavity, and described harmonic oscillator is filter resonance described in any one of claim 10 to 13.
15. 1 kinds of electromagnetic equipments, it is characterized in that, comprise signal emission module, signal receiving module and filtering device, the input of described filtering device is connected with described signal emission module, output is connected with signal receiving module, and described filtering device is filtering device as claimed in claim 14.
16. electromagnetic equipments according to claim 15, is characterized in that, described electromagnetic equipment is communication system, navigation system, navigation system, tracing system or measuring system.
17. electromagnetic equipments according to claim 15, is characterized in that, described electromagnetic equipment is base station, aircraft, ship, car, radar or satellite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310256998.7A CN104253296A (en) | 2013-06-25 | 2013-06-25 | Filter harmonic oscillator, manufacturing method of filter harmonic oscillator, filter device and electromagnetic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310256998.7A CN104253296A (en) | 2013-06-25 | 2013-06-25 | Filter harmonic oscillator, manufacturing method of filter harmonic oscillator, filter device and electromagnetic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104253296A true CN104253296A (en) | 2014-12-31 |
Family
ID=52187984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310256998.7A Pending CN104253296A (en) | 2013-06-25 | 2013-06-25 | Filter harmonic oscillator, manufacturing method of filter harmonic oscillator, filter device and electromagnetic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104253296A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023093741A1 (en) * | 2021-11-24 | 2023-06-01 | 天津大学 | Method for manufacturing dielectric waveguide radio-frequency device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040151876A1 (en) * | 2003-01-31 | 2004-08-05 | Tanielian Minas H. | Fabrication of electromagnetic meta-materials and materials made thereby |
| CN102731102A (en) * | 2012-05-30 | 2012-10-17 | 深圳光启创新技术有限公司 | Harmonic oscillator and preparation method thereof |
| CN103022623A (en) * | 2012-11-20 | 2013-04-03 | 深圳光启创新技术有限公司 | Harmonic oscillator, method for preparing harmonic oscillator, resonant cavity, filter device and microwave device |
| CN203481357U (en) * | 2013-06-25 | 2014-03-12 | 深圳光启创新技术有限公司 | Filter harmonic oscillator, filter, and electromagnetic equipment |
-
2013
- 2013-06-25 CN CN201310256998.7A patent/CN104253296A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040151876A1 (en) * | 2003-01-31 | 2004-08-05 | Tanielian Minas H. | Fabrication of electromagnetic meta-materials and materials made thereby |
| CN102731102A (en) * | 2012-05-30 | 2012-10-17 | 深圳光启创新技术有限公司 | Harmonic oscillator and preparation method thereof |
| CN103022623A (en) * | 2012-11-20 | 2013-04-03 | 深圳光启创新技术有限公司 | Harmonic oscillator, method for preparing harmonic oscillator, resonant cavity, filter device and microwave device |
| CN203481357U (en) * | 2013-06-25 | 2014-03-12 | 深圳光启创新技术有限公司 | Filter harmonic oscillator, filter, and electromagnetic equipment |
Non-Patent Citations (1)
| Title |
|---|
| 李小秋等: "一种适用于雷达罩的频率选择表面新单元研究", 《物理学报》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023093741A1 (en) * | 2021-11-24 | 2023-06-01 | 天津大学 | Method for manufacturing dielectric waveguide radio-frequency device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1807905B1 (en) | Method for forming a load bearing portion of a mobile platform | |
| US7563475B2 (en) | Vertically separated acoustic filters and resonators | |
| CN101426333B (en) | Multi-layer mixed pressing printed circuit board and manufacturing method, apparatus thereof | |
| EP2955782A1 (en) | Waveguide filter | |
| US9318812B2 (en) | Antenna fabrication | |
| CN101631433A (en) | Implementation method of printing thick copper foil in PCB | |
| CN107517043B (en) | SMD quartz crystal resonator processing method and resonator thereof | |
| CN107529274B (en) | Integrated suspension line circuit structure of medium based on 3D prints | |
| CN104837098A (en) | Low and medium frequency sound insulation meta-material structure prepared by 3D printing | |
| CN102731102A (en) | Harmonic oscillator and preparation method thereof | |
| CN114094317A (en) | Multi-layer composite material strip line antenna, integrated forming mold and method | |
| CN203481357U (en) | Filter harmonic oscillator, filter, and electromagnetic equipment | |
| CN104253296A (en) | Filter harmonic oscillator, manufacturing method of filter harmonic oscillator, filter device and electromagnetic equipment | |
| CN105322262A (en) | Composite stripline waveguide detection and calibration network and processing method | |
| CN202797213U (en) | Cavity filter and cross coupling structure | |
| CN104009276A (en) | Dielectric resonator, assembly method and dielectric filter | |
| CN205122743U (en) | Power distribution unit | |
| CN102810761B (en) | The manufacture method of sandwich Meta Materials and manufacture method and sandwich metamaterial antenna cover | |
| CN109411889B (en) | Regular hexagon type EBG structure for antenna and manufacturing process thereof | |
| CN105048052B (en) | A kind of tunable dielectric resonator and dielectric filter | |
| CN110881240A (en) | High-heat-dissipation and low-loss PCB and manufacturing method thereof | |
| CN107911939B (en) | Flexible printed circuit board | |
| CN103009713A (en) | Thermal compression bonding copper-clad plate by adopting polymethyl methacrylate as medium, printed circuit board as well as manufacturing method thereof | |
| CN113677089B (en) | Printed circuit board, antenna system and electronic equipment | |
| CN104159406A (en) | Slotting multilayer circuit board manufacturing method and slotting multilayer circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141231 |
|
| RJ01 | Rejection of invention patent application after publication |