CN104245219B - 激光接合装置 - Google Patents

激光接合装置 Download PDF

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Publication number
CN104245219B
CN104245219B CN201380019472.5A CN201380019472A CN104245219B CN 104245219 B CN104245219 B CN 104245219B CN 201380019472 A CN201380019472 A CN 201380019472A CN 104245219 B CN104245219 B CN 104245219B
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China
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laser
methods
substrate
red outer
ripple
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CN104245219A (zh
Inventor
诶瑞克·麦克·欧立松
简里森·阮卫尔
阿玛·德阮尔·图卫尔
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Alere San Diego Inc
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Alere San Diego Inc
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7855Provisory fixing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/21Bonding by welding
    • B23K26/24Seam welding
    • B23K26/244Overlap seam welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/32Bonding taking account of the properties of the material involved
    • B23K26/324Bonding taking account of the properties of the material involved involving non-metallic parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60Preliminary treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/16Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16Laser beams
    • B29C65/1629Laser beams characterised by the way of heating the interface
    • B29C65/1635Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16Laser beams
    • B29C65/1629Laser beams characterised by the way of heating the interface
    • B29C65/1654Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16Laser beams
    • B29C65/1629Laser beams characterised by the way of heating the interface
    • B29C65/1664Laser beams characterised by the way of heating the interface making use of several radiators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • B29C65/72Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/02Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/028Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/20Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/21Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/20Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/23Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being multiple and parallel or being in the form of tessellations
    • B29C66/232Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being multiple and parallel or being in the form of tessellations said joint lines being multiple and parallel, i.e. the joint being formed by several parallel joint lines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
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    • B29C66/24Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
    • B29C66/242Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours
    • B29C66/2424Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain
    • B29C66/24243Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral
    • B29C66/24244Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral forming a rectangle
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/30223Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined said melt initiators being rib-like
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    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • B29C66/50General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
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    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/83General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
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    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • B29C66/90Measuring or controlling the joining process
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    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
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    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16Laser beams
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    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
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Abstract

本发明涉及接合材料的方法以及用该方法制造物品的工艺。本发明涉及一种用于接合第一基板和第二基板的工艺。该工艺包括用具有第一波长和足够强度的激光束辐射第一基板的部分来增强第一基板对具有不同于第一波长的第二波长的光线。激光束可以碳化第一基板的被辐射部分的至少一个部分,从而赋予其比第一基板的未被辐射部分具有更高的吸光度。然后放置第二基板与第一基板的被辐射部分相接触。用具有第二波长不同于第一波长并具有足够强度的第二激光辐射第一基板,从而加热,最好熔化,第一基板的被辐射部分。

Description

激光接合装置
发明领域
本发明涉及连接材料的方法以及用该种方法制造物品的工艺。
发明背景
许多物品的制造和装配通常包括将两表面接合或粘合在一起来制成复合材料。在微流体装置领域,可以使用在一定程度上决定固定装置的性质的连接部件的方法和装置。例如,用于检测葡萄糖的该类型的一次性试纸的制造工艺通常包括基于网状基板的高速加工,该工艺包括使用印刷粘合剂或胶带式粘合剂。通常这样的胶粘剂是压力活化的,并且需要使得两部件接触的动作足够活化胶黏剂。
参考文件描述了在物品组装中压敏粘结剂使用方面相关的限制的解决方案。美国专利3477194描述了一个热封热塑性塑料包装,该方法可被用于实现物品的连续包装。美国专利申请2004-0056006(现已放弃)描述了一种形成工件之间的焊接的方法。该方法包括:为了使得在在接合区域的一个或两个工件的表面熔化,并且允许熔化的材料冷却,从而焊接工件一起,从而将结合区域(3)在具有波长在可见光范围外的入射辐射(4)中曝光。在工件(1,2)中的一个或两者之间的接合区域(3)提供了一个辐射吸收材料。为了吸收入射辐射并且为熔化工艺产生热量,该吸收材料具有与入射辐射的波长相匹配的吸收谱带。
根据本发明,提供了一种工件间接合的方法,该方法可以不需要添加剂或是外部施加的胶粘剂。
发明内容
本发明涉及连接材料的方法以及用该种方法制造产品的工艺。
在一些实施例中,该方法包括增加第一材料的一部分相对于具有第二波长的光线的吸光度,使得第一材料的部分和第二材料的部分相接触;以及用具有第二波长和强度足够的光线辐射第一材料和第二材料的接触面来接合第一和第二基板的被辐射部分。
增加吸光度包括对第一材料的至少一部分进行碳化处理。增加第一材料的至少一部分的吸光度可能通过如下来执行,例如,用光线辐射第一材料,例如,用激光束来加热第一材料,和/或在第一材料上使用化学物质。在实施例中,增加吸光度包括用具有第一波长的光线辐射第一材料,该光线不同于第二波长。用具有第一波长的光线辐射第一材料碳化处理第一材料的至少一部分。
增加吸光度包括对第一材料的至少一部分进行氧化处理。对第一材料的至少一部分的氧化处理可以通过如下来执行,例如,用光线辐射第一材料,例如,用激光束来加热第一材料,和/或在第一材料上使用化学物质。在实施例中,增加吸光度包括用具有第一波长的光线辐射第一材料,该光线不同于第二波长。用具有第一波长的光线辐射第一材料碳化处理第一材料的至少一部分。对第一材料的至少一部分进行的氧化处理可以替代或结合对第一材料的至少一个部分的碳化处理。
增加吸光度包括在第一材料表面上涂敷试剂或涂层。在一些实施例中这些试剂或涂层不会改变第一材料的化学成分。然而这些试剂或涂层的存在使得第一材料的表面对光线敏感,该光线具有不同于第一波长的第二波长,可以被用于直接增加第一材料对第二波长的吸光度。
在其他实施例中,这些添加剂可以造成第一材料中的化学成分发生变化,从而使得第一基板对第二波长敏感,该第二波长不同于用来修饰第一基板表面的第一波长。在这种情况下,添加剂会暴露第一材料表面的某些化学基团,其中相对于光的第二波长,化学基团有一个增加的吸光度。
在一些实施例中,增加吸光度包括在第一材料的表面涂敷吸收第二波长的添加剂。例如,添加剂可以通过印刷、喷雾、浸涂或写的工艺涂敷。在这些实施例中,使用的添加剂不会影响或改变第一材料的化学/物理组成。添加剂本身直接吸收具有第二波长的光线,从而造成对第一材料的加热。
在一些实施例中,第一个和第二材料各自为第一和第二基板。第一和第二基板可以是微流体装置的基板。
在一些实施例中,一种接合第一基板和第二基板的方法,包括在第一基板的表面布置图案,其中该图案可以由如下形成:(i)将基板暴露于具有第一波长的激光束下,(ii)用颜料组合印刷图案,或(iii)用划线器来划线。接着让有图案的基板接触到第二基板;将与第二基板相接触的有图案的基板暴露于具有第二波长的不同于第一波长的激光束下,其中第一基板上图案的存在会吸收第二波长激光束的能量,因此加热以及熔化第一基板,造成部件的接合。
在其他实施例中,一种将第一基板接合到第二基板的方法包括将第一基板的一部分暴露于第一激光中来碳化处理基板的表面,接着将第一基板与第二基板相接触,在第一和第二基板之间施加一个作用力;第一基板的表面暴露于第一激光之后,将第一和第二基板暴露于第二激光中来加热第一基板的表面,从而至少熔化第一基板并选择性地熔化第二基板;使得第一和第二基板在第二激光接触到的区域附近相互混合,从而接合基板。
在另一个实施例中,一种接合第一和第二基板的方法,包括用具有第一波长的激光辐射第一基板的一部分;将第一基板的辐射部分与第二基板相接触;用不同于第一激光的具有第二波长的激光来辐射与第二基板相接触的之前被辐射的第一基板的一部分。
第一基板可以包括一个特征,并且暴露于第一激光的第一基板的部分处在该特征的周边附近。该特征可以是一个凹槽,一个通道,一个洞,一个孔,一个通风口或者一个通路。当第一基板的表面暴露于其被修饰的激光下,使得该表面对第二激光更敏感。在某些实施例中,第一激光使第一基板的表面的碳化。
第一激光可以具有在约238nm至约532nm之间的波长,并且可以包括一个紫外激光器或绿光激光器。第二激光可以具有介于约700nm和1540nm的波长,并且可以包括一个红外激光器。
在一些实施例中,当红外激光使得在先前暴露于第一激光的区域的第一基板熔化,并且可选地熔化第二基板,第二基板在碳化处理的表面附近与第一基板接合。在一些实施例中,第一基板与第二基板在第一基板暴露于第一激光的区域相互混合。
在某些实施例中,由第一激光接触的第一基板的部分在围绕待接合的特征确定一条线;并且在一些实施例中,由第一激光接触的第一基板的部分确定至少两条,并且在一些实施例中确定三条或更多围绕待接合的特征的线。
由第一激光接触的第一基板的部分与待接合特征的距离至少大约0.05um,至少大约0.075um,至少大约0.1um,至少大约0.2um,至少大约0.5um,至少大约1um,至少大约2.5um,至少大约5um,至少大约10um,至少大约20um,至少大约30um,至少大约50um。
由第一激光接触的第一基板的部分与待接合的特征的距离大约100um或更少,大约75um或更少,大约50um或更少,大约25um或更少,大约10um或更少,大约5um或更少,大约2.5um或更少,大约1um或更少,大约0.5um或更少。
第一激光可以在第一基板的表面上提供一条连续的线,或激光可以在第一基板的表面上提供一系列离散的图案。线或图案可以包括至少大约0.1um到至少大约100um的直径以及至少0.1um到至少大约100um的间隔。第一个激光可以在第一基板的表面上确定圆形图案,正方形图案,六边形图案,三角形图案或椭圆图案。
在其他实施例中,该方法包括增加第一基板表面的一部分相对于具有第一波长的光线的吸光度;以第二基板表面的一部分来接触第一基板表面的一部分;并且以具有第一波长具有足够强度的光线来辐射第一和第二基板相接触的部分,在第一和第二基板表面的辐射部分上接合第一和第二基板。
制造的物品包括将第一基板接合到第二基板,其中第一和第二基板中的至少一个的一部分暴露于第一激光中,致使基板的熔化和接合到另一个基板上。
在进一步实施例中,一种接合第一和第二基板的方法,包括在第一基板的表面产生第一图案,其中该图案可以通过将基板暴露于具有第一波长的激光束中来形成,或使用颜料组合来印刷图案或使用划线器来划线来形成。第二图案可以提供在第一基板的表面;第二图案可以通过将材料注塑成型、热压成型、研磨、挤压或分散在表面,通过使之硬化而形成图案。有图案的基板然后与第二基板相接触,并且与第二基板相接触的有图案的基板在第二图案附近暴露于超声能量中。基板上存在的第二图案吸收了施加的超声能量,导致基板的局部熔化,因此在第二图案的附近接合了第一和第二基板。然后与第二基板相接触的具有图案的基板暴露于具有不同于第一波长的第二波长的激光束中。在第一基板上的第一图案吸收了第二波长的激光能量,并且导致在第一图案的附近加热和熔化第一基板。
在另一个实施例中,一种接合第一和第二基板的方法,包括在第一基板的表面的第一部分提供一个结构,该结构作为能量导向,并且用具有第一波长的激光辐射第一基板的同样表面的第二部分。第一基板有图案的表面然后与第二基板相接触,并且将超声辐射应用于第二基板的表面,该第二基板位于处在第一基板上的能量导向的附近。接着用不同于第一波长的具有第二波长的激光辐射与第二基板相接触的第一基板的先前被辐射部分。第一基板可以包括一个特征,该特征可以是一个凹槽,一个通道,一个洞,一个孔,一个通风口或者一个通路。可以在该特征的周边的第一部分的附近提供一个能量导向。超声能量在第一基板上的能量导向的附近的第二基板上的应用可以被用于接合第一基板至第二基板。暴露于第一激光中的第一基板的一部分可以在特征周边的第二部分的附近,并且当第一基板的表面暴露于修饰第一基板表面的激光中时,使得其对第二激光敏感。在一些情况下,第一激光使得第一基板的表面发生碳化。
通常情况下,第一激光拥有的波长介于238nm和532nm之间;并且可以是紫外激光或绿光激光。通常情况下,第二激光拥有的波长介于700nm和1540nm之间;并且可以是红外激光。
在一个实施例中,第二基板接合到碳化表面附近的第一基板。红外激光使得第一基板熔化,并且选择性地熔化在暴露于第一激光区域附近的第二基板,从而导致在先前暴露于第一激光中的第一基板的区域,第一基板和第二基板发生混合。
在一个实施例中,第一激光接触到的第一基板的部分在待接合特征的周围确定一条线。在另一个实施例中,第一激光接触到的第一基板的部分在待接合特征的周围确定至少两条线。由第一激光接触的第一基板的部分与待接合特征的距离至少大约0.05um,至少大约0.075um,至少大约0.1um,至少大约0.2um,至少大约0.5um,至少大约1um,至少大约2.5um,至少大约5um,至少大约10um,至少大约20um,至少大约30um,至少大约50um。由第一激光接触的第一基板的部分与待接合特征的距离至少大约100um,至少大约75um,至少大约50um,至少大约25um,至少大约10um,至少大约5um,至少大约2.5um,至少大约1um,至少大约0.5um。
在一个实施例中,第一激光在第一基板的表面确定一个连续的线。在另一个实施例中,第一激光确定一系列直径为至少0.1um至10um的离散图案,并且图案之间的间距为至少0.1um至10um。第一激光可以在第一基板的表面确定圆形图案,正方形图案,六边形图案,三角形图案或椭圆图案。
在一个实施例中,第一基板和第二基板在没有任何外部施加力的作用下,可以通过激光焊接接合。
附图说明
图1描述包含凹槽的第一基板的立体图。
图2描述图1中的第一基板被激光束辐射。
图3描述图1和图2中的第一基板的另一部分暴露于激光束中。
图4描述图1-3中的第一基板与第二基板相接触且被图2-3中的激光束辐射的第一基板的一部分暴露于不同于第一激光束的第二激光束的立体图。
图5描述图4的视图,其中暴露于第一激光束中的第一基板的整个部分现在同时暴露于具有第二波长的第二激光束中。
图6a-6d描述图1中第一基板的视图,其中描绘一系列通过激光束辐射的区域。图6a描述通过点来形成一系列离散线,图6b描述由第一激光辐射出的一系列线,图6c描述排列成立体图案的一系列的点;图6d描述排列成三角形图案的一系列的点。
图7描述了图1的立体图,其中装置的区域暴露于第一激光中,装置的区域被修饰来提供能量导向。
图8为图7通过A-A线的剖视图。
图9为图8的剖视图,其中放置第二基板与第一基板相接触。
具体实施方式
微流体装置的形成通常包括将两个基板接合在一起。一个或两个基板可以确定微尺度特征,例如凹槽、通道、洞、坑、孔、通风口或者通路。接合基板封装微尺度特征来形成微流体网络,该微流体网络可以用来输送流体样品。因此,通常优选基板按照微流体网络中的流体不能泄露或溢出的方式接合在一起。这些特征的表面之间的间隙距离可以精确控制以达到实现可重复的体积容量以及进一步得到可重复的毛细管压力是可以期望的,该毛细管压力可能是唯一动力用于通过微流体网络移动流体。
描述了一种第一基板和第二基板的接合工艺。在一个实施例中,该工艺包括用具有第一波长和强度足够的第一激光束来辐射第一基板的一部分来增强第一基板对具有第二的不同波长的激光的吸光度。例如,激光束可以碳化第一基板的被辐射部分的至少一部分。第一基板的被碳化部分通常比第一基板的未被辐射的部分具有更高的吸光度。放置第二基板与第一基板的被辐射部分相接触。由于第一和第二基板如此接触,用具有第二波长,不同于第一波长的,第二激光来辐射第一基板的被辐射部分;第二激光的强度足够来加热,最好熔化,第一基板的被辐射部分。因为第一基板的被辐射部分的吸光度比第一基板的未被辐射部分的吸光度高,第二激光束有效地加热(最好熔化)第一基板的先前被辐射部分,致使第一和第二基板接合在一起,而基本上不影响基板的先前未暴露于第一波长的激光的部分。在实施例中,接合的第一和第二基板形成了微流体装置的至少一部分。
在另一个实施例中,在上一段描述的接合两块基板的工艺可以另外涉及使用超声焊接。在本实施例中,可以在待接合特征的附近提供一个被称为能量导向的结构。能量导向通常是呈现在一个基板表面的突出特征,用来接合另一个基板。能量导向,当暴露于超声能量中,作为待接合的基板被压缩在一起,被用于引起振动并且因此产生热量。这种热量导致基板的熔化,在压力的作用下导致基板熔融以形成接合处。两块基板的超声焊接预接合,可以充分保持基板在一起以致于激光焊接可以不需激光焊接过程中要施加于部件上的压缩压力。当部件在类似输送带传输工艺上使用激光焊接且在不同的区域待接合,这可以是特别有益的。
参照图1,基板10确定了第一基板11,第一基板11确定了一个宽w12微米和深d12微米的凹槽。第一基板10是由可以通过激光辐射和/或超声辐射的工艺接合到第二基板的材料组成的。通常,第一基板包括一个聚合物材料,例如聚苯乙烯、聚碳酸酯、聚甲基丙烯酸甲酯、聚酯、聚醚醚酮或其组合。在实施例中,第一基板对波长介于300nm和1000nm之间的光线是不透明的。这里使用的术语“凹槽”为术语“特征”的非限制性例子,是为了描述特定的实施例。这里使用的术语“特征”用来确定凹槽、通道、洞、孔、通风口、通路、坑或其他结构或元件。
在某些实施例中,宽度w12的凹槽12可以至少250um(例如至少500um,至少750um,至少1000um,至少2500um,至少5000um)。
在其他实施例中宽度w12的凹槽12可以0.5mm(例如小于0.4mm,小于0.3mm,小于0.2mm,小于0.1mm,小于0.05mm,小于0.01mm)。
深度d12的凹槽12可以为250um(例如至少500um,至少750um,至少1000um,至少1.5mm)。在其他实施例中,深度d12的凹槽12可以为250um(例如小于200um,小于150um,小于100um,小于75um,小于50um,小于25um,小于20um,小于10um,小于5um)
凹槽12可以通过很多工艺在第一基板10的表面形成,包括但不限制于注塑成型、热压成型、挤出成型、雕刻、激光烧蚀、微机械加工或类似的方法。
参照图2,提供了将第一基板10的一部分暴露于一激光束20中的工艺。第一激光器16产生一个具有第一波长的激光束20。第二激光器32产生一个具有第二波长不同于第一激光器16的激光束(未显示)。选择第一波长以使得第一基板10的表面碳化。碳化线14具有宽度w14产生在第一基板10的表面,接着将第一基板10暴露于激光束20中。碳化线14的宽度w14可以至少50um(例如至少52um,至少54um,至少56um,至少58um,至少60um,至少65um,至少70um,至少80um)。碳化线14的宽度w14可以至少50um(例如小于45um,小于40um,小于35um,小于30um,小于25um,小于10um)。
在一个示例性实施例中,激光器16可以被描述为具有如下特点:波长355nm或532nm;用如下的操作参数使用(当使用赛刻紫外光标识系统)激光能量100%,激光频率50Hz;激光开启延迟50us;激光关闭延迟135us,标识延迟0us,标识速度3000mm/s,脉冲宽度2us,跳跃速度150us,模式-标识一次。
激光束20通过第一光学装置18导向于第一基板10。第一光学装置18被用于第一激光束20的导向来使与第一基板10的表面发生特定接触。在图2中所描绘的具体实施例中,激光束20导向于在距凹槽12边缘距离为d10与第一基板10的表面相接触,凹槽12在第一基板10的表面。距离d10可以为30um,(例如至少为32um,至少为35um,至少为40um,至少为45um,至少为50um)。距离d10可以为30um,(例如小于25um,小于20um,小于15um,小于10um,小于5um)。第一光学装置18被用于引导激光束20沿着箭头22方向的路径,保持距离d10平行于凹槽12的边缘来产生碳化线14。图3描述了图2的视图,表示沿着凹槽12周边的碳化线14的形成进度。操作第一光学装置18沿着围绕感兴趣的待接合特征的定义的路径导向第一激光束16。在实施例中,图2中描述的待接合特征是凹槽12,将参照图4和5进行描述。
第一激光器16用于提供各种波长的光,来修饰或碳化第一基板10的表面,使得被接触部分对具有第二波长的光线敏感。例如,在一个实施例中,第一激光器16可以是紫外激光,在另一个实施例中,第一激光器16可以是绿光激光。第一激光器16的典型波长可以介于248nm至532nm之间。选择第一激光器16使得其碳化第一基板10的表面,而基本不改变表面形貌。也就是说,碳化工艺基本上不会导致第一基板10表面的凹陷,也不会导致第一基板10表面抬高。提供修饰或碳化第一基板10表面的工艺来改变第一基板10的吸收特性,使得其对具有不同波长的激光敏感。该具有不同波长的激光可以包括加热和熔化适当敏感聚合物表面。例如,聚合物包含炭黑颗粒,例如黑色聚苯乙烯,可能直接吸收可能诱导加热和熔化聚合物的波长的激光能量。因此,整个黑色聚苯乙烯的表面对足够导致加热和熔化表面的波长的激光敏感。本发明的一个好处在于第一基板10的表面上的独特的和离散的区域可以通过使用第一激光16器来“激活”。第一基板10上离散区域的这种图案化或标识可以减少在某地方不必要的加热,例如在蛋白质或其他温度敏感的品种或组分被放置的位置。
现在参照图4,第二基板30布置在第一基板10的表面,在其上面形成一个碳化线14产生微流控芯片50。第二激光器32用于产生激光束36,该激光束通过使用第二光学装置34导向于第一基板10的表面。从聚合物材料中选择第二基板30,该聚合物材料对激光束36透明且对激光束36产生的加热和熔化不敏感。在一个实施例中,如图4所描述,激光束36沿着箭头22的方向遵循碳化线14。在另一个实施例中,如图5所描述,激光束36暴露了整个区域,在区域上使用在目标表面上确定线而不是点的“帘束”同步布置了碳化线14。
第二激光器32用于提供各种波长的光使得在碳化线14的附近的第一基板10表面局部加热和/或熔化。在替代实施例中,来自第一基板10组成的聚合物可以是直接吸收来自激光器32能量的材料。例如,负载炭黑的聚苯乙烯可以使用,当接触到第二激光器32时,该材料对加热和/或熔化自然地敏感。然而应当指出的是,当第一基板10由黑色聚苯乙烯组成时,例如,可能有必要使用一个掩膜来限制暴露于第二激光器32中的第一基板10的区域来防止在某些地方不期望的加热和熔化。当白色聚苯乙烯,例如,用于生产第一基板10,该材料通常对第二激光器32不敏感,同时不存在碳化线14,当接触到第二激光器32时,该材料不会加热和/或熔化。通常地,可以选择波长介于750nm和1500nm之间的红外激光来加热和/或熔化先前暴露于第一激光器16下的第一基板10。在示例性实施例中,第二激光器具有的波长为940nm。
当碳化线14暴露于激光束36中,碳化线14吸收激光能量,从而导致在碳化线14附近的第一基板10局部加热。第一基板10和第二基板30的聚合物由于激光束36的局部加热而熔化。熔融的聚合物混合,一旦激光束36被关闭,聚合物接着冷却,第一基板10和第二基板30在第一基板10的表面形成的碳化线14附近接合。如图4所描述,第二光学装置34被用于导向激光束36在沿着箭头22的方向环绕碳化线14的路径。碳化线14对激光束36敏感,到达一定程度的是能量产生的激光束36导致局部温度升高从而引起第一基板10到达熔化,并且在紧邻碳化线14,选择性熔化第二基板30。当激光束36沿着碳化线14被导向,第一基板10和第二基板30的聚合物熔化并混合,从而导致基板沿着碳化线14的长度方向接合。
参照图5,沿着微流控芯片50的碳化线14的凹槽12同时暴露于激光束36中。在本实施例中,光学装置34产生一个楔形或帘状的激光束足够在单个步骤中影响碳化线14的整个长度和/或宽度的加热。在这种情况下,激光束36将不会沿着碳化线14被导向,正如参照图4中被描述的,但接触到碳化线14形成的整个区域。另外地,楔形或帘状的激光束36可以跨越扫描第一基板10的表面,在这种情况下,待接合部件的长度或宽度沿着激光束36和基板接触产生的线被暴露,与参照图4中描述的激光束36和第一基板10的接触方向相反。在一些实施例中,当暴露微流控芯片50于一个楔形或帘状的激光束中,有必要对第一基板10上的某些区域采用一个掩膜来防止微流控芯片50的潜在敏感区域暴露于激光束36中。例如,如果经过在第二激光器32的曝光下可能会变性的生物或化学材料放置在微流控芯片50中的凹槽或通道内,则有必要防止此类材料暴露于激光器32中。
在进一步实施例中,在第一基板10的表面可能形成多个碳化线14。例如,可以由直径为50um的一系列点44来形成碳化线14,14’和14”(例如,点的直径可以至少为52um,至少为54um至少为56um至少为58um至少为60um至少为65um至少为70um至少为80um)。如图6a所描述,可以由直径为50um的一系列点44来形成碳化线14,14’和14”(可以小于45um,小于40um小于35um小于30um小于25um小于10um)。可选地,可以由宽度为50um的一系列的线46来形成碳化线14,14’和14”(例如,线的宽度至少52um,至少54um,至少56um,至少58um,至少60um,至少65um,至少70um,至少80um)。可选地,如图6b所描述,可选地,可以由宽度为50um的一系列的线46来形成碳化线14,14’和14”(例如,线的宽度小于45um,小于40um,小于35um,小于30um,小于25um,小于10um)。参照图6a或图6b,碳化线14,14’和14”可以通过10um间距隔开(例如,间距至少12um,至少14um,至少16um,至少18um,至少20um,至少25um,至少30um,至少40um)。参照图6a或图6b,碳化线14,14’和14”可以通过10um间距隔开(例如,小于8um,小于6um,小于4um,小于2um,小于1um)。
如图6a所描述,每一个点与另一个点之间的圆周间距为10um(例如,至少12um,至少14um,至少16um,至少18um,至少20um,至少25um,至少30um,至少40um)。如图6a所描述,每一个点与另一个点之间的圆周间距为10um(例如,小于8um,小于6um,小于4um,小于2um,小于1um)。进一步地,排列点于不同的空间位置。在一个实施例中,如图6c所描述,排列点成立方图案,其中相邻行的中心点确定了一个立方图案。在进一步的实施例中,如图6d所示,点44可以移动,相邻行的中心点确定了一个三角形图案。如图4和5所描述,依赖于微流控芯片50的目的,在凹槽12附近提供两个或更多的碳化线。对本领域技术人员显而易见的是,随着用于接合第一基板10和第二基板30的碳化线14,14’和14’的数目的增加,两基板之间将产生更强大的接合,因为聚合物熔化和混合的接触区域将会增加。
在又进一步的实施例中,可以通过多种工艺在第一基板10的表面提供碳化线14,14’和14’。例如,碳化线14,14’和14’可以通过印刷工艺来形成,例如,丝网印刷,凹版印刷,槽染料印刷,轮转印刷,喷墨印刷或其它非接触印刷方法,这些方法被用于沉积一薄层材料来吸收激光束36以及引起加热和熔化第一和第二基板(10,30)。在一些实施例中,包含碳颗粒的材料可以沉积在第一基板10的表面。在其他实施例中,可以使用吸收来自激光器32的能量的包含其他颗粒或添加剂的材料。当材料暴露于第二激光器32中,这些颗粒的目的是促使第一基板10的加热和熔化。当这些组合物被施加到第一基板10的表面,这些组合物基板上不影响或改变第一基板10的化学组成。而该组合物是容易吸收来自第二激光器32的能量来产生热量,从而导致第一基板10的熔化优先于第一基板10和第二基板30之间的接合或粘合。
在进一步的实施例中,应用于第一基板10表面的一薄层材料造成第一基板10的组成发生了化学变化。在这种情况下,由这些应用的材料所接触的第一基板10的区域可以变得对第二激光32更为敏感。因此,遵循第一基板10的处理方法,化学改性的部分可以接触到激光器32,从而导致在邻近第一基板10和第二基板30之间的接触点的区域加热和接合到第二基板30,其中第一基板10先前通过一薄层材料的化学处理。
碳化线14可以另外通过共成型的工艺来形成,其中碳负载的聚合物专门注射到模具工具中在待接合部件的表面上提供一个或多个离散的线或区域。在又进一步的实施例中,可以使用笔在第一基板10的表面划一道线,例如,使用碳颜料墨水的毡尖笔,或其他可以吸收来自第二激光32能量的颜料,导致至少第一基板的加热和熔化,并且另外可选第二基板30。
参照图7,在某个实施例中,凹槽12可以由能量导向15和碳化线14在周围划线。能量导向15代表一个凸起部分,该部分在图8中可以清晰地看到,图8为图7通过A-A线的剖视图。能量导向15是一个呈现在基板10表面的结构或特征,并对超声辐射敏感。如图9所描述,当第一和第二基板第一次相接触,能量导向15与第二基板30初次接触。当超声能量应用于在第一基板10上能量导向15附近的第二基板30的外表面(该表面与第一基板10不接触),振动能量导致来自两基板的结合处形成的能量导向的聚合物材料的局部加热。施加于第一和第二基板的应用超声能量的位置处的压缩压力导致两基板的接合。当能量导向暴露于超声能量中,能量导向伴随着被压缩,加热以及熔化,从而导致与第二基板融合。通常地,根据待接合聚合物的组成,可以使用处于15kHz、20kHz、30kHz、35kHz、40kHz和70kHz范围的频率。能量导向15可以通过多种步骤形成,包括但不限制于,注塑成型,热压成型,激光划线,注塑成型之后对塑料基板的碾磨,塑料部件的挤压,或在成型部件的表面分配材料,然后硬化来形成能量导向。通常地,能量导向15将通过注塑成型与凹槽12同步形成。
根据本发明的一个实施例,在由激光束20所初步形成的碳化线14(如图2所描述)之后,第一和第二基板将接触放置,并且朝着玻璃板(未显示)被压缩,第二基板30直接与玻璃板直接接触。根据先前在图3-5中所描述的,引导第二激光32透过玻璃板接触碳化线14,从而导致基板的接合。在某些条件下,然而更有利于实现所述激光焊接步骤,无需在焊接工艺过程中朝着玻璃板压缩待接合的部件。根据一个进一步实施例,可以使用超声和激光焊接的组合来接合两个工件。在第一实例中,可以使用超声焊接接合部件。超声焊接接合处保持部件充分靠近在一起,以便成功激光焊接。因此,在激光焊接步骤中,没有后续要求朝着玻璃板压缩部件。
当与单独使用超声焊接得到的间隙高度相对比,部件的激光焊接通常在部件之间产生接合处,该接合处与两部件接合处的间隙高度相比具有更高的重复性。这种是局部的,因为在接合处区域,即能量导向15所占据的空间,没有附加材料需要被容纳,使得在两基板间的间隙高度引起变化。因此,希望有一种更具有可重复性间隙高度,例如在用毛细填充工艺的微流体装置中,封闭腔体的维度变化,例如毛细管,可能导致在这些毛细管中流体流速的变化。当这些装置在试验测量中使用时,组成部件任何变化可足以影响试验测量的精度。因此,通过超声和激光焊接的组合工艺在组装工艺中提供改进的控制是有益的。超声/激光焊接工艺的进一步好处是激光焊接可以是使用输送带操作的半自动化的,其中如图5所描述的,先前通过超声焊接接合在一起的部件可以暴露于第二激光器32下,其中使用帘状光束暴露先前暴露于第一激光器16下的基板10表面上的所有区域,在输送带(未显示)上基板10作为部件经过激光器32的下方。

Claims (181)

1.一种接合第一基板和第二基板的方法,包括:
在第一基板的表面布置图案,其特征在于该图案可以由如下形成:(i)将所述的第一基板暴露于具有第一波长的激光束下,或(ii)用颜料组合印刷图案,或用划线器来划线;
将第二基板与有图案的第一基板相接触;
将与第二基板相接触的有图案的第一基板暴露于具有第二波长的,不同于第一波长的,激光束下,其中第一基板上存在的图案会吸收具有第二波长的激光束的能量,因此,加热及熔化第一基板;其中,第一基板包括一种微尺度特征,该特征包括一个凹槽、一个通道、一个洞、一个孔、一个通风口或者一个通路;其中,第一激光使得第一基板的表面碳化。
2.一种接合第一基板和第二基板的方法,包括:
将第一基板的一部分暴露于第一激光中来修饰第一基板的表面;将第一基板与第二基板相接触;
在第一和第二基板之间施加一个作用力;
将第一和第二基板暴露于第二激光中来加热先前暴露于第一激光的第一基板的表面,来加热和熔化至少第一基板并选择性地加热和熔化第二基板;使得第一和第二基板在第二激光接触到的区域附近相互混合,从而接合第一和第二基板;其中,第一基板包括一种微尺度特征,该特征包括一个凹槽、一个通道、一个洞、一个孔、一个通风口或者一个通路;其特征在于,第一激光使得第一基板的表面碳化。
3.如权利要求1所述的方法,其特征在于,暴露于第一激光的第一基板的部分在特征周边的附近。
4.如权利要求2所述的方法,其特征在于,暴露于第一激光的第一基板的部分在特征周边的附近。
5.如权利要求2所述的方法,其特征在于,第一基板的表面暴露于其被修饰的第一激光下,使得该表面对第二激光更敏感。
6.如权利要求3所述的方法,其特征在于,第一基板的表面暴露于其被修饰的第一激光下,使得该表面对第二激光更敏感。
7.如权利要求4所述的方法,其特征在于,第一基板的表面暴露于其被修饰的第一激光下,使得该表面对第二激光更敏感
8.如权利要求2所述的方法,其特征在于,第一激光的波长介于238nm和532nm之间。
9.如权利要求3所述的方法,其特征在于,第一激光的波长介于238nm和532nm之间。
10.如权利要求4所述的方法,其特征在于,第一激光的波长介于238nm和532nm之间。
11.如权利要求5所述的方法,其特征在于,第一激光的波长介于238nm和532nm之间。
12.如权利要求6所述的方法,其特征在于,第一激光的波长介于238nm和532nm之间。
13.如权利要求7所述的方法,其特征在于,第一激光的波长介于238nm和532nm之间。
14.如权利要求2所述的方法,其特征在于,第一激光是紫外激光。
15.如权利要求3所述的方法,其特征在于,第一激光是紫外激光。
16.如权利要求4所述的方法,其特征在于,第一激光是紫外激光。
17.如权利要求5所述的方法,其特征在于,第一激光是紫外激光。
18.如权利要求6所述的方法,其特征在于,第一激光是紫外激光。
19.如权利要求7所述的方法,其特征在于,第一激光是紫外激光。
20.如权利要求8所述的方法,其特征在于,第一激光是紫外激光。
21.如权利要求9所述的方法,其特征在于,第一激光是紫外激光。
22.如权利要求10所述的方法,其特征在于,第一激光是紫外激光。
23.如权利要求11所述的方法,其特征在于,第一激光是紫外激光。
24.如权利要求12所述的方法,其特征在于,第一激光是紫外激光。
25.如权利要求13所述的方法,其特征在于,第一激光是紫外激光。
26.如权利要求2所述的方法,其特征在于,第一激光是绿光激光。
27.如权利要求3所述的方法,其特征在于,第一激光是绿光激光。
28.如权利要求4所述的方法,其特征在于,第一激光是绿光激光。
29.如权利要求5所述的方法,其特征在于,第一激光是绿光激光。
30.如权利要求6所述的方法,其特征在于,第一激光是绿光激光。如权利要求7所述的方法,其特征在于,第一激光是绿光激光。
31.如权利要求8所述的方法,其特征在于,第一激光是绿光激光。
32.如权利要求9所述的方法,其特征在于,第一激光是绿光激光。
33.如权利要求10所述的方法,其特征在于,第一激光是绿光激光。
34.如权利要求11所述的方法,其特征在于,第一激光是绿光激光。
35.如权利要求12所述的方法,其特征在于,第一激光是绿光激光。
36.如权利要求13所述的方法,其特征在于,第一激光是绿光激光。
37.如权利要求2所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
38.如权利要求3所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
39.如权利要求4所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
40.如权利要求5所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
41.如权利要求6所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
42.如权利要求7所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
43.如权利要求8所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
44.如权利要求9所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
45.如权利要求10所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
46.如权利要求11所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
47.如权利要求12所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
48.如权利要求13所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
49.如权利要求14所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
50.如权利要求15所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
51.如权利要求16所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
52.如权利要求17所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
53.如权利要求18所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
54.如权利要求19所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
55.如权利要求20所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
56.如权利要求21所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
57.如权利要求22所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
58.如权利要求23所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
59.如权利要求24所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
60.如权利要求25所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
61.如权利要求26所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
62.如权利要求27所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
63.如权利要求28所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
64.如权利要求29所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
65.如权利要求30所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
66.如权利要求31所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
67.如权利要求32所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
68.如权利要求33所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
69.如权利要求34所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
70.如权利要求35所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
71.如权利要求36所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
72.如权利要求2所述的方法,其特征在于,第二激光是红外激光。
73.如权利要求3所述的方法,其特征在于,第二激光是红外激光。
74.如权利要求4所述的方法,其特征在于,第二激光是红外激光。
75.如权利要求5所述的方法,其特征在于,第二激光是红外激光。
76.如权利要求6所述的方法,其特征在于,第二激光是红外激光。
77.如权利要求7所述的方法,其特征在于,第二激光是红外激光。
78.如权利要求8所述的方法,其特征在于,第二激光是红外激光。
79.如权利要求9所述的方法,其特征在于,第二激光是红外激光。
80.如权利要求10所述的方法,其特征在于,第二激光是红外激光。
81.如权利要求11所述的方法,其特征在于,第二激光是红外激光。
82.如权利要求12所述的方法,其特征在于,第二激光是红外激光。
83.如权利要求13所述的方法,其特征在于,第二激光是红外激光。
84.如权利要求14所述的方法,其特征在于,第二激光是红外激光。
85.如权利要求15所述的方法,其特征在于,第二激光是红外激光。
86.如权利要求16所述的方法,其特征在于,第二激光是红外激光。
87.如权利要求17所述的方法,其特征在于,第二激光是红外激光。
88.如权利要求18所述的方法,其特征在于,第二激光是红外激光。
89.如权利要求19所述的方法,其特征在于,第二激光是红外激光。
90.如权利要求20所述的方法,其特征在于,第二激光是红外激光。
91.如权利要求21所述的方法,其特征在于,第二激光是红外激光。
92.如权利要求22所述的方法,其特征在于,第二激光是红外激光。
93.如权利要求23所述的方法,其特征在于,第二激光是红外激光。
94.如权利要求24所述的方法,其特征在于,第二激光是红外激光。
95.如权利要求25所述的方法,其特征在于,第二激光是红外激光。
96.如权利要求26所述的方法,其特征在于,第二激光是红外激光。
97.如权利要求27所述的方法,其特征在于,第二激光是红外激光。
98.如权利要求28所述的方法,其特征在于,第二激光是红外激光。
99.如权利要求29所述的方法,其特征在于,第二激光是红外激光。
100.如权利要求30所述的方法,其特征在于,第二激光是红外激光。
101.如权利要求31所述的方法,其特征在于,第二激光是红外激光。
102.如权利要求32所述的方法,其特征在于,第二激光是红外激光。
103.如权利要求33所述的方法,其特征在于,第二激光是红外激光。
104.如权利要求34所述的方法,其特征在于,第二激光是红外激光。
105.如权利要求35所述的方法,其特征在于,第二激光是红外激光。
106.如权利要求36所述的方法,其特征在于,第二激光是红外激光。
107.如权利要求37所述的方法,其特征在于,第二激光是红外激光。
108.如权利要求38所述的方法,其特征在于,第二激光是红外激光。
109.如权利要求39所述的方法,其特征在于,第二激光是红外激光。
110.如权利要求40所述的方法,其特征在于,第二激光是红外激光。
111.如权利要求41所述的方法,其特征在于,第二激光是红外激光。
112.如权利要求42所述的方法,其特征在于,第二激光是红外激光。
113.如权利要求43所述的方法,其特征在于,第二激光是红外激光。
114.如权利要求44所述的方法,其特征在于,第二激光是红外激光。
115.如权利要求45所述的方法,其特征在于,第二激光是红外激光。
116.如权利要求46所述的方法,其特征在于,第二激光是红外激光。
117.如权利要求47所述的方法,其特征在于,第二激光是红外激光。
118.如权利要求48所述的方法,其特征在于,第二激光是红外激光。
119.如权利要求49所述的方法,其特征在于,第二激光是红外激光。
120.如权利要求50所述的方法,其特征在于,第二激光是红外激光。
121.如权利要求51所述的方法,其特征在于,第二激光是红外激光。
122.如权利要求52所述的方法,其特征在于,第二激光是红外激光。
123.如权利要求53所述的方法,其特征在于,第二激光是红外激光。
124.如权利要求54所述的方法,其特征在于,第二激光是红外激光。
125.如权利要求55所述的方法,其特征在于,第二激光是红外激光。
126.如权利要求56所述的方法,其特征在于,第二激光是红外激光。
127.如权利要求57所述的方法,其特征在于,第二激光是红外激光。
128.如权利要求58所述的方法,其特征在于,第二激光是红外激光。
129.如权利要求59所述的方法,其特征在于,第二激光是红外激光。
130.如权利要求60所述的方法,其特征在于,第二激光是红外激光。
131.如权利要求61所述的方法,其特征在于,第二激光是红外激光。
132.如权利要求62所述的方法,其特征在于,第二激光是红外激光
133.如权利要求63所述的方法,其特征在于,第二激光是红外激光。
134.如权利要求64所述的方法,其特征在于,第二激光是红外激光。
135.如权利要求65所述的方法,其特征在于,第二激光是红外激光。
136.如权利要求66所述的方法,其特征在于,第二激光是红外激光。
137.如权利要求67所述的方法,其特征在于,第二激光是红外激光。
138.如权利要求68所述的方法,其特征在于,第二激光是红外激光。
139.如权利要求69所述的方法,其特征在于,第二激光是红外激光。
140.如权利要求70所述的方法,其特征在于,第二激光是红外激光。
141.如权利要求71所述的方法,其特征在于,第二激光是红外激光。
142.如权利要求2至141中任意一项所述的方法,其特征在于,在修饰表面的附近将第二基板接合到第一基板。
143.如权利要求2至141中任意一项所述的方法,其特征在于,在暴露于第一激光区域的附近,红外激光熔化第一基板,并选择性地熔化第二基板。
144.如权利要求2-141之一所述的方法,其特征在于,在第一基板先前暴露于第一激光的区域,第一基板和第二基板相互混合。
145.如权利要求2-141之一所述的方法,其特征在于,由第一激光接触的第一基板的部分在待接合特征的周围确定一条线。
146.如权利要求2-141之一所述的方法,其特征在于,由第一激光接触的第一基板的部分在待接合特征的周围确定至少两条线。
147.如权利要求2-141之一所述的方法,其特征在于,由第一激光接触的第一基板的部分与待接合特征的距离为0.05um、0.075um、0.1um、0.2um、0.5um、1um、2.5um、5um或10um。
148.如权利要求2-141之一所述的方法,其特征在于,由第一激光接触的第一基板的部分与待接合特征的距离为100um、75um、50um、25um、10um、5um、2.5um、1um或0.5um。
149.如权利要求2-141之一之一所述的方法,其特征在于,第一激光可以在第一基板的表面上产生一条连续的线。
150.如前权利要求2-141之一之一所述的方法,其特征在于,第一激光产生一系列直径介于0.1um到10um之间,间隔介于0.1um到10um之间的不连续的图案。
151.如项权利要求2-141之一之一所述的方法,其特征在于,第一激光在第一基板的表面确定了圆形图案、正方形图案、六边形图案、三角形图案或椭圆图案。
152.一种接合第一基板和第二基板的方法,包括:
(a)在第一基板的表面上布置第一图案,该第一图案可以通过以下任意一个方式形成:
(i)注塑成型,或
(ii)热压成型,或
(iii)研磨,或
(iv)挤压,或
(v)分散;
(b)在第一基板的表面上布置第二图案,该第二图案可以通过以下任意一个方式形成:
(i)将第一基板暴露于具有第一波长的激光中,或
(ii)使用颜料组合来印刷图案,或
(iii)使用划线器来划线;
(c)将第二基板与有图案的基板相接触;
(d)将与第二基板相接触的具有图案的第一基板在第一图案附近暴露于超声能量中,其中在基板上存在的第一图案吸收超声能量,导致基板的局部熔化,因此,在第一图案附近接合了第一和第二基板;
(e)将与第二基板相接触的具有图案的第一基板暴露于具有第二波长的,不同于第一波长的,激光束中,其中存在的第二图案吸收了第二波长的激光能量,导致在第一图案的附近加热和熔化第一基板;
其中,第一基板包括一种微尺度特征,其特征在于,能量导向在特征的周边的第一部分的附近。
153.一种接合第一基板和第二基板的方法,包括:
(a)在第一基板的表面的第一部分提供一个结构,该结构作为能量导向;
(b)用具有第一波长的激光辐射第一基板的相同表面的第二部分;
(c)用第二基板与第一基板有图案的表面相接触;
(d)将超声辐射应用于处在第一基板上的能量导向附近的第二基板的表面;
(e)用具有第二波长的不同于第一波长的激光辐射与第二基板相接触的第一基板的先前被辐射部分;
其中,第一基板包括一种微尺度特征,其特征在于,能量导向在微尺度特征的周边的第一部分的附近。
154.如权利要求152所述的方法,其特征在于,超声能量在第一基板上的能量导向的附近的第二基板上的应用被用于接合第一基板和第二基板。
155.如权利要求153所述的方法,其特征在于,超声能量在第一基板上的能量导向的附近的第二基板上的应用被用于接合第一基板和第二基板。
156.如权利要求152所述的方法,其特征在于,暴露于第一激光中的第一基板的部分在特征周边的第二部分的附近。
157.如权利要求152所述的方法,其特征在于,第一基板的表面暴露于修饰其表面的激光中,使得该表面对第二激光敏感。
158.如权利要求153所述的方法,其特征在于,第一基板的表面暴露于修饰其表面的激光中,使得该表面对第二激光敏感。
159.如权利要求154所述的方法,其特征在于,第一基板的表面暴露于修饰其表面的激光中,使得该表面对第二激光敏感。
160.如权利要求155所述的方法,其特征在于,第一基板的表面暴露于修饰其表面的激光中,使得该表面对第二激光敏感。
161.如权利要求156所述的方法,其特征在于,第一基板的表面暴露于修饰其表面的激光中,使得该表面对第二激光敏感。
162.如权利要求152所述的方法,其特征在于,第一激光的波长介于238nm和532nm之间。
163.权利要求153所述的方法,其特征在于,第一激光的波长介于238nm和532nm之间。
164.权利要求154所述的方法,其特征在于,第一激光的波长介于238nm和532nm之间。
165.权利要求155所述的方法,其特征在于,第一激光的波长介于238nm和532nm之间。
166.权利要求156所述的方法,其特征在于,第一激光的波长介于238nm和532nm之间。
167.如权利要求152-166之一所述的方法,其特征在于,第一激光是紫外激光。
168.如权利要求152-166中任意一项所述的方法,其特征在于,第二激光的波长介于700nm和1540nm之间。
169.如权利要求152-166中任意一项所述的方法,其特征在于,第二激光是红外激光。
170.如权利要求152-166中任意一项所述的方法,其特征在于,在修饰的表面附近,将第二基板接合到第一基板。
171.如权利要求152-166中任意一项所述的方法,其特征在于,在暴露于第一激光的区域附近,红外激光使得第一基板熔化,并且选择性地熔化第二基板。
172.如权利要求152-166所述的方法,其特征在于,在先前暴露于第一激光中的第一基板的区域,第一基板和第二基板相互混合。
173.如权利要求152-166中任意一项所述的方法,其特征在于,由第一激光接触到的第一基板的部分在待接合特征的周围确定了一条线。
174.如权利要求152-166中任意一项所述的方法,其特征在于,由第一激光接触到的第一基板的部分在待接合特征的周围确定了至少两条线。
175.如权利要求152-166中任意一项所述的方法,其特征在于,由第一激光接触的第一基板的部分与待接合特征的距离为0.05um、0.075um、0.1um、0.2um、0.5um、1um、2.5um、5um或10um。
176.如权利要求152-166中任意一项所述的方法,其特征在于,由第一激光接触的第一基板的部分与待接合特征的距离为100um、75um、50um、25um、10um、5um、2.5um、1um或0.5um。
177.如权利要求152-166中任意一项所述的方法,其特征在于,第一激光在第一基板的表面产生了一条连续的线。
178.如权利要求152-166中任意一项所述的方法,其特征在于,第一激光产生一系列直径介于0.1um到10um之间,间距介于0.1um到10um之间的不连续的图案。
179.如权利要求152-166中任意一项所述的方法,其特征在于,第一激光在第一基板的表面确定圆形图案、正方形图案、六边形图案、三角形图案或椭圆图案。
180.如权利要求152-166之一所述的方法,其特征在于,第一基板和第二基板在没有任何外部施加力的作用下,可以通过激光焊接接合。
181.如权利要求152-166中所述的方法,其特征在于,该特征包括一个凹槽、一个通道、一个洞、一个孔、一个通风口或者一个通路。
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