CN104241399A - 一种点接触型二极管 - Google Patents

一种点接触型二极管 Download PDF

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Publication number
CN104241399A
CN104241399A CN201410532986.7A CN201410532986A CN104241399A CN 104241399 A CN104241399 A CN 104241399A CN 201410532986 A CN201410532986 A CN 201410532986A CN 104241399 A CN104241399 A CN 104241399A
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Prior art keywords
junction
point
wafer
diode
contact diode
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CN201410532986.7A
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夏洪贵
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1203Rectifying Diode
    • H01L2924/12036PN diode

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

本发明涉及一种点接触型二极管,包括方形外壳,所述方形外壳两端分别设置有阳极引线、阴极引线,所述阳极引线上设置有支架,所述支架上表面设置有PN结,所述PN结上固定有晶片,所述晶片通过触丝与阴极引线连接。本发明结构简单、易封装、制造成本低廉,所承载的整流电流、反响电压较大,不易被击穿。

Description

一种点接触型二极管
技术领域
本发明涉及一种半导体器件,尤其涉及一种点接触型二极管。
背景技术
二极管又称晶体二极管,简称二极管(diode),另外,还有早期的真空电子二极管;它是一种具有单向传导电流的电子器件。在半导体二极管内部有一个PN结两个引线端子,这种电子器件按照外加电压的方向,具备单向电流的转导性。一般来讲,晶体二极管是一个由p型半导体和n型半导体烧结形成的p-n结界面。在其界面的两侧形成空间电荷层,构成自建电场。当外加电压等于零时,由于p-n结两边载流子的浓度差引起扩散电流和由自建电场引起的漂移电流相等而处于电平衡状态,这也是常态下的二极管特性。
目前,二极管制造技术已经相当成熟,但仍然存在结构复杂、成本高、封装难、容易被击穿等问题。
发明内容
本发明所要解决的技术问题是提供一种结构简单、易封装、制造成本低廉,所承载的整流电流、反响电压较大,不易被击穿的点接触型二极管。
本发明解决上述技术问题的技术方案如下:一种点接触型二极管,包括方形外壳,所述方形外壳两端分别设置有阳极引线、阴极引线,所述阳极引线上设置有支架,所述支架上表面设置有PN结,所述PN结上固定有晶片,所述晶片通过触丝与阴极引线连接。
半导体二极管是一个由p型半导体和n型半导体烧结形成的PN结界面。在其界面的两侧形成空间电荷层,构成自建电场。当外加电压等于零时,由于PN结两边载流子的浓度差引起扩散电流和由自建电场引起的漂移电流相等而处于电平衡状态,所述支架与PN结导通用于载流子的传输,所述触丝用于晶片与阴极引线之间的导通。
在上述技术方案的基础上,本发明还可以做如下改进。
进一步,所述方形外壳为金属外壳,所述二极管PN结自建电场极容易受到外界温度、湿度、干扰信号的影响,所述金属外壳可以有效屏蔽外界干扰信号,以及其他影响因素,保证二极管的正常工作。
进一步,所述阳极引线、阴极引线为银丝引线,所述银丝引线电阻小、导电性好,有利于载流子的传输,从而增大整流电流。
进一步,所述晶片为硅晶片,所述硅晶片可通过掺杂改变其导电性,以此来控制二极管的整流电流大小。
进一步,所述晶片与PN结欧姆接触,用于自建电场的建立,以及反向电压的截止。
本发明的有益效果是:结构简单、易封装、制造成本低廉,所承载的整流电流、反响电压较大,不易被击穿。
附图说明
图1为本发明一种点接触型二极管结构示意图;
附图中,各标号所代表的部件列表如下:1、阴极引线,2、方形外壳,3、晶片,4、PN结,5、支架,6阳极引线,7、触丝。
具体实施方式
以下结合附图对本发明的原理和特征进行描述,所举实例只用于解释本发明,并非用于限定本发明的范围。
如图1所示,一种点接触型二极管,包括方形外壳2,所述方形外壳2两端分别设置有阳极引线6、阴极引线1,所述阳极引线6上设置有支架5,所述支架5上表面设置有PN结4,所述PN结4上固定有晶片3,所述晶片3通过触丝7与阴极引线1连接。
半导体二极管是一个由p型半导体和n型半导体烧结形成的PN结4界面。在其界面的两侧形成空间电荷层,构成自建电场。当外加电压等于零时,由于PN结4两边载流子的浓度差引起扩散电流和由自建电场引起的漂移电流相等而处于电平衡状态,所述支架与PN结4导通用于载流子的传输,所述触丝7用于晶片3与阴极引线1之间的导通。
所述方形外壳2为金属外壳,所述二极管PN结4自建电场极容易受到外界温度、湿度、干扰信号的影响,所述金属外壳1可以有效屏蔽外界干扰信号,以及其他影响因素,保证二极管的正常工作;所述阳极引线6、阴极引线1为银丝引线,所述银丝引线电阻小、导电性好,有利于载流子的传输,从而增大整流电流;所述晶片3为硅晶片,所述硅晶片可通过掺杂改变其导电性,以此来控制二极管的整流电流大小;所述晶片3与PN结4欧姆接触,用于自建电场的建立,以及反向电压的截止。
以上所述仅为本发明的较佳实施例,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。

Claims (5)

1.本发明涉及一种点接触型二极管,其特征在于,包括方形外壳,所述方形外壳两端分别设置有阳极引线、阴极引线,所述阳极引线上设置有支架,所述支架上表面设置有PN结,所述PN结上固定有晶片,所述晶片通过触丝与阴极引线连接。
2.根据权利要求1所述一种点接触型二极管,其特征在于,所述方形外壳为金属外壳。
3.根据权利要求1所述一种点接触型二极管,其特征在于,所述阳极引线、阴极引线为银丝引线。
4.根据权利要求1所述一种点接触型二极管,其特征在于,所述晶片为硅晶片。
5.根据权利要求1所述一种点接触型二极管,其特征在于,所述晶片与PN结欧姆接触。
CN201410532986.7A 2014-09-30 2014-09-30 一种点接触型二极管 Pending CN104241399A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105006491A (zh) * 2015-08-07 2015-10-28 南通明芯微电子有限公司 一种点接触型整流二极管

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105006491A (zh) * 2015-08-07 2015-10-28 南通明芯微电子有限公司 一种点接触型整流二极管

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Application publication date: 20141224