CN104241065A - Direct insertion type electronic element accommodating base - Google Patents
Direct insertion type electronic element accommodating base Download PDFInfo
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- CN104241065A CN104241065A CN201410376602.7A CN201410376602A CN104241065A CN 104241065 A CN104241065 A CN 104241065A CN 201410376602 A CN201410376602 A CN 201410376602A CN 104241065 A CN104241065 A CN 104241065A
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- pin
- pin insertion
- electronic component
- placement rack
- insertion groove
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Abstract
The invention discloses a direct insertion type electronic element accommodating base. The accommodating base comprises a base body and multiple pin insertion grooves, wherein the pin insertion grooves are formed in the base body, the space between the pin insertion grooves is determined according to the space between a direction insertion type electronic element and the column where the pin of the electronic element is located, and the depth of each pin insertion groove is determined according to the height of the pin of the direction insertion type electronic element. By the adoption of the direct insertion type electronic element accommodating base, during storage of samples or finished products of electronic elements, pins do not need to be deformed repeatedly, so that damage to the pins is avoided, and then the influence on later test caused by damage to the pins is eliminated.
Description
Technical field
The invention belongs to technical field of semiconductors, specifically, relate to a kind of direct insertion electronic component placement rack.
Background technology
Along with the development of semiconductor technology, sample after more and more encapsulation needs scanning electron microscopy (Scanning Electron Microscopy, SEM) chip overlay film Bonding situation is observed, with to the element not meeting element design originally produced, element makes the amendment of local line, the place of find problem and layout designs again.
In prior art, avoid light shield to waste owing to can shorten greatly the time, scanning electron microscopy SEM/ focused ion beam equipment (Focused Ion Beams, FIB) is conventional circuit mending instrument.For dual in-line package sample, Fig. 1 is the schematic diagram of dual in-line package sample in prior art, as shown in Figure 1, because dual in-line package sample pin is very high, the specimen holder that dual in-line package sample is deposited is not applicable to when present scanning electron microscopy SEM/ focused ion beam equipment FIB works, pin is broken curved with tweezers under normal circumstances, as shown in Figure 2, for pin break curved after dual in-line package sample schematic diagram; Again sample is fixed on SEM/FIB specimen holder, as shown in Figure 3, for pin break curved after the placement schematic diagram of dual in-line package sample on SEM/FIB specimen holder.To be observed by SEM again or FIB circuit mending is complete breaks directly with tweezers by pin again, as shown in Figure 4, for pin break straight after dual in-line package sample schematic diagram.Once pin is injured will affect later-period test result.
As can be seen here, in the process of circuit mending, pin needs at least twice physical deformation, therefore, is easy to be damaged to pin, once pin is injured will affect later-period test result.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of direct insertion electronic component placement rack, in order to avoid pin need not repeated deformation, eliminates the damage of pin, thus eliminates the injured impact on later stage test caused of pin.
In order to solve the problems of the technologies described above, the invention provides a kind of direct insertion electronic component placement rack, it comprises: pedestal, some pin insertion grooves, described pin insertion groove is opened on described pedestal, spacing between described pin insertion groove according to direct insertion electronic component and the column pitch at pin place determine, the degree of depth of described pin insertion groove is determined according to the height of pin of direct insertion electronic component.
Preferably, in one embodiment of this invention, described direct insertion electronic component is double is dual inline type electronic component.
Preferably, in one embodiment of this invention, the spacing specification between described pin insertion groove comprises multiple, with the multiple direct insertion electronic component that the column pitch can placing pin place is different.
Preferably, in one embodiment of this invention, the spacing between adjacent two described pin insertion grooves is 8mm, and the spacing between adjacent three described pin insertion grooves is 17mm.
Preferably, in one embodiment of this invention, the degree of depth of described pin insertion groove is 8mm.
Preferably, in one embodiment of this invention, the pin insertion groove that distance pedestal outer ledge second is near is arranged on apart from pedestal outer ledge 40mm place.
Preferably, in one embodiment of this invention, also comprise support column, be arranged on described base bottom.
Preferably, in one embodiment of this invention, bottom described support column to the distance of described pedestal upper surface be 16mm.
Compared with existing scheme, because placement rack comprises pedestal, some pin insertion grooves, described pin insertion groove is opened on described pedestal, spacing between described pin insertion groove according to direct insertion electronic component and the column pitch at pin place determine, the degree of depth of described pin insertion groove is determined according to the height of pin of direct insertion electronic component.When depositing sample or the finished product of electronic devices and components, pin need not repeated deformation, avoids the damage of pin, thus eliminates the injured impact on later stage test caused of pin.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of dual in-line package sample in prior art,
Fig. 2 be pin break curved after dual in-line package sample schematic diagram;
Fig. 3 be pin break curved after the placement schematic diagram of dual in-line package sample on SEM/FIB specimen holder.
Fig. 4 is that pin breaks the dual in-line package sample schematic diagram directly.
Fig. 5 is the structural representation of the embodiment of the present application one dual in-line package specimen holder;
Fig. 6 and Fig. 7 is respectively the schematic diagram placing small sample and large sample,
Fig. 8 is schematic diagram placement large sample being fixed to process.
Embodiment
Below in conjunction with accompanying drawing and preferred embodiment, technical scheme of the present invention is set forth in detail.Should be appreciated that, the embodiment below enumerated only for instruction and explanation of the present invention, and does not form the restriction to technical solution of the present invention.
In the following embodiment of the present invention, because placement rack comprises pedestal, some pin insertion grooves, described pin insertion groove is opened on described pedestal, spacing between described pin insertion groove according to direct insertion electronic component and the column pitch at pin place determine, the degree of depth of described pin insertion groove is determined according to the height of pin of direct insertion electronic component.When depositing sample or the finished product of electronic devices and components, pin need not repeated deformation, avoids the damage of pin, thus eliminates the injured impact on later stage test caused of pin.
the core concept of the application:
The direct insertion electronic component placement rack that the following embodiment of the application provides, its core concept is, comprise: pedestal, some pin insertion grooves, described pin insertion groove is opened on described pedestal, spacing between described pin insertion groove according to direct insertion electronic component and the column pitch at pin place determine, the degree of depth of described pin insertion groove is determined according to the height of pin of direct insertion electronic component.
It should be noted that, the following embodiment of the application is with when using SEM/FIB to carry out circuit mending, placing dual in-line package sample is example, but, one of ordinary skill in the art will appreciate that, processing sample, the sample of in fact arbitrary electronic component or finished product can apply the above-mentioned core concept of the application, repeat no more in detail.
It should be noted that, the size of relevant sample seat is not particularly limited, and those of ordinary skill in the art can be arranged flexibly according to the product size of reality.
Fig. 5 is the structural representation of the embodiment of the present application one dual in-line package specimen holder; As shown in Figure 5, the present embodiment is described from the angle of specimen holder sectional structure, specimen holder comprises: pedestal 501, some pin insertion grooves 502, described pin insertion groove 502 is opened on described pedestal 501, spacing between described pin insertion groove 502 according to dual in-line package sample and the column pitch at pin place determine, the degree of depth of described pin insertion groove 502 is determined according to dual in-line package sample height of pin.
In the present embodiment, the spacing between adjacent two described pin insertion grooves 502 is 8mm, and the spacing between adjacent three described pin insertion grooves 502 is 17mm.The degree of depth of described pin insertion groove 502 is 8mm.The pin insertion groove 502 near apart from pedestal outer ledge second is arranged on apart from pedestal 501 outer ledge 40mm place.
In the present embodiment, specimen holder also comprises support column 503, and this support column 503 is arranged on bottom described pedestal 501.Preferably, bottom described support column 503 to the distance of described pedestal 501 upper surface be 16mm.
In the present embodiment, in order to be placed on same sample seat by the dual inline type electronic component sample of different size, the column pitch with reference to pin place is different, the spacing between the pin insertion groove being provided with plurality of specifications targetedly.
Fig. 6 and Fig. 7 is respectively the schematic diagram placing small sample and large sample, as shown in Figure 6, for small sample 600, is such as directly placed on two adjacent pin insertion grooves 502, and for large sample 700, may horizontal money three two pin insertion grooves 502.
Fig. 8 is schematic diagram placement large sample being fixed to process; As shown in Figure 8, coat a small amount of elargol 504 at large sample 700 edge, take off sample at needs, elargol washes by available acetone.
It should be noted that, be also can carry out the process shown in Fig. 8 at placement small sample.
Above-mentioned explanation illustrate and describes some preferred embodiments of the present invention, but as previously mentioned, be to be understood that the present invention is not limited to the form disclosed by this paper, should not regard the eliminating to other embodiments as, and can be used for other combinations various, amendment and environment, and can in invention contemplated scope described herein, changed by the technology of above-mentioned instruction or association area or knowledge.And the change that those skilled in the art carry out and change do not depart from the spirit and scope of the present invention, then all should in the protection range of claims of the present invention.
Claims (8)
1. a direct insertion electronic component placement rack, it is characterized in that, comprise: pedestal, some pin insertion grooves, described pin insertion groove is opened on described pedestal, spacing between described pin insertion groove according to direct insertion electronic component and the column pitch at pin place determine, the degree of depth of described pin insertion groove is determined according to the height of pin of direct insertion electronic component.
2. placement rack according to claim 1, is characterized in that, described direct insertion electronic component is double is dual inline type electronic component.
3. placement rack according to claim 1, is characterized in that, the spacing specification between described pin insertion groove comprises multiple, with the multiple direct insertion electronic component that the column pitch can placing pin place is different.
4. placement rack according to claim 1, is characterized in that, the spacing between adjacent two described pin insertion grooves is 8mm, and the spacing between adjacent three described pin insertion grooves is 17mm.
5. placement rack according to claim 1, is characterized in that, the degree of depth of described pin insertion groove is 8mm.
6. placement rack according to claim 1, is characterized in that, the pin insertion groove near apart from pedestal outer ledge second is arranged on apart from pedestal outer ledge 40mm place.
7. the placement rack described arbitrarily according to claim 1-6, is characterized in that, also comprise support column, be arranged on described base bottom.
8. placement rack according to claim 7, is characterized in that, bottom described support column to the distance of described pedestal upper surface be 16mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410376602.7A CN104241065A (en) | 2014-08-01 | 2014-08-01 | Direct insertion type electronic element accommodating base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410376602.7A CN104241065A (en) | 2014-08-01 | 2014-08-01 | Direct insertion type electronic element accommodating base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104241065A true CN104241065A (en) | 2014-12-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410376602.7A Pending CN104241065A (en) | 2014-08-01 | 2014-08-01 | Direct insertion type electronic element accommodating base |
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| CN (1) | CN104241065A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3665952B2 (en) * | 1999-08-23 | 2005-06-29 | 日本航空電子工業株式会社 | ZIF socket connector |
| CN201548448U (en) * | 2009-10-20 | 2010-08-11 | 中芯国际集成电路制造(上海)有限公司 | Chip fixing structure |
| CN102608362A (en) * | 2012-03-14 | 2012-07-25 | 上海华力微电子有限公司 | Universal fixing clamp for tests |
-
2014
- 2014-08-01 CN CN201410376602.7A patent/CN104241065A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3665952B2 (en) * | 1999-08-23 | 2005-06-29 | 日本航空電子工業株式会社 | ZIF socket connector |
| CN201548448U (en) * | 2009-10-20 | 2010-08-11 | 中芯国际集成电路制造(上海)有限公司 | Chip fixing structure |
| CN102608362A (en) * | 2012-03-14 | 2012-07-25 | 上海华力微电子有限公司 | Universal fixing clamp for tests |
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Application publication date: 20141224 |