CN104237569B - Floating gauge head and the test equipment using this floating gauge head - Google Patents
Floating gauge head and the test equipment using this floating gauge head Download PDFInfo
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- CN104237569B CN104237569B CN201310233489.2A CN201310233489A CN104237569B CN 104237569 B CN104237569 B CN 104237569B CN 201310233489 A CN201310233489 A CN 201310233489A CN 104237569 B CN104237569 B CN 104237569B
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- gauge head
- semiconductor element
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Abstract
The invention provides a kind of floating gauge head and the test equipment using this floating gauge head.This floating gauge head includes：One top board, a clamping plate, a gas seal member, a base plate, multiple elastic recovery device and a support plate.Top board has the passage to a pulsometer for the connection, and passage has the through hole running through top board bottom.Clamping plate is connected to top board bottom, has a storage tank of corresponding through hole.Gas seal member is located in storage tank, has a perforation being connected with through hole, and gas seal member defines an airtight space including passage, through hole and storage tank, so that airtight space is produced in longitudinal pressure buffer effect by the effect of pulsometer.Base plate is connected to clamping plate bottom, and multiple elastic recovery device is located between base plate and clamping plate, in order to allow horizontal off normal between base plate and clamping plate.Support plate is connected to base plate, and support plate bottom is provided with to draw multiple suction nozzles of a strip semiconductor element.
Description
Technical field
The present invention is the test equipment with regard to a kind of floating gauge head and using this floating gauge head, and espespecially one kind is applied to absorption
The floating gauge head of strip semiconductor element and the test equipment using this floating gauge head.
Background technology
Current product line chip testing product, all based on single test, and must be converted into expects pipe (tube) before test
Or charging tray (tray) mode feeds, cause many one procedure, and the time tested and flow process also long.In addition, making expects pipe
Or during charging tray conversion, easily cause and get stuck, and expects pipe must be bought or charging tray is changed.General chip is not yet processed into single
It is in strip semiconductor element (strip) state before chip, strip semiconductor element arranges uncut multiple semiconductor core
Piece, now, if directly tested to this strip semiconductor element, such as electrically, the test such as temperature, can reduce one section of expects pipe or
The converting process of charging tray, is greatly improved the output capacity of semiconductor chip.
But strip semiconductor element length is longer, area is big and thickness of thin, therefore itself deflection are larger, if made
Push absorption strip semiconductor element with traditional gauge head when being tested, it will have two problems to produce, one be gauge head longitudinally
The power pushing absorption strip semiconductor element is difficult to control, and easily weighs strip semiconductor element wounded when pushing；Its two be bar
If there are deformation condition, general gauge head pushes without being directed at strip semiconductor element shape semiconductor element itself, also easily
Infringement strip semiconductor element.
Therefore, inventor, in line with the spirit of positive invention, urgently thinks a kind of floating gauge head that can solve the above problems and makes
With the test equipment of this floating gauge head, several times research experiment is eventually to completing the present invention.
Content of the invention
The main object of the present invention is in a kind of floating gauge head of offer, has the buffering of vapour-pressure type damping in the vertical,
And there are multiple elastic recovery devices in the horizontal to allow horizontal off normal, therefore floating gauge head is pushing absorption strip half
During conductor element, can have longitudinal buffer, horizontal rapid-aligning mechanism, it is to avoid damage strip when floating gauge head pushes and partly lead simultaneously
Volume elements part.
A kind of present invention floating gauge head, includes：One top board, a clamping plate, a gas seal member, a base plate, multiple elastic recovery
Device and a support plate.Top board has the passage to a pulsometer for the connection, and passage has the through hole running through top board bottom.
Clamping plate is connected to top board bottom, has a storage tank of corresponding through hole.Gas seal member is located in storage tank, and has one and through hole
The perforation being connected, gas seal member defines an airtight space including passage, through hole, perforation and storage tank, by pulsometer
Effect make airtight space produce in longitudinal pressure buffer effect.Base plate is connected to clamping plate bottom, and multiple elastic recovery dress
Put and be located between base plate and clamping plate, in order to allow horizontal off normal between base plate and clamping plate.Support plate is connected to base plate, and the bottom of support plate
Portion is provided with to draw multiple suction nozzles of a strip semiconductor element.
As described above, the floating gauge head of the present invention, there is the buffering of vapour-pressure type damping in the vertical, and have in the horizontal
There are multiple elastic recovery devices to allow horizontal off normal, therefore floating gauge head, can when pushing absorption strip semiconductor element
There is longitudinal buffer, horizontal rapid-aligning mechanism simultaneously, it is to avoid when floating gauge head pushes, damage strip semiconductor element.
Aforesaid gas seal member can be a cylinder of cincture soft materials, and soft materials can be rubber or other tool phases
Material with effect.Additionally, above-mentioned soft materials can be pressed against the side wall of storage tank, so that the pneumatic supply of pulsometer will not leak
To produce airtight effect.In addition, aforesaid clamping plate can be bolted to top board by multiple, and one between top board and clamping plate, can be reserved
Gap, so that vapour-pressure type damping is able to generation effect.
Above-mentioned elastic recovery device can also include：One have the disk body of a groove, one be located in the spheroid of groove with
And a spring.In addition, groove can become one coniform, and spheroid elasticity can be resisted against coniform top.Additionally, spheroid and spring
Between can also be folded with a pad.In addition, disk body can correspond to elasticity being resisted against in a groove of clamping plate.
That is, when elongated strip semiconductor element itself is if there are flexure or out-of-flatness phenomenon, floating gauge head is originally
Body may be allowed to off normal transversely coordinating strip semiconductor element, is unlikely to para-position inaccurate and produce and weigh strip quasiconductor wounded
The situation of element.It act as, when floating gauge head pushes absorption strip semiconductor element, if because core between clamping plate and base plate
Piece flexure or out-of-flatness and produce horizontal skew, now spheroid can compress spring toward top offset to allow the horizontal stroke of clamping plate and base plate
To off normal, when floating gauge head is drawn and moved on strip semiconductor element, spheroid, because being located in the cone shape relation of disk body, passes through
The contact of spring is returned to original position, and so that base plate is resetted.
In addition, the present invention can also include a ball bearing group being located between clamping plate and base plate, in order to allow base plate in clamping plate
Sliding in plane.Above-mentioned ball bearing group can have a body and two ball bearings, and body can have a screw, sheathed
Portion and a supporting part.Two ball bearings can be divided into the upper and lower end face of a block holding part of base plate, and is worn by the sleeved part of body
Enter the one of base plate to bore a hole and be resisted against clamping plate, supporting part may be used to carry the ball bearing below block holding part, then passes through screw pair
The perforate on clamping plate is answered to carry out locking fixation, so as to connecting bottom board and clamping plate.
In addition, the present invention can also include a heating plate being arranged on support plate, in order to heat support plate.Additionally, multiple support columns
Can be located between base plate and heating plate.Additionally, the present invention can also include a position sensor, it is arranged on clamping plate, in order to sense
Top board and the spacing of clamping plate.
There are inside aforementioned support plate multiple passages be connected between a vacuum pump and multiple suction nozzle, in order to produce suction source.This
Outward, above-mentioned support plate can also include multiple fasteners, in order to be fastened on multiple buckling parts of base plate, to connect support plate and base plate.
Additionally, support plate can also include multiple location holes, the purposes positioning when pushing for the gauge head that floats.In addition, the present invention can also wrap
Include a keyset and be fixedly arranged on top board, so that floating gauge head may be connected to other test equipments.
The test equipment with floating gauge head of the present invention, may be used to test a strip semiconductor element, includes：One floats
Dynamic gauge head, a charging/discharging device and a test device.
Above-mentioned floating gauge head is fixedly arranged on a pedestal, and its structure is identical with aforesaid floating gauge head, therefore no longer superfluous
State.Charging/discharging device includes an in-material seat, a pan feeding fetching device, a discharging set and a discharging fetching device, in order to bar
Shape semiconductor element carries out pan feeding and the transfer of discharging is transported.And test device is fixedly arranged on pedestal, in order to strip quasiconductor
Element is tested.
Aforesaid pan feeding fetching device the pan feeding of longitudinal direction and transverse shifting can draw platform for one, in order to draw and transfer
The strip semiconductor element of in-material seat.Additionally, above-mentioned discharging fetching device be alternatively one can longitudinal direction and transverse shifting discharging
Draw platform, survey the strip semiconductor element finished to discharging set in order to draw simultaneously transfer.
In addition, this test equipment can also include an image detection device, it is fixedly arranged on pedestal, in order to detect strip quasiconductor
The bar code of element.Additionally, a shifting carrying platform can be fixedly provided with aforesaid pedestal, in order to by the strip of pan feeding fetching device partly
Conductor element is transported to test device.
Above-mentioned test device may include a lifting platform, a test bench and is fixedly arranged on the slide rail of lifting platform, floats and surveys
Head can be fixedly arranged on slide rail, is tested to test bench in order to draw strip semiconductor element.
This test equipment can also include an output stage and be fixedly arranged on pedestal, in order to move surveying the strip semiconductor element finished
It is loaded onto discharging fetching device.In addition, at least one heating platform can be fixedly provided with aforesaid pedestal, in order to heat strip quasiconductor
Element.
Brief description
Fig. 1 is the explosive view of floating gauge head one preferred embodiment of the present invention.
Fig. 2 is the axonometric chart of floating gauge head one preferred embodiment of the present invention.
Fig. 3 is the side cutaway view of floating gauge head one preferred embodiment of the present invention.
Fig. 4 is the explosive view with elastic recovery device for the ball bearing group of floating gauge head one preferred embodiment of the present invention.
Fig. 5 is the sectional view of the elastic recovery device of floating gauge head one preferred embodiment of the present invention.
Fig. 6 is the local A cutaway view Amplified image of the elastic recovery device of floating gauge head one preferred embodiment of the present invention.
Fig. 7 is the whole machine axonometric chart of test equipment one preferred embodiment of the present invention.
Fig. 8 is the partial enlarged drawing of test equipment one preferred embodiment of the present invention.
Fig. 9 is the test device axonometric chart of test equipment one preferred embodiment of the present invention.
Figure 10 is the test device side view of test equipment one preferred embodiment of the present invention.
【Symbol description】
Specific embodiment
As shown in Figure 1, Figure 2 and shown in Fig. 3, be the explosive view of floating gauge head one preferred embodiment of the present invention, axonometric chart and
Side cutaway view.Floating gauge head 1 as depicted, includes：One top board 11, a clamping plate 12, two gas seal members 13, a base plate 14,
Multiple elastic recovery devices 15, a support plate 16, two ball bearing groups 17, a keyset 18, a heating plate 19, two position sensors
124 and four support columns 191.
Top board 11 has the passage 111 to a pulsometer 90 for the connection, and passage 111 has and runs through the two of top board 11 bottom
Through hole 112.Keyset 18 is fixedly arranged on top board 11, so that floating gauge head 1 may be connected to associated test devices.
Clamping plate 12 is connected to top board 11 bottom by four bolts 122, and clamping plate 12 simultaneously has the two of corresponding two through holes 112 and houses
A gap is reserved between groove 121, and top board 11 and clamping plate 12.Additionally, the position sensor 124 of the present embodiment, it is arranged at clamping plate 12
On, in order to sense the spacing of top board 11 and clamping plate 12.
In addition, two gas seal members 13 of the present embodiment are respectively located in two storage tanks 121, each gas seal member 13 have one with every
The perforation 131 that one through hole 112 is connected, each gas seal member 13 define one include passage 111, through hole 112, perforation 131 and
The airtight space 132 of two storage tanks 121, makes airtight space 132 result from longitudinal pressure buffer by the effect of pulsometer 90
Effect.Additionally, the gas seal member 13 of the present embodiment is a cylinder of a cincture rubber 133, and rubber 133 is pressed against storage tank 121
Side wall so that the pneumatic supply of pulsometer 90 will not leak to produce airtight effect.
In addition, the base plate 14 of the present embodiment is connected to clamping plate 12 bottom, and multiple elastic recovery device 15 is in the present embodiment
Quantity is four, is located between base plate 14 and clamping plate 12, in order to allow horizontal off normal between base plate 14 and clamping plate 12.
The support plate 16 of the present embodiment is connected to base plate 14, and the bottom of support plate 16 is provided with to draw a strip semiconductor element
Multiple suction nozzles 161 of part 92.In addition, have inside support plate 16 multiple passages 162 be connected in a vacuum pump (not shown) and
Between multiple suction nozzles 161, in order to produce suction source, so that a strip semiconductor element 92 can be drawn.In addition, the support plate 16 of the present embodiment wraps
Four fasteners 163 are included, in order to be fastened on four buckling parts 143 of base plate 14, to connect support plate 16 and base plate 14, so that support plate 16 can
Elasticity is replaced.Additionally, the support plate 16 of the present embodiment includes two location holes 164, the use positioning when pushing for the gauge head 1 that floats
On the way.
In addition, in heating plate 19 setting and support plate 16 of the present embodiment, in order to heat support plate 16.Additionally, the present embodiment tool
Four support columns 191 are had to be located between base plate 14 and heating plate 19.
Please continue to refer to Fig. 4, it is ball bearing group and the elastic recovery device of floating gauge head one preferred embodiment of the present invention
Explosive view, and see also Fig. 3.The two ball bearing groups 17 of the present embodiment are located between clamping plate 12 and base plate 14, in order to
Allow sliding in clamping plate 12 plane for the base plate 14.Each ball bearing group 17 has a body 171 and two ball bearings 172,
Body 171 can have a screw 171a, sleeved part 171b and a supporting part 171c.Two ball bearings 172 are divided into base plate
The upper and lower end face of 14 block holding part 141, and by sleeved part 171c of body 171 penetrate base plate 14 one perforation 142 and against
In clamping plate 12, supporting part 171c is in order to carrying the ball bearing 172 of block holding part 141 lower section, then corresponds to clamping plate by screw 171a
A perforate 125 on 12 carries out locking fixation, so as to connecting bottom board 14 and clamping plate 12.
Please continue to refer to Fig. 5 and Fig. 6, it is the section view of the elastic recovery device of floating gauge head one preferred embodiment of the present invention
Figure and the local A cutaway view Amplified image of elastic recovery device, please also refer to Fig. 4.Shown in figure, elastic recovery device 15 includes
Have：One disk body 151, with a groove 151a is located in the spheroid 152 of groove 151a, a pad 154 and a spring
153.In addition, groove 151a one-tenth one is coniform, and spheroid 152 elasticity is resisted against coniform top.Additionally, disk body 151 can correspond to
Elasticity is resisted against in a groove 123 of clamping plate 12.
Above-mentioned elastic recovery device 15 act as, when floating gauge head 1 pushes absorption strip semiconductor element 92, if folder
Between plate 12 and base plate 14 because strip semiconductor element 92 bend or out-of-flatness and horizontal skew will be produced, now spheroid 152
Spring 153 can be compressed toward top offset to allow the horizontal off normal of clamping plate 12 and base plate 14, partly lead when floating gauge head 1 is drawn to strip
When moving on volume elements part 92, spheroid 152, because being located in the cone shape relation of disk body 151, is returned to original position by spring 153
Put, and so that base plate 14 is resetted.
In sum, the floating gauge head 1 of the present invention has the buffering of vapour-pressure type damping in the vertical, and has in the horizontal
There are four elastic recovery devices 15 to allow horizontal off normal, therefore floating gauge head 1 when pushing absorption strip semiconductor element 92,
Can have longitudinal pressure buffer, horizontal rapid-aligning mechanism, it is to avoid when floating gauge head 1 pushes, damage strip semiconductor element simultaneously
92.
As shown in Figures 7 and 8, be test equipment one preferred embodiment of the present invention whole machine axonometric chart and partial enlarged drawing.
A kind of test equipment with floating gauge head 1 of the present embodiment, includes：One floating gauge head 1, a charging/discharging device, a test dress
Put 3, one image detection device 4, a shifting carrying platform 5, an output stage 6 and four heating platforms 7.Shown in figure, floating gauge head 1
It is fixedly arranged on a slide rail 33 of a pedestal 8, its structure is identical with aforesaid floating gauge head 1, therefore repeats no more.Input and output material
Device includes an in-material seat 21, a pan feeding fetching device 22, a discharging set 23 and a discharging fetching device 24, in order to strip
Semiconductor element 92 carries out pan feeding and the transfer of discharging is transported.And test device 3 is fixedly arranged on pedestal 8, in order to partly to lead to strip
Volume elements part 92 is tested.
The pan feeding fetching device 22 of the present embodiment is one the pan feeding of longitudinal direction and transverse shifting can to draw platform 221, in order to inhale
Take the strip semiconductor element 92 of simultaneously transfer in-material seat 21.Additionally, discharging fetching device 24 also can longitudinal direction and transverse shifting for one
Discharging draw platform 241, in order to draw and transfer survey finish strip semiconductor element 92 to discharging set 23.
In addition, the image detection device 4 of the present embodiment, it is fixedly arranged on pedestal 8, in order to detect strip semiconductor element 92
Bar code.In addition, shifting carrying platform 5 is fixedly arranged on pedestal 8, the strip semiconductor element 92 in order to pan feeding to be drawn platform 221 transports
To test device 3.
As shown in FIG. 9 and 10, be test equipment one preferred embodiment of the present invention test device axonometric chart and side view.
The test device 3 of the present embodiment includes a lifting platform 31, a test bench 32 and is fixedly arranged on the slide rail 33 of lifting platform 31, floats
Gauge head 1 is fixedly arranged on slide rail 33, is tested to test bench 32 in order to draw strip semiconductor element 92.
The output stage 6 of the present embodiment is fixedly arranged on pedestal 8, and the strip semiconductor element 92 in order to finish survey is placed in defeated
Go out on platform 6, wherein, floating gauge head 1 is drawn and passed through output stage 6 and transports strip semiconductor element 92 to discharging fetching device
24.In addition, being fixedly arranged on pedestal 8, in order to heat strip semiconductor element 92 on four heating platforms 7 of the present embodiment.
Above-described embodiment explanation merely for convenience and illustrate, the interest field that the present invention is advocated is from should be with right
It is defined described in requirement, rather than be only limitted to above-described embodiment.
Claims (15)
1. a kind of floating gauge head is it is characterised in that include：
One top board, has the passage to a pulsometer for the connection, and this passage has the through hole running through this top board bottom；
One clamping plate, is connected to this top board bottom, have to should through hole a storage tank；
One gas seal member, is located in this storage tank, and has a perforation being connected with this through hole, and this gas seal member defines a bag
Include this passage, the airtight space of this through hole, this perforation and this storage tank, so that this airtight space is produced by the effect of this pulsometer
Life is in longitudinal pressure buffer effect；
One base plate, is connected to this clamping plate bottom；
Multiple elastic recovery devices, are located between this base plate and this clamping plate, horizontal inclined between this base plate and this clamping plate in order to allow
Position；
One support plate, is connected to this base plate, and the bottom of this support plate is provided with to draw multiple suction nozzles of a strip semiconductor element；
And
One ball bearing group, is located between this clamping plate and this base plate, in order to allow sliding in this clamping plate plane for this base plate, should
Ball bearing group, has a body and two ball bearings, and this body has a screw, a sleeved part and a supporting part, and this two
Ball bearing is divided into the upper and lower end face of a block holding part of this base plate, and penetrates the one of this base plate by this sleeved part of this body
Bore a hole and be resisted against this clamping plate, this supporting part is in order to carrying this ball bearing below this block holding part, then corresponds to by this screw
A perforate on this clamping plate carries out locking fixation, in order to connect this base plate and this clamping plate.
2. floating gauge head according to claim 1, wherein, this elastic recovery device includes：One disk body with a groove,
One spheroid being located in this groove and a spring.
3. floating gauge head according to claim 2, wherein, is also folded with a pad between this spheroid and this spring.
4. floating gauge head according to claim 1, it is characterised in that also including a position sensor, is arranged at this clamping plate,
In order to sense the spacing of this top board and this clamping plate.
5. floating gauge head according to claim 1, wherein, have inside this support plate multiple passages be connected in a vacuum pump with
And between the plurality of suction nozzle, in order to produce suction source.
6. floating gauge head according to claim 1, wherein, this support plate also includes multiple fasteners, in order to be fastened on this bottom
Multiple buckling parts of plate, so as to connecting this support plate and this base plate.
7. a kind of test equipment with floating gauge head is it is characterised in that in order to test a strip semiconductor element, include：
One floating gauge head, is fixedly arranged on a pedestal, including：One top board, a clamping plate, a gas seal member, a base plate, multiple elastic recovery
Device, a support plate and a ball bearing group；This top board has the passage to a pulsometer for the connection, and this passage has and runs through this
One through hole of top board bottom；This clamping plate is connected to this top board bottom, have to should through hole a storage tank；This gas seal member is installed with
In this storage tank, and be there is a perforation being connected with this through hole, this gas seal member defines including this passage, this through hole, is somebody's turn to do
Perforation and an airtight space of this storage tank, make this airtight space produce in longitudinal pressure buffer by this air pressure pumping action
Effect；This base plate is connected to this clamping plate bottom, and the plurality of elastic recovery device is located between this base plate and this clamping plate, in order to allow
Horizontal off normal between this base plate and this clamping plate；This support plate is connected to this base plate, and the bottom of this support plate is provided with to draw one
Multiple suction nozzles of shape semiconductor element；This ball bearing group, is located between this clamping plate and this base plate, in order to allow this base plate in this
Sliding in clamping plate plane, this ball bearing group, there are a body and two ball bearings, this body has a screw, sheathed
Portion and a supporting part, this two ball bearing is divided into the upper and lower end face of a block holding part of this base plate, and this set by this body
If portion penetrates the one of this base plate and bores a hole and be resisted against this clamping plate, this supporting part is in order to carry this ball axle below this block holding part
Hold, then by this screw to should the perforate on clamping plate carry out locking fixation, in order to connect this base plate and this clamping plate；
One charging/discharging device, includes an in-material seat, a pan feeding fetching device, a discharging set and a discharging fetching device, in order to
This strip semiconductor element is carried out with pan feeding and the transfer of discharging is transported；And
One test device, is fixedly arranged on this pedestal, in order to test to this strip semiconductor element.
8. test equipment according to claim 7, wherein, this elastic recovery device includes：One disk body with a groove,
One spheroid being located in this groove and a spring.
9. test equipment according to claim 7, wherein, this pan feeding fetching device is one can the entering of longitudinal direction and transverse shifting
Platform drawn by material, in order to draw this strip semiconductor element of simultaneously this in-material seat of transfer.
10. test equipment according to claim 7, wherein, this discharging fetching device is one can longitudinal direction and transverse shifting
Platform is drawn in discharging, surveys this strip semiconductor element finished to this discharging set in order to draw simultaneously transfer.
11. test equipments according to claim 7, it is characterised in that also including an image detection device, are fixedly arranged on this base
On seat, in order to detect this strip semiconductor element.
12. test equipments according to claim 7, it is characterised in that also including a shifting carrying platform, are fixedly arranged on this pedestal
On, in order to this strip semiconductor element of this pan feeding fetching device to be transported to this test device.
13. test equipments stated according to claim 7, wherein, it is solid that this test device includes a lifting platform, a test bench and one
Located at the slide rail of this lifting platform, this floating gauge head is fixedly arranged on this slide rail, in order to draw this strip semiconductor element to this test
Seat is tested.
14. test equipments according to claim 7 are fixedly arranged on this pedestal it is characterised in that also including an output stage,
In order to transfer load to this discharging fetching device by surveying this strip semiconductor element finished.
15. test equipments according to claim 7, wherein, also include at least one heating platform, are fixedly arranged on this pedestal,
In order to heat this strip semiconductor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310233489.2A CN104237569B (en) | 2013-06-13 | 2013-06-13 | Floating gauge head and the test equipment using this floating gauge head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310233489.2A CN104237569B (en) | 2013-06-13 | 2013-06-13 | Floating gauge head and the test equipment using this floating gauge head |
Publications (2)
| Publication Number | Publication Date |
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| CN104237569A CN104237569A (en) | 2014-12-24 |
| CN104237569B true CN104237569B (en) | 2017-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310233489.2A Active CN104237569B (en) | 2013-06-13 | 2013-06-13 | Floating gauge head and the test equipment using this floating gauge head |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105929321B (en) * | 2016-06-12 | 2023-03-03 | 深圳市斯纳达科技有限公司 | Integrated circuit test equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW559333U (en) * | 2003-03-28 | 2003-10-21 | Hon Tech Inc | Bearing-type floating apparatus |
| CN201017021Y (en) * | 2007-02-12 | 2008-02-06 | 寰邦科技股份有限公司 | Test mechanism |
| CN101689526A (en) * | 2007-05-07 | 2010-03-31 | 综合制造科技有限公司 | Apparatus for object processing |
| CN102698969A (en) * | 2012-05-29 | 2012-10-03 | 格兰达技术（深圳）有限公司 | Automatic testing and sorting machine for integrated circuit IC chip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6586954B2 (en) * | 1998-02-10 | 2003-07-01 | Celadon Systems, Inc. | Probe tile for probing semiconductor wafer |
-
2013
- 2013-06-13 CN CN201310233489.2A patent/CN104237569B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW559333U (en) * | 2003-03-28 | 2003-10-21 | Hon Tech Inc | Bearing-type floating apparatus |
| CN201017021Y (en) * | 2007-02-12 | 2008-02-06 | 寰邦科技股份有限公司 | Test mechanism |
| CN101689526A (en) * | 2007-05-07 | 2010-03-31 | 综合制造科技有限公司 | Apparatus for object processing |
| CN102698969A (en) * | 2012-05-29 | 2012-10-03 | 格兰达技术（深圳）有限公司 | Automatic testing and sorting machine for integrated circuit IC chip |
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| CN104237569A (en) | 2014-12-24 |
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