CN104237569A - Floating test head and test equipment using same - Google Patents

Floating test head and test equipment using same Download PDF

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Publication number
CN104237569A
CN104237569A CN201310233489.2A CN201310233489A CN104237569A CN 104237569 A CN104237569 A CN 104237569A CN 201310233489 A CN201310233489 A CN 201310233489A CN 104237569 A CN104237569 A CN 104237569A
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China
Prior art keywords
order
base plate
clamping plate
plate
semiconductor element
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CN201310233489.2A
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Chinese (zh)
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CN104237569B (en
Inventor
詹勋亮
梁居平
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King Yuan Electronics Co Ltd
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King Yuan Electronics Co Ltd
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Priority to CN201310233489.2A priority Critical patent/CN104237569B/en
Publication of CN104237569A publication Critical patent/CN104237569A/en
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Publication of CN104237569B publication Critical patent/CN104237569B/en
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Abstract

The invention provides a floating test head and test equipment using the floating test head. The floating test head comprises a top plate, a clamp plate, airtight parts, a bottom plate, a plurality of elastic return mechanisms and a carrier plate. The top plate is provided with a channel connected to a pneumatic pump, and the channel is provided with through holes through the bottom of the top plate. The clamp plate is connected to the bottom of the top plate and provided with containing grooves corresponding to the through holes. Each airtight part is arranged in the corresponding containing groove in a contained mode and provided with a penetrating hole communicated with the corresponding through hole, and an airtight space comprising the channels, the through holes and the containing grooves is formed by the airtight parts in a defined mode and has the air pressure buffering effect in the longitudinal direction under the action of the pneumatic pump. The bottom plate is connected to the bottom of the clamp plate, and the elastic return mechanisms are arranged between the bottom plate and the clamp plate in a clamped mode and used for allowing transverse deviation between the bottom plate and the clamp plate. The carrier plate is connected to the bottom plate, and a plurality of suckers used for sucking a strip-shaped semiconductor element are arranged at the bottom of the carrier plate.

Description

Float gauge head and use the testing apparatus of this floating gauge head
Technical field
The invention relates to a kind of floating gauge head and use the testing apparatus of this floating gauge head, espespecially a kind of being applicable to is drawn the floating gauge head of strip semiconductor element and uses the testing apparatus of this floating gauge head.
Background technology
Current product line chip testing product, all based on single test, and must convert material pipe (tube) or the charging of charging tray (tray) mode to, cause many procedures before test, and the time of test and flow process also long.In addition, make material pipe or charging tray conversion time, easily cause and get stuck, and must buy material pipe or charging tray change.General chip is strip semiconductor element (strip) state before being not yet processed into single chips, strip semiconductor element arranges uncut multiple semi-conductor chip, now, if directly tested this strip semiconductor element, as tests such as electrical, temperature, the converting process of one section of material pipe or charging tray can be reduced, significantly improve the output capacity of semi-conductor chip.
But strip semiconductor element length is longer, area is large and thickness is thin, therefore itself deflection is larger, if when using traditional gauge head to press down to draw strip semiconductor element to test, two problems will be had produce, one is that the longitudinal power drawing strip semiconductor element that presses down of gauge head is difficult to control, and very easily weighs strip semiconductor element wounded when pressing down; If it two has deformation condition for strip semiconductor element itself, if general gauge head presses down do not aim at strip semiconductor element, also very easily damage strip semiconductor element.
Therefore, inventor, in line with the spirit of actively invention, urgently thinks a kind of floating gauge head that can solve the problem and the testing apparatus using this floating gauge head, and several times research experiment is eventually to completing the present invention.
Summary of the invention
Fundamental purpose of the present invention is in providing a kind of gauge head that floats, there is the buffering of vapour-pressure type damping in the vertical, and there is multiple elastic recovery device in the horizontal to allow horizontal off normal, therefore gauge head is floated when pressing down absorption strip semiconductor element, longitudinal buffer, horizontal rapid-aligning mechanism can be had simultaneously, when avoiding floating gauge head to press down, damage strip semiconductor element.
The floating gauge head of the present invention's one, includes: a top board, clamping plate, a gas seal member, a base plate, multiple elastic recovery device and a support plate.Top board has the passage that is connected to an air lift pump, and passage has the through hole run through bottom top board.Clamping plate are connected to bottom top board, have a storage tank of corresponding through hole.Gas seal member is located in storage tank, and has a perforation be connected with through hole, and gas seal member defines the airtight space that comprises passage, through hole, perforation and storage tank, makes airtight space generation in the pressure buffer effect of longitudinal direction by the effect of air lift pump.Base plate is connected to bottom clamping plate, and multiple elastic recovery device is located between base plate and clamping plate, in order to allow off normal horizontal between base plate and clamping plate.Support plate is connected to base plate, and the bottom of support plate is provided with the multiple suction nozzles drawing a strip semiconductor element.
As mentioned above, floating gauge head of the present invention, there is the buffering of vapour-pressure type damping in the vertical, and there is multiple elastic recovery device in the horizontal to allow horizontal off normal, therefore gauge head is floated when pressing down absorption strip semiconductor element, longitudinal buffer, horizontal rapid-aligning mechanism can be had simultaneously, when avoiding floating gauge head to press down, damage strip semiconductor element.
Aforesaid gas seal member can be one around a cylinder of soft materials, and soft materials can be the material of rubber or the identical effect of other tools.In addition, above-mentioned soft materials can be pressed against the sidewall of storage tank, produces airtight effect to make unlikely the leaking of the pneumatic supply of air lift pump.In addition, aforesaid clamping plate are bolted to top board by multiple, and can reserve a gap between top board and clamping plate, are able to generation effect to make vapour-pressure type damping.
Above-mentioned elastic recovery device can also include: a disk body, with a groove is located in spheroid and a spring of groove.In addition, groove can become one coniform, and spheroid elastic top can be butted on coniform top.In addition, a pad can be also folded with between spheroid and spring.In addition, disk body may correspond to elastic top and is butted in a groove of clamping plate.
That is, if when microscler strip semiconductor element itself has flexure or out-of-flatness phenomenon, the own tolerable of gauge head off normal transversely of floating, to coordinate strip semiconductor element, is unlikely to the situation that the inaccurate and generation of contraposition weighs strip semiconductor element wounded.It act as, when floating gauge head presses down absorption strip semiconductor element, if produce horizontal skew because of chip flexure or out-of-flatness between clamping plate and base plate, now spheroid can compress spring toward top offset to allow the horizontal off normal of clamping plate and base plate, when floating gauge head absorption strip semiconductor element moves, spheroid, because be located in the cone shape relation of disk body, be returned to original position by the contact of spring, and base plate is resetted.
In addition, the present invention also can comprise a ball bearing group and be located between clamping plate and base plate, in order to allow the slippage of base plate in clamping plate plane.Above-mentioned ball bearing group can have a body and two ball bearing, and body can have a screw, a sleeved part and a supporting part.Two ball bearing can be divided into the upper and lower end face of a block holding part of base plate, and penetrate one of base plate by the sleeved part of body and bore a hole and be resisted against clamping plate, supporting part can in order to the ball bearing below carrier card support, undertaken locking fixing again by the perforate on the corresponding clamping plate of screw, so as to connecting bottom board and clamping plate.
In addition, the present invention also can comprise a heating plate and is arranged on support plate, in order to heat support plate.In addition, multiple support column can be located between base plate and heating plate.In addition, the present invention can also comprise a position transducer, is arranged on clamping plate, in order to sense the spacing of top board and clamping plate.
Aforementioned support plate inside has multiple passage and is connected between a vacuum pump and multiple suction nozzle, in order to produce suction source.In addition, above-mentioned support plate can also include multiple fastener, in order to be fastened on multiple buckling parts of base plate, to connect support plate and base plate.In addition, support plate can also include multiple pilot hole, the purposes of location when pressing down for floating gauge head.In addition, the present invention also can comprise a card extender and be fixedly arranged on top board, can be connected to other testing apparatuss to make floating gauge head.
The testing apparatus with floating gauge head of the present invention, in order to test a strip semiconductor element, can include: floating gauge head, a charging/discharging device and a proving installation.
Above-mentioned floating gauge head is fixedly arranged on a pedestal, and its structure is identical with aforesaid floating gauge head, therefore repeats no more.Charging/discharging device includes an in-material seat, a pan feeding fetching device, a discharging seat and a discharging fetching device, transports in order to transfer strip semiconductor element being carried out to pan feeding and discharging.And proving installation is fixedly arranged on pedestal, in order to test strip semiconductor element.
Aforesaid pan feeding fetching device can be one the pan feeding of longitudinal direction and transverse shifting can draw platform, in order to draw and the strip semiconductor element of transfer in-material seat.In addition, above-mentioned discharging fetching device also can be one the discharging of longitudinal direction and transverse shifting can draw platform, in order to draw and transfer surveys the strip semiconductor element finished to discharging seat.
In addition, this testing apparatus can also comprise an image detection device, is fixedly arranged on pedestal, in order to detect the bar code of strip semiconductor element.In addition, aforesaid pedestal can also be installed with a shifting carrying platform, in order to the strip semiconductor element of pan feeding fetching device is transported to proving installation.
The slide rail that above-mentioned proving installation can comprise a lifting table, a test bench and is fixedly arranged on lifting table, floating gauge head can be fixedly arranged on slide rail, tests to test bench in order to draw strip semiconductor element.
This testing apparatus also can comprise an output stage and be fixedly arranged on pedestal, in order to transfer load to discharging fetching device by surveying the strip semiconductor element finished.In addition, aforesaid pedestal can also be installed with at least one heating platform, in order to heat strip semiconductor element.
Accompanying drawing explanation
Fig. 1 is that the present invention floats the explosive view of gauge head one preferred embodiment.
Fig. 2 is that the present invention floats the stereographic map of gauge head one preferred embodiment.
Fig. 3 is that the present invention floats the side cutaway view of gauge head one preferred embodiment.
Fig. 4 is that the present invention floats the ball bearing group of gauge head one preferred embodiment and the explosive view of elastic recovery device.
Fig. 5 is that the present invention floats the cut-open view of elastic recovery device of gauge head one preferred embodiment.
Fig. 6 is that the present invention floats the local A cutaway view Amplified image of elastic recovery device of gauge head one preferred embodiment.
Fig. 7 is the complete machine stereographic map of testing apparatus one preferred embodiment of the present invention.
Fig. 8 is the partial enlarged drawing of testing apparatus one preferred embodiment of the present invention.
Fig. 9 is the proving installation stereographic map of testing apparatus one preferred embodiment of the present invention.
Figure 10 is the proving installation side view of testing apparatus one preferred embodiment of the present invention.
[symbol description]
Embodiment
As shown in Figure 1, Figure 2 and shown in Fig. 3, for the present invention floats the explosive view of gauge head one preferred embodiment, stereographic map and side cutaway view.Floating gauge head 1 as shown in the figure, includes: top board 11, clamping plate 12, two gas seal member 13, base plate 14, multiple elastic recovery device 15, support plate 16, two ball bearing group 17, card extender 18, heating plate 19, two position transducer 124 and four support columns 191.
Top board 11 has the passage 111 that is connected to an air lift pump 90, and passage 111 has two through holes 112 run through bottom top board 11.Card extender 18 is fixedly arranged on top board 11, can be connected to associated test devices to make floating gauge head 1.
Clamping plate 12 are connected to bottom top board 11 by four bolts 122, and clamping plate 12 also have two storage tanks 121 of corresponding two through holes 112, and a reserved gap between top board 11 and clamping plate 12.In addition, the position transducer 124 of the present embodiment, is arranged on clamping plate 12, in order to sense the spacing of top board 11 and clamping plate 12.
In addition, two gas seal members 13 of the present embodiment are respectively located in two storage tanks 121, each gas seal member 13 has a perforation 131 be connected with each through hole 112, each gas seal member 13 defines the airtight space 132 that comprises passage 111, through hole 112, perforation 131 and two storage tanks 121, makes airtight space 132 result from longitudinal pressure buffer effect by the effect of air lift pump 90.In addition, the gas seal member 13 of the present embodiment is one around a cylinder of rubber 133, and rubber 133 is pressed against the sidewall of storage tank 121, produces airtight effect to make unlikely the leaking of the pneumatic supply of air lift pump 90.
In addition, the base plate 14 of the present embodiment is connected to bottom clamping plate 12, and multiple elastic recovery device 15 is four in the present embodiment quantity, is located between base plate 14 and clamping plate 12, in order to allow off normal horizontal between base plate 14 and clamping plate 12.
The support plate 16 of the present embodiment is connected to base plate 14, and the bottom of support plate 16 is provided with the multiple suction nozzles 161 drawing a strip semiconductor element 92.In addition, support plate 16 inside has multiple air hole 162 and is connected between a vacuum pump (not shown) and multiple suction nozzle 161, in order to produce suction source, can draw a strip semiconductor element 92.In addition, the support plate 16 of the present embodiment includes four fasteners 163, in order to be fastened on four buckling parts 143 of base plate 14, to connect support plate 16 and base plate 14, can elasticity replace to make support plate 16.In addition, the support plate 16 of the present embodiment includes two pilot holes 164, the purposes of location when pressing down for floating gauge head 1.
In addition, the heating plate 19 of the present embodiment arranges with on support plate 16, in order to heat support plate 16.In addition, the present embodiment has four support columns 191 and is located between base plate 14 and heating plate 19.
Please continue to refer to Fig. 4, for the present invention floats the ball bearing group of gauge head one preferred embodiment and the explosive view of elastic recovery device, and see also Fig. 3.The two ball bearing groups 17 of the present embodiment are located between clamping plate 12 and base plate 14, in order to allow the slippage of base plate 14 in clamping plate 12 plane.Each ball bearing group 17 has body 171 and two ball bearing 172, and body 171 can have a screw 171a, a sleeved part 171b and a supporting part 171c.Two ball bearing 172 are divided into the upper and lower end face of a block holding part 141 of base plate 14, and penetrate a perforation 142 of base plate 14 by the sleeved part 171c of body 171 and be resisted against clamping plate 12, supporting part 171c is in order to the ball bearing 172 below carrier card support 141, undertaken locking fixing again by the perforate 125 on the corresponding clamping plate 12 of screw 171a, so as to connecting bottom board 14 and clamping plate 12.
Please continue to refer to Fig. 5 and Fig. 6, for the present invention floats the cut-open view of elastic recovery device of gauge head one preferred embodiment and the local A cutaway view Amplified image of elastic recovery device, please also refer to Fig. 4.Shown in figure, elastic recovery device 15 includes: a disk body 151, with a groove 151a is located in spheroid 152, pad 154 and a spring 153 of groove 151a.In addition, groove 151a becomes one coniform, and spheroid 152 elastic top is butted on coniform top.In addition, disk body 151 may correspond to elastic top and is butted in a groove 123 of clamping plate 12.
Above-mentioned elastic recovery device 15 act as, when floating gauge head 1 presses down absorption strip semiconductor element 92, if between clamping plate 12 and base plate 14 because strip semiconductor element 92 bend or out-of-flatness and will produce transverse direction skew, now spheroid 152 can compress spring 153 toward top offset to allow the horizontal off normal of clamping plate 12 and base plate 14, when floating gauge head 1 be drawn to strip semiconductor element 92 moves time, spheroid 152 is because be located in the cone shape relation of disk body 151, be returned to original position by spring 153, and base plate 14 is resetted.
In sum, floating gauge head 1 of the present invention has the buffering of vapour-pressure type damping in the vertical, and there are four elastic recovery devices 15 in the horizontal to allow horizontal off normal, therefore gauge head 1 is floated when pressing down absorption strip semiconductor element 92, longitudinal pressure buffer, horizontal rapid-aligning mechanism can be had simultaneously, when avoiding floating gauge head 1 to press down, damage strip semiconductor element 92.
As shown in Figures 7 and 8, be complete machine stereographic map and the partial enlarged drawing of testing apparatus one preferred embodiment of the present invention.A kind of testing apparatus with floating gauge head 1 of the present embodiment, includes: floating gauge head 1, charging/discharging device, proving installation 3, image detection device 4, shifting carrying platform 5, output stage 6 and four heating platforms 7.Shown in figure, the gauge head 1 that floats is fixedly arranged on a slide rail 33 of a pedestal 8, and its structure is identical with aforesaid floating gauge head 1, therefore repeats no more.Charging/discharging device includes in-material seat 21, pan feeding fetching device 22, discharging seat 23 and a discharging fetching device 24, transports in order to transfer strip semiconductor element 92 being carried out to pan feeding and discharging.And proving installation 3 is fixedly arranged on pedestal 8, in order to test strip semiconductor element 92.
The pan feeding fetching device 22 of the present embodiment is one the pan feeding of longitudinal direction and transverse shifting can draw platform 221, in order to draw and the strip semiconductor element 92 of transfer in-material seat 21.In addition, discharging fetching device 24 is also one the discharging of longitudinal direction and transverse shifting can draw platform 241, in order to draw and strip semiconductor element 92 to the discharging seat 23 finished is surveyed in transfer.
In addition, the image detection device 4 of the present embodiment, is fixedly arranged on pedestal 8, in order to detect the bar code of strip semiconductor element 92.In addition, shifting carrying platform 5 is fixedly arranged on pedestal 8, is transported to proving installation 3 in order to the strip semiconductor element 92 pan feeding being drawn platform 221.
As shown in FIG. 9 and 10, be proving installation stereographic map and the side view of testing apparatus one preferred embodiment of the present invention.The proving installation 3 of the present embodiment comprises the slide rail 33 that lifting table 31, test bench 32 and is fixedly arranged on lifting table 31, and the gauge head 1 that floats is fixedly arranged on slide rail 33, tests in order to draw strip semiconductor element 92 to test bench 32.
The output stage 6 of the present embodiment is fixedly arranged on pedestal 8, and in order to be placed on output stage 6 by surveying the strip semiconductor element 92 finished, wherein, the gauge head 1 that floats is drawn and transports strip semiconductor element 92 to discharging fetching device 24 by output stage 6.In addition, four heating platforms 7 of the present embodiment are fixedly arranged on pedestal 8, in order to heat strip semiconductor element 92.
Above-described embodiment is only citing for convenience of description, and the interest field that the present invention advocates from should being as the criterion with described in claim, but not is only limitted to above-described embodiment.

Claims (19)

1. a floating gauge head, is characterized in that, comprising:
One top board, has the passage that is connected to an air lift pump, and this passage has the through hole run through bottom this top board;
One clamping plate, are connected to bottom this top board, have should a storage tank of through hole;
One gas seal member, be located in this storage tank, and there is a perforation be connected with this through hole, this gas seal member defines the airtight space that comprises this passage, this through hole, this perforation and this storage tank, makes the generation of this airtight space in the pressure buffer effect of longitudinal direction by the effect of this air lift pump;
One base plate, is connected to bottom these clamping plate;
Multiple elastic recovery device, is located between this base plate and this clamping plate, in order to allow off normal horizontal between this base plate and this clamping plate; And
One support plate, is connected to this base plate, and the bottom of this support plate is provided with the multiple suction nozzles drawing a strip semiconductor element.
2. floating gauge head according to claim 1, wherein, this elastic recovery device comprises: a disk body, with a groove is located in spheroid and a spring of this groove.
3. floating gauge head according to claim 2, wherein, is also folded with a pad between this spheroid and this spring.
4. floating gauge head according to claim 1, is characterized in that, also comprises a ball bearing group and is located between these clamping plate and this base plate, in order to allow the slippage of this base plate in this clamping plate plane.
5. floating gauge head according to claim 4, wherein, this ball bearing group, there are a body and two ball bearing, this body has a screw, a sleeved part and a supporting part, this two ball bearing is divided into the upper and lower end face of a block holding part of this base plate, and penetrate one of this base plate by this sleeved part of this body and bore a hole and be resisted against this clamping plate, this supporting part is in order to carry this ball bearing below this block holding part, again by this screw to should the perforate on clamping plate lock fixing, in order to connect this base plate and this clamping plate.
6. floating gauge head according to claim 1, is characterized in that, also comprises a position transducer, is arranged at this clamping plate, in order to sense the spacing of this top board and these clamping plate.
7. floating gauge head according to claim 1, wherein, this support plate inside has multiple passage and is connected between a vacuum pump and the plurality of suction nozzle, in order to produce suction source.
8. floating gauge head according to claim 1, wherein, this support plate also includes multiple fastener, in order to be fastened on multiple buckling parts of this base plate, so as to connecting this support plate and this base plate.
9. there is a testing apparatus for floating gauge head, it is characterized in that, in order to test a strip semiconductor element, include:
One floating gauge head, is fixedly arranged on a pedestal, comprises: a top board, clamping plate, a gas seal member, a base plate, multiple elastic recovery device and a support plate; This top board has the passage that is connected to an air lift pump, and this passage has the through hole run through bottom this top board; These clamping plate are connected to bottom this top board, have should a storage tank of through hole; This gas seal member is located in this storage tank, and there is a perforation be connected with this through hole, this gas seal member defines the airtight space comprising this passage, this through hole, this perforation and this storage tank, makes the generation of this airtight space in the pressure buffer effect of longitudinal direction by this air lift pump effect; This base plate is connected to bottom these clamping plate, and the plurality of elastic recovery device is located between this base plate and this clamping plate, in order to allow off normal horizontal between this base plate and this clamping plate; This support plate is connected to this base plate, and the bottom of this support plate is provided with the multiple suction nozzles drawing a strip semiconductor element;
One charging/discharging device, includes an in-material seat, a pan feeding fetching device, a discharging seat and a discharging fetching device, transports in order to the transfer this strip semiconductor element being carried out to pan feeding and discharging; And
One proving installation, is fixedly arranged on this pedestal, in order to test this strip semiconductor element.
10. testing apparatus according to claim 9, wherein, this elastic recovery device comprises: a disk body, with a groove is located in spheroid and a spring of this groove.
11. testing apparatuss according to claim 9, is characterized in that, also comprise a ball bearing group and are located between these clamping plate and this base plate, in order to allow the slippage of this base plate in this clamping plate plane.
12. testing apparatuss according to claim 11, wherein, this ball bearing group, there are a body and two ball bearing, this body has a screw, a sleeved part and a supporting part, this two ball bearing is divided into the upper and lower end face of a block holding part of this base plate, and penetrate one of this base plate by this sleeved part of this body and bore a hole and be resisted against this clamping plate, this supporting part is in order to carry this ball bearing below this block holding part, again by this screw to should the perforate on clamping plate lock fixing, in order to connect this base plate and this clamping plate.
13. testing apparatuss according to claim 9, wherein, this pan feeding fetching device is one the pan feeding of longitudinal direction and transverse shifting can draw platform, in order to draw and this strip semiconductor element of this in-material seat of transfer.
14. testing apparatuss according to claim 9, wherein, this discharging fetching device is one the discharging of longitudinal direction and transverse shifting can draw platform, in order to draw and transfer surveys this strip semiconductor element of finishing to this discharging seat.
15. testing apparatuss according to claim 9, is characterized in that, also comprise an image detection device, are fixedly arranged on this pedestal, in order to detect this strip semiconductor element.
16. testing apparatuss according to claim 9, is characterized in that, also comprise a shifting carrying platform, are fixedly arranged on this pedestal, in order to this strip semiconductor element of this pan feeding fetching device is transported to this proving installation.
17. testing apparatuss stated according to claim 9, wherein, the slide rail that this proving installation comprises a lifting table, a test bench and is fixedly arranged on this lifting table, this floating gauge head is fixedly arranged on this slide rail, tests to this test bench in order to draw this strip semiconductor element.
18. testing apparatuss according to claim 9, is characterized in that, also comprise an output stage and are fixedly arranged on this pedestal, in order to transfer load to this discharging fetching device by surveying this strip semiconductor element finished.
19. testing apparatuss according to claim 9, wherein, also comprise at least one heating platform, are fixedly arranged on this pedestal, in order to heat this strip semiconductor element.
CN201310233489.2A 2013-06-13 2013-06-13 Floating gauge head and the test equipment using this floating gauge head Active CN104237569B (en)

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CN104237569B CN104237569B (en) 2017-03-01

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN105929321A (en) * 2016-06-12 2016-09-07 深圳市斯纳达科技有限公司 Integrated circuit tester

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CN101689526A (en) * 2007-05-07 2010-03-31 综合制造科技有限公司 Apparatus for object processing
CN102698969A (en) * 2012-05-29 2012-10-03 格兰达技术(深圳)有限公司 Automatic testing and sorting machine for integrated circuit IC chip

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Publication number Priority date Publication date Assignee Title
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TW559333U (en) * 2003-03-28 2003-10-21 Hon Tech Inc Bearing-type floating apparatus
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105929321A (en) * 2016-06-12 2016-09-07 深圳市斯纳达科技有限公司 Integrated circuit tester
CN105929321B (en) * 2016-06-12 2023-03-03 深圳市斯纳达科技有限公司 Integrated circuit test equipment

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