CN104233198A - Linear evaporation source, and glass deposition device provided with same linear evaporation source and used for flat display - Google Patents
Linear evaporation source, and glass deposition device provided with same linear evaporation source and used for flat display Download PDFInfo
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- CN104233198A CN104233198A CN201410256362.7A CN201410256362A CN104233198A CN 104233198 A CN104233198 A CN 104233198A CN 201410256362 A CN201410256362 A CN 201410256362A CN 104233198 A CN104233198 A CN 104233198A
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- deposition material
- evaporation source
- linear evaporation
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- 230000008021 deposition Effects 0.000 title claims abstract description 98
- 238000001704 evaporation Methods 0.000 title claims abstract description 56
- 230000008020 evaporation Effects 0.000 title claims abstract description 55
- 239000011521 glass Substances 0.000 title claims description 38
- 239000000463 material Substances 0.000 claims abstract description 77
- 238000010438 heat treatment Methods 0.000 claims abstract description 50
- 238000000151 deposition Methods 0.000 claims description 99
- 238000001816 cooling Methods 0.000 claims description 12
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 6
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 208000034189 Sclerosis Diseases 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 230000027756 respiratory electron transport chain Effects 0.000 description 2
- WMAXWOOEPJQXEB-UHFFFAOYSA-N 2-phenyl-5-(4-phenylphenyl)-1,3,4-oxadiazole Chemical compound C1=CC=CC=C1C1=NN=C(C=2C=CC(=CC=2)C=2C=CC=CC=2)O1 WMAXWOOEPJQXEB-UHFFFAOYSA-N 0.000 description 1
- AWXGSYPUMWKTBR-UHFFFAOYSA-N 4-carbazol-9-yl-n,n-bis(4-carbazol-9-ylphenyl)aniline Chemical compound C12=CC=CC=C2C2=CC=CC=C2N1C1=CC=C(N(C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=C1 AWXGSYPUMWKTBR-UHFFFAOYSA-N 0.000 description 1
- DIVZFUBWFAOMCW-UHFFFAOYSA-N 4-n-(3-methylphenyl)-1-n,1-n-bis[4-(n-(3-methylphenyl)anilino)phenyl]-4-n-phenylbenzene-1,4-diamine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 DIVZFUBWFAOMCW-UHFFFAOYSA-N 0.000 description 1
- 101000837344 Homo sapiens T-cell leukemia translocation-altered gene protein Proteins 0.000 description 1
- 102100028692 T-cell leukemia translocation-altered gene protein Human genes 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a linear evaporation source. The linear evaporation source comprises a heating module used for heating a deposition material in a crucible, a nozzle head and a plurality of nozzles. The nozzle head comprises a deposition material accommodating portion and a module configuration unit. The deposition material accommodating portion is used for holding the deposition material conveyed by the crucible. The module configuration unit is radially disposed in the inner part of the deposition material accommodating portion. The heating module is disposed in the module configuration unit. One end part of each of the plurality of nozzles is communicated with the deposition material accommodating portion, and the other end part is exposed outside the nozzle head to discharge the deposition material evaporated by the heating module.
Description
CROSS REFERENCE TO RELATED reference
Subject application advocates the rights and interests of the 10-2013-0071385 korean patent application case that on June 21st, 2013 files an application in Korean Intellectual Property Office, and the disclosure of described patent application case is incorporated herein in full with way of reference.
Technical field
The present invention relates to a kind of linear evaporation source and a kind of glass deposition equipment for flat-panel monitor with described linear evaporation source, and more specifically, relate to and a kind ofly prevent latch up phenomenon and do not use the linear evaporation source of Large Copacity power supply unit and a kind of glass deposition equipment for flat-panel monitor with described linear evaporation source.
Background technology
Flat-panel monitor hails the rapid expansion in exhibition and market along with the speed of ICT and receives much attention as display unit.Flat-panel monitor comprises liquid-crystal display (liquid crystal display; LCD), Plasmia indicating panel (plasma display panel; And Organic Light Emitting Diode (organic light emitting diode PDP); OLED).
In the middle of above-mentioned flat-panel monitor, OLED because of compared with LCD fast response time, watt consumption low, lightweight, do not need extra backlight device thus realize that product is ultra-thin and brightness is high and be subject to extensive concern as display unit of future generation.
When sequentially forming positivity layer, organic thin layer and negativity layer and apply voltage and make to form suitable energy difference in organic thin layer between positivity electrode and negativity electrode on glass, OLED self can be luminous.In other words, inject and reconfigure electronics and hole, and producing remaining excitation energy with light form.In this operation, due to optical wavelength can according to the doping agent of organic substance measure adjust, therefore can produce panchromatic.
Fig. 1 illustrates the structure of OLED.Reference Fig. 1, OLED comprise the layer that multiple anode, hole injection layer, hole-transporting layer, luminescent layer, hole blocking layer, electron transfer layer, electron injecting layer and negative electrode by sequentially being formed on glass is formed.
In described structure, anode is formed primarily of the tin indium oxide (ITO) with low surface resistivity and high-transmission rate.For improving luminous efficiency, organic thin layer has multilayered structure, and described multilayered structure comprises hole injection layer (hole injection layer; HIL), hole transmission layer (hole transport layer; HTL), luminescent layer (light emitting layer; EL), hole blocking layer, electron transfer layer (electron transport layer; And electron injecting layer (electron injection layer ETL); EIL).Organic substance for luminescent layer can be Alq
3, TPD, PBD, m-MTDATA or TCTA.Negative electrode is formed by LiF-Al metal level.The ability resisting moisture in air and oxygen due to organic thin layer is very weak, thus formed on the top of device be used for encapsulation device be encapsulated layer to increase the light of device time (light time).
The luminescent layer that OLED shown in short summary Fig. 1, described OLED comprise described anode, described negative electrode and be arranged between described anode and described negative and positive.During driving, hole to be injected in described luminescent layer and electronics is injected in described luminescent layer from described negative electrode from described anode.Be injected into hole in described luminescent layer and electronics combines to produce exciton in described luminescent layer.When described exciton self-excitation state is transferred to ground state, luminous.
Described OLED can be divided into monochromatic OLED and full color OLED according to produced color.Described full color OLED comprises luminescent layer, and described luminescent layer for as each chromaticity diagram patterning in the trichromatic red R of light, green G and blue B, and then produces panchromatic.
Alternatively, provide a kind of glass deposition equipment for flat-panel monitor with OLED shown in shop drawings 1, that is, deposit described luminescent layer (organic substance) and described electrode layer (inorganic substance).The glass deposition equipment for flat-panel monitor of vacuum evaporation method is adopted to be provided with linear evaporation source as the deposition source for discharging deposition material towards glass.
Fig. 2 is the sectional view of the structure of linear evaporation source for schematically illustrating correlation technique.With reference to Fig. 2, the linear evaporation source of correlation technique has the structure that wherein heating unit is configured at injector head 1 outside.In other words, heater strip 3, heater block (heater block) 4, tamper 5 and cooling jacket 6 are configured at injector head 1 outside.
Like this, linear evaporation source due to correlation technique has wherein heater strip 3, heater block 4, tamper 5 and cooling jacket 6 and is configured at the structure of injector head 1 outside, therefore the length of nozzle 2 is along with nozzle 2 is by being connected to injector head 1 through being configured at the heater strip 3 of injector head 1 outside, heater block 4, tamper 5 and cooling jacket 6 and increasing.
But when the length of nozzle 2 increases as in the related, very likely occur the latch up phenomenon caused because of calorific loss, that is, the hole of nozzle 2 is blocked along with the organic substance sclerosis as deposition material.
For preventing latch up phenomenon, that is, for preventing the organic substance as deposition material from hardening in very long nozzle 2, use have jumbo power supply unit by increase be applied to heater strip 3 heating power and with comparatively high temps heating deposition material.In the case, for install or safeguard equipment cost increase and equipment complex structure, thus manufacture and difficult in maintenance.Therefore, need to develop a kind of Improvement type structure.
Summary of the invention
The invention provides a kind of linear evaporation source and a kind of glass deposition equipment for flat-panel monitor with described linear evaporation source, described linear evaporation source can prevent latch up phenomenon and not use Large Copacity power supply unit, and then not only reduces for installing or safeguarding the cost of equipment but also improve the manufacture of equipment and the accessibility of maintenance.
According to an aspect of the present invention, provide a kind of linear evaporation source, described linear evaporation source comprises: heating module, for from crucible heating deposition material; Injector head, comprise deposition material holding part and block configuration portion, described deposition material holding part is used for the accommodating described deposition material transmitted from described crucible, it is inner that described block configuration portion is radially configured at described deposition material holding part, and described heating module is configured in described block configuration portion; And multiple nozzle, in described multiple nozzle, an end of each nozzle is communicated with the described deposition material holding part of described nozzle and another end is exposed to the outside of described injector head to discharge the described deposition material evaporated by described heating module.
Described injector head can have double pipe structure.
Described heating module can comprise module body and heater strip, and described heater strip coiled arrangement is outside in described module body.
Can form the head coupling unit with step-off construction in of a described module body end, the end of described injector head is coupled to described head coupling unit, and multiple cutting portion can be formed in described head coupling unit.
Described heating module can comprise isolator further, and it is outside to support described heater strip that described isolator is configured at described module body, and then prevent described heater strip from directly contacting described module body and described injector head.
Described isolator can along the circumferential direction be provided with multiple with equi-angularly space in described module body outside and can be supported by multiple annular component.
Described linear evaporation source can comprise the shell of the outward appearance for the formation of described linear evaporation source further, and wherein form nozzle arrangement hole in the housing, described multiple nozzle arrangement is in described nozzle arrangement hole.
Described linear evaporation source can comprise the cooling jacket be configured between described injector head and described shell further.
Wherein said crucible and described injector head can be coupled to each other formation inclined-plane, surface, the first flange part and the second flange part can be formed in described crucible and described injector head region coupled to each other wherein, and when described first flange part and described second flange part coupled to each other time, described first flange part and described second flange part can gas-tight seals.
Described crucible can comprise body and angled head, and described deposition material is placed in described body, and described angled head is formed to tilt at a predetermined angle relative to the length direction of described body in an end of described body.
According to another aspect of the present invention, a kind of glass deposition equipment for flat-panel monitor is provided, described glass deposition equipment comprises treatment chamber and linear evaporation source, in described treatment chamber, depositing operation is performed to glass, described linear evaporation source is arranged at the side of described treatment chamber to discharge deposition material towards described glass, wherein said linear evaporation source can comprise: heating module, for heating described deposition material from crucible; Injector head, comprise deposition material holding part and block configuration portion, described deposition material holding part is used for the accommodating described deposition material transmitted from described crucible, it is inner that described block configuration portion is radially configured at described deposition material holding part, and described heating module is configured in described block configuration portion; And multiple nozzle, in described multiple nozzle, an end of each nozzle is communicated with the described deposition material holding part of described injector head and another end is exposed to the outside of described injector head to discharge the described deposition material evaporated by described heating module.
Described injector head can have double pipe structure.
Described heating module can comprise: module body; Heater strip, coiled arrangement is outside in described module body; And isolator, be configured at described module body outside to support described heater strip, and then prevent described heater strip from directly contacting described module body and described injector head.
Described linear evaporation source can comprise the shell of the outward appearance for the formation of described linear evaporation source further, and forms nozzle arrangement hole in the housing, and described multiple nozzle arrangement is in described nozzle arrangement hole.
Described linear evaporation source can comprise the cooling jacket be configured between described injector head and described shell further.
Wherein said crucible and described injector head surface coupled to each other can form inclined-plane, described crucible can comprise body and angled head, described deposition material is placed in described body, described angled head is formed to tilt at a predetermined angle relative to the length direction of described body in an end of described body, and described glass can be the glass for Organic Light Emitting Diode.
Accompanying drawing explanation
Read by reference to the accompanying drawings hereafter to describe in detail and more clearly will understand each example embodiments of the present invention.In the accompanying drawings:
Fig. 1 illustrates the structure of OLED;
Fig. 2 is the sectional view of the structure of linear evaporation source for schematically illustrating correlation technique;
Fig. 3 schematically illustrates the structure of the glass deposition equipment for flat-panel monitor according to the present invention one example embodiments;
Fig. 4 illustrates the structure of linear evaporation source shown in Fig. 3;
Fig. 5 is the enlarged view of the A of region shown in Fig. 4;
Fig. 6 is the enlarged view of the B of region shown in Fig. 4;
Fig. 7 is the skeleton view of injector head and heating module;
Fig. 8 is the enlarged view of major portion shown in Fig. 7; And
Fig. 9 is the skeleton view of crucible.
Main element description of symbols
1: injector head
2: nozzle
3: heater strip
4: heater block
5: tamper
6: cooling jacket
10: treatment chamber
100: linear deposit source
110: shell
111: nozzle arrangement hole
120: crucible
121: body
122: angled head
122a: the first flange part
130: heating module
131: module body
132: heater strip
133: isolator
134: head coupling unit
134a: cutting portion
135: annular component
140: injector head
140a: the second flange part
141: deposition material holding part
142: block configuration portion
150: nozzle
160: cooling jacket
A: region
B: region
Embodiment
For obtaining fully understanding the present invention and advantage thereof, please refer to the accompanying drawing for illustrating each example embodiments of the present invention.
Hereinafter, will explain that each example embodiments of the present invention is to elaborate the present invention by referring to accompanying drawing.In the drawings, identical Ref. No. represents identical element.
Fig. 3 schematically illustrates the structure of the glass deposition equipment for flat-panel monitor according to the present invention one example embodiments.
Before with reference to graphic being described, although flat-panel monitor comprises liquid-crystal display (LCD), Plasmia indicating panel (PDP) and Organic Light Emitting Diode (OLED), but in the following description, flat-panel monitor is described to OLED.
With reference to Fig. 3, the glass deposition equipment for flat-panel monitor according to example embodiments of the present invention comprises treatment chamber 10 and linear deposit source 100, in treatment chamber 10, perform depositing operation to glass, linear deposit source 100 is arranged at the side for the treatment of chamber 10, and towards glass discharge deposition material.
Treatment chamber 10 is the place performing glass deposition process.In other words, treatment chamber 10 is for depositing light emitting layer (organic substance) and electrode layer (inorganic substance) are with the place of OLED shown in shop drawings 1.The equipment for sedimentary organic material matter is can be according to the depositing device of example embodiments of the present invention.
During described depositing operation, the inside for the treatment of chamber 10 keeps vacuum atmosphere.Vacuum pump (not shown) can be connected to treatment chamber 10.
Linear evaporation source 100 is arranged at the side for the treatment of chamber 10 to discharge deposition material towards glass.
Linear evaporation source 100 according to example embodiments of the present invention discloses a kind of integrated morphology, and described integrated morphology does not need independent assembling, thus can prevent below by set forth for using the temperature deviation that may occur at every turn.
Specifically, owing to adopting the linear evaporation source 100 of example embodiments of the present invention, and do not need to adopt Large Copacity power supply unit, therefore latch up phenomenon can be prevented, that is, wherein the Kong Yin of multiple nozzle 150 shown in Fig. 5 as the organic substance sclerosis of deposition material blocked phenomenon.Therefore, not only can reduce the cost for installing or safeguard equipment, and the manufacture of equipment and the accessibility of maintenance can be improved.
The linear evaporation source 100 of example embodiments of the present invention is elaborated with reference to Fig. 4 to Fig. 9.
Fig. 4 illustrates the structure of linear evaporation source shown in Fig. 3.Fig. 5 is the enlarged view of the A of region shown in Fig. 4.Fig. 6 is the enlarged view of the B of region shown in Fig. 4.Fig. 7 is the skeleton view of injector head and heating module.Fig. 8 is the enlarged view of major portion shown in Fig. 7.Fig. 9 is the skeleton view of crucible.
See Fig. 4 to Fig. 9, the linear evaporation source 100 of example embodiments of the present invention can prevent latch up phenomenon and not adopt Large Copacity power supply unit, and comprises shell 110, crucible 120, heating module 130, injector head 140 and nozzle 150.
Shell 110 forms the outward appearance of the linear evaporation source 100 of example embodiments of the present invention.When linear evaporation source 100 pairs of horizontal glass of example embodiments of the present invention perform depositing operation, shell 110 can configure and be in horizontality (see Fig. 3) in treatment chamber 10.When performing depositing operation to vertical glass, shell 110 can configure and be in plumbness in treatment chamber 10.
Although do not elaborate, shell 110 can be assembled or be disassembled into the multiple cell enclosure connected along its length.
When shell 110 is by connecting multiple cell enclosure manufacture along its length and forming, all size from small dimension to large gauge advantageously suitably can be used.
Because above-mentioned explanation only relates to an exemplary embodiments, therefore correct scope of the present invention can be not limited only to this.
In other words, can the cell enclosure of the treatment chamber being applicable to have small dimension be manufactured separately for purposes and be applicable to have the cell enclosure for the treatment of chamber of large gauge.The structure of all cell enclosure can be identical.
Nozzle arrangement hole 111 is formed as shown in Figures 4 and 5, for discharging in the nozzle 150 by heating deposition material each nozzle arrangement in nozzle arrangement hole 111 in shell 110.The volume in nozzle arrangement hole 111 is greater than the volume of each nozzle in nozzle 150.In nozzle 150, each nozzle is configured to not from the outer exposed in nozzle arrangement hole 111 in nozzle arrangement hole 111.
Crucible 120 is for being coupled to the cylindrical structural of the side of shell 110.Be placed in crucible 120 by the deposition material evaporating to be deposited on the surface of glass.The deposition material be placed in crucible 120 is organic substance.
In the structure of crucible 120, with reference to Fig. 9, crucible 120 comprises body 121 and angled head 122, and deposition material is placed in body 121, and angled head 122 is formed to tilt at a predetermined angle relative to the length direction of body 121 in an end of body 121.
Owing to forming angled head 122 at crucible 120 place, therefore crucible 120 easily can removably be coupled to shell 110.In addition, owing to forming angled head 122 at crucible 120 place, therefore can the easy movement deposition material that will evaporate.
Injector head 140 is arranged in shell 110, and nozzle 150 is coupled to injector head 140.Crucible 120 is coupled to one end of injector head 140.
As shown in Figure 6, the formation inclined-plane, surface that wherein crucible 120 is coupled to each other with injector head 140.For this purpose, first flange part 122a and second flange part 140a is formed in the region that crucible 120 is coupled to each other with injector head 140 wherein.
Therefore, be that an angle utilizes screw to be coupled to each other by making the first flange part 122a and the second flange part 140a facing with each other due to the first flange part 122a and the second flange part 140a, therefore crucible 120 can easily be coupled inclined with injector head 140.
When the first flange part 122a and the second flange part 140a is coupled to each other, the first flange part 122a and the second flange part 140a is by being such as inserted in the packing ring gas-tight seal between the first flange part 122a and the second flange part 140a.
Alternatively, heating module 130 heats the deposition material of the inside being sent to injector head 140 from crucible 120.
In the related, heating module 130 is configured at injector head 140 outside.Therefore, the length of nozzle 2 (see Fig. 2) increases, and thus can occur latch up phenomenon.
In addition, for preventing latch up phenomenon, by improving heating power, deposition material is heated to comparatively high temps.Therefore, use and there is jumbo power supply unit, thus for installing or safeguarding that the cost of equipment increases.In addition, the complex structure of equipment, thus manufactures and repaired item may be difficult.But, according to example embodiments of the present invention, because heating module 130 is configured at injector head 140 inside, therefore can clearly solve the problem.
As shown in Fig. 7 and Fig. 8, heating module 130 comprises: module body 131; Heater strip 132, coiled arrangement is outside in module body 131; And isolator 133, be configured at module bodies 131 outside and support heater strip 132, and then preventing heater strip 132 directly contact modules body 131 and injector head 140.
When isolator 133 is configured at the outside and heater strip 132 of module body 131 and is spirally wound in module body 131 via isolator 133 as in example embodiments of the present invention, and then when forming heating module 130, greatly can improve the accessibility of manufacture.
Isolator 133 along the circumferential direction can be provided with multiple in module body 131 outside with equi-angularly space.
In example embodiments of the present invention, four isolators 133 along the circumferential direction configure with equi-angularly space in module body 131 outside, and correct scope of the present invention is not limited in an above-mentioned number isolator.
Head coupling unit 134 is arranged at an end of module body 131 further, and the end of injector head 140 is coupled to a coupling unit 134.Head coupling unit 134 has step-off construction.Multiple cutting portion 134a is formed in a coupling unit 134, but example embodiments of the present invention is not limited in this.
Multiple annular component 135 is arranged at several positions of module body 131 along the length direction of module body 131.Annular component 135 support insulator 133.
Alternatively, injector head 140 not only forms crucible 120 transmits deposition material position to it, and comprising heating module 130.In addition, nozzle 150 is coupled to the outside surface of injector head 140.
Injector head 140 has the double pipe structure different from correlation technique.In other words, injector head 140 has the double pipe structure comprising deposition material holding part 141 and block configuration portion 142, deposition material holding part 141 is for the accommodating deposition material transmitted from crucible 120, it is inner that block configuration portion 142 is radially configured at deposition material holding part 141, and heating module 130 is configured in block configuration portion 142.
Like this, heating module 130 configures the innermost portion being in injector head 140 and divides in block configuration portion 142, and produces heat.Deposition material is sent to from crucible 120 the deposition material holding part 141 that is arranged at outside, block configuration portion 142 and is placed in deposition material holding part 141.Therefore, deposition material can be heated by heating module 130, and is disposed to outside.
Specifically, because said structure does not need such as reflector, therefore the structure of equipment is simplified.Therefore, the installation that the manufacture of not only equipping can be easily but also equips or maintenance and repair also can be easily.
Cooling jacket 160 is configured between injector head 140 and casing 110.Cooling jacket 160 cool deposition material high temperature or equipment maintenance and repair during cooling spray mouth 140.
Alternatively, in nozzle 150, an end of each nozzle is communicated with the deposition material holding part 141 of injector head 140 and in the nozzle arrangement hole 111 of casing 110, be configured to be exposed to injector head 140 outside in another end.Nozzle 150 discharges the deposition material evaporated by heating module 130 towards substrate shown in Fig. 3.
In example embodiments of the present invention, as mentioned above, heating module 130 is configured in block configuration portion 142 and (is namely in the most inboard of injector head 140), and produce heat, deposition material is sent to the deposition material holding part 141 being arranged at outside, block configuration portion 142 from crucible 120, be placed in deposition material holding part 141, and heated by heating module 130, and nozzle 150 is connected to deposition material holding part 141.Therefore, different from reference to the correlation technique described in Fig. 2, the length of nozzle 150 can be made to keep short as much as possible.Therefore, can prevent the hole of nozzle 150 along with the organic substance sclerosis as deposition material blocked latch up phenomenon.
Concise and to the point elaboration below has the operation of the substrate deposition equipment for flat-panel monitor of said structure.
For performing depositing operation to substrate, the heating module 130 to linear evaporation source 100 supplies electric power.
When heating module 130 to be heated to because of supplied electric power such as exceed a few Baidu time, heat is passed to the deposition material holding part 141 of injector head 140.
Then, heat and evaporate and to transmit and through the deposition material of deposition material holding part 141 from crucible 120.Therefore, deposition material can be disposed to the outside of casing 110 to be deposited on the surface of glass via nozzle 150.
In this operation, the calorific loss via the tamper in correlation technique can be reduced, and therefore can by most of transmission ofenergy of heating module 130 to injector head 140 and nozzle 150.Therefore, can high-level efficiency be kept, and therefore can use the power supply unit with relative low capacity.
According to there is said structure and operation and do not use the example embodiments of the present invention of relatively high capacity power supply unit as correlation technique, latch up phenomenon can be prevented.Therefore, not only can reduce the cost for installing or safeguard equipment, and the manufacture of equipment and the accessibility of maintenance can be improved.
Although specifically show with reference to each example embodiments of the present invention and set forth the present invention, should be understood that under the condition of the spirit and scope not deviating from following claims, in form and details, various change can be made to the present invention.
Claims (16)
1. a linear evaporation source, is characterized in that, comprising:
Heating module, for from crucible heating deposition material;
Injector head, comprise deposition material holding part and block configuration portion, described deposition material holding part is used for the accommodating described deposition material transmitted from described crucible, it is inner that described block configuration portion is radially configured at described deposition material holding part, and described heating module is configured in described block configuration portion; And
Multiple nozzle, in described multiple nozzle, an end of each nozzle is communicated with the described deposition material holding part of described injector head and another end is exposed to the outside of described injector head to discharge the described deposition material evaporated by described heating module.
2. linear evaporation source as claimed in claim 1, it is characterized in that, described injector head has double pipe structure.
3. linear evaporation source as claimed in claim 1, it is characterized in that, described heating module comprises:
Module body; And
Heater strip, coiled arrangement is outside in described module body.
4. linear evaporation source as claimed in claim 3, it is characterized in that, form the head coupling unit with step-off construction in an end of described module body, the end of described injector head is coupled to described head coupling unit, and multiple cutting portion is formed in described head coupling unit.
5. linear evaporation source as claimed in claim 3, it is characterized in that, described heating module comprises isolator further, and it is outside to support described heater strip that described isolator is configured at described module body, and then prevent described heater strip from directly contacting described module body and described injector head.
6. linear evaporation source as claimed in claim 5, it is characterized in that, described isolator is along the circumferential direction provided with multiple with equi-angularly space in described module body outside and is supported by multiple annular component.
7. linear evaporation source as claimed in claim 1, is characterized in that, comprise the shell of the outward appearance for the formation of described linear evaporation source further,
Wherein form nozzle arrangement hole in the housing, described multiple nozzle arrangement is in described nozzle arrangement hole.
8. linear evaporation source as claimed in claim 7, is characterized in that, comprise the cooling jacket be configured between described injector head and described shell further.
9. linear evaporation source as claimed in claim 1, is characterized in that, wherein said crucible and described injector head formation inclined-plane, surface coupled to each other,
The first flange part and the second flange part is formed wherein in described crucible and described injector head region coupled to each other, and
When described first flange part and described second flange part coupled to each other time, described first flange part and described second flange part gas-tight seal.
10. linear evaporation source as claimed in claim 1, it is characterized in that, described crucible comprises: body, and described deposition material is placed in described body; And
Angled head, is formed to tilt at a predetermined angle relative to the length direction of described body in an end of described body.
11. 1 kinds of glass deposition equipment for flat-panel monitor, described glass deposition equipment comprises:
Treatment chamber, performs depositing operation to glass in described treatment chamber; And
Linear evaporation source, is arranged at the side of described treatment chamber to discharge deposition material towards described glass,
Wherein said linear evaporation source comprises:
Heating module, for heating described deposition material from crucible;
Injector head, comprise deposition material holding part and block configuration portion, described deposition material holding part is used for the accommodating described deposition material transmitted from described crucible, and described block configuration portion radial arrangement is inner in described deposition material holding part, and described heating module is configured in described block configuration portion; And
Multiple nozzle, an end of each nozzle in described multiple nozzle is communicated with the described deposition material holding part of described injector head and another end is exposed to the outside of described injector head to discharge the described deposition material evaporated by described heating module.
12. glass deposition equipment as claimed in claim 11, it is characterized in that, described injector head has double pipe structure.
13. glass deposition equipment as claimed in claim 11, it is characterized in that, described heating module comprises:
Module body;
Heater strip, coiled arrangement is outside in described module body; And
Isolator, is configured at described module body outside to support described heater strip, and then prevents described heater strip from directly contacting described module body and described injector head.
14. glass deposition equipment as claimed in claim 11, it is characterized in that, described linear evaporation source comprises the shell of the outward appearance for the formation of described linear evaporation source further, and
Form nozzle arrangement hole in the housing, described multiple nozzle arrangement is in described nozzle arrangement hole.
15. glass deposition equipment as claimed in claim 14, it is characterized in that, described linear evaporation source comprises the cooling jacket be configured between described injector head and described shell further.
16. glass deposition equipment as claimed in claim 11, is characterized in that, wherein said crucible and described injector head formation inclined-plane, surface coupled to each other,
Described crucible comprises body and angled head, and described deposition material is placed in described body, and described angled head is formed to tilt at a predetermined angle relative to the length direction of described body in an end of described body, and
Described glass is the glass for Organic Light Emitting Diode.
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| KR10-2013-0071385 | 2013-06-21 | ||
| KR20130071385A KR101479942B1 (en) | 2013-06-21 | 2013-06-21 | Linear evaporation source and thin layers deposition apparatus for flat panel display having the same |
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| CN104233198A true CN104233198A (en) | 2014-12-24 |
| CN104233198B CN104233198B (en) | 2017-01-04 |
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| KR102104307B1 (en) * | 2017-12-28 | 2020-05-29 | 주식회사 에스에프에이 | Linear evaporation source |
| KR102020768B1 (en) | 2017-12-29 | 2019-09-11 | 주식회사 에스에프에이 | Glass Deposition Apparatus |
| KR102190642B1 (en) | 2018-12-26 | 2020-12-14 | 주식회사 에스에프에이 | High temperature evaporation source |
| KR102160508B1 (en) * | 2018-12-26 | 2020-09-28 | 주식회사 에스에프에이 | Linear evaporation source |
| KR102229164B1 (en) | 2019-10-18 | 2021-03-17 | 주식회사 에스에프에이 | High temperature evaporation source |
| KR102243719B1 (en) | 2019-10-18 | 2021-04-23 | 주식회사 에스에프에이 | High temperature evaporation source |
| KR102257020B1 (en) | 2019-12-27 | 2021-05-26 | 주식회사 에스에프에이 | High temperature evaporation source |
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| KR101282537B1 (en) * | 2011-09-16 | 2013-07-04 | 주식회사 야스 | Linear Source For Large Area Substrate |
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| KR100467535B1 (en) * | 2004-03-11 | 2005-01-24 | 주식회사 야스 | Linear type evaporator and apparatus for deposition by using it |
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| CN104233198B (en) | 2017-01-04 |
| KR101479942B1 (en) | 2015-01-12 |
| KR20140148035A (en) | 2014-12-31 |
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