CN104218446B - Strip installing device and strip installing method for semiconductor laser - Google Patents
Strip installing device and strip installing method for semiconductor laser Download PDFInfo
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- CN104218446B CN104218446B CN201410485065.XA CN201410485065A CN104218446B CN 104218446 B CN104218446 B CN 104218446B CN 201410485065 A CN201410485065 A CN 201410485065A CN 104218446 B CN104218446 B CN 104218446B
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- bar
- bearing
- ridges
- ambulatory splint
- outer lateral
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Abstract
The invention discloses a strip installing device and a strip installing method for semiconductor laser, the device comprises a support and a clamp, four ridges with interval are formed on the support, two ridges at outer sides are the same on height and two ridges at the middle are the same on height, the height of two ridges at the middle is less than that of two ridges at outer sides; the clamp comprises a fixing clamping board, a mobile clamping board and a guide pillar, the guide pillar is formed on the fixing clamping board, the mobile clamping board is mounted on the guide pillar, a spring is formed between the mobile clamping board and the fixing clamping board, the mobile clamping board is provided with four grooves being corresponding to the four ridges on the support; the clamp is located on the support for installing the strips, the fixing clamping board and the mobile clamping board of the clamp are located between four ridges on the support, and the support is inclined, the accompany strips and super bars are arranged on the support from the lower part to the upper part with interval and clamped between the fixing clamping board and the mobile clamping board. The device can eliminate the shield among the strips, the cavity surface film layer evenness for cavity can be guaranteed after coated, and the yield and performance stability of the tube core are raised.
Description
Technical field
The present invention relates to a kind of for bar loading device during plating films on cavity surfaces of semiconductor lasers and dress bar method, belong to and partly lead
Body laser cavity surface film coating technical field.
Background technology
Semiconductor laser relies on the advantages of small volume, life-span length to have been widely used military affairs, medical treatment, optic communication, processing
In field.In the production process of semiconductor laser, need for epitaxial wafer to be cleaved into bar bar, for avoiding Cavity surface oxidation and improving
The performances such as the power of laser instrument, it usually needs carry out plated film in bar bar Cavity surface.At present, the master that bar bar cavity surface film coating exists
The problem is wanted to be：Because of reasons such as the long error in chamber, dress bar technology, being uneven occurs in bar bar cavity length direction after shelving.During plated film, high
Low uneven bar bar leads to film layer uneven because blocking；Film layer inequality causes the reflectivity of Cavity surface inconsistent, ultimately results in tube core work(
Rate is low, stability is poor.Especially for laser product more than watt level, the problems referred to above are particularly evident, and had a strong impact on sharp
The performance of light device product and qualification rate.
Disclosed in Chinese patent literature CN102545041A《Films on cavity surfaces of semiconductor lasers accompanies bar and preparation method》It is proposed that
A kind of prevent adjacent semiconductor laser bar from sticking together, it is to avoid the method for " shade " effect.The method is with " convex " word
Bar bar is spaced apart by the bar of accompanying of type, accompanies the width of bar to be less than bar bar, bar bar one end ratio accompanies bar high, accompany the thickness of bar as bar bar between
Gauge from；The other end, with to accompany bar concordant, accompanies the depth of bar groove as accompanying bar and bar bar spacing distance.
Said method has the following disadvantages：
1st, bar is accompanied to need to process the groove of corresponding size, technique is relative complex.
2nd, effective spacing at laser bar bar two ends is different；It is inconsistent, especially that two Cavity surfaces of bar bar remove " shade " effect
Laser bar bar one end concordant with accompanying bar, the side near non-crestal surface there is also " shade " effect.
Putting the during bar bar it is desirable to side of bar band ridge must be adjacent with accompanying band groove face, and operation easier is relatively large.
Content of the invention
The present invention is directed to the deficiency that dress bar technology during existing plating films on cavity surfaces of semiconductor lasers exists, and provides a kind of structure
It is simple and convenient to operate, ensure that the semiconductor laser bar loading device of Cavity surface membrane uniformity, this device a kind of is provided simultaneously
Dress bar method.
The semiconductor laser bar loading device of the present invention, employs the following technical solutions：
This device, including bearing and fixture, fixture is placed on bearing, spaced four vallates of bearing upper band, two outsides
The height of ridge is identical, and the height of middle two ridges is identical, and the height of middle two ridges is less than the height of two outer lateral ridges；Middle two
The length being smaller than filled bar bar of individual ridge, the spacing of two outer lateral ridges is more than the bar bar length of filled bar bar and is less than institute
The length of bar need to be accompanied；Fixture includes strap, ambulatory splint and guide pillar, and strap is provided with guide pillar, and ambulatory splint is pacified
It is contained on guide pillar, between ambulatory splint and strap, is provided with spring, ambulatory splint is provided with and four vallate phases on bearing
Corresponding four bar grooves.
The height of middle two ridges is less than the height 0.01mm of two outer lateral ridges.
The method entering luggage bar by above-mentioned semiconductor laser bar loading device, comprises the following steps：
（1）The bar bar length of cleavage is more than the spacing of two ridges in the middle of bearing, and is less than the spacing of two outer lateral ridges, makes bar
Bar can be taken and be placed on two center spine and do not reach two outer lateral ridges；Depending on bar bar chamber length is according to design requirement；
（2）Bar is accompanied in making：Accompany the thickness of bar consistent with bar bar, accompany bar chamber length little 0.02mm longer than bar bar chamber, accompany bar length
Spacing more than two outer lateral ridges on bearing；
（3）Fixture is placed on bearing, make the strap of fixture and four vallates that ambulatory splint is on bearing it
Between, strap is against the lower end of four vallates of bearing, and the gathering sill on ambulatory splint is accordingly stuck in four vallates on bearing
On；Make bearing slant setting, angle of inclination ensures that entirety will not be toppled over after placing bar bar and accompanying bar；Push activity folder upwards open
One is first accompanied bar to be placed on two outer lateral ridges of bearing and fall on strap by plate, then accompanies one bar bar of placement on bar at this,
Bar bar is supported on centre two vallate of bearing, so accompanies bar and bar bar to be gradually respectively placed on bearing from bottom to top, on
Lower both sides are final to be to accompany bar；Placement finishes, and decontrols ambulatory splint, and ambulatory splint is clamped under the action of the spring and accompanied bar and bar bar.
Finally the fixture being clamped with bar bar is placed in filming equipment and carries out plated film production.
Present configuration is simple, operation easier is relatively low, can eliminate blocking between bar bar, can ensure that bar bar chamber after plated film
Face mask layer uniformity, substantially increases qualification rate and the stability of tube core, and the bar bar qualification rate after plated film is carried by less than 88%
High to more than 97%.
Brief description
Fig. 1 is the structural representation of semiconductor laser bar loading device of the present invention.
Fig. 2 is the top view of Fig. 1.
Fig. 3 is the left view of Fig. 1.
Fig. 4 is the position relationship schematic diagram of four vallates on bearing.
Fig. 5 is dress bar schematic diagram.
Fig. 6 is present invention dress bar effect and tradition conventional dress bar Contrast on effect schematic diagram.
In figure：1st, bearing, 2, ridge, 3, strap, 4, guide pillar, 5, ambulatory splint, 6, spring, 7, groove, 8, accompany bar, 9, bar
Bar.
Specific embodiment
As shown in figure 1, the semiconductor laser bar loading device of the present invention, including bearing 1 and fixture, fixture is placed in bearing 1
On.Four vallates 2 are arranged on bearing 1, referring to Fig. 4, A, B, C, D tetra- vallate arranged for interval, the height phase of two outer lateral ridge A and D
With the height of middle two ridge B with C is identical, and the height of middle two ridge B and C is less than the height of two outer lateral ridge A and D
0.01mm.The length being smaller than bar bar 1 of middle two ridge B and C, the spacing of two outer lateral ridge A and D is more than bar bar length.
Fixture includes strap 3, guide pillar 4 and ambulatory splint 5, and strap 3 is provided with two guide pillars 4, and ambulatory splint 5 is arranged on
Article two, on guide pillar 4, between ambulatory splint 5 and strap 3, it is provided with spring 6.Be provided with ambulatory splint 5 with bearing 1 on four
Four corresponding gathering sills 7 of vallate（Referring to Fig. 2）.Fixture is placed on bearing 1, and strap 3 is against four vallates of bearing 1
Lower end, the lower end blocking four vallates is motionless, and four bar grooves 7 on ambulatory splint 5 are corresponding with four vallate positions on bearing 1, activity
Clamping plate 5 can along guide pillar 4 and bearing 1 ridge slide, along guide pillar 4 pull up ambulatory splint 5 when, ambulatory splint 5 can be subject to two
The pulling force of side spring 6.
The process entering luggage bar by above-mentioned semiconductor laser bar loading device is as described below：
1. epitaxial wafer is cleaved into bar bar, depending on bar bar chamber length is according to design requirement, bar bar length is more than two ridge B and C
Spacing, and be less than the spacing of two outer lateral ridge A and D, so that bar bar is taken and be placed on ridge B and C but do not reach ridge A again
And D；
2. make and accompany bar 8：Si piece or other material are cleaved into and accompany bar 8, dimensional requirement is as follows：Thickness is suitable with bar bar 1,
Chamber length 0.02mm less than bar bar 1, length is more than the spacing of ridge A and D, but takes and do not affect other operations when being placed on ridge A and D；
3., as shown in figure 5, being placed into fixture on bearing 1, make strap 3 and ambulatory splint 5 be on bearing 1 four
Between vallate, strap 3 is against the lower end of four vallates of bearing 1, and four bar grooves 7 on ambulatory splint 5 are accordingly stuck in bearing 1
On four vallates on.Make bearing 1 slant setting, angle of inclination ensures that entirety will not be toppled over after placing bar bar and accompanying bar.Upwards
Push ambulatory splint 5 open, first bar 8 will be accompanied to be placed on ridge A and D of bearing 1, then place bar bar 9 on accompanying bar 8, bar bar 9 is supported on and props up
On centre two vallate B and C of seat 1, bar 8 and bar bar 9 is so accompanied gradually respectively to be placed on bearing 3 from bottom to top, upper and lower two
Side is final to be to accompany bar 8.Finally, decontrol ambulatory splint 5, ambulatory splint 5 is clamped in the presence of spring 6 and accompanied bar 8 and bar bar 9.Complete
After becoming dress bar, bar bar 9 accompanies the high 0.01mm of bar 8 in the long two ends in chamber all ratios, and bar bar 9 is the formation of accompanying between bar thickness in the long both sides in chamber
Away from.
Fig. 6 gives the dress bar effect of the present invention and the contrast of tradition conventional dress bar effect, and upper figure is the dress bar of the present invention
Effect, figure below is tradition conventional dress bar effect, and in figure above-below direction is cavity length direction.This it appears that the present invention can eliminate
Blocking between bar bar, can ensure that bar bar Cavity surface membrane uniformity after plated film, the qualification rate substantially increasing tube core is steady with performance
Qualitative.
4. the fixture being clamped with bar bar is placed in filming equipment and carries out plated film production.
Claims (3)
1. a kind of semiconductor laser bar loading device, including bearing and fixture, is characterized in that：Fixture is placed on bearing, on bearing
Carry spaced four vallates, the height of two outer lateral ridges is identical, the height of middle two ridges is identical, the height of middle two ridges is little
Height in two outer lateral ridges；The length being smaller than filled bar bar of middle two ridges, the spacing of two outer lateral ridges is more than institute
Fill the bar bar length of bar bar and be less than the required length accompanying bar；Fixture includes strap, ambulatory splint and guide pillar, geometrical clamp
Guide pillar is provided with plate, ambulatory splint is arranged on guide pillar, between ambulatory splint and strap, is provided with spring, ambulatory splint
On be provided with four bar grooves corresponding with four vallates on bearing.
2. semiconductor laser bar loading device according to claim 1, is characterized in that：The height of two ridges in described centre is little
Height 0.01mm in two outer lateral ridges.
3. the method that semiconductor laser bar loading device described in a kind of claim 1 enters luggage bar, is characterized in that, walks including following
Suddenly：
（1）The bar bar length of cleavage is more than the spacing of two ridges in the middle of bearing, and is less than the spacing of two outer lateral ridges, enables bar bar
Enough take and be placed on two center spine and do not reach two outer lateral ridges；
（2）Bar is accompanied in making：Accompany the thickness of bar consistent with bar bar, accompany bar chamber length little 0.02mm longer than bar bar chamber, accompany bar length to be more than
The spacing of two outer lateral ridges on bearing；
（3）Fixture is placed on bearing, so that the strap of fixture and ambulatory splint is between four vallates on bearing, Gu
Clamp plate is against the lower end of four vallates of bearing, and the gathering sill on ambulatory splint is accordingly stuck on four vallates on bearing；Make
Bearing slant setting, angle of inclination ensures that entirety will not be toppled over after placing bar bar and accompanying bar；Push ambulatory splint upwards open, first will
Accompany bar to be placed on two outer lateral ridges of bearing and fall on strap for one, then accompany one bar bar of placement on bar at this, bar bar props up
Support, on centre two vallate of bearing, so accompanies bar and bar bar to be gradually respectively placed on bearing, upper and lower both sides from bottom to top
Final is to accompany bar；Placement finishes, and decontrols ambulatory splint, and ambulatory splint is clamped under the action of the spring and accompanied bar and bar bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410485065.XA CN104218446B (en) | 2014-09-22 | 2014-09-22 | Strip installing device and strip installing method for semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410485065.XA CN104218446B (en) | 2014-09-22 | 2014-09-22 | Strip installing device and strip installing method for semiconductor laser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104218446A CN104218446A (en) | 2014-12-17 |
| CN104218446B true CN104218446B (en) | 2017-02-22 |
Family
ID=52099695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410485065.XA Active CN104218446B (en) | 2014-09-22 | 2014-09-22 | Strip installing device and strip installing method for semiconductor laser |
Country Status (1)
| Country | Link |
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| CN (1) | CN104218446B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105006740A (en) * | 2015-07-23 | 2015-10-28 | 山东华光光电子有限公司 | End face coating fixture for stripe-geometry semiconductor laser and application thereof |
| CN106025789A (en) * | 2016-06-30 | 2016-10-12 | 西安立芯光电科技有限公司 | Facet film-plating clamp for semiconductor laser chip |
| CN107132594B (en) * | 2017-04-28 | 2019-10-25 | 武汉锐晶激光芯片技术有限公司 | A kind of heap bar machine, its fixture and the heap bar method using heap bar machine |
| CN110768102B (en) * | 2018-07-26 | 2021-08-03 | 潍坊华光光电子有限公司 | Clamp for laser bar cavity surface coating and using method thereof |
| CN111628406B (en) * | 2019-02-28 | 2021-07-02 | 潍坊华光光电子有限公司 | Strip mounting clamp with vacuum adsorption effect and strip mounting method |
| CN110744472B (en) * | 2019-09-30 | 2023-09-26 | 武汉云岭光电股份有限公司 | Stacking clamp |
| CN112993755B (en) * | 2019-11-29 | 2022-02-18 | 山东华光光电子股份有限公司 | Semiconductor laser chip and application method thereof |
| CN112501576B (en) * | 2020-11-30 | 2022-09-20 | 武汉光迅科技股份有限公司 | Clamp and clamping method for semiconductor laser bar |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03268382A (en) * | 1990-03-16 | 1991-11-29 | Mitsubishi Electric Corp | Manufacture of semiconductor laser device |
| US6170132B1 (en) * | 1999-09-01 | 2001-01-09 | Lucent Technologies Inc. | Magnetic laser bar clamp |
| JP4075057B2 (en) * | 2003-05-13 | 2008-04-16 | 住友電気工業株式会社 | Fixing jig for semiconductor laser bar and method for installing semiconductor laser bar on this fixing jig |
| CN1271762C (en) * | 2004-10-14 | 2006-08-23 | 北京工业大学 | Gripper used for semiconductor laser chamber surface filming and bar loading device |
| JP2007123374A (en) * | 2005-10-26 | 2007-05-17 | Oputo System:Kk | Aligning device and suction device for small electronic device |
| CN102545041A (en) * | 2012-01-17 | 2012-07-04 | 苏州纳睿光电有限公司 | Coating strip of cavity surface of semiconductor laser and preparation method thereof |
-
2014
- 2014-09-22 CN CN201410485065.XA patent/CN104218446B/en active Active
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| CN104218446A (en) | 2014-12-17 |
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| C14 | Grant of patent or utility model | ||
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| CP01 | Change in the name or title of a patent holder |
Address after: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Patentee after: SHANDONG HUAGUANG OPTOELECTRONICS CO., LTD. Address before: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Patentee before: Shandong Huaguang Photoelectronic Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder |