CN106025789A - Facet film-plating clamp for semiconductor laser chip - Google Patents
Facet film-plating clamp for semiconductor laser chip Download PDFInfo
- Publication number
- CN106025789A CN106025789A CN201610505896.8A CN201610505896A CN106025789A CN 106025789 A CN106025789 A CN 106025789A CN 201610505896 A CN201610505896 A CN 201610505896A CN 106025789 A CN106025789 A CN 106025789A
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- China
- Prior art keywords
- shaped
- plate
- bar
- lower plate
- semiconductor laser
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention provides a novel facet film-plating clamp for a semiconductor laser chip. The clamp has advantages of stable clamping, simple structure, convenient operation, and easy processing; and film plating can be carried out products in batches and the plated film quality can be improved effectively. The clamp comprises a flat-panel U-shaped frame assembly and a choke plug assembly arranged at a U-shaped opening end; and a plurality of bars are stacked successively from a U-shaped closing end to the U-shaped opening end in a planar closing area encircled by the flat-panel U-shaped frame assembly and the choke plug assembly. The inner side width of a U-shaped middle plate of the flat-panel U-shaped frame assembly is larger than inner side widths of a lower plate and a U-shaped upper plate, so that side cavity parts at the two ends of the multiple bars are supported on a rail surface reserved by the lower plate, are pressed and covered by a rail surface reserved by the U-shaped upper plate, and are limited by the U-shaped middle plate in a horizontal direction. The choke plug assembly applies tightening pressures on the multiple bars from the U-shaped opening end to the U-shaped closing end.
Description
Technical field
The present invention relates to a kind of semiconductor laser chip cavity surface film coating fixture.
Background technology
High power semiconductor lasers have all solid state, volume is little, lightweight, long-life, high efficiency,
Reliability is high and metal absorbs advantages of higher to semiconductor laser, thus is widely used in solid and swashs
The pumping source of light device, Laser Processing, cut, precision detection and measurement, command, control, communications, and information process,
Medical treatment and each side such as beauty treatment, military affairs, and cause revolutionary breakthrough in many fields, the market demand
Amount and development potentiality are huge.
Resonator cavity cleavage surface is the important component part of semiconductor laser, and it has for the reliability of device
Important impact.The generally reflectance of GaAs its natural cleavage plane of laser instrument is about 32%, unsatisfactory
And natural cleavage plane the most easily aoxidizes and suffers ambient contamination, affect laser performance special
It it not the life-span of high power semiconductor.And be energy in semiconductor laser processing procedure to laser cavity surface plated film
Enough effective important process improving performance parameter so that it is improve output further, drop low-threshold power
Stream, effectively protection face, chamber.
Owing to chip of laser is small-sized, in its cavity surface film coating technique, the form of cleavage bar is usually taken；
Semi-conducting material itself is the most fragile, easily snaps off, or chip clamps not strongly slip or drops, and can cause brokenly
Damage；One time plated film need to load multiple cleavage bar, need to ensure that the uniformity of its film plating layer makes its cleavage surface be in
Same level, is typically required for a specific purpose tool to clamp solution for solving these problems in coating process
Reason bar, this fixture is referred to as film plating frame, therefore the Design and Machining of coating clamp and important.
At present, conventional coating clamp is primarily present problems with:
1. fixture structure is complicated, the cleaning after being unfavorable for processing and using, maintenance, causes precise decreasing fast,
Service life shortens.
2. at present relatively multiple clip can only coating single side, double-sided coating needs twice dismounting, assembling, repeatable operation
Relatively big to chip damage, fixed area angle causes greatly shade；
3. chip structure is complicated, and tolerance is little, high to personnel's skill set requirements, such as stacks and have some setbacks in operating process
Profit easily causes chamber surface pollution or damage, causes work efficiency, yield rate low, damages product；
4. unreasonable, the chip of individual clips structure design clamps not strongly slip or drops, and can cause breakage；
5. clamp structure is complicated, and parts are many, and clamp precision is required height, and processed finished products rate is low, is processed into
This height；
6. fixture assembly parts are many, deposit chip position few, and one time plated film amount is few, and production cost is high；Fixture
Structure is complicated, the most easy to clean, easily pollutes chip end face in coating process.
Summary of the invention
The present invention proposes a kind of new semiconductor laser chip cavity surface film coating fixture, and clamping is stable, structure letter
Bright, easy to operate, easily processing, can high-volume plated film, be effectively improved coating quality.
Technical scheme is as follows:
This semiconductor laser chip cavity surface film coating fixture includes flat-plate U frame assembly and is positioned at U-shaped opening
Plug component, in flat-plate U frame assembly and plug component surround the plane enclosed region of formation, if
A dry bar bar stacks gradually arrangement from U-shaped Guan Bi end to U-shaped opening；Described flat-plate U frame assembly has
Body mainly by vertically stacking gradually, relatively-stationary U-shaped upper plate, U-shaped middle plate and lower plate form；
Described lower plate is U-shaped, consistent with U-shaped upper plate, U-shaped middle plate opening direction, or described lower plate is for closing
Ring-like, cylindrical void in the middle part of lower plate and U-shaped upper plate, U-shaped middle plate are through；The inboard width of U-shaped middle plate is big
In lower plate and the inboard width of U-shaped upper plate so that if the lucky support in side chamber position, two ends of wizened bar under
The rail level gland that reserves on the rail level that plate reserves and by U-shaped upper plate, simultaneously by U-shaped middle plate in level side
To spacing, described plug component applies top to U-shaped Guan Bi end to several bar bars described from U-shaped opening
Tight pressure.
On the basis of above scheme, the present invention has made following optimization the most further:
In described plane enclosed region, the two ends of several bar bars described are respectively arranged with cushion block.So,
The two ends of folded bar directly do not contact with flat-plate U frame assembly and plug component.
In several bar bars, 1-3 the bar bar being positioned at two ends is spacer bar, and remaining main body bar bar is
Spacer bar is spaced apart with bar to be coated.
The inside contact surface of lower plate and U-shaped upper plate has incline structure, to ensure near U-shaped Guan Bi end
The face, chamber of bar bar is not blocked.
Plug component specifically includes jackscrew and jackscrew fixed block, jackscrew fixed block and flat-plate U frame assembly
U-shaped opening is fixing to be connected, and jackscrew applies the pressure holding out against several bar bars described through jackscrew fixed block
Power.
The opening of U-shaped middle plate extends beyond lower plate and U-shaped upper plate；Described jackscrew fixed block is I shape
Structure or T-type structure, be connected by screw fixing with the extension of U-shaped middle plate.
U-shaped upper plate, U-shaped middle plate and lower plate connect fixing by the screw that vertical direction runs through.
If furthermore it is also possible to be grouped by wizened bar, each group is placed in the filling module of a frame structure,
The side chamber position, two ends of bar bar, is made by the indirect support of framework of filling module on the rail level that lower plate reserves
Bar bar side chamber contacts with fixture zero.
The present invention has following technical effect that
1, clamper component is simple, be beneficial to processing, can be machined to degree of precision；Reusable, reliability
High.
2, can fix by reliable retention, positive and negative end face plated film simultaneously.
3, the shielded area of plated film window reduces.
4, use the present invention, can effectively reduce laser instrument bar bar manufacturing process steps, improve production efficiency.
More than 70 semiconductor laser bar bar of quantity can be disposably installed.
Accompanying drawing explanation
Fig. 1 is the schematic diagram after present clip assembling.
Fig. 2 is the fractionation schematic diagram (not loading bar bar) of core component in the present invention.
Fig. 3 is the plan view of Fig. 2.
Fig. 4 is the lateral plan of Fig. 2.
Fig. 5 is the fractionation schematic diagram (U-shaped middle plate is filled with bar bar) of core component in the present invention.
Fig. 6 is the schematic diagram that plug component has not yet been assembled by structure shown in Fig. 1.
Drawing reference numeral illustrates:
1-flat-plate U frame assembly；101-U type upper plate；Plate in 102-U type；103-closed-loop type lower plate；2-
Rustless steel cushion block；3-bar bar；4-jackscrew fixed block；401-jackscrew is through the position of jackscrew fixed block；1030-
The groove suitable with jackscrew external diameter arranged in closed-loop type lower plate.
Detailed description of the invention
As shown in Figure 1 and Figure 2, this coating clamp includes flat-plate U frame assembly 1 and is positioned at U-shaped opening
The plug component (illustrate only jackscrew fixed block 4 therein in figure) of end, at flat-plate U frame assembly with stifled
Head assembly surrounds in the plane enclosed region of formation, the rustless steel pad that several bar bars 3 and two ends thereof are arranged
Block 2 stacks gradually arrangement from U-shaped Guan Bi end to U-shaped opening.
Flat-plate U frame assembly is specifically mainly by vertically stacking gradually, by the through connection of screw admittedly
Fixed U-shaped upper plate 101, U-shaped middle plate 102 and closed-loop type lower plate 103 form, the most U-shaped middle plate 102
Inboard width more than closed-loop type lower plate 103 and the inboard width of U-shaped upper plate 101, wherein so that if
The lucky support in side chamber position, two ends of wizened bar is on the rail level that closed-loop type lower plate reserves and by U-shaped upper plate
The rail level gland that reserves, the most spacing by U-shaped middle plate.The opening of U-shaped middle plate extends
Beyond closed-loop type lower plate and U-shaped upper plate；Jackscrew fixed block is I-shaped structure, with the extension of U-shaped middle plate
Portion is connected by screw fixing, if the jackscrew of plug component from U-shaped opening to U-shaped Guan Bi end to described
Dry bar bar applies the pressure held out against.
Here, the preferred closed-loop type of lower plate, mainly in view of the concrete condition at coating process: in vacuum
In chamber, sputtering target material is placed in the bottom of vacuum chamber, and the coating clamp filling laser chip is placed in sputtering
The surface of target, the top of fixture can arrange quartz lamp, is used for heating chip.In order to avoid quartz lamp
Sputtered, so lower plate does not use U-shaped, but use closed-loop type, double as quartz lamp and sputtering target material
Between barrier.
Therefore, even if lower plate is also adopted by U-shaped, also advise sealing by the transverse slat of one fixed width at U-shaped opening
Stifled rectangular square frame shape, additionally it is possible to a part of region of support cushion block, with prevent cushion block and plug component it
Between leave gap, make sputtering material pass this gap and be deposited on the quartz lamp above chip, impact quartz
The heats of lamp and service life.
Owing in the present embodiment, the diameter of jackscrew is more than the thickness of U-shaped middle plate, therefore, lower plate corresponds to U
Type open end is additionally provided with the groove suitable with jackscrew external diameter, thus ensures that jackscrew is reliably installed.
In several bar bars, 1-3 the bar bar being positioned at two ends is spacer bar, remaining main body bar bar
It is spaced apart with bar to be coated for spacer bar.
The inside contact surface of closed-loop type lower plate and U-shaped upper plate has incline structure, to ensure to close near U-shaped
The face, chamber of the bar bar closing end is not blocked.
The assembling process of this coating clamp can follow the steps below:
(1) closed-loop type lower plate and U-shaped middle plate are put on assistance with hill, form groove (closed-loop type lower plate
The rail level reserved)；
(2) play rustless steel cushion block both sides with probe forceps sub-folder to be put in groove, draw bar P face by wand
Right edge, forward, high-reflecting film (HR face), towards operator, is put in not anti-reflection film (AR face) completely
On rust bloom cushion block；The 1-3 layer of bottommost places spacer bar；
(3) needing plated film bar bar with wand absorption, forward-facing, HR is facing to operator, gently for AR
It is put on spacer bar；
(4) spacer bar is spaced apart with bar to be coated, the most upwards stacks；Bar bar
After placement completes, need to place 3 spacer bar more above, then rustless steel cushion block is placed on above, bar
Bar has been placed；
(5) by HR towards on be put on U-shaped middle plate (face, U-shaped Guan Bi bottom), U-shaped upper plate is installed
With jackscrew fixed block；Lift assistance with hill gently, shake gently, allow all bar bars align；
(6) installing rear left hand and be fixed motionless, screw is put in screw hole inner opposite angle and twists by the right hand successively
After Jin, taking off from assistance with hill, assembling completes, and carries out plated film.
Claims (8)
1. semiconductor laser chip cavity surface film coating fixture, it is characterised in that: include flat-plate U frame assembly and
It is positioned at the plug component of U-shaped opening, surrounds the plane of formation at flat-plate U frame assembly and plug component
In enclosed region, several bar bars stack gradually arrangement from U-shaped Guan Bi end to U-shaped opening；Described flat
Plate U-shaped frame assembly specifically mainly by vertically stacking gradually, relatively-stationary U-shaped upper plate, U-shaped
Middle plate and lower plate composition；Described lower plate is U-shaped, consistent with U-shaped upper plate, U-shaped middle plate opening direction,
Or described lower plate is closed-loop type, the cylindrical void in the middle part of lower plate and U-shaped upper plate, U-shaped middle plate are through；U-shaped
The inboard width of middle plate is more than lower plate and the inboard width of U-shaped upper plate so that if the two ends side chamber of wizened bar
Rail level gland that the lucky support in position reserves on the rail level that lower plate reserves and by U-shaped upper plate, simultaneously by
U-shaped middle plate is the most spacing, described plug component from U-shaped opening to U-shaped Guan Bi end to described
Several bar bars apply the pressure held out against.
Semiconductor laser chip cavity surface film coating fixture the most according to claim 1, it is characterised in that:
In described plane enclosed region, the two ends of several bar bars described are respectively arranged with cushion block.
Semiconductor laser chip cavity surface film coating fixture the most according to claim 1 and 2, its feature exists
In: in several bar bars described, 1-3 the bar bar being positioned at two ends is spacer bar, remaining main body bar
Bar is that spacer bar is spaced apart with bar to be coated.
Semiconductor laser chip cavity surface film coating fixture the most according to claim 1 and 2, its feature exists
In: the inside contact surface of described lower plate and U-shaped upper plate has incline structure, to ensure near U-shaped Guan Bi
The face, chamber of the bar bar of end is not blocked.
Semiconductor laser chip cavity surface film coating fixture the most according to claim 1 and 2, its feature exists
In: described plug component includes jackscrew and jackscrew fixed block, jackscrew fixed block and flat-plate U frame assembly
U-shaped opening is fixing to be connected, and jackscrew applies the pressure holding out against several bar bars described through jackscrew fixed block
Power.
Semiconductor laser chip cavity surface film coating fixture the most according to claim 5, it is characterised in that:
The opening of described U-shaped middle plate extends beyond lower plate and U-shaped upper plate；Described jackscrew fixed block is I shape
Structure or T-type structure, be connected by screw fixing with the extension of U-shaped middle plate.
Semiconductor laser chip cavity surface film coating fixture the most according to claim 1, it is characterised in that:
Described U-shaped upper plate, U-shaped middle plate and lower plate connect fixing by the screw that vertical direction runs through.
Semiconductor laser chip cavity surface film coating fixture the most according to claim 2, it is characterised in that:
Described lower plate is closed-loop type, and lower plate auxiliary support is near the cushion block of U-shaped opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610505896.8A CN106025789A (en) | 2016-06-30 | 2016-06-30 | Facet film-plating clamp for semiconductor laser chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610505896.8A CN106025789A (en) | 2016-06-30 | 2016-06-30 | Facet film-plating clamp for semiconductor laser chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106025789A true CN106025789A (en) | 2016-10-12 |
Family
ID=57105652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610505896.8A Pending CN106025789A (en) | 2016-06-30 | 2016-06-30 | Facet film-plating clamp for semiconductor laser chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106025789A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107557748A (en) * | 2017-08-21 | 2018-01-09 | 丁芸娉 | A kind of sputtering jig |
| CN111501042A (en) * | 2020-06-02 | 2020-08-07 | 海南师范大学 | Edge-emitting semiconductor laser chip cavity surface coating clamp |
| CN112501576A (en) * | 2020-11-30 | 2021-03-16 | 武汉光迅科技股份有限公司 | Clamp and clamping method for semiconductor laser bar |
| CN112593200A (en) * | 2020-12-28 | 2021-04-02 | 芯思杰技术(深圳)股份有限公司 | Film coating jig, film coating device and film coating method |
| CN113913876A (en) * | 2021-09-08 | 2022-01-11 | 中国电子科技集团公司第十三研究所 | High-precision machining forming method for metal interior |
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| US20050064090A1 (en) * | 2003-09-24 | 2005-03-24 | Union Optronics Corporation | Method for coating on laser-diode facet |
| CN101483316A (en) * | 2008-01-10 | 2009-07-15 | 三菱电机株式会社 | End-face-processing jig, and method of manufacturing semiconductor laser using end-face-processing jig |
| CN203747237U (en) * | 2014-03-27 | 2014-07-30 | 北京牡丹电子集团有限责任公司 | Novel semiconductor laser cavity surface film-coating clamp |
| CN104218446A (en) * | 2014-09-22 | 2014-12-17 | 山东华光光电子有限公司 | Strip installing device and strip installing method for semiconductor laser |
| CN105006740A (en) * | 2015-07-23 | 2015-10-28 | 山东华光光电子有限公司 | End face coating fixture for stripe-geometry semiconductor laser and application thereof |
| CN205811273U (en) * | 2016-06-30 | 2016-12-14 | 西安立芯光电科技有限公司 | Semiconductor laser chip cavity surface film coating fixture |
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Patent Citations (7)
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| JP3040763B1 (en) * | 1998-12-25 | 2000-05-15 | 松下電子工業株式会社 | Method of manufacturing semiconductor device and jig for forming film used therefor |
| US20050064090A1 (en) * | 2003-09-24 | 2005-03-24 | Union Optronics Corporation | Method for coating on laser-diode facet |
| CN101483316A (en) * | 2008-01-10 | 2009-07-15 | 三菱电机株式会社 | End-face-processing jig, and method of manufacturing semiconductor laser using end-face-processing jig |
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| CN205811273U (en) * | 2016-06-30 | 2016-12-14 | 西安立芯光电科技有限公司 | Semiconductor laser chip cavity surface film coating fixture |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107557748A (en) * | 2017-08-21 | 2018-01-09 | 丁芸娉 | A kind of sputtering jig |
| CN111501042A (en) * | 2020-06-02 | 2020-08-07 | 海南师范大学 | Edge-emitting semiconductor laser chip cavity surface coating clamp |
| CN111501042B (en) * | 2020-06-02 | 2023-09-01 | 海南师范大学 | Edge-emitting semiconductor laser chip cavity surface coating clamp |
| CN112501576A (en) * | 2020-11-30 | 2021-03-16 | 武汉光迅科技股份有限公司 | Clamp and clamping method for semiconductor laser bar |
| CN112593200A (en) * | 2020-12-28 | 2021-04-02 | 芯思杰技术(深圳)股份有限公司 | Film coating jig, film coating device and film coating method |
| CN113913876A (en) * | 2021-09-08 | 2022-01-11 | 中国电子科技集团公司第十三研究所 | High-precision machining forming method for metal interior |
| CN113913876B (en) * | 2021-09-08 | 2023-02-28 | 中国电子科技集团公司第十三研究所 | High-precision machining forming method for metal interior |
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Application publication date: 20161012 |
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