CN104209289A - Soldering flux cleaning device and soldering flux cleaning method - Google Patents
Soldering flux cleaning device and soldering flux cleaning method Download PDFInfo
- Publication number
- CN104209289A CN104209289A CN201310220570.7A CN201310220570A CN104209289A CN 104209289 A CN104209289 A CN 104209289A CN 201310220570 A CN201310220570 A CN 201310220570A CN 104209289 A CN104209289 A CN 104209289A
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- CN
- China
- Prior art keywords
- cleaning
- electronic component
- thing
- cleaning device
- water cutter
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention provides a soldering flux cleaning device and a soldering flux cleaning method. The soldering flux cleaning device comprises a cleaning device, a liquid collecting groove, a separating device and a circulation liquid supply device. The cleaning device can generate high-pressure and high-temperature water jet flows, the high-pressure and high-temperature water jet flows can be directly sprayed on the two side faces of an electronic element, and high-pressure hot water jet flows are directly acted on the surface of the electronic element. Accordingly, soldering flux with adhesiveness can be removed from the two side surfaces of the electronic element without damaging the surface of the electronic element, and therefore the quality and the yield of electronic products can be improved. The liquid collecting groove is used for collecting cleaning and removed objects to be cleaned, the separating device enables cleaning fluid and the objects to be cleaned to be separated from each other, and the circulation liquid supply device supplies the separated cleaning liquid to the cleaning device for use. Accordingly, the cleaning liquid can be recovered and reused, the using amount of clear water or solvents is greatly saved, the manufacturing cost is greatly lowered, and the natural environment can also be prevented from being influenced.
Description
Technical field
The present invention relates to a kind of cleaning device and cleaning method, especially a kind of about utilizing the water cutter diffluence of high pressure-temperature except cleaning device and the cleaning method of scaling powder, and cleaning fluid also can be recycled.
Background technology
Scaling powder is the mixture taking rosin as main component normally, is the auxiliary material that ensure that welding process is carried out smoothly.Welding is the main processes in electronic assemblies, the auxiliary material using when scaling powder is welding, the Main Function of scaling powder is the oxide of removing scolder and welded mother metal surface, make metal surface reach necessary cleannes, the oxidation again on surface while preventing from welding, reduces solder surface tension force, improves welding performance, the quality of scaling powder performance, directly has influence on the quality of electronic product.
But scaling powder or oil stain can hinder the transmission of electronic component signal, therefore need to carry out washing and cleaning operation so that scaling powder or oil stain are dissolved and to be removed more.Scaling powder generally has two kinds of water-soluble flux and oil-soluble scaling powders, and mostly the removing method of water-soluble flux is directly to rinse with clear water, and oil-soluble scaling powder is to rinse its removal with solvent.In addition, also have the washing and cleaning operation mode so that scaling powder or oil stain are removed by ultrasonic wave cleaning, though it can effectively remove scaling powder or oil stain, ultrasonic can injure electronic component, causes electronic component accelerated ageing.
Summary of the invention
But prior art utilizes backwashing manner to remove the poor effect of scaling powder, when being to rinse, reason is difficult to current effectively to concentrate on the surface of electronic component, and the current power deficiency of rinsing, therefore be difficult to adhesive tool scaling powder to be removed from electronic component, as reached the object of removing scaling powder, just must repeatedly rinse, therefore cause the consumption multiplication of clear water or solvent, manufacturing cost also thereby soaring.Moreover the clear water having rinsed is because being mixed with scaling powder or oil stain, can not recycling, and must deliver to waste water processing station, and so not only increasing manufacturing cost, more waste water resource, as without dealing carefully with or leaking, will impact natural environment.
Main purpose of the present invention is to provide a kind of flux cleaning device, comprises a cleaning device, in order to spray a cleaning fluid on an electronic component, removes the thing to be removed on this electronic component; One collecting tank, this cleaning device is arranged among this collecting tank, mixes in order to receive this cleaning fluid that needs to be removed thing; One separator, mat one first pipeline is even connected to the below of this collecting tank, this cleaning fluid that needs to be removed thing to receive the mixing of discharging from this collecting tank, this thing to be removed is separated from this cleaning fluid naturally, and wherein this removing thing is suspended on this cleaning fluid; One circulating feeding liquid device, is received from this cleaning fluid of this separator, and sends this cleaning fluid back to this cleaning device and re-use.
Feature of the present invention is that this cleaning device can produce the water cutter stream of high pressure-temperature, the water cutter of high pressure-temperature fails to be convened for lack of a quorum and is directly injected on the two sides of this electronic component, therefore this cleaning device is in the time cleaning, the hot water cutter stream of high pressure can effectively concentrate on the surface of electronic component, and the flow of hot water power of high pressure washing is powerful, therefore can effectively adhesive tool scaling powder be removed from the both side surface of electronic component, and do not injure the surface of electronic component, and then improve quality and the yield of electronic product.
Another feature of the present invention is, this thing to be cleaned that this collecting tank is removed collected this cleaning fluid is given this separator together with this cleaning fluid and is carried out separating treatment, this circulating feeding liquid device makees isolated this cleaning device of this cleaning solution supplying cleaning treatment again and uses, therefore this cleaning fluid can be recycled, significantly save the consumption of clear water or solvent, and significantly reduce manufacturing cost, also can avoid affecting natural environment.
Another object of the present invention is to provide a kind of flux cleaning method, comprise with water cutter stream and rinse the thing to be removed on this electronic component; This electronic component is soaked in a liquid; And utilize ultrasonic cleaning way to remove this thing to be removed on this electronic component.In said method, this electronic component is held in delivery status, except avoiding this electronic component to be subject to the secondary pollution of this thing to be cleaned, and the multiple electronic components of cleaning that can be continuous, and then improve cleaning efficiency.
In addition, this thing to be cleaned fails to be convened for lack of a quorum and mixes and flow among a separator through a collecting tank with the water cutter rinsing, this separator is separated this thing to be removed from the water cutter stream that rinsed, separate water cutter that afterflush the crosses circulating feeding liquid device of flowing through and be re-used as the water cutter stream that rinses this thing to be removed on this electronic component.
Brief description of the drawings
Fig. 1 is the side schematic view of flux cleaning device of the present invention;
Fig. 2 is the front view of flux cleaning device of the present invention; And
Fig. 3 is the schematic flow sheet of flux cleaning method of the present invention.
Wherein, description of reference numerals is as follows:
100 flux cleaning devices
1 cleaning device
11,13 water cutter devices
111 spouts
T11 the first pipeline
2 collecting tanks
3 separators
31 separating tanks
33 overflow launders
4 circulating feeding liquid devices
6 heaters
7 temperature sensing devices
T21 the second pipeline
T31, T33 the 3rd pipeline
D gap
S10, S20, S30 step
Detailed description of the invention
Below coordinate graphic and component symbol to do more detailed description to embodiments of the present invention, to make those skilled in the art can implement according to this with reference to description word.
Consult Fig. 1, Fig. 1 is the side schematic view of flux cleaning device of the present invention, consults Fig. 2, is the front view of flux cleaning device of the present invention.As shown in Figures 1 and 2, flux cleaning device 100 of the present invention comprises a cleaning device 1, a collecting tank 2, a separator 3 and a circulating feeding liquid device 4.
This cleaning device 1 is above removed the thing to be removed on this electronic component in order to spray a cleaning fluid in an electronic component (figure does not show), wherein this cleaning device 1 is by two water cutter devices 11, 13 compositions, this two water cutter device 11, 13 respectively have multiple spouts 111, this two water cutter device 11, 13 for corresponding setting and be separated with mutually a gap d, this gap d is passed through for this electronic component, and the two sides of this electronic component correspond respectively to this two water cutter device 11, 13 described spout 111, this cleaning fluid is from this two water cutter device 11, 13 described spout 111 ejects.
Preferably, this cleaning fluid is water or other suitable liquid, and this thing to be removed is scaling powder, oil, oil stain or other foreign matter.
By this, when this cleaning fluid is in the time that the described spout 111 of this two water cutter device 11,13 ejects, the high-pressure water knife stream that will form multiple tracks brute force, these high-pressure water knifes fail to be convened for lack of a quorum and are directly injected on the two sides of this electronic component, and effectively the thing to be removed on this electronic component are removed.Preferably, described spout 111 is crack type or slit-type, so that cleaning fluid forms the high-pressure water knife stream of multiple tracks brute force in the time that the described spout 111 of this two water cutter device 11,13 ejects.
This cleaning device 1 is arranged among this collecting tank 2, uses to receive and mixes this cleaning fluid that needs to be removed thing.This separator 3 mat one first pipeline T11 and be connected in the below of this collecting tank 2, to receive this cleaning fluid that is mixed with this thing to be removed of discharging from this collecting tank 2, and this thing to be removed and this cleaning fluid are separated, wherein the proportion of this cleaning fluid need be less than thing to be removed, so that this thing to be removed is suspended on this cleaning fluid.
Wherein this separator 3 comprises multiple separating tanks 31.Such as with reference to shown in the present embodiment, this separator 3 comprises three separating tanks 31, and the bottom of described separating tank 31 is connected, and so can make this clean cleaning fluid circulation mutually between described separating tank 31 being separated; If suitably configure the position of described separating tank 31, can make this clean wash liquid stream being separated to a predetermined direction, such as flowing to this circulating feeding liquid device 4.
Preferably, the present invention more comprises an overflow launder 33, and this overflow launder 33 is arranged at the outside of at least one or more than one separating tank 31, and this overflow launder 33 is in order to accept this thing to be removed overflowing from this separating tank 31.
This circulating feeding liquid device 4 is received from this cleaning fluid of this separator 3, and this cleaning fluid is flowed to this cleaning device 1 re-uses.Wherein, between this circulating feeding liquid device 4 and this separator 3, be connected with one second pipeline T21, make this circulating feeding liquid device 4 be taken the clean cleaning fluid obtaining after this separator 2 is processed, and this circulating feeding liquid device 4 is connected in this two water cutter device 11,13 by two the 3rd pipeline T31, T33, this circulating feeding liquid device 4 flows to this cleaning device 1 by clean cleaning fluid via this two the 3rd pipeline T31,33 and re-uses.Preferably this circulating feeding liquid device 4 is a pumping or a glandlesspump Pu.
A preferred embodiment of the present invention, one heater 6 and a temperature sensing device 7 are more set in this separator 3, this heater 6 determines whether this cleaning fluid is heated to a predetermined temperature range according to the temperature-sensitive state of this temperature sensing device 7, such as when the temperature of 7 sensings of temperature sensing device is during lower than this predetermined temperature range, this heater 6 heats this cleaning fluid to this predetermined temperature range.
Feature of the present invention is, this cleaning device 1 can produce the water cutter stream of high pressure-temperature, the water cutter of high pressure-temperature fails to be convened for lack of a quorum and is directly injected on the two sides of this electronic component, therefore this cleaning device is in the time cleaning, the hot water cutter stream of high pressure can effectively concentrate on the surface of electronic component, and the flow of hot water power of high pressure washing is powerful, therefore can effectively adhesive tool scaling powder be removed from the both side surface of electronic component, and do not injure the surface of electronic component, and then improve quality and the yield of electronic product.
Another feature of the present invention is, this thing to be cleaned that this collecting tank 2 is removed collected this cleaning fluid is given this separator 3 together with this cleaning fluid and is carried out separating treatment, this circulating feeding liquid device 4 makees this cleaning device 1 of isolated this cleaning solution supplying cleaning treatment again and uses, therefore this cleaning fluid can be recycled, significantly save the consumption of clear water or solvent, and significantly reduce manufacturing cost, also can avoid affecting natural environment.
Consult Fig. 3, Fig. 3 is the schematic flow sheet of flux cleaning method of the present invention.As shown in the step S10 of Fig. 3, first, rinse the thing to be removed on an electronic component with water cutter stream, particularly, to make multiple tracks high-pressure water knife stream be directly injected on the two sides of this electronic component, use effective punching except this thing to be removed on this electronical elements surface, wherein when with this on this electronic component of water cutter stream flushing in the time removing thing, this electronic component is held in delivery status.
Then as shown in the step S20 of Fig. 3, this electronic component is soaked in a liquid, wherein in the time that this electronic component is soaked in this liquid, this electronic component is held in delivery status, use reduction and still remain in the adhesive force of this thing to be removed to this electronic component on this electronic component, avoid this electronic component to be subject to the secondary pollution of this thing to be cleaned simultaneously.
Last as shown in the step S30 of Fig. 3, utilize ultrasonic cleaning way to remove this thing to be removed remaining on this electronic component, because this thing to be removed weakens at FEOL to the adhesive force of this electronic component, therefore see through ultrasonic removing and just can thoroughly this thing to be removed be removed on this electronical elements surface.In the time cleaning this electronic component with ultrasonic, this electronic component is held in delivery status, with the multiple electronic components of continuous cleaning, avoids this electronic component to be subject to the secondary pollution of this thing to be cleaned, and then improves cleaning efficiency and product yield.
In addition, this thing to be cleaned fails to be convened for lack of a quorum and mixes and flow among a separator through a collecting tank with the water cutter rinsing, this separator is separated this thing to be removed from the water cutter stream rinsing, separate the water cutter crossed of the afterflush circulating feeding liquid device of flowing through and be re-used as the water cutter stream that rinses this thing to be removed on this electronic component, shown in please refer to the drawing 1 and Fig. 2.
As described above is only in order to explain preferred embodiment of the present invention; not attempt is done any pro forma restriction to the present invention according to this; therefore, all have under identical invention spirit, do relevant any modification of the present invention or change, all must be included in the category that the invention is intended to protection.
Claims (15)
1. a flux cleaning device, is characterized in that, comprises:
One cleaning device, in order to spray a cleaning fluid on an electronic component, and removes the thing to be removed on this electronic component;
One collecting tank, this cleaning device is arranged among this collecting tank, mixes in order to receive this cleaning fluid that needs to be removed thing;
One separator, mat one first pipeline is even connected to the below of this collecting tank, this cleaning fluid that needs to be removed thing to receive the mixing of discharging from this collecting tank, this thing to be removed is separated from this cleaning fluid naturally, and wherein this removing thing is suspended on this cleaning fluid; And
One circulating feeding liquid device, is received from this cleaning fluid of this separator, and sends this cleaning fluid back to this cleaning device and re-use.
2. flux cleaning device as claimed in claim 1, is characterized in that, this cleaning fluid is water.
3. flux cleaning device as claimed in claim 1, is characterized in that, this thing to be removed is scaling powder or oil.
4. flux cleaning device as claimed in claim 1, it is characterized in that, this cleaning device is made up of two water cutter devices, this two water cutter device respectively has multiple spouts, this two water cutter device is corresponding setting and is separated with mutually a gap, this gap is passed through for this electronic component, and the both sides of this electronic component correspond respectively to the described spout of this two water cutter device.
5. flux cleaning device as claimed in claim 4, is characterized in that, described spout is crack type.
6. flux cleaning device as claimed in claim 1, is characterized in that, is connected with one second pipeline between this circulating feeding liquid device and this separator, and this circulating feeding liquid device is connected in this two water cutter device by two the 3rd pipelines.
7. flux cleaning device as claimed in claim 6, is characterized in that, this circulating feeding liquid device is a pumping or a glandlesspump Pu.
8. flux cleaning device as claimed in claim 1, is characterized in that, this separator comprises multiple separating tanks, and the bottom of described separating tank is connected.
9. flux cleaning device as claimed in claim 1, is characterized in that, more comprises an overflow launder, is arranged at the outside of at least one separating tank.
10. flux cleaning device as claimed in claim 1, it is characterized in that, one heater and a temperature sensing device are more set in this separator, and this heater determines whether this cleaning fluid is heated to a predetermined temperature range according to the temperature-sensitive state of this temperature sensing device.
11. 1 kinds of flux cleaning methods, is characterized in that, comprise:
Rinse the thing to be removed on this electronic component with water cutter stream;
This electronic component is soaked in a liquid; And utilize ultrasonic cleaning way to remove this thing to be removed on this electronic component.
12. flux cleaning methods as claimed in claim 11, is characterized in that, rinse this on this electronic component in the time removing thing with water cutter stream, and this electronic component is held in delivery status.
13. flux cleaning methods as claimed in claim 11, is characterized in that, in the time that this electronic component is soaked in this liquid, this electronic component is held in delivery status.
14. flux cleaning methods as claimed in claim 11, is characterized in that, in the time cleaning this electronic component with ultrasonic, this electronic component is held in delivery status.
15. flux cleaning methods as claimed in claim 11, it is characterized in that, rinse this on this electronic component after removing thing with water cutter stream, this thing to be cleaned fails to be convened for lack of a quorum and mixes and flow among a separator through a collecting tank with the water cutter rinsing, this separator is separated this thing to be removed from the water cutter stream that rinsed, the water cutter of the flushing after the separation circulating feeding liquid device of flowing through is re-used as the water cutter stream that rinses this thing to be removed on this electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310220570.7A CN104209289A (en) | 2013-06-05 | 2013-06-05 | Soldering flux cleaning device and soldering flux cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310220570.7A CN104209289A (en) | 2013-06-05 | 2013-06-05 | Soldering flux cleaning device and soldering flux cleaning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104209289A true CN104209289A (en) | 2014-12-17 |
Family
ID=52091424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310220570.7A Pending CN104209289A (en) | 2013-06-05 | 2013-06-05 | Soldering flux cleaning device and soldering flux cleaning method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104209289A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111014093A (en) * | 2019-11-26 | 2020-04-17 | 耒阳市旗心电子科技有限公司 | Circuit board scaling powder cleaning equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0687210A (en) * | 1992-09-08 | 1994-03-29 | Kofu Nippon Denki Kk | Method and equipment for cleaning metal mask and screen |
| US6716290B1 (en) * | 2002-12-04 | 2004-04-06 | The United States Of America As Represented By The Secretary Of The Navy | Method for removing soldering flux residue from a substrate |
| KR20120071501A (en) * | 2010-12-23 | 2012-07-03 | 한라공조주식회사 | Flux cleaning system for heat exchanger and flux cleaning method |
| CN202427677U (en) * | 2011-12-29 | 2012-09-12 | 北京泰拓精密清洗设备有限公司 | Jet cleaning machine |
| CN202823987U (en) * | 2012-09-18 | 2013-03-27 | 广东美的制冷设备有限公司 | Ultrasonic cleaning device |
| CN102989709A (en) * | 2012-12-28 | 2013-03-27 | 深圳市凯尔迪光电科技有限公司 | Printed circuit board assembly (PCBA) on-line cleaning machine |
| CN203400890U (en) * | 2013-06-05 | 2014-01-22 | 久尹股份有限公司 | Flux cleaning unit |
-
2013
- 2013-06-05 CN CN201310220570.7A patent/CN104209289A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0687210A (en) * | 1992-09-08 | 1994-03-29 | Kofu Nippon Denki Kk | Method and equipment for cleaning metal mask and screen |
| US6716290B1 (en) * | 2002-12-04 | 2004-04-06 | The United States Of America As Represented By The Secretary Of The Navy | Method for removing soldering flux residue from a substrate |
| KR20120071501A (en) * | 2010-12-23 | 2012-07-03 | 한라공조주식회사 | Flux cleaning system for heat exchanger and flux cleaning method |
| CN202427677U (en) * | 2011-12-29 | 2012-09-12 | 北京泰拓精密清洗设备有限公司 | Jet cleaning machine |
| CN202823987U (en) * | 2012-09-18 | 2013-03-27 | 广东美的制冷设备有限公司 | Ultrasonic cleaning device |
| CN102989709A (en) * | 2012-12-28 | 2013-03-27 | 深圳市凯尔迪光电科技有限公司 | Printed circuit board assembly (PCBA) on-line cleaning machine |
| CN203400890U (en) * | 2013-06-05 | 2014-01-22 | 久尹股份有限公司 | Flux cleaning unit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111014093A (en) * | 2019-11-26 | 2020-04-17 | 耒阳市旗心电子科技有限公司 | Circuit board scaling powder cleaning equipment |
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Application publication date: 20141217 |