TWI537085B - Flux cleaning method - Google Patents

Flux cleaning method Download PDF

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TWI537085B
TWI537085B TW102119918A TW102119918A TWI537085B TW I537085 B TWI537085 B TW I537085B TW 102119918 A TW102119918 A TW 102119918A TW 102119918 A TW102119918 A TW 102119918A TW I537085 B TWI537085 B TW I537085B
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electronic component
cleaning
water jet
liquid
flux
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TW102119918A
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TW201446388A (en
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guang-hong Shi
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Description

助焊劑清洗方法 Flux cleaning method

一種清洗方法,尤其是一種關於利用高壓高溫的水刀流去除助焊劑的清洗方法,且清洗液還可被回收再利用。 A cleaning method, in particular, a cleaning method for removing a flux by using a high-pressure high-temperature water jet stream, and the cleaning liquid can also be recycled and reused.

助焊劑通常是以松香為主要成分的混合物,是保證焊接過程順利進行的輔助材料。焊接是電子裝配中的主要工藝過程,助焊劑是焊接時使用的輔料,助焊劑的主要作用是清除焊料和被焊母材表面的氧化物,使金屬表面達到必要的清潔度,防止焊接時表面的再次氧化,降低焊料表面張力,提高焊接性能,助焊劑性能的優劣,直接影響到電子產品的品質。 Flux is usually a mixture of rosin as a main component and is an auxiliary material to ensure the smooth progress of the welding process. Welding is the main process in electronic assembly. Flux is the auxiliary material used in soldering. The main function of flux is to remove the oxide and the oxide on the surface of the soldered base material, so that the metal surface can reach the necessary cleanliness and prevent the surface from soldering. The oxidation again reduces the surface tension of the solder, improves the soldering performance, and the performance of the flux directly affects the quality of the electronic product.

但是助焊劑或油漬會妨礙電子元件訊號之傳輸,因此多需進行清洗作業以將助焊劑或油漬溶解並去除。助焊劑一般有水溶性助焊劑及油溶性助焊劑兩種,水溶性助焊劑之去除方式多係直接以清水進行沖洗,而油溶性助焊劑則是以溶劑進行沖洗來將其去除。此外,還有藉由超音波洗淨以將助焊劑或油漬去除之清洗作業方式,其雖可以有效的去除助焊劑或油漬,但超音波會傷害電子元件,導致電子元件加速老化。 However, flux or oil stains can hinder the transmission of electronic component signals, so cleaning operations are often required to dissolve and remove flux or grease. Fluxes generally have two types of water-soluble fluxes and oil-soluble fluxes. Water-soluble fluxes are mostly washed directly with clean water, while oil-soluble fluxes are washed with a solvent to remove them. In addition, there is a cleaning operation by ultrasonic cleaning to remove flux or grease. Although it can effectively remove flux or grease, ultrasonic waves can damage electronic components and cause accelerated aging of electronic components.

然而習知技術利用沖洗方式清除助焊劑的效果不佳,原因在於沖洗時難以將水流有效集中在電子元件的表面,且沖洗的水流力道不足,因此難以將具粘著性的助焊劑從電子元件去除,如要達到去除助焊劑的目的,就必須重複地進行沖洗,因此導致清水或溶劑的用量倍增,製造成本也因而攀升。再者,沖洗完的清水因已混有助焊劑或油漬,也不能回收再利用,而必須送至廢水處理場,如此不僅增加製造成本,更浪費水資源,如無妥善處理或外洩,將會對自然環境造成影響。 However, the conventional technique uses the flushing method to remove the flux, because the water flow is difficult to concentrate on the surface of the electronic component, and the flushing water flow is insufficient, so it is difficult to remove the adhesive flux from the electronic component. Removal, in order to achieve the purpose of removing the flux, it is necessary to repeatedly rinse, thus causing the use of water or solvent to double, and the manufacturing cost is also increased. In addition, the rinsed clean water can not be recycled and reused because it has been mixed with flux or oil stains, and must be sent to the wastewater treatment plant, which not only increases the manufacturing cost, but also wastes water resources. If it is not properly disposed or leaked, it will It will affect the natural environment.

本發明的主要目的在於提供一種助焊劑清洗裝置,包含一清 洗裝置,用以噴射一清洗液於一電子元件上,而清除在該電子元件上的一待清除物;一集液槽,該清洗裝置設置於該集液槽之中,用以接收混合有待清除物的該清洗液;一分離裝置,藉一第一管路連而接於該集液槽之下方,以接收從該集液槽排出之混合有待清除物的該清洗液,該待清除物自然地從該清洗液分離出來,其中該清除物懸浮於該清洗液之上;一循環供液裝置,接收自該分離裝置的該清洗液,並將該清洗液送回該清洗裝置再使用。 The main object of the present invention is to provide a flux cleaning device comprising a clear a washing device for spraying a cleaning liquid on an electronic component to remove a material to be removed on the electronic component; a liquid collecting tank disposed in the liquid collecting tank for receiving the mixture to be mixed a cleaning liquid for removing the object; a separating device connected to the lower side of the liquid collecting tank by a first pipe to receive the cleaning liquid discharged from the liquid collecting tank and mixed with the object to be removed, the object to be removed Naturally separated from the cleaning liquid, wherein the cleaning material is suspended above the cleaning liquid; a circulating liquid supply device receives the cleaning liquid from the separation device, and returns the cleaning liquid to the cleaning device for reuse.

本發明的特點在於該清洗裝置會產生高壓高溫的水刀流,高壓高溫的水刀流會直接噴射到該電子元件的兩側面上,因此該清洗裝置在清洗時,高壓的熱水刀流能有效集中在電子元件的表面,且高壓沖洗的熱水流力道強而有力,因此能有效地將具粘著性的助焊劑從電子元件的兩側表面上去除,且不傷及電子元件的表面,進而提高電子產品的品質及良率。 The invention is characterized in that the cleaning device generates a high-pressure and high-temperature water jet flow, and the high-pressure high-temperature water jet flow is directly sprayed on both sides of the electronic component, so that the cleaning device can clean the high-pressure hot water cutter flow during cleaning. Effectively concentrated on the surface of the electronic component, and the high-pressure flushing hot water flow is strong and powerful, so that the adhesive flux can be effectively removed from both sides of the electronic component without damaging the surface of the electronic component. In turn, improve the quality and yield of electronic products.

本發明的另一特點在於,該集液槽將所收集到該清洗液清除的該待清洗物連同該清洗液送給該分離裝置進行分離處理,該循環供液裝置再將分離出的該清洗液供給該清洗裝置做清洗處理使用,因此該清洗液可以被回收再利用,大幅節省清水或溶劑的用量,而大幅降低製造成本,也能避免影響自然環境。 Another feature of the present invention is that the liquid collecting tank sends the cleaning liquid collected by the cleaning liquid together with the cleaning liquid to the separating device for separation processing, and the circulating liquid supply device further separates the cleaning. The liquid is supplied to the cleaning device for cleaning treatment, so that the cleaning liquid can be recycled and reused, thereby greatly reducing the amount of water or solvent, thereby greatly reducing the manufacturing cost and avoiding affecting the natural environment.

本發明的另一目的在於提供一種助焊劑清洗方法,包含以水刀流沖洗該電子元件上的一待清除物;將該電子元件浸泡於一液體中;以及利用超音波清洗方式清除該電子元件上的該待清除物。上述方法中,該電子元件係保持於傳送狀態中,除避免該電子元件受該待清洗物的二次污染,並能連續的清洗多個電子元件,進而提高清洗效率。 Another object of the present invention is to provide a flux cleaning method comprising: rinsing a material to be removed on the electronic component with a water jet flow; immersing the electronic component in a liquid; and removing the electronic component by ultrasonic cleaning The object to be removed. In the above method, the electronic component is maintained in the transport state, in addition to avoiding secondary contamination of the electronic component by the object to be cleaned, and continuously cleaning a plurality of electronic components, thereby improving cleaning efficiency.

此外,該待清洗物與沖洗過的水刀流會混合並經一集液槽而流入一分離裝置之中,該分離裝置將該待清除物自沖洗過的水刀流分離出來,分離後之沖洗過的水刀流經一循環供液裝置再作為沖洗該電子元件上的該待清除物的水刀流。 In addition, the to-be-cleaned material and the rinsed water jet stream are mixed and flowed into a separating device through a collecting tank, and the separating device separates the to-be-cleaned material from the flushed water jet stream, and after separating The rinsed water jet flows through a circulating liquid supply device and acts as a water jet for flushing the object to be removed on the electronic component.

100‧‧‧助焊劑清洗裝置 100‧‧‧ Flux cleaning device

1‧‧‧清洗裝置 1‧‧‧cleaning device

11、13‧‧‧水刀裝置 11, 13‧‧‧ waterjet device

111‧‧‧噴口 111‧‧‧ spout

T11‧‧‧第一管路 T11‧‧‧ first pipeline

2‧‧‧集液槽 2‧‧‧ sump

3‧‧‧分離裝置 3‧‧‧Separation device

31‧‧‧分離槽 31‧‧‧Separation tank

33‧‧‧溢流槽 33‧‧‧Overflow trough

4‧‧‧循環供液裝置 4‧‧‧Circulating liquid supply device

6‧‧‧加熱裝置 6‧‧‧ heating device

7‧‧‧感溫裝置 7‧‧‧ Temperature sensing device

T21‧‧‧第二管路 T21‧‧‧Second line

T31、T33‧‧‧第三管路 T31, T33‧‧‧ third pipeline

d‧‧‧間隙 D‧‧‧ gap

S10、S20、S30‧‧‧步驟 S10, S20, S30‧‧‧ steps

第一圖為本發明助焊劑清洗裝置的側面示意圖。 The first figure is a schematic side view of the flux cleaning device of the present invention.

第二圖為本發明助焊劑清洗裝置的前視圖。 The second figure is a front view of the flux cleaning device of the present invention.

第三圖為本發明助焊劑清洗方法的流程示意圖。 The third figure is a schematic flow chart of the flux cleaning method of the present invention.

以下配合圖式及元件符號對本發明之實施方式做更詳細的說明,俾使熟習該項技藝者在研讀本說明書後能據以實施。 The embodiments of the present invention will be described in more detail below with reference to the drawings and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

參閱第一圖,本發明助焊劑清洗裝置的側面示意圖,參閱第二圖,本發明助焊劑清洗裝置的前視圖。如第一圖及第二圖所示,本發明助焊劑清洗裝置100包含一清洗裝置1、一集液槽2、一分離裝置3及一循環供液裝置4。 Referring to the first figure, a side view of the flux cleaning apparatus of the present invention, see the second drawing, a front view of the flux cleaning apparatus of the present invention. As shown in the first and second figures, the flux cleaning apparatus 100 of the present invention comprises a cleaning device 1, a liquid collection tank 2, a separation device 3, and a circulating liquid supply device 4.

該清洗裝置1用以噴射一清洗液於一電子元件(圖面未顯示)上而清除在該電子元件上的一待清除物,其中該清洗裝置1由兩水刀裝置11、13組成,該兩水刀裝置11、13各具有複數個噴口111,該兩水刀裝置11、13為相對應的設置且相隔有一間隙d,該間隙d供該電子元件通過,且該電子元件的兩側面分別對應於該兩水刀裝置11、13的該等噴口111,該清洗液自該兩水刀裝置11、13的該等噴口111噴射出來。 The cleaning device 1 is configured to spray a cleaning liquid on an electronic component (not shown) to remove a to-be-removed object on the electronic component, wherein the cleaning device 1 is composed of two waterjet devices 11, 13. The two water jet devices 11 and 13 each have a plurality of nozzles 111, which are correspondingly arranged and separated by a gap d for the electronic component to pass through, and the two sides of the electronic component are respectively The cleaning liquids are ejected from the nozzles 111 of the two water jet devices 11, 13 corresponding to the nozzles 111 of the two water jet devices 11, 13.

較佳的,該清洗液為水或其他適當的液體,而該待清除物則是助焊劑、油、油漬或其他異物。 Preferably, the cleaning solution is water or other suitable liquid, and the object to be removed is flux, oil, grease or other foreign matter.

藉此,當該清洗液自該兩水刀裝置11、13的該等噴口111噴射出來時,就會形成多道強力的高壓水刀流,這些高壓水刀流會直接噴射到該電子元件的兩側面上,而有效將該電子元件上的一待清除物移除。較佳的,該等噴口111為夾縫型或狹縫型,以使清洗液自該兩水刀裝置11、13的該等噴口111噴射出來時形成多道強力的高壓水刀流。 Thereby, when the cleaning liquid is ejected from the nozzles 111 of the two water jet devices 11, 13, a plurality of powerful high-pressure water jet flows are formed, and the high-pressure water jet flows directly to the electronic component. On both sides, the object to be removed on the electronic component is effectively removed. Preferably, the nozzles 111 are of a slit type or a slit type to form a plurality of powerful high-pressure water jet flows when the cleaning liquid is ejected from the nozzles 111 of the two water jet devices 11 and 13.

該清洗裝置1設置於該集液槽2之中,藉以接收混合有待清除物的該清洗液。該分離裝置3藉一第一管路T11而連接於該集液槽2之下方,以接收從該集液槽2排出之混合有該待清除物的該清洗液,並將該待清除物及該清洗液分離出來,其中該清洗液的比重需小於待清除物,以使該待清除物懸浮於該清洗液之上。 The cleaning device 1 is disposed in the sump 2 to receive the cleaning liquid mixed with the object to be removed. The separating device 3 is connected to the lower portion of the sump 2 by a first pipe T11 to receive the cleaning liquid discharged from the sump 2 and mixed with the object to be removed, and the object to be removed and The cleaning liquid is separated, wherein the cleaning liquid has a specific gravity smaller than that to be removed, so that the object to be removed is suspended above the cleaning liquid.

其中該分離裝置3包含複數個分離槽31。比如參考本實施例所示,該分離裝置3包含三個分離槽31,該等分離槽31的底部相連通, 如此可以使得被分離出之乾淨的該清洗液於該等分離槽31之間相互流通;若適當配置該等分離槽31的位置,即可使被分離出之乾淨的該清洗液流向一預定方向,比如流向該循環供液裝置4。 The separating device 3 comprises a plurality of separating grooves 31. For example, referring to the embodiment, the separating device 3 includes three separating grooves 31, and the bottoms of the separating grooves 31 are connected to each other. In this way, the cleaned cleaning liquid can be circulated between the separation tanks 31; if the positions of the separation tanks 31 are properly disposed, the cleaned cleaning liquid can be flowed to a predetermined direction. For example, flow to the circulating liquid supply device 4.

較佳的,本發明更包含一溢流槽33,該溢流槽33設置於至少一個或一個以上的分離槽31的外側,該溢流槽33用以承接自該分離槽31溢出的該待清除物。 Preferably, the present invention further includes an overflow tank 33 disposed outside the at least one or more separation tanks 31 for receiving the overflow from the separation tank 31. Clearance.

該循環供液裝置4接收自該分離裝置3的該清洗液,並將該清洗液輸送給該清洗裝置1再使用。其中,該循環供液裝置4與該分離裝置3之間連接有一第二管路T21,使該循環供液裝置4得以取用經該分離裝置2處理後而得的乾淨的清洗液,而該循環供液裝置4藉由兩第三管路T31、T33而連接於該兩水刀裝置11、13,該循環供液裝置4將乾淨的清洗液經由該兩第三管路T31、33輸送給該清洗裝置1再使用。較佳的該循環供液裝置4為一泵浦或一無軸封泵浦。 The circulating liquid supply device 4 receives the cleaning liquid from the separation device 3, and supplies the cleaning liquid to the cleaning device 1 for reuse. A second pipeline T21 is connected between the circulating liquid supply device 4 and the separation device 3, so that the circulating liquid supply device 4 can take the clean cleaning liquid obtained by the separation device 2, and the cleaning liquid is obtained. The circulating liquid supply device 4 is connected to the two water jet devices 11 and 13 by two third pipes T31 and T33, and the circulating liquid supply device 4 supplies the clean cleaning liquid to the two third pipes T31 and 33. This cleaning device 1 is reused. Preferably, the circulating liquid supply device 4 is a pump or a shaftless pump.

本發明的一較佳實施例,該分離裝置3內更設置一加熱裝置6及一感溫裝置7,該加熱裝置6根據該感溫裝置7的感溫狀態而決定是否將該清洗液加熱至一預定溫度範圍,比如當感溫裝置7所感測的溫度低於該預定溫度範圍時,該加熱裝置6即加熱該清洗液至該預定溫度範圍內。 In a preferred embodiment of the present invention, a heating device 6 and a temperature sensing device 7 are further disposed in the separating device 3, and the heating device 6 determines whether to heat the cleaning liquid according to the temperature sensing state of the temperature sensing device 7. A predetermined temperature range, such as when the temperature sensed by the temperature sensing device 7 is lower than the predetermined temperature range, the heating device 6 heats the cleaning liquid to the predetermined temperature range.

本發明的特點在於,該清洗裝置1會產生高壓高溫的水刀流,高壓高溫的水刀流會直接噴射到該電子元件的兩側面上,因此該清洗裝置在清洗時,高壓的熱水刀流能有效集中在電子元件的表面,且高壓沖洗的熱水流力道強而有力,因此能有效地將具粘著性的助焊劑從電子元件的兩側表面上去除,且不傷及電子元件的表面,進而提高電子產品的品質及良率。 The invention is characterized in that the cleaning device 1 generates a high-pressure and high-temperature water jet flow, and the high-pressure high-temperature water jet flow is directly sprayed on both sides of the electronic component, so the cleaning device is in the high-pressure hot water knife during cleaning. The flow energy is effectively concentrated on the surface of the electronic component, and the high-pressure flushing hot water flow is strong and powerful, so that the adhesive flux can be effectively removed from both side surfaces of the electronic component without damaging the electronic component. Surface, which in turn improves the quality and yield of electronic products.

本發明的另一特點在於,該集液槽2將所收集到該清洗液清除的該待清洗物連同該清洗液送給該分離裝置3進行分離處理,該循環供液裝置4再將分離出的該清洗液供給該清洗裝置1做清洗處理使用,因此該清洗液可以被回收再利用,大幅節省清水或溶劑的用量,而大幅降低製造成本,也能避免影響自然環境。 Another feature of the present invention is that the sump 2 separates the object to be cleaned from the cleaning liquid and the cleaning liquid to the separating device 3 for separation treatment, and the circulating liquid supply device 4 is separated again. The cleaning liquid is supplied to the cleaning device 1 for cleaning treatment, so that the cleaning liquid can be recycled and reused, thereby greatly reducing the amount of water or solvent, thereby greatly reducing the manufacturing cost and avoiding affecting the natural environment.

參閱第三圖,本發明助焊劑清洗方法的流程示意圖。如第三 圖的步驟S10所示,首先,以水刀流沖洗一電子元件上的一待清除物,具體而言,是令多道高壓水刀流直接噴射到該電子元件的兩側面上,藉以有效沖除該電子元件表面上的該待清除物,其中當以水刀流沖洗該電子元件上的該待清除物時,該電子元件保持於傳送狀態。 Referring to the third figure, a schematic flow chart of the flux cleaning method of the present invention. Like the third Step S10 of the figure, firstly, flushing a to-be-cleaned object on an electronic component with a water jet flow, specifically, spraying a plurality of high-pressure water jet streams directly onto both sides of the electronic component, thereby effectively rushing In addition to the object to be removed on the surface of the electronic component, when the object to be removed on the electronic component is flushed with a water jet, the electronic component remains in a transport state.

較佳的,水刀流係透過上述的助焊劑清洗裝置100而產生。 Preferably, the water jet flow is generated by the flux cleaning device 100 described above.

接著如第三圖的步驟S20所示,將該電子元件浸泡於一液體中,其中當該電子元件浸泡於該液體時,該電子元件保持於傳送狀態,藉以降低仍殘留在該電子元件上的該待清除物對該電子元件的附著力,同時避免該電子元件受該待清洗物的二次污染。 Then, as shown in step S20 of the third figure, the electronic component is immersed in a liquid, wherein when the electronic component is immersed in the liquid, the electronic component is kept in a transmitting state, thereby reducing the remaining on the electronic component. The adhesion of the object to be removed to the electronic component while avoiding secondary contamination of the electronic component by the object to be cleaned.

在本發明的一較佳實施例中,該液體是放置在一槽室或多個分開設置的槽室中,且槽室中液體的液面在該電子元件之上。 In a preferred embodiment of the invention, the liquid is placed in a chamber or a plurality of separately disposed chambers, and the liquid level of the liquid in the chamber is above the electronic component.

最後如第三圖的步驟S30所示,利用超音波清洗方式清除殘留在該電子元件上的該待清除物,由於該待清除物對該電子元件的附著力在前段製程已減弱,因此透過超音波清除就能徹底將該待清除物自該電子元件表面上去除。當以超音波清洗該電子元件時,該電子元件保持於傳送狀態,以連續的清洗多個電子元件,避免該電子元件受該待清洗物的二次污染,進而提高清洗效率及產品良率。 Finally, as shown in step S30 of the third figure, the object to be removed remaining on the electronic component is removed by ultrasonic cleaning, and the adhesion of the object to be removed to the electronic component is weakened in the previous stage, so The sonic cleaning can completely remove the object to be removed from the surface of the electronic component. When the electronic component is ultrasonically cleaned, the electronic component is kept in a transmitting state to continuously clean a plurality of electronic components, thereby preventing the electronic component from being secondaryly contaminated by the object to be cleaned, thereby improving cleaning efficiency and product yield.

在本發明的一較佳實施例中,承【0026】段所述,超音波清洗是在其中一槽室做超音波清洗處理,較佳而言,做超音波清洗處理的槽室是在做浸泡的槽室(即步驟20)之後。 In a preferred embodiment of the present invention, as described in paragraph [0026], the ultrasonic cleaning is performed in one of the chambers, and preferably, the chamber for ultrasonic cleaning is being made. After soaking the chamber (ie, step 20).

此外,該待清洗物與沖洗過的水刀流會混合並經一集液槽而流入一分離裝置之中,該分離裝置將該待清除物自沖洗過的水刀流分離出來,分離後之沖洗過的水刀流經循環供液裝置再作為沖洗該電子元件上的該待清除物的水刀流,請參第一圖及第二圖所示。 In addition, the to-be-cleaned material and the rinsed water jet stream are mixed and flowed into a separating device through a collecting tank, and the separating device separates the to-be-cleaned material from the flushed water jet stream, and after separating The rinsed water jet flows through the circulating liquid supply device and acts as a water jet for flushing the object to be removed on the electronic component, as shown in the first and second figures.

以上所述者僅為用以解釋本發明之較佳實施例,並非企圖據以對本發明做任何形式上之限制,是以,凡有在相同之發明精神下所作有關本發明之任何修飾或變更,皆仍應包括在本發明意圖保護之範疇。 The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the present invention in any way, and any modifications or alterations to the present invention made in the spirit of the same invention. All should still be included in the scope of the intention of the present invention.

100‧‧‧助焊劑清洗裝置 100‧‧‧ Flux cleaning device

1‧‧‧清洗裝置 1‧‧‧cleaning device

11‧‧‧水刀裝置 11‧‧‧Waterjet device

111‧‧‧噴口 111‧‧‧ spout

T11‧‧‧第一管路 T11‧‧‧ first pipeline

2‧‧‧集液槽 2‧‧‧ sump

3‧‧‧分離裝置 3‧‧‧Separation device

31‧‧‧分離槽 31‧‧‧Separation tank

4‧‧‧循環供液裝置 4‧‧‧Circulating liquid supply device

6‧‧‧加熱裝置 6‧‧‧ heating device

7‧‧‧感溫裝置 7‧‧‧ Temperature sensing device

T21‧‧‧第二管路 T21‧‧‧Second line

T31‧‧‧第三管路 T31‧‧‧ third pipeline

Claims (4)

一種助焊劑清洗方法,包含:以水刀流沖洗該電子元件上的一待清除物;將該電子元件浸泡於一液體中,其中當該電子元件浸泡於該液體時,該電子元件保持於傳送狀態;以及利用超音波清洗方式清除該電子元件上的該待清除物。 A flux cleaning method comprising: rinsing a material to be removed on the electronic component with a water jet; immersing the electronic component in a liquid, wherein the electronic component is kept in a transmission when the electronic component is immersed in the liquid a state; and cleaning the object to be removed on the electronic component by ultrasonic cleaning. 依據申請專利範圍第1項所述之助焊劑清洗方法,其中,以水刀流沖洗該電子元件上的該待清除物時,該電子元件保持於傳送狀態。 The flux cleaning method according to claim 1, wherein the electronic component is kept in a transport state when the object to be removed on the electronic component is flushed with a water jet. 依據申請專利範圍第1項所述之助焊劑清洗方法,其中當以超音波清洗該電子元件時,該電子元件保持於傳送狀態。 A flux cleaning method according to claim 1, wherein when the electronic component is ultrasonically cleaned, the electronic component is maintained in a transport state. 依據申請專利範圍第1項所述之助焊劑清洗方法,其中以水刀流沖洗該電子元件上的該待清除物後,該待清洗物與沖洗過的水刀流會混合並經一集液槽而流入一分離裝置之中,該分離裝置將該待清除物自沖洗過的水刀流分離出來,分離後之沖洗過的水刀流經一循環供液裝置再作為沖洗該電子元件上的該待清除物的水刀流。 According to the flux cleaning method of claim 1, wherein the object to be cleaned and the rinsed water jet are mixed and passed through a liquid collection after flushing the object to be removed on the electronic component with a water jet stream. The tank flows into a separating device, the separating device separates the water to be purged from the flushed water jet, and the separated washed water jet flows through a circulating liquid feeding device to rinse the electronic component. The water knife flow of the object to be removed.
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