CN104204748B - 热传感器的校正 - Google Patents

热传感器的校正 Download PDF

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Publication number
CN104204748B
CN104204748B CN201380015788.7A CN201380015788A CN104204748B CN 104204748 B CN104204748 B CN 104204748B CN 201380015788 A CN201380015788 A CN 201380015788A CN 104204748 B CN104204748 B CN 104204748B
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China
Prior art keywords
temperature
cold junction
change
thermojunction
measure
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CN201380015788.7A
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English (en)
Chinese (zh)
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CN104204748A (zh
Inventor
H·S·卡拉基
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Texas Instruments Inc
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Texas Instruments Inc
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Publication of CN104204748A publication Critical patent/CN104204748A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
    • G01J5/14—Electrical features thereof
    • G01J5/16—Arrangements with respect to the cold junction; Compensating influence of ambient temperature or other variables

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Radiation Pyrometers (AREA)
CN201380015788.7A 2012-03-22 2013-03-15 热传感器的校正 Active CN104204748B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/427,521 US8899828B2 (en) 2012-03-22 2012-03-22 Heat sensor correction
US13/427,521 2012-03-22
PCT/US2013/032304 WO2013142360A1 (en) 2012-03-22 2013-03-15 Heat sensor correction

Publications (2)

Publication Number Publication Date
CN104204748A CN104204748A (zh) 2014-12-10
CN104204748B true CN104204748B (zh) 2017-03-08

Family

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CN201380015788.7A Active CN104204748B (zh) 2012-03-22 2013-03-15 热传感器的校正

Country Status (4)

Country Link
US (1) US8899828B2 (enExample)
JP (1) JP2015519542A (enExample)
CN (1) CN104204748B (enExample)
WO (1) WO2013142360A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10830171B2 (en) * 2016-02-23 2020-11-10 Ford Global Technologies, Llc Vehicle sensor output processing
JP6777428B2 (ja) * 2016-06-02 2020-10-28 アズビル株式会社 温度測定装置
CN117804639B (zh) * 2024-02-29 2024-05-17 潍坊盛品印刷设备有限公司 一种胶装机温控传感器的温度校准方法及系统

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CN1141672A (zh) * 1994-01-10 1997-01-29 温度扫描股份有限公司 非接触式有源温度传感器
CN2368020Y (zh) * 1998-10-21 2000-03-08 陈朝旺 红外线温度测量装置
JP2000136966A (ja) * 1998-10-31 2000-05-16 Lg Electronics Inc サ―モパイルセンサを用いた温度測定回路
CN1734242A (zh) * 2004-08-11 2006-02-15 三洋电机株式会社 温度校正处理装置
CN101031784A (zh) * 2005-03-31 2007-09-05 株式会社东芝 半导体集成电路

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JPH0666639A (ja) * 1992-08-20 1994-03-11 Toyota Central Res & Dev Lab Inc 赤外線温度計
JPH06129914A (ja) 1992-10-16 1994-05-13 Nippon Avionics Co Ltd 温度測定装置
JPH0783761A (ja) * 1993-09-20 1995-03-31 Matsushita Electric Ind Co Ltd 放射温度検出装置
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JP2001349787A (ja) * 2000-06-06 2001-12-21 Seiko Epson Corp 赤外線検出素子および測温計
JP4161626B2 (ja) 2002-07-01 2008-10-08 オムロン株式会社 温度調節器
JP2004191075A (ja) * 2002-12-06 2004-07-08 Matsushita Electric Ind Co Ltd 温度測定装置、温度補正方法、及び画像形成装置
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DE10341142A1 (de) * 2003-09-06 2005-03-31 Braun Gmbh Verfahren und Vorrichtung zur Kompensation des thermischen Einflusses eines Temperaturgradienten im Sensorgehäuse eines Strahlungssensors auf die Meßgenauigkeit
US20050081905A1 (en) * 2003-10-17 2005-04-21 Lan Alex H. Thermopile IR detector package structure
US7447607B2 (en) 2004-08-31 2008-11-04 Watow Electric Manufacturing System and method of compensation for device mounting and thermal transfer error
JP4555148B2 (ja) * 2005-01-07 2010-09-29 株式会社キーエンス 放射温度計
JP4214124B2 (ja) * 2005-03-14 2009-01-28 株式会社バイオエコーネット 耳式体温計
JP4888861B2 (ja) * 2005-11-17 2012-02-29 光照 木村 電流検出型熱電対等の校正方法および電流検出型熱電対
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JP5793679B2 (ja) 2009-12-18 2015-10-14 パナソニックＩｐマネジメント株式会社 赤外線センサモジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1141672A (zh) * 1994-01-10 1997-01-29 温度扫描股份有限公司 非接触式有源温度传感器
CN2368020Y (zh) * 1998-10-21 2000-03-08 陈朝旺 红外线温度测量装置
JP2000136966A (ja) * 1998-10-31 2000-05-16 Lg Electronics Inc サ―モパイルセンサを用いた温度測定回路
CN1734242A (zh) * 2004-08-11 2006-02-15 三洋电机株式会社 温度校正处理装置
CN101031784A (zh) * 2005-03-31 2007-09-05 株式会社东芝 半导体集成电路

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
基于MEMS热电堆传感器的高温测量技术;邹令敏等;《传感器与微系统》;20090930;第28卷(第9期);第19-21页 *

Also Published As

Publication number Publication date
JP2015519542A (ja) 2015-07-09
US8899828B2 (en) 2014-12-02
US20130250998A1 (en) 2013-09-26
WO2013142360A1 (en) 2013-09-26
CN104204748A (zh) 2014-12-10

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