CN104204100A - 可固化的有机硅组合物、其固化产物以及光学半导体器件 - Google Patents
可固化的有机硅组合物、其固化产物以及光学半导体器件 Download PDFInfo
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- CN104204100A CN104204100A CN201380016211.8A CN201380016211A CN104204100A CN 104204100 A CN104204100 A CN 104204100A CN 201380016211 A CN201380016211 A CN 201380016211A CN 104204100 A CN104204100 A CN 104204100A
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- 239000000203 mixture Substances 0.000 title claims abstract description 85
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 21
- 239000004065 semiconductor Substances 0.000 title claims description 42
- 230000003287 optical effect Effects 0.000 title claims description 30
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 19
- 239000003054 catalyst Substances 0.000 claims abstract description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 8
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 5
- 125000005375 organosiloxane group Chemical group 0.000 claims abstract description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 46
- 239000010703 silicon Substances 0.000 claims description 46
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 30
- 125000000217 alkyl group Chemical group 0.000 claims description 18
- 125000002769 thiazolinyl group Chemical group 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 3
- 230000003197 catalytic effect Effects 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 125000003342 alkenyl group Chemical group 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000014759 maintenance of location Effects 0.000 abstract 1
- -1 acryloxy Chemical group 0.000 description 55
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 13
- 239000005977 Ethylene Substances 0.000 description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000004954 Polyphthalamide Substances 0.000 description 9
- 229920006375 polyphtalamide Polymers 0.000 description 9
- 238000002834 transmittance Methods 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 7
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 5
- 239000007822 coupling agent Substances 0.000 description 5
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 5
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 4
- 235000013399 edible fruits Nutrition 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 3
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 3
- 125000001188 haloalkyl group Chemical group 0.000 description 3
- 125000006038 hexenyl group Chemical group 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 125000003944 tolyl group Chemical group 0.000 description 3
- 125000005023 xylyl group Chemical group 0.000 description 3
- YRAJNWYBUCUFBD-UHFFFAOYSA-N 2,2,6,6-tetramethylheptane-3,5-dione Chemical compound CC(C)(C)C(=O)CC(=O)C(C)(C)C YRAJNWYBUCUFBD-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 2
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 2
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 2
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 2
- 238000007306 functionalization reaction Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000012463 white pigment Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- HGNRUZCVKNLRHE-UHFFFAOYSA-N 3-oxo-4,4-di(propan-2-yloxy)hexanoic acid Chemical compound CC(C)OC(CC)(OC(C)C)C(=O)CC(O)=O HGNRUZCVKNLRHE-UHFFFAOYSA-N 0.000 description 1
- BDCLDNALSPBWPQ-UHFFFAOYSA-N 3-oxohexanoic acid Chemical compound CCCC(=O)CC(O)=O BDCLDNALSPBWPQ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- QBRBKPZFIKWTOQ-UHFFFAOYSA-N CC(=C)C(=O)O[SiH2]O Chemical compound CC(=C)C(=O)O[SiH2]O QBRBKPZFIKWTOQ-UHFFFAOYSA-N 0.000 description 1
- NDHFYDKYYXSPFR-UHFFFAOYSA-N CC(C)CO[Ti] Chemical compound CC(C)CO[Ti] NDHFYDKYYXSPFR-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- KYTGWYJWMAKBPN-UHFFFAOYSA-N [dimethyl(prop-2-enyl)silyl]oxy-dimethyl-prop-2-enylsilane Chemical compound C=CC[Si](C)(C)O[Si](C)(C)CC=C KYTGWYJWMAKBPN-UHFFFAOYSA-N 0.000 description 1
- UNRQTHVKJQUDDF-UHFFFAOYSA-N acetylpyruvic acid Chemical compound CC(=O)CC(=O)C(O)=O UNRQTHVKJQUDDF-UHFFFAOYSA-N 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- GAURFLBIDLSLQU-UHFFFAOYSA-N diethoxy(methyl)silicon Chemical compound CCO[Si](C)OCC GAURFLBIDLSLQU-UHFFFAOYSA-N 0.000 description 1
- ASGKDLGXPOIMTM-UHFFFAOYSA-N diethoxy-methyl-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](C)(OCC)OCC)CCC2OC21 ASGKDLGXPOIMTM-UHFFFAOYSA-N 0.000 description 1
- SLQTWNAJXFHMHM-UHFFFAOYSA-N dimethoxy-methyl-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](C)(OC)OC)CCC2OC21 SLQTWNAJXFHMHM-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical class [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002899 organoaluminium compounds Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229960001866 silicon dioxide Drugs 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
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Abstract
本发明涉及一种可固化的有机硅组合物,其包含:(A)(A1)在分子中具有至少两个烯基并且不含硅键合的羟基或硅键合的氢原子的有机聚硅氧烷,或所述组分(A1)和(A2)由平均单元式表示的支链有机聚硅氧烷的混合物;(B)在分子中具有至少两个硅键合的氢原子的有机聚硅氧烷;(C)由通式表示的二有机二烷氧基硅烷;(D)在分子中具有至少一个硅键合的羟基并且不含硅键合的氢原子的直链有机硅氧烷低聚物;以及(E)氢化硅烷化催化剂,所述组合物可形成表现出优异初始粘合性和透明性并且在高温高湿条件下表现出优异粘合耐久性和透明保持性的固化产物。
Description
技术领域
本发明涉及一种可固化的有机硅组合物,其固化产物,以及使用该固化产物的光学半导体器件。
本发明要求于2012年3月30日提交的日本专利申请No.2012-079251的优先权,其内容以引用方式并入本文。
背景技术
氢化硅烷化反应可固化的有机硅组合物形成具有优异性质诸如耐候性和耐热性的固化产物,并因此用于多种应用。然而,此类组合物表现出不良的粘合性。因此,已提出包含粘合力赋予剂的可固化的有机硅组合物。例如,日本未经审查的专利申请公布No.2008-528788提出了一种可固化的有机硅组合物,其包含:丙烯酰氧基官能化烷氧基硅烷或甲基丙烯酰氧基官能化烷氧基硅烷、烯基官能化硅烷醇封端的有机聚硅氧烷以及环氧官能化烷氧基硅烷;以及日本未经审查的专利申请公布No.2010-248384提出了一种可固化的有机硅组合物,其包含:在分子中具有两个直接键合到硅原子的烷氧基的硅烷偶联剂以及至少一种类型的选自硼偶联剂、钛偶联剂、铝偶联剂和锆偶联剂的偶联剂。
日本未经审查的专利申请公布No.2008-528788中所提出的可固化的有机硅组合物涉及一种用于合成纤维材料的涂层组合物,并且其未指出或表明可以通过合并规定的烷氧基硅烷与烯基官能化硅烷醇封端的有机聚硅氧烷而解决得自该组合物的固化产物在高温高湿条件下表现出随时间降低的粘合性和透明性的问题。
此外,日本未经审查的专利申请公布No.2010-248384中所提出的可固化的有机硅组合物具有得自该组合物的固化产物在高温高湿条件下表现出随时间降低的粘合性和透明性的问题。因此,使用所述组合物作为光学半导体元件的密封剂或粘合剂会导致光学半导体器件的可靠性在高温高湿条件下显著降低的问题。
本发明的目标是提供一种可固化的有机硅组合物,其形成表现出优异初始粘合性和透明性并且在高温高湿条件下表现出优异粘合耐久性和透明保持性的固化产物。本发明的另一目标是提供这种类型的固化产物。本发明的另一目标是提供使用这种类型的固化产物的具有优异可靠性的光学半导体器件。
发明内容
本发明的可固化的有机硅组合物包含:
(A)100质量份(A1)在分子中具有至少两个烯基并且不含硅键合的羟基和硅键合的氢原子的有机聚硅氧烷,或所述组分(A1)和(A2)由以下平均单元式表示的支链有机聚硅氧烷的混合物:
(R1 2R2SiO1/2)a(R1 3SiO1/2)b(SiO4/2)c(HO1/2)d
其中R1为相同的或不同的具有1至10个碳的烷基;R2为烯基;并且“a”、“b”、“c”和“d”均为满足以下条件的正数:a+b+c=1;a/(a+b)=0.15至0.35;c/(a+b+c)=0.53至0.62;并且d/(a+b+c)=0.005至0.03;
(B)在分子中具有至少两个硅键合的氢原子的有机聚硅氧烷,其含量为对于组分(A)中每1摩尔的烯基,在此组分中提供0.1至10摩尔的硅键合的氢原子;
(C)0.01至10质量份由以下通式表示的二有机二烷氧基硅烷:
R3R4Si(OR5)2
其中R3为缩水甘油氧基烷基、环氧环己基烷基、环氧烷基、丙烯酰氧基烷基或甲基丙烯酰氧基烷基;R4为具有1至6个碳的烷基;并且R5为具有1至4个碳的烷基;
(D)0.01至10质量份在分子中具有至少一个硅键合的羟基并且不含硅键合的氢原子的直链有机硅氧烷低聚物;以及
(E)催化量的氢化硅烷化催化剂。
此外,通过使上述组合物固化而获得本发明的固化产物。
另外,本发明的光学半导体器件包括:光学半导体元件;以及通过使上述可固化的有机硅组合物固化而获得的并且密封或粘合所述元件的固化产物。
本发明的效果
本发明的可固化的有机硅组合物形成表现出优异初始粘合性和透明性并且在高温高湿条件下表现出优异粘合耐久性和透明保持性的固化产物。此外,本发明的固化产物表现出优异初始粘合性和透明性并且在高温高湿条件下表现出优异粘合耐久性和透明保持性。另外,本发明的光学半导体器件表现出优异可靠性。
附图说明
图1是作为本发明的光学半导体器件的例子的LED的剖面图。
具体实施方式
首先,对本发明的可固化的有机硅组合物进行详细说明。
组分(A)是本发明组合物中的主要组分并为(A1)在分子中具有至少两个烯基并且不含硅键合的羟基和硅键合的氢原子的有机聚硅氧烷,或所述组分(A1)和(A2)由以下平均单元式表示的支链有机聚硅氧烷的混合物:
(R1 2R2SiO1/2)a(R1 3SiO1/2)b(SiO4/2)c(HO1/2)d
组分(A1)中的烯基的例子包括乙烯基、烯丙基、异丙烯基、丁烯基、己烯基和环己烯基,其中乙烯基是优选的。组分(A1)中除烯基以外的硅键合的有机基团的例子包括:烷基,诸如甲基、乙基、丙基、丁基、戊基、己基、环戊基或环己基;芳基,诸如苯基、甲苯基或二甲苯基;芳烷基,诸如苄基或苯乙基;或卤代烷基,诸如3-氯丙基或3,3,3-三氟丙基,其中甲基或苯基是优选的。组分(A1)在25℃下的粘度不受限制,但优选地为10至10,000,000mPa·s,并且更优选地为50至1,000,000mPa·s。组分(A1)的分子结构不受限制,并且可以为直链、部分支化的直链或支链,其中直链是优选的。
这种类型的组分(A1)的例子包括在两个分子末端均被二甲基乙烯基硅氧基封端的二甲基聚硅氧烷、在两个分子末端均被二甲基乙烯基硅氧基封端的二甲基硅氧烷与甲基乙烯基硅氧烷的共聚物、在两个分子末端均被二甲基乙烯基硅氧基封端的二甲基硅氧烷与甲基苯基硅氧烷的共聚物、在两个分子末端均被三甲基硅氧基封端的甲基乙烯基聚硅氧烷、在两个分子末端均被三甲基硅氧基封端的二甲基硅氧烷与甲基乙烯基硅氧烷的共聚物或其中两者或更多者的混合物。
组分(A2)是用于为本发明组合物的固化产物赋予适当的硬度和机械强度的任选组分,并由以下平均单元式表示:
(R1 2R2SiO1/2)a(R1 3SiO1/2)b(SiO4/2)c(HO1/2)d
在该式中,R1是相同的或不同的具有1至10个碳的烷基,其具体的例子包括甲基、乙基、丙基、丁基、戊基、己基、环戊基和环己基,其中甲基是优选的。在该式中,R2为烯基,其例子包括乙烯基、烯丙基、异丙烯基、丁烯基、己烯基和环己烯基,其中乙烯基是优选的。在该式中,“a”、“b”、“c”和“d”均为满足以下条件的正数:a+b+c=1;a/(a+b)=0.15至0.35;c/(a+b+c)=0.53至0.62;并且d/(a+b+c)=0.005至0.03。为了为本发明的组合物赋予令人满意的可固化性,a/(a+b)的值优选地为0.2至0.3。为了为本发明组合物的固化产物赋予令人满意的硬度和机械强度,c/(a+b+c)的值优选地为0.55至0.60。为了为本发明组合物的固化产物赋予令人满意的粘合性和机械强度,d/(a+b+c)的值优选地为0.01至0.025。
组分(A2)是任选的组分,但为了使组分(A2)为本发明组合物的固化产物赋予令人满意的硬度和机械强度,组分(A)优选地为组分(A1)和组分(A2)的混合物。为了使本发明的组合物表现出良好的可处理性,组分(A2)在组分(A)中的含量优选地为60质量%或更少,并且更优选地为15质量%至60质量%。
组分(B)用于使本发明的组合物固化,并为在分子中具有至少两个硅键合的氢原子的有机聚硅氧烷。组分(B)中的硅键合的有机基团的例子包括:烷基,诸如甲基、乙基、丙基、丁基、戊基、己基、环戊基或环己基;芳基,诸如苯基、甲苯基或二甲苯基;芳烷基,诸如苄基或苯乙基;或卤代烷基,诸如3-氯丙基或3,3,3-三氟丙基,其中甲基或苯基是优选的。组分(B)在25℃下的粘度不受限制,但优选地为1至10,000mPa·s,并且更优选地为5至1,000mPa·s。组分(B)的分子结构不受限制,并且可以为直链、部分支化的直链、环状或支链,其中直链是优选的。
这种类型的组分(B)的例子包括在两个分子末端均被二甲基氢硅氧基封端的二甲基聚硅氧烷、在两个分子末端均被二甲基氢硅氧基封端的二甲基硅氧烷与甲基氢硅氧烷的共聚物、在两个分子末端均被三甲基硅氧基封端的甲基氢聚硅氧烷、在两个分子末端均被三甲基硅氧基封端的二甲基硅氧烷与甲基氢硅氧烷的共聚物、包含SiO4/2单元和(CH3)2HSiO1/2单元的有机聚硅氧烷、包含SiO4/2单元、(CH3)2HSiO1/2单元和(CH3)3SiO1/2单元的有机聚硅氧烷,以及其中两者或更多者的混合物。
组分(B)的含量是对于组分(A)中每1摩尔烯基,在此组分中提供0.1至10摩尔并优选0.5至5摩尔硅键合的氢原子的量。这是因为:如果组分(B)的含量不低于上述范围的下限,则本发明组合物的可固化性得以改善,并且如果组分(B)的含量不高于上述范围的上限,则通过使本发明组合物固化所获得的固化产物的机械性质和耐热性得以改善。
组分(C)用于改善本发明组合物的粘合性,并为由以下通式表示的二有机二烷氧基硅烷:
R3R4Si(OR5)2
在该式中,R3为缩水甘油氧基烷基,诸如3-缩水甘油氧基丙基或4-缩水甘油氧基丁基;环氧环己基烷基,诸如2-(3,4-环氧环己基)乙基或3-(3,4-环氧环己基)丙基;环氧烷基,诸如5,6-环氧己基或9,10-环氧癸基;丙烯酰氧基烷基,诸如3-丙烯酰氧基丙基或4-丙烯酰氧基丁基;或甲基丙烯酰氧基烷基,诸如3-甲基丙烯酰氧基丙基或4-甲基丙烯酰氧基丁基。在该式中,R4为具有1至6个碳的烷基,其例子包括甲基、乙基、丙基、丁基、戊基和己基,其中甲基是优选的。在该式中,R5为具有1至4个碳的烷基,其例子包括甲基、乙基、丙基和丁基,其中甲基或乙基是优选的。
这种类型的组分(C)的例子包括3-缩水甘油氧基丙基甲基二甲氧基硅烷、3-缩水甘油氧基丙基甲基二乙氧基硅烷、2-(3,4-环氧环己基)乙基甲基二甲氧基硅烷、2-(3,4-环氧环己基)乙基甲基二乙氧基硅烷、5,6-环氧己基甲基二甲氧基硅烷、5,6-环氧己基甲基二乙氧基硅烷、3-丙烯酰氧基丙基甲基二甲氧基硅烷、3-丙烯酰氧基丙基甲基二乙氧基硅烷、3-甲基丙烯酰氧基丙基甲基二甲氧基硅烷和3-甲基丙烯酰氧基丙基甲基二乙氧基硅烷。
组分(C)的含量为每100质量份组分(A)0.01至10质量份,并优选0.1至10质量份。这是因为:如果组分(C)的含量不低于上述范围的下限,则通过使本发明组合物固化所获得的固化产物的粘合性得以改善,并且如果组分(C)的含量不高于上述范围的上限,则本发明组合物的贮存稳定性得以改善。
组分(D)是有助于维持通过使本发明组合物固化所获得的固化产物的透明性和粘合性的组分,并为在分子中具有至少一个硅键合的羟基(即硅烷醇基团)并且不含硅键合的氢原子的直链有机硅氧烷低聚物。组分(D)中的硅键合的有机基团的例子包括:烷基,诸如甲基、乙基、丙基、丁基、戊基、己基、环戊基或环己基;烯基,诸如乙烯基、烯丙基、异丙烯基、丁烯基、己烯基或环己烯基;芳基,诸如苯基、甲苯基或二甲苯基;芳烷基,诸如苄基或苯乙基;或卤代烷基,诸如3-氯丙基或3,3,3-三氟丙基,其中甲基或乙烯基是优选的。此外,组分(D)在分子中优选地具有至少一个烯基。组分(D)在25℃下的粘度不受限制,但优选地为1至100mPa·s并且更优选地为1至50mPa·s。
这种类型的组分(D)的例子包括在两个分子末端均被硅烷醇基团封端的二甲基硅氧烷与甲基乙烯基硅氧烷的共聚物低聚物、在两个分子末端均被硅烷醇基团封端的甲基乙烯基硅氧烷低聚物以及在两个分子末端均被硅烷醇基团封端的二甲基硅氧烷低聚物。
组分(D)的含量为每100质量份组分(A)0.01至10质量份,并优选0.1至10质量份。这是因为:如果组分(D)的含量不低于上述范围的下限,则可维持通过使本发明组合物固化所获得的固化产物的良好透明性,并且如果组分(D)的含量不高于上述范围的上限,则可维持通过使本发明组合物固化所获得的固化产物的良好粘合性。
组分(E)是用于加速本发明组合物固化的氢化硅烷化催化剂。这种类型的组分(E)的例子包括铂基催化剂、铑基催化剂和钯基催化剂,其中铂基催化剂是优选的,因为其能够显著加速本发明组合物的固化。铂基催化剂的例子包括铂细粉、氯铂酸、氯铂酸的醇溶液、铂-烯基硅氧烷复合物、铂-烯烃复合物和铂-羰基复合物,其中铂-烯基硅氧烷复合物是尤其优选的。烯基硅氧烷的例子包括1,3-二乙烯基-1,1,3,3-四甲基二硅氧烷和1,3,5,7-四甲基-1,3,5,7-四乙烯基环四硅氧烷。为了使铂-烯基硅氧烷复合物表现出良好的稳定性,使用1,3-二乙烯基-1,1,3,3-四甲基二硅氧烷是尤其优选的。此外,为了能够改善铂-烯基硅氧烷复合物的稳定性,优选的是,将烯基硅氧烷诸如1,3-二乙烯基-1,1,3,3-四甲基二硅氧烷、1,3-二烯丙基-1,1,3,3-四甲基二硅氧烷或1,3,5,7-四甲基-1,3,5,7-四乙烯基环四硅氧烷,或有机硅氧烷低聚物诸如二甲基硅氧烷低聚物,特别是烯基硅氧烷加入复合物中。
组分(E)的含量为催化量并且不受特别限制,只要所用的量可加速本发明组合物的固化即可,但其量优选地使得以质量单位计,此组分中金属原子的量相对于本发明组合物为0.01至500ppm并且更优选0.01至50ppm。这是因为:如果组分(E)的含量不低于上述范围的下限,则可以使本发明组合物令人满意地固化,并且如果组分(E)的含量不高于上述范围的上限,则通过使本发明组合物固化所获得的固化产物的透明性得以改善。
可将反应抑制剂,例如炔醇,诸如2-甲基-3-丁炔-2-醇、3,5-二甲基-1-己炔-3-醇或2-苯基-3-丁炔-2-醇;烯炔化合物,诸如3-甲基-3-戊烯-1-炔或3,5-二甲基-3-己烯-1-炔;或1,3,5,7-四甲基-1,3,5,7-四乙烯基环四硅氧烷、1,3,5,7-四甲基-1,3,5,7-四己烯基环四硅氧烷或苯并三唑作为任选的组分掺入本发明的组合物中。该反应抑制剂的含量不受限制,但优选地为每100质量份组分(A)0.0001至5质量份。
此外,可将有机钛化合物诸如异丙氧基钛、异丁氧基钛、二异丙氧基双(2,4-戊二酮酸)钛、二异丙氧基双(四甲基庚二酮酸)钛或二异丙氧基双(乙基乙酰乙酸)钛;有机铝化合物诸如乙酰丙酮酸铝、二仲丁氧基乙基乙酰乙酸铝或二异丙氧基乙基乙酰乙酸铝;有机锆化合物诸如正丁醇锆、二正丁氧基双(2,4-戊二酮酸)锆或2,4-戊二酮酸锆;或有机金属化合物诸如2,4-戊二酮酸铁、四甲基庚二酮酸铁或其他有机铁化合物掺入本发明的组合物中以改善其粘合性。有机金属化合物的含量优选地为每100质量份组分(A)0.0001至1质量份。
可将无机填料诸如二氧化硅、玻璃、氧化铝或氧化锌;聚甲基丙烯酸酯树脂等的有机树脂细粉;耐热剂、染料、颜料、阻燃剂、溶剂等作为任选组分以不损害本发明目标的水平掺入本发明的组合物中。
本发明的组合物使得在室温或加热下发生固化,但优选的是,对组合物加热以实现快速固化。加热温度优选地为50至200℃。
本发明的固化产物通过使上述组合物固化而获得,并且其硬度不受限制,但对于在JIS K 6253中所规定的A型硬度计硬度优选地为20至99并且更优选地为30至95。这是因为:如果固化产物的硬度不低于上述范围的下限,则固化产物的表面粘性较低并且可以抑制固化产物与污垢附着之间的粘附性,并且如果固化产物的硬度不高于上述范围的上限,则固化产物中几乎不会发生破裂。
该固化产物在高温高湿条件下表现出优异的透明保持性,但在使用上述组合物作为光学半导体元件的密封剂或粘合剂的情况下改善光学半导体器件的可靠性,并且该固化产物优选地具有90%或更高且更优选95%或更高的透光率变化率[(T2/T1)×100],其中T1(%)是该固化产物在25℃和450nm波长下的初始透光率(光程长:1.0mm)并且T2(%)是前述固化产物在85℃的温度和85%的相对湿度下暴露1,000小时后的透光率。
此外,该固化产物在高温高湿条件下表现出优异的粘合耐久性,但在使用上述组合物作为光学半导体元件的密封剂或粘合剂的情况下改善光学半导体器件的可靠性,并且该固化产物优选地具有80%或更高且更优选90%或更高的粘合强度变化率[(S2/S1)×100],其中S1(%)为该固化产物在25℃下对聚邻苯二甲酰胺(PPA)薄片的初始粘合强度并且S2(%)为该固化产物在85℃的温度和85%的相对湿度下暴露1,000小时后的粘合强度。
现在将详细阐述本发明的光学半导体器件。
本发明的光学半导体器件包括光学半导体元件以及通过使上述可固化的有机硅组合物固化而获得的并且密封或粘结所述元件的固化产物。光学半导体元件的例子包括发光二极管(LED)、半导体激光器、光电二极管、光电晶体管、固态成像器件以及用于光耦合器的光发射器和光接收器,其中发光二极管(LED)是优选的。
在发光二极管(LED)器件中,因为发光二极管(LED)以垂直和水平方式发光,因此不希望该光学半导体器件的构成组件吸收光,并选择具有高透光率或高反射率的材料。这也适用于其上安装有光学半导体元件的基板。基板的例子包括:导电金属,诸如银、金或铜;非导电金属,诸如铝或镍;含白色颜料的热塑性树脂,诸如PPA或LCP;含白色颜料的热固性树脂,诸如环氧树脂、BT树脂、聚酰亚胺树脂或有机硅树脂;或陶瓷,诸如氧化铝或氮氧化铝。本发明的光学半导体器件使用上述组合物,并因此在光学半导体元件与基板之间表现出优异的粘合性并且可改善光学半导体器件的可靠性。
现在将通过图1来阐述本发明的光学半导体器件。图1是作为光学半导体器件的典型例子的独立表面安装型发光二极管(LED)器件的剖面图。图1中所示的发光二极管(LED)器件使得发光二极管(LED)芯片(5)通过粘合剂材料(4)而管芯接合到聚邻苯二甲酰胺(PPA)树脂外壳(1)内部的管芯焊盘(3)上。发光二极管(LED)芯片(5)和内部引线(2)通过接合线(6)打线接合并通过密封材料(7)密封到所述外壳的内壁。在该光学半导体器件中,形成该密封材料(7)的组合物为上述组合物。
实例
现将使用实例阐述本发明的可固化的有机硅组合物、其固化产物以及光学半导体器件。此外,物理性质值是在25℃下测得的值,并且如下测量固化产物的性质。
[固化产物的硬度]
通过在150℃下加热可固化的有机硅组合物1小时而制备固化产物。使用JIS K 6253中所规定的A型硬度计测量固化产物的硬度。
随后,使固化产物在85℃的温度和85%的相对湿度下暴露1,000小时。以如上所述的相同方式测量固化产物在高温高湿条件下处理后的硬度。
[固化产物的透光率]
通过在150℃下将可固化的有机硅组合物加热1小时而制备具有1.0mm光程长的固化产物。测量固化产物在450nm波长下的透光率。
随后,使固化产物在85℃的温度和85%的相对湿度下暴露1,000小时。以如上所述的相同方式测量固化产物在高温高湿条件下处理后的透光率。
[固化产物的粘合强度]
将聚四氟乙烯树脂垫片(宽度:10mm,长度:20mm,厚度:1mm)插入两个聚邻苯二甲酰胺(PPA)树脂薄片(宽度:25mm,长度:50mm,厚度:1mm)之间,用可固化的有机硅组合物填充此间隙,使用夹具夹紧薄片,随后通过在150℃的内部空气循环型烘箱中加热1小时使上述组合物固化。在冷却至室温后,使用拉伸试验机以水平相反方向牵拉通过移除夹具和垫片而获得的样品来测量固化产物的粘合强度。
另外,随后使上述样品在85℃的温度和85%的相对湿度下暴露1,000小时。以如上所述的相同方式,在高温高湿条件下进行处理后测量该样品的固化产物粘合强度。
[实践例1至4和比较例1至5]
通过以表1中所示的组成均匀混合以下组分而制备可固化的有机硅组合物。其中,Vi表示乙烯基并且Me表示甲基。在该表中,SiH/Vi表示在可固化的有机硅组合物中,相对于组分(A-1)至(A-4)中总计每1摩尔的乙烯基,组分(B-1)至(B-2)中的硅键合的氢原子的总摩尔数;透光率变化率意指固化产物在高温高湿条件下处理后的透光率相对于初始透光率的变化;并且粘合强度变化率意指固化产物在高温高湿条件下处理后的粘合强度相对于初始粘合强度的变化。
组分(A-1):在两个分子末端均被二甲基乙烯基硅氧基封端的二甲基聚硅氧烷,其具有360mPa·s的粘度(乙烯基含量=0.44质量%)
组分(A-2):在两个分子末端均被二甲基乙烯基硅氧基封端的二甲基聚硅氧烷,其具有11,000mPa·s的粘度(乙烯基含量=0.14质量%)
组分(A-3):有机聚硅氧烷树脂,其在25℃下为白色固体,可溶于甲苯并由以下平均单元式表示:
(ViMe2SiO1/2)0.13(Me3SiO1/2)0.45(SiO4/2)0.42(HO1/2)0.01
(乙烯基含量=3.4质量%)
组分(A-4):有机聚硅氧烷,其在25℃下为白色固体,可溶于甲苯并由以下平均单元式表示:
(ViMe2SiO1/2)0.15(Me3SiO1/2)0.38(SiO4/2)0.47(HO1/2)0.01
(乙烯基含量=4.2质量%)
组分(B-1):在两个分子末端均被三甲基硅氧基封端的二甲基硅氧烷与甲基氢硅氧烷的共聚物,其具有5mPa·s的粘度(硅键合的氢原子含量=1.4质量%)
组分(B-2):在两个分子末端均被三甲基硅氧基封端的聚甲基氢硅氧烷,其具有20mPa·s的粘度(硅键合的氢原子含量=1.57质量%)
组分(C-1):3-缩水甘油氧基丙基三甲氧基硅烷
组分(C-2):3-缩水甘油氧基丙基甲基二甲氧基硅烷
组分(C-3):3-缩水甘油氧基丙基甲基二乙氧基硅烷
组分(C-4):3-丙烯酰氧基丙基甲基二甲氧基硅烷
组分(D-1):在两个分子末端均被硅键合的氢原子封端的二甲基硅氧烷与甲基乙烯基硅氧烷的共聚物低聚物,其具有40mPa·s的粘度
组分(E-1):1,3-二乙烯基四甲基二硅氧烷铂复合物的1,3-二乙烯基四甲基二硅氧烷溶液(铂金属含量=4,000ppm)
组分(F-1):3,5-二甲基-1-辛炔-3-醇
表1
表1(续)
表1(续)
工业适用性
本发明的可固化的有机硅组合物对金属诸如钢、不锈钢、铝、铜、银、钛或钛合金;半导体元件诸如硅半导体、镓磷基半导体、镓砷基半导体或氮化镓基半导体;陶瓷材料、玻璃、热固性树脂、具有极性基团的热塑性树脂等表现出优异的初始粘合性和粘合耐久性,并在经历加热和冷却循环时表现出尤其优异的粘合耐久性,并因此可用作光学半导体元件诸如发光二极管(LED)、半导体激光器、光电二极管、光电晶体管、固态成像器件或用于光耦合器的光发射器和光接收器的密封剂或粘合剂。此外,本发明的光学半导体器件可用作诸如光学器件、光学设备、照明设备或照明器件的光学半导体器件。
标记说明
1 聚邻苯二甲酰胺(PPA)树脂外壳
2 内部引线
3 管芯焊盘
4 粘合材料
5 发光二极管(LED)芯片
6 接合线
7 密封材料
Claims (6)
1.一种可固化的有机硅组合物,包含:
(A)100质量份(A1)在分子中具有至少两个烯基并且不含硅键合的羟基和硅键合的氢原子的有机聚硅氧烷,或所述组分(A1)和(A2)由以下平均单元式表示的支链有机聚硅氧烷的混合物:
(R1 2R2SiO1/2)a(R1 3SiO1/2)b(SiO4/2)c(HO1/2)d
其中R1为相同的或不同的具有1至10个碳的烷基;R2为烯基;并且“a”、“b”、“c”和“d”均为满足以下条件的正数:a+b+c=1;a/(a+b)=0.15至0.35;c/(a+b+c)=0.53至0.62;并且d/(a+b+c)=0.005至0.03;
(B)在分子中具有至少两个硅键合的氢原子的有机聚硅氧烷,其含量为对于组分(A)中每1摩尔的所述烯基,在此组分中提供0.1至10摩尔的硅键合的氢原子;
(C)0.01至10质量份由以下通式表示的二有机二烷氧基硅烷:
R3R4Si(OR5)2
其中R3为缩水甘油氧基烷基、环氧环己基烷基、环氧烷基、丙烯酰氧基烷基或甲基丙烯酰氧基烷基;R4为具有1至6个碳的烷基;并且R5为具有1至4个碳的烷基;
(D)0.01至10质量份在分子中具有至少一个硅键合的羟基并且不含硅键合的氢原子的直链有机硅氧烷低聚物;以及
(E)催化量的氢化硅烷化催化剂。
2.根据权利要求1所述的可固化的有机硅组合物,其中组分(A)为组分(A1)和组分(A2)的混合物,并且组分(A2)在组分(A)中的含量为60质量%或更少。
3.根据权利要求1或2所述的可固化的有机硅组合物,其为用于光学半导体元件的密封剂或粘合剂。
4.一种通过使权利要求1或2中所述的可固化的有机硅组合物固化而获得的固化产物。
5.一种光学半导体器件,包括:光学半导体元件;以及权利要求1或2中所述的可固化的有机硅组合物的固化产物,其密封或粘合所述元件。
6.根据权利要求5所述的光学半导体器件,其中所述光学半导体元件为发光二极管。
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KR20140145177A (ko) | 2014-12-22 |
US20150069456A1 (en) | 2015-03-12 |
KR102044675B1 (ko) | 2019-11-15 |
EP2831175B1 (en) | 2020-06-17 |
TW201402656A (zh) | 2014-01-16 |
WO2013146334A1 (en) | 2013-10-03 |
US9546309B2 (en) | 2017-01-17 |
EP2831175A1 (en) | 2015-02-04 |
JP5922463B2 (ja) | 2016-05-24 |
TWI567112B (zh) | 2017-01-21 |
JP2013209454A (ja) | 2013-10-10 |
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