CN104170013A - Manufacturing method for glass substrate for information recording medium, and information recording medium - Google Patents
Manufacturing method for glass substrate for information recording medium, and information recording medium Download PDFInfo
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- CN104170013A CN104170013A CN201380011847.3A CN201380011847A CN104170013A CN 104170013 A CN104170013 A CN 104170013A CN 201380011847 A CN201380011847 A CN 201380011847A CN 104170013 A CN104170013 A CN 104170013A
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- Prior art keywords
- glass substrate
- carrier
- retaining hole
- grinding
- information recording
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Magnetic Record Carriers (AREA)
Abstract
A carrier (500) has: one first holding through hole (520C) disposed in the proximity of the center position thereof; and a plurality of second holding through holes (520P) disposed in a circular shape around the first holding through hole (520C). If the diameter of a glass substrate (1) is Dmm, and the distance from the center position (C1) of the carrier (500) to the center position (C2) of the first holding through hole (520C) of the carrier (500) is rmm, the center position (C2) of the first holding through hole (520C) is provided in a position so as to satisfy the following relational formula: [(D/4)<=r<=(D/2)].
Description
Technical field
The present invention relates to manufacture method and the information recording carrier of glass substrate for information recording medium, particularly relate to the manufacture method of the glass substrate for information recording medium using and possess the information recording carrier of this glass substrate for information recording medium in the manufacture of information recording carrier.
Background technology
The information recording carriers such as disk are equipped on computing machine etc. as hard disk.Information recording carrier is on the surface of substrate, to form the magnetic thin film layer comprise recording layer to manufacture, and described recording layer has utilized magnetic, light or optomagnetic etc. character.Recording layer is magnetized by magnetic head, thus by regulation information recording in information recording carrier.
Information recording carrier is improving constantly recording density year by year.Accompany therewith, the quality of the substrate using for information recording carrier, also requires high-quality.The substrate of using as information recording carrier uses aluminium base all the time, still, along with the raising of recording density, replaces with gradually the glass substrate of flatness and the strength ratio aluminium base excellence of substrate surface.
In the manufacture method of the glass substrate of using at information recording carrier, have for guaranteeing the grinding process/grinding step of higher surface configuration precision.In order to realize the high-precision shape quality of glass substrate, adopted the different slurry of processing processing power and grinding/grinding pad are combined effectively, 2 grinding/grinding steps more than stage.For example in TOHKEMY 2007-015105 communique (patent documentation 1), disclose the technology relevant to manufacture glass substrate in the past.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2007-015105 communique
Summary of the invention
The problem that invention will solve
For the glass substrate using as information recording carrier, generally a plurality of glass substrates are held in to the retaining hole that runs through of the upper setting of carrier (carrier), carry out the grinding/grinding of glass substrate.In recent years, for cutting down cost, there is such trend: be increased in the glass substrate number on each carrier using in grinding/grinding.
In addition, in order to improve the recording density of each glass substrate, even near the region to the end face of outer circumferential side of glass substrate is all used as to information recording area, therefore, the precision that the shape finishing precision of the outer circumference side edge face of glass substrate is also had relatively high expectations.
If run through retaining hole for carrier with the closeest mode setting, near the center of carrier, be also placed with glass substrate.If glass substrate is disposed to the center of carrier, while driving double-sided grinding device in grinding process, the glass substrate that is configured in center is concentrated by near near the region week in the platform in grinding pad and in the middle of platform periphery and (below, is called Intermediate Gray region.) same position.
Glass substrate concentrates this situation of same position by grinding pad to make in grinding process, part on grinding pad, that glass substrate passes through produces the uneven wear of grinding pad (bonded-abrasive), thus the step (impression) that is spill in the generation cross section, Intermediate Gray region of grinding pad.
If produce step on grinding pad, easily on the surface of glass substrate, produce the grinding damage (cut) being caused by this step.In addition, in order to eliminate this grinding damage, in grinding step after this, need long processing (larger removal amount)., in grinding step, particularly final grinding step (precise finiss) below, mostly use the grinding pad of soft, if the time of final grinding step is elongated, the end surface shape of glass substrate worsens.
The present invention completes in view of above-mentioned problem, and a kind of manufacture method and information recording carrier of glass substrate for information recording medium is provided, and in having used the grinding process of double-sided grinding device, can be suppressed on grinding pad and produce step.
For the means of dealing with problems
In the manufacture method based on glass substrate for information recording medium of the present invention, described information recording carrier is formed with magnetic thin film layer on the first type surface of the glass substrate of disc-shape, in the manufacture method of described glass substrate for information recording medium, there is surfacing operation, in this surfacing operation, utilization possesses the double-sided grinding device of planetary gears, while supply the first type surface of feedwater, grinding fluid or the above-mentioned glass substrate of lubricating fluid grinding.
Above-mentioned double-sided grinding device possesses: upper mounting plate, and it is positioned at the upside of above-mentioned glass substrate, and has upside grinding pad in the above-mentioned glass substrate side of this upper mounting plate; Lower platform, it is positioned at the downside of above-mentioned glass substrate, and has downside grinding pad in the above-mentioned glass substrate side of this lower platform; And discoid carrier, it is provided with the retaining hole that runs through of the above-mentioned glass substrate of a plurality of maintenances, and above-mentioned carrier is clipped by above-mentioned upside grinding pad and above-mentioned downside grinding pad, and rotatablely moving of stipulating by above-mentioned planetary gears.
The above-mentioned retaining hole that runs through has: one the 1st that is configured near the center of above-mentioned carrier runs through retaining hole; With around the above-mentioned the 1st, run through that retaining hole configures in the form of a ring a plurality of the 2nd run through retaining hole.
In the situation that the diameter of above-mentioned glass substrate is made as to Dmm and the center from above-mentioned carrier is made as to rmm to above-mentioned the 1st distance that runs through the center of retaining hole, the position of the relational expression that above-mentioned the 1st center of running through retaining hole is arranged on is satisfied [(D/4)≤r≤(D/2)].
In another way, above-mentioned carrier, than what run through around the above-mentioned the 1st that retaining hole configures in the form of a ring, the above-mentioned the 2nd run through retaining hole by the position of the radial direction inner side of above-mentioned carrier, also there is diameter and run through than above-mentioned the auxiliary through hole that retaining hole is little.
In based on information recording carrier of the present invention, possess: glass substrate, it is that manufacture method by the glass substrate for information recording medium described in above-mentioned any one mode obtains; And magnetic thin film layer, it is formed on the first type surface of above-mentioned glass substrate.
Invention effect
According to the present invention, a kind of manufacture method and information recording carrier of glass substrate for information recording medium can be provided, in having used the grinding process of double-sided grinding device, can be suppressed on grinding pad and produce step.
Accompanying drawing explanation
Fig. 1 is the stereographic map illustrating by the resulting glass substrate of manufacture method of the glass substrate in embodiment.
Fig. 2 is the stereographic map that the disk that possesses the resulting glass substrate of manufacture method by the glass substrate in embodiment is shown.
Fig. 3 is the process flow diagram that the manufacture method of the glass substrate in embodiment is shown.
Fig. 4 is the partial perspective view of the double-sided grinding device that uses in grinding process.
Fig. 5 is the vertical view that the carrier in embodiment is shown.
Fig. 6 is the vertical view that the size relationship of the carrier in embodiment is shown.
Fig. 7 is the vertical view of glass substrate.
Fig. 8 is the vertical view that the carrier in reference technique is shown.
Fig. 9 is the vertical view of the downside grinding pad in reference technique.
Figure 10 is the vertical view that the carrier in another embodiment is shown.
Figure 11 is the figure that the evaluation result of the end surface shape in embodiment 1-2, comparative example 1-2 is shown.
Embodiment
Below, with reference to accompanying drawing, to describing based on embodiments of the present invention and embodiment.In the explanation of embodiment and embodiment, in the situation that mentioning number, amount etc., except having the situation of special record, scope of the present invention might not be defined in this number, amount etc.In the explanation of embodiment and embodiment, there is such situation: for same parts and corresponding parts, mark identical reference number, and repeatedly do not carry out the explanation of repetition.
[glass substrate/disk 10]
See figures.1.and.2, first, the resulting glass substrate 1 of the manufacture method of the glass substrate for information recording medium by based on present embodiment and the disk 10 that possesses glass substrate 1 are described.Fig. 1 is the stereographic map that is illustrated in the glass substrate 1 using in disk 10 (with reference to Fig. 2).Fig. 2 is the stereographic map illustrating as disk 10 information recording carrier, that possess glass substrate 1.
Glass substrate 1 (glass substrate for information recording medium) the Cheng center of using in disk 10 as shown in Figure 1, forms the circular plate shape of the ring-type of porose 1H.The glass substrate 1 of disc-shape has front first type surface 1A, back side first type surface 1B, interior all end face 1C and peripheral end face 1D.
The size of glass substrate 1 is not particularly limited, and for example, external diameter is 0.8 inch, 1.0 inches, 1.8 inches, 2.5 inches or 3.5 inches etc.From preventing damaged viewpoint, the thickness of glass substrate 1 is for example 0.30mm～2.2mm.The size of the glass substrate 1 in present embodiment is: external diameter is about 65mm, and internal diameter is about 20mm, and thickness is about 0.8mm.The thickness of glass substrate 1 is by the average value calculating of the value of the point-symmetric any number of somes place measurement on glass substrate 1.
As shown in Figure 2, in disk 10, on the first type surface 1A of the front of above-mentioned glass substrate 1, be formed with magnetic film, thereby form the magnetic thin film layer 2 that comprises magnetic recording layer.In Fig. 2, only on the first type surface 1A of front, be formed with magnetic thin film layer 2, but also on first type surface 1B, be formed with magnetic thin film layer 2 overleaf.
Magnetic thin film layer 2 is by the thermosetting resin that is dispersed with magnetic particle being spun on to upper (spin-coating method) forming of front first type surface 1A of glass substrate 1.Magnetic thin film layer 2 also can be formed at by sputtering method or electroless plating method etc. the front first type surface 1A of glass substrate 1.
Thickness about the magnetic thin film layer 2 that forms on the front first type surface 1A at glass substrate 1, the in the situation that of spin-coating method, be about 0.3 μ m～about 1.2 μ m, the in the situation that of sputtering method, be about 0.04 μ m～about 0.08 μ m, be about 0.05 μ m～about 0.1 μ m in the situation that of electroless plating method.From the viewpoint of filming and densification, preferably by sputtering method or electroless plating method, form magnetic thin film layer 2.
As the magnetic material for magnetic thin film layer 2, be not particularly limited, can use known magnetic material in the past, but, in order to obtain high confining force, take crystalline anisotropy compared with high Co as basis and take and adjust relict flux density and added the Co class alloy etc. of Ni or Cr proper as object.In addition, as the magnetic layer material that is applicable to thermal assisted recording, can adopt the material of FePt class.
In addition,, in order to improve the smoothness of magnetic recording head, can apply thinly lubricant on the surface of magnetic thin film layer 2.As lubricant, such as enumerating with the solvent dilution of freon class etc. as the PFPE (PFPE) of fluid lubricant and the lubricant obtaining.
And, also basalis or protective seam can be set as required.Basalis in disk 10 is selected according to magnetic film.As the material of basalis, such as the material that can enumerate more than at least one that select from the nonmagnetic metal such as Cr, Mo, Ta, Ti, W, V, B, Al or Ni.
In addition, basalis is not limited to individual layer, also can be made as the sandwich construction that stacked identical type or different types of layer form.For example, can be made as the multi-layer substrate layers such as Cr/Cr, Cr/CrMo, Cr/CrV, NiAl/Cr, NiAl/CrMo or NiAl/CrV.
As the protective seam that prevents the abrasion and corrosion of magnetic thin film layer 2, such as enumerating Cr layer, Cr alloy-layer, carbon-coating, hydrogenation carbon-coating, zirconia layer or silicon dioxide layer etc.These protective seams can, together with basalis, magnetic film etc., utilize in-line arrangement sputter equipment to form continuously.In addition, these protective seams can be made as individual layer, or are made as the sandwich construction consisting of identical type or different types of layer.
Can on above-mentioned protective seam, form other protective seam, or substitute above-mentioned protective seam and form other protective seam.For example, can substitute above-mentioned protective seam, and on Cr layer, in the process of the solvent dilution tetraalkoxysilane of use alcohol type, apply dispersedly colloidal silica particles and carry out sintering, form monox (SiO
2) layer.
[manufacture method of glass substrate]
Next, utilize the process flow diagram shown in Fig. 3, the glass substrate for information recording medium in present embodiment (is simply called to glass substrate below.) manufacture method describe.Fig. 3 is the process flow diagram that the manufacture method of the glass substrate 1 in embodiment is shown.
The manufacture method of the glass substrate in present embodiment possesses glass blank preparatory process (step S10), glass substrate forms operation (step S20), grinding/grinding step (step S30), chemical enhanced operation (step S40) and matting (step S50).Can implement magnetic thin film to the glass substrate (being equivalent to the glass substrate 1 in Fig. 1) obtaining through chemical enhanced treatment process (step S40) and form operation (step S60).By magnetic thin film, form operation (step S60), can obtain the disk 10 as information recording carrier.
Below, in the following content that the details of this each step S10～S60 is described successively, be not documented in the simplified cleaning suitably carrying out between each step S10～S60.
(glass blank preparatory process)
In glass blank preparatory process (step S10), make the glass material melting (step S11) of glass substrate to be formed.Glass material for example adopts common alumina silicate glass.The SiO that alumina silicate glass contains 58% mass percent～75% mass percent
2, 5% mass percent～23% mass percent Al
2o
3, 3% mass percent～10% mass percent Li
2the Na of O, 4% mass percent～13% mass percent
2o is as principal ingredient.The glass material of melting, after flowing on counterdie, carries out impact briquetting (step S12) by upper die and lower die.By impact briquetting, formed discoid glass blank (base glass material).
Glass blank can utilize grinding grinding tool to cut out the foliated glass (plate glass) forming by drop-down (down draw) method or float glass process and form.In addition, glass material is not limited to alumina silicate glass, can be material arbitrarily.
(glass substrate formation operation)
Next, at glass substrate, form in operation (step S20), take and improve dimensional accuracy and form accuracy is object, two sides' of the glass blank that impact briquetting is formed first type surface is implemented the 1st friction process (step S21).Two sides' of glass blank first type surface refers to through described later each and processes and to form as the first type surface of the front first type surface 1A in Fig. 1 and to become the first type surface (following, to be called two first type surfaces) of back side first type surface 1B.For example, by using the alumina abrasive grain (about 40～60 μ m of particle diameter) of granularity #400, being finish-machined to surfaceness Rmax, be 6 μ m left and right.
After the 1st friction process, use diamond drill machine cylindraceous first-class, the central part of glass blank is implemented to get core (interior week excision) and process (step S22).By getting core, process, can obtain offering porose circular glass substrate at central part.Also can implement to the hole of central part the chamfer machining of regulation.
In addition, utilize brush that the peripheral end face of glass substrate is become to mirror-like (step S22) with interior all end surface grindings.As grinding abrasive particle, can adopt the slurry that contains cerium oxide abrasive particle.
(grinding/grinding step)
Next, in grinding/grinding step (step S30), two of glass substrate first type surfaces are implemented to the 2nd friction process (step S31).The 2nd friction process (step S31) carries out with double-sided grinding device, and this double-sided grinding device has utilized planetary gears.Specifically, from up and down platform being pressed into two first type surfaces of glass blank, water, grinding fluid or lubricating fluid are supplied on two first type surfaces, glass blank and friction platform are relatively moved, carry out the 2nd friction process.
By the 2nd friction process (step S31), the depth of parallelism roughly, flatness and the thickness etc. of glass substrate are carried out to pre-adjustment, thereby obtain having the base glass material of the first type surface of general planar.In the 2nd friction process, in order to reduce the polishing scratch of generation, use than the fine abrasive particle of described the 1st friction process.For example, by the bonded-abrasives such as diamond grinding pad are installed on platform, by being refined to surfaceness Rmax on two faces of glass substrate, be 2 μ m left and right.
At this, with reference to Fig. 4, the Sketch of double-sided grinding device 1000 is described.Fig. 4 is the partial perspective view of the double-sided grinding device 1000 that uses in the 2nd friction process.
Double-sided grinding device 1000 possesses: upper mounting plate (upside grinding tool keeps platform) 300; Lower platform (downside grinding tool keeps platform) 400; Upside grinding pad 310, it is installed on the lower surface of a side (glass substrate side) relative with lower platform 400 of upper mounting plate 300; And downside grinding pad 410, it is installed on the upper surface of a side (glass substrate side) relative with upper mounting plate 300 of lower platform 400.
Upside grinding pad 310 and downside grinding pad 410 are for to two of glass substrate 1 machining tools that first type surface carries out grinding.Upper mounting plate 300 and lower platform 400 are with respect to the revolution direction rotation in the opposite direction mutually of carrier 500.In the gap being formed between upper mounting plate 300 and lower platform 400, dispose carrier 500.The glass substrate 1 of a plurality of plate-likes is maintained on this carrier 500.In addition, can be described the detailed structure of carrier 500 afterwards.
Can in the 2nd friction process (step S31), carry out the surface clean of upside grinding pad 310 and downside grinding pad 410.The surface clean of upside grinding pad 310 and downside grinding pad can be carried out in any operation in the 2nd friction process (step S31), also can between any operation in grinding/grinding step (step S30), carry out, or, can also after grinding/grinding step (step S30) finishes, carry out.
Two of glass substrate 1 first type surfaces are carried out after one or many grinding, in double-sided grinding device 1000, carry out the surface clean of upside grinding pad 310 and downside grinding pad 410.The surface of upside grinding pad 310 and downside grinding pad 410 can regularly be cleaned when often carrying out one or many grinding, or, also can be cleaned aperiodically.
Next, as the 1st polishing process (rough lapping), remove the cut on two first type surfaces that remain in glass substrate in the 2nd friction process (step S31), the warpage of glass substrate is corrected to (step S33) simultaneously.In the 1st polishing process, use the double-side polishing apparatus that has utilized planetary gears.For example, use the grinding pads such as hard velvet, polyurethane foam part or bituminizing suede to grind.As lapping compound, adopted and take the slurry that common cerium oxide abrasive particle is principal ingredient.
In the 2nd polishing process (precise finiss), glass substrate is implemented to attrition process again, to eliminate (the step S34) such as tiny flaws on two first type surfaces that remain in glass substrate.Two first type surfaces of glass substrate, by being finish-machined to mirror-like, form desirable flatness, and the warpage of glass substrate is also eliminated.In the 2nd polishing process, use the double-side polishing apparatus that has utilized planetary gears.For example, use and to using the grinding pad as soft burnisher that suede or velvet be material, grind.As lapping compound, used and take the slurry that the common cataloid finer than the cerium oxide using be principal ingredient in the 1st polishing process.
(chemical enhanced operation)
After cleaning glass substrate, glass substrate be impregnated in chemical enhanced treating fluid, two first type surfaces at glass substrate form chemical enhanced layer (step S40) thus.After cleaning glass substrate 1, glass substrate 1 be impregnated in to the mixing that is heated to the potassium nitrate (70%) of 300 ℃ and sodium nitrate (30%) with in the chemical enhanced treating fluids such as liquid about 30 minutes, carry out thus chemical enhanced.
The alkali metal ions such as the lithium ion containing in glass substrate 1, sodion are by alkali metal ion displacements (ion exchange process) such as the large potassium ions of these ions of ratio of ionic radii.
Due to because of the different distortion that produce of ionic radius, carrying out the region generating compression stress after ion-exchange, thereby by two first type surface strengthenings of glass substrate 1.For example, on two first type surfaces of glass substrate 1, can be the surface from glass substrate 1 form chemical enhanced layer in the scope of about 5 μ m, thereby improve the rigidity of glass substrate 1.As described above, can obtain being equivalent to the glass substrate of the glass substrate 1 shown in Fig. 1.
Also the removal amount that can further implement on two first type surfaces glass substrate 1 is the polishing more than 0.1 μ m and below 0.5 μ m.By by through the attachment that remains in after chemical enhanced operation on the first type surface of glass substrate 1 remove, can reduce the situation that produces head crash on the disk that uses glass substrate 1 to produce.In addition, by more than the removal amount on two first type surfaces of polishing being set as to 0.1 μ m and below 0.5 μ m, can there is not from the teeth outwards the stress inhomogeneous producing because of chemical enhanced processing.The manufacture method of the glass substrate in present embodiment forms as described above.
In addition, also can between the 1st polishing process (rough lapping) and the 2nd polishing process (precise finiss), implement chemical enhanced operation.
(matting)
Next, glass substrate is cleaned to (step S50).(ultraviolet: ultraviolet ray) ozone etc. cleans two of glass substrate first type surfaces, thus, the attachment being attached on two first type surfaces of glass substrate is removed to utilize washing agent, pure water, ozone, IPA (isopropyl alcohol) or UV.
Then, utilize the lip-deep attachment quantity of the inspection glass substrates 1 such as optical profile type flaw detection apparatus.
(magnetic thin film formation operation)
The upper magnetic film that forms of two first type surfaces (or any one first type surface) of the glass substrate after completing chemical enhanced processing (being equivalent to the glass substrate 1 shown in Fig. 1), forms magnetic thin film layer 2 thus.Magnetic thin film layer by make following layer successively film forming form: the lubricating layer that the orientation that fits tightly layer, the soft ferromagnetic layer consisting of CoFeZr alloy, consists of Ru consisting of Cr alloy is controlled basalis, the perpendicular magnetic recording layer consisting of CoCrPt alloy, the protective seam consisting of C class and consisted of F class.By forming magnetic thin film layer, can access the perpendicular magnetic recording disk of the disk 10 being equivalent to shown in Fig. 2.
Disk in present embodiment is an example of the vertical disk that consists of magnetic thin film layer.Disk also can be configured to so-called interior disk by magnetosphere etc.
(carrier 500)
Next, with reference to Fig. 5 to Fig. 7, the detailed structure of the carrier 500 that the double-sided grinding device 1000 using in the 2nd friction process in above-mentioned grinding/grinding process is adopted describes.Fig. 5 is the vertical view that the carrier 500 in present embodiment is shown, and Fig. 6 is the vertical view that the size relationship of the carrier in present embodiment is shown, and Fig. 7 is the vertical view of glass substrate 1.
With reference to Fig. 5, the carrier 500 in present embodiment has the main body 510 of disc-shape, and its thickness is about 0.30mm～2.2mm, selects than the thickness of the thin thickness of the glass substrate 1 that will keep.The diameter of carrier 500 is about 430mm.Main body 510 can adopt aramid fiber, FRP (glass epoxy resin), PC (polycarbonate) etc.
What on carrier 500, be provided with that 23 places keep glass substrates 1 runs through retaining hole 520.In the present embodiment, run through retaining hole 520 and have: one the 1st runs through retaining hole 520C, its be configured in carrier 500 center C1 near; With 22 the 2nd run through retaining hole 520P, they run through retaining hole 520C around the 1st and configure in the form of a ring.In the present embodiment, the 2nd runs through retaining hole 520P is arranged as dual ring-type, on interior ringed line r1, to be uniformly-spaced arranged with 8, runs through retaining hole 520P, and ringed line r2 is upper outside, to be uniformly-spaced arranged with 14, runs through retaining hole 520P.The diameter that runs through retaining hole 520 is about 66.5mm.
At this, with reference to Fig. 6, in the situation that the diameter of glass substrate 1 is made as to Dmm and the distance that the center C1 to the 1 from carrier 500 runs through the center C2 of retaining hole 520C is made as to rmm, the position (shadow region representing with S in figure) of the relational expression that the 1st center C2 that runs through retaining hole 520C is arranged on is satisfied [(D/4)≤r≤(D/2)] is located.
In the present embodiment, the diameter D of glass substrate 1 is 65mm, and therefore the 1st center C2 that runs through retaining hole 520C is arranged on the position that meets 16.25mm≤r≤32.5mm.
Double-sided grinding device 1000 in present embodiment is configured in 5 carriers 500 between upper mounting plate 300 and lower platform 400 in the form of a ring.Outer peripheral face at carrier 500 is provided with gear, but has omitted the diagram of gear.In addition, the radius of carrier 500 refers in the situation that the size that the point circle place of gear is measured.
At this, with reference to Fig. 8 and Fig. 9, the double-sided grinding device 1000 in following situation is described: the center C2 that the center C1 of carrier 500 and the 1st runs through retaining hole 520C overlaps, that is, run through retaining hole 520C be arranged at carrier 500 center by the 1st.Fig. 8 shows the carrier 500 running through in the situation that retaining hole 520C is arranged at carrier 500 center the 1st.
In the situation that use the carrier 500 shown in this Fig. 8 and utilize double-sided grinding device 1000 to carry out the double-side grinding of glass substrate 1, as shown in Figure 9, when driving double-sided grinding device 1000, the glass substrate 1 that is configured in center is concentrated same position by downside grinding pad 410, is Intermediate Gray region BL1.
It is that Intermediate Gray region this situation of BL1 makes in grinding process that glass substrate 1 is concentrated the same position by downside grinding pad 410, part on the downside grinding pad 410 as bonded-abrasive, that glass substrate 1 passes through, produce the uneven wear of downside grinding pad 410, thereby produce at the Intermediate Gray region of downside grinding pad 410 BL1 the step (impression) that cross section is spill.
If produce step on downside grinding pad 410, easily on the surface of glass substrate 1, produce the grinding damage (cut) being caused by this step.In addition, in order to eliminate this grinding damage, in grinding step after this, need long processing (larger removal amount)., in grinding step, particularly final grinding step (precise finiss) below, mostly use the grinding pad of soft, if the time of final grinding step is elongated, the end surface shape of glass substrate worsens.This is not limited to downside grinding pad 410, on upside grinding pad 410, also can produce identical phenomenon.
On the other hand, carrier 500 in present embodiment shown in Fig. 5 is configured to, the position (region being represented by S in figure) of that the 1st center C2 that runs through retaining hole 520C departs from the center C1 from carrier 500, to meet [(D/4)≤r≤(D/2)] relational expression.
Thus, even in the situation that carry out the double-side grinding of glass substrate 1 by double-sided grinding device 1000, also can suppress to be run through glass substrate 1 that retaining hole 520C keeps by the situation of the same position of upside grinding pad 310 and downside grinding pad 410 by the 1st.
Consequently, suppressed the generation of the uneven wear of upside grinding pad 310 and downside grinding pad 410, reduced on upside grinding pad 310 and downside grinding pad 410 and produced the situation of the step that cross section is spill (impression), thereby the grinding damage (cut) that can suppress to be caused by this step appears on the surface of glass substrate 1.
(embodiment)
Below, each embodiment of the manufacture method of above-mentioned glass substrate for information recording medium and each comparative example are described.In each embodiment shown below and each comparative example, till the S20 shown in Fig. 3 " glass substrate forming process " implemented as the above description like that.The number of glass substrate is to amount to 115 concerning each condition.
(the 2nd friction process)
Then the operation before has been implemented the 2nd friction process.In upside grinding pad and downside grinding pad, used as diamond grinding pad bonded-abrasive, abrasive particle diameter 9 μ m.In embodiment 1 and embodiment 2, used from the center C1 to the 1 of carrier 500 and run through the carrier that the distance r of the center C2 of retaining hole 520C is 20mm.On the other hand, in comparative example 1, used the carrier that the 1st center C2 that runs through retaining hole 520C is arranged to the center C1 of carrier 500, in comparative example 2, used r for 16.25mm be the carrier of 15mm below.
In addition, in embodiment 2, as shown in figure 10, used such glass substrate 1: than what run through around the 1st that retaining hole 520C configures in the form of a ring, the 2nd running through retaining hole 520p more by the position of the radial direction inner side of carrier 500, thering is diameter than the little auxiliary through hole 520M that runs through retaining hole 520.On this glass substrate, be provided with 4 auxiliary through hole 520M.The diameter of auxiliary through hole 520M is 26mm, from the center C1 of carrier 500, to assisting the distance of the center of through hole 520M, is 50mm.
About this auxiliary through hole 520M, in the situation that only run through retaining hole 520C by 1 the 1st, be arranged at the position of departing from from the center C1 of carrier 500, the centre of gravity place of carrier 500 departs from, thereby carrier may produce distortion in grinding process, may cause damage to upside grinding pad 310 and downside grinding pad 410.Therefore, auxiliary through hole 520M can be arranged on to the position that makes the centre of gravity place of carrier 500 become the center of carrier 500.Thus, can suppress to produce because of upside grinding pad 310 and the damage in downside grinding pad 410 that carrier 500 distortion cause.
In addition, in each embodiment and each comparative example, the double-sided grinding device that utilization is used in the 2nd friction process has carried out prior processing in advance, the condition that upper and lower grinding pad is shown to inherent trend has been implemented the 2nd friction process after reunification, wherein, in this processing in advance, used the glass substrate outside the glass substrate using in this test.Specifically, before carry out this test, use the carrier adopting in each embodiment and each comparative example, and utilize the double-sided grinding device using in this test, with accumulative total, be respectively the mode of 40 hours that roughly amounts to process time, carried out prior glass substrate processing.In in advance processing, used with according to till the identical glass substrate of glass substrate that the process of above-mentioned S22 operation is made.By prior processing, the carrier that can observe this embodiment/comparative example is intrinsic, the wearing and tearing to grinding pad.
(surface finish measurement)
After the 2nd friction process (S31) finishes, the glass substrate obtaining by each embodiment and each comparative example has been carried out to the measurement of surfaceness.In the measurement of surfaceness, used KEYENCE company of Co., Ltd. system, shape measure laser microscope VK9700.
For the surperficial 1mm that measures glass substrate
2resulting result, all evaluates.In embodiment 1 and embodiment 2, to compare with comparative example 2 with comparative example 1, the roughness on surface is lower, the negligible amounts of the dark damage that can confirm.
(the 1st polishing process (rough lapping))
Implemented the 1st polishing process (rough lapping), until reach the processing capacity of thinking that the grinding marks observed from the teeth outwards disappears.In embodiment 1 and embodiment 2, compare with comparative example 1 and comparative example 2, can shorten required process time.
Next, implemented the 2nd polishing process (precise finiss).In each embodiment and each comparative example, make processing conditions identical.At this, in each embodiment and each comparative example, mainly by the 1st polishing process, realize the removal of grinding marks, although make processing conditions identical in the 2nd polishing process, but mainly utilize the 2nd polishing process to adjust processing capacity, even in the situation that grinding marks will be removed, also can shorten process time by same method.The grinding pad that the hardness ratio of the grinding pad particularly using in the 2nd polishing process is being used in the 1st polishing process is low, in the 2nd polishing process, the easy generation face angle of collapsing on glass substrate, but, by the method identical with the present embodiment, can expect to shorten process time and the face that the prevents such effect in angle of collapsing.
(end surface measurement of glass substrate)
Figure 11 illustrates the evaluation result of embodiment 1, embodiment 2 and comparative example 1, comparative example 2.For passing through embodiment 1, embodiment 2 and comparative example 1, the resulting glass substrate of comparative example 2, use contact pin type profile meter, from the center of glass substrate, towards radial direction, measure the height of the glass substrate of R1 (22.25mm) this point, R2 (27.25mm) this point and R3 (31.25mm) this point, shape as the end face part of glass substrate, using the line of the height at connection R1 and R2 place as datum line, analyzed the relative shift of the height of R3 position.This analysis result is judged to be to certified products for ± 0.18 μ m with interior product.
In addition, in embodiment 1,2 and comparative example 1,2, respectively 50 glass substrates are carried out to end surface measurement, the ratio of investigation certified products, more than 86% glass substrate is set as evaluating " A " at ± 0.18 μ m with interior situation, and thinks qualified, the in the situation that of less than 86%, be set as evaluating " C ", and think defective.
As shown in figure 11, for the result of end surface measurement, in embodiment 1 and embodiment 2, obtained evaluation " A ".It in comparative example 1 and comparative example 2, is evaluation " C ".
Like this, about the result of end surface measurement, in comparative example 1 and comparative example 2, end surface shape is poor, and in embodiment 1 and embodiment 2, end surface shape is good.In comparative example 1 and comparative example 2, compare embodiment 1 and embodiment 2 increases the process time of the 1st polishing process (rough lapping), therefore, can expect, along with the increase of this process time, the end surface shape of glass substrate worsens.
For the grinding platform using, after formal processing, measured the average thickness of upper and lower grinding pad in embodiment 1 and embodiment 2.About the thickness measure to upside grinding pad and downside grinding pad, internally near week, respectively measure respectively 2 places near Intermediate Gray region, periphery and amount to 6 places, and then obtained the mean value of upside grinding pad and downside grinding pad.
As shown in figure 11, compare with embodiment 1, in embodiment 2, the mean value of the wearing and tearing of upside grinding pad 310 and downside grinding pad 410 is less, is 20 μ m left and right.This be because, the in the situation that of embodiment 2, by auxiliary through hole 520M is set, it is the center C1 of carrier 500 that the centre of gravity place of carrier 500 is proofreaied and correct, thus, compare with the carrier 500 of embodiment 1, the distortion of the vertical direction that carrier 500 produces reduces, thereby the damage having suppressed in upside grinding pad 310 and downside grinding pad 410 produces.
And then, the glass substrate obtaining by above-described embodiment 1-2 and comparative example 1-2 has been implemented to the chemical enhanced operation (S40) shown in Fig. 3, matting (S50) and magnetic thin film and formed operation (S60), obtained information recording carrier.
Pack this information recording carrier into hard disk drive, carried out read-write test.Used the information recording carrier of the glass substrate obtaining by comparative example 1-2 near the periphery of information recording carrier, to produce the district that cannot record.On the other hand, even if used the information recording carrier of the glass substrate obtaining by embodiment 1-2 also can realize good record near the periphery of information recording carrier.
As described above embodiments of the present invention and embodiment are illustrated, should think that this time disclosed embodiment and embodiment are all illustration and unrestricted in all respects.Scope of the present invention be can't help above-mentioned explanation and is represented by claims, be intended to comprise all changes in the meaning equal with claim and scope.
Label declaration
1A: front first type surface; 1B: back side first type surface; 1C: interior all end faces; 1D: peripheral end face; 1H: hole; 2: magnetic thin film layer; 10: disk; 300: upper mounting plate; 310: upside grinding pad; 310g, 410g: groove; 400: lower platform; 410: downside grinding pad; 500: carrier; 510: main body; 520: run through retaining hole; 520C: the 1st runs through retaining hole; 520P: the 2nd runs through retaining hole; 520M: auxiliary through hole; 1000: double-sided grinding device.
Claims (3)
1. a manufacture method for glass substrate for information recording medium, described information recording carrier is formed with magnetic thin film layer on the first type surface of the glass substrate of disc-shape, in the manufacture method of described glass substrate for information recording medium,
There is surfacing operation, in this surfacing operation, utilize to possess the double-sided grinding device of planetary gears, while supply the first type surface of glass substrate described in feedwater, grinding fluid or lubricating fluid grinding,
Described double-sided grinding device possesses:
Upper mounting plate, it is positioned at the upside of described glass substrate, and has upside grinding pad in the described glass substrate side of this upper mounting plate;
Lower platform, it is positioned at the downside of described glass substrate, and has downside grinding pad in the described glass substrate side of this lower platform; And
Discoid carrier, it is provided with the retaining hole that runs through of the described glass substrate of a plurality of maintenances, and described carrier is clipped by described upside grinding pad and described downside grinding pad, and rotatablely moving of stipulating by described planetary gears,
The described retaining hole that runs through has: one the 1st that is configured near the center of described carrier runs through retaining hole; With around the described the 1st, run through that retaining hole configures in the form of a ring a plurality of the 2nd run through retaining hole,
In the situation that the diameter of described glass substrate is made as to Dmm and the center from described carrier is made as to rmm to described the 1st distance that runs through the center of retaining hole, the position of the relational expression that described the 1st center of running through retaining hole is arranged on is satisfied [(D/4)≤r≤(D/2)].
2. the manufacture method of glass substrate for information recording medium according to claim 1, wherein,
Described carrier, than what run through around the described the 1st that retaining hole configures in the form of a ring, the described the 2nd run through retaining hole by the position of the radial direction inner side of described carrier, also there is diameter and than described in run through the auxiliary through hole that retaining hole is little.
3. an information recording carrier, wherein, described information recording carrier possesses:
Glass substrate, it is that manufacture method by glass substrate for information recording medium obtains; With
Magnetic thin film layer, it is formed on the first type surface of described glass substrate,
The manufacture method of described glass substrate for information recording medium has surfacing operation, in this surfacing operation, utilization possesses the double-sided grinding device of planetary gears, while supply the first type surface of glass substrate described in feedwater, grinding fluid or lubricating fluid grinding
Described double-sided grinding device possesses:
Upper mounting plate, it is positioned at the upside of described glass substrate, and has upside grinding pad in the described glass substrate side of this upper mounting plate;
Lower platform, it is positioned at the downside of described glass substrate, and has downside grinding pad in the described glass substrate side of this lower platform; And
Discoid carrier, it is provided with the retaining hole that runs through of the described glass substrate of a plurality of maintenances, and described carrier is clipped by described upside grinding pad and described downside grinding pad, and rotatablely moving of stipulating by described planetary gears,
The described retaining hole that runs through has: one the 1st that is configured near the center of described carrier runs through retaining hole; With around the described the 1st, run through that retaining hole configures in the form of a ring a plurality of the 2nd run through retaining hole,
In the situation that the diameter of described glass substrate is made as to Dmm and the center from described carrier is made as to rmm to described the 1st distance that runs through the center of retaining hole, the position of the relational expression that described the 1st center of running through retaining hole is arranged on is satisfied [(D/4)≤r≤(D/2)].
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012080465 | 2012-03-30 | ||
| JP2012-080465 | 2012-03-30 | ||
| PCT/JP2013/056080 WO2013146133A1 (en) | 2012-03-30 | 2013-03-06 | Manufacturing method for glass substrate for information recording medium, and information recording medium |
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| CN104170013A true CN104170013A (en) | 2014-11-26 |
| CN104170013B CN104170013B (en) | 2018-02-27 |
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| JP (1) | JP6138113B2 (en) |
| CN (1) | CN104170013B (en) |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107263278A (en) * | 2017-07-03 | 2017-10-20 | 适新科技（苏州）有限公司 | Twin grinder and grinding technics |
| CN110014353A (en) * | 2018-01-10 | 2019-07-16 | Ａｇｃ株式会社 | The processing method of bend glass substrate and the manufacturing method of glass shaping body |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2024088310A (en) * | 2022-12-20 | 2024-07-02 | 東洋鋼鈑株式会社 | Double-sided polishing machine |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN104170013B (en) | 2018-02-27 |
| JPWO2013146133A1 (en) | 2015-12-10 |
| WO2013146133A1 (en) | 2013-10-03 |
| JP6138113B2 (en) | 2017-05-31 |
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