JP2000288919A - Polishing carrier, polishing method, and manufacture of information recording medium substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing carrier having high durability and low manufacturing costs, a polishing method, and a method for manufacturing an information recording medium substrate. SOLUTION: In a polishing carrier 1 provided with a polished article holding portion 2 having a plurality of holding holes 2a for holding an article to be polished, and a gear portion 3 provided in the outer periphery of the polished article holding portion 2, coincidence is prevented between straight lines A and B: the straight line A passing through the center of an at least holding hole disposed in the outermost periphery and the center of the polished article holding portion, and the straight line B passing through the center of a holding hole adjacent to the holding hole positioned in the outermost periphery and the center of the polished article holding portion. Alternatively, a distance between the holding holes 2a disposed in the outermost. peripheral side and/or a distance between the holding hole 2a disposed in the outermost periphery and the gear portion 3 is set larger than a distance between the plurality of the holding holes 2a. The concentration of stress applied to the polished article holding portion 2 in the particular part of the holding portion 2 is thereby prevented, and thus the particular part is prevented from being broken.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a magnetic disk substrate,
For holding an object to be polished when polishing an optical disk substrate, silicon wafer, electronic device substrate (photomask blank substrate, phase shift mask blank substrate, liquid crystal display substrate), etc. The present invention relates to a polishing carrier to be used, a polishing method using the carrier, and a method for manufacturing a substrate for an information recording medium using the polishing method.

[0002]

2. Description of the Related Art Disc polishing or lapping of a disk-shaped glass substrate used as a substrate for a magnetic disk or the like is performed by inserting a glass substrate into a plurality of circular holding holes provided in a disk-shaped polishing carrier. It is performed by rotating the upper and lower platens in opposite directions while holding the glass substrate between the lower platen and the upper platen.

Here, a gear formed on the outer peripheral portion of the polishing carrier is designed to mesh with an internal gear and a sun gear of the polishing apparatus, and the polishing carrier has a rotational speed between the internal gear and the sun gear. The difference causes a planetary motion, whereby the glass substrate is simultaneously polished or wrapped on both sides.

FIGS. 4 and 5 are plan views showing a conventional polishing carrier (for lapping). In these figures, a polishing carrier 1 is made of glass epoxy and has a plurality of holding bodies 2 having a plurality of holding holes 2a,..., 2a for holding a body to be polished such as a glass substrate for a magnetic disk. And a gear unit 3 provided on the outer periphery of the polished body holding unit 2.

A plurality of the plurality of holding holes 2a,..., 2a are respectively arranged on four (FIG. 4) or three (FIG. 5) concentric circles centered on the center of the holder 2 to be polished. Things. The lapping device is equipped with five such polishing carriers inside and outside. Therefore, several hundreds of objects to be polished are lapped at a time, and the manufacturing cost is reduced. In recent years, it has been confirmed that the present invention is useful not only for magnetic disk glass substrate teeth and 2.5-inch glass substrates mounted on hard disks of notebook personal computers but also for desktop personal computers. Demand for glass substrates is rapidly increasing. Even in such a background, the above-mentioned carrier capable of processing a very large number of glass substrates in a single lapping step is indispensable for reducing the manufacturing cost.

[0006]

However, the above-mentioned conventional polishing carrier is mainly used in the lapping step, but the lapping step requires a processing speed of about 10 to 20 μm.
/ Min, when used for several hours, especially the holding hole door located on the outermost circumference side, and the shredding between the holding hole located adjacent to the outermost circumference and the material used Has not always been able to be said to have a sufficient life as compared with the life normally expected from the general durability.

SUMMARY OF THE INVENTION The present invention has been made in view of the above background, and has excellent durability and a polishing method capable of reducing the manufacturing cost, and a method for manufacturing a substrate for an information recording medium. The purpose is to provide.

[0008]

According to a first aspect of the present invention, there is provided a polishing object holder having a plurality of holding holes for holding a polishing object, and an outer periphery of the polishing object holder. A polishing carrier having a gear portion provided in
The plurality of holding holes are arranged on a plurality of concentric circles having different radii about the center of the polished body holding portion, and at least the center of the holding hole arranged at the outermost periphery and the center of the holding hole. A straight line A passing through the center of the polished body holding portion does not coincide with a straight line B passing through the center of the holding hole adjacent to the holding hole located at the outermost periphery and the center of the polished body holding portion. A polishing carrier, characterized in that stress applied to the object-to-be-polished holding part during polishing is prevented from being concentrated on a specific part of the object-to-be-polished holding part, thereby preventing the specific part from being broken. It is.

A second invention is the polishing carrier according to the first invention, wherein the angle between the straight line A and the straight line B is 1 ° or more.

In a third aspect of the present invention, the distance between the holding holes arranged on the outermost periphery and / or the distance between the holding holes arranged on the outermost periphery and the gear portion is determined by changing the distance between the plurality of holding holes. The polishing carrier according to the first or second invention, wherein the distance is set to be larger than the distance between the holding holes.

According to a fourth aspect of the present invention, there is provided a polishing carrier having a polished body holding portion having a plurality of holding holes for holding a polished body, and a gear portion provided on an outer periphery of the polished body holding portion. The plurality of holding holes are arranged on a plurality of concentric circles having different radii about the center of the polished body holding portion, and the distance between the holding holes arranged on the outermost periphery and / or the outermost periphery By setting the distance between the holding holes arranged on the side and the gear portion to be larger than the distance between the plurality of holding holes, the stress applied to the holder to be polished during polishing is reduced. A polishing carrier characterized in that the carrier is prevented from concentrating on a specific portion of the holding portion to prevent the specific portion from being fatigued and broken.

According to a fifth aspect of the present invention, there is provided a polishing carrier holding hole having a plurality of holding holes for holding a member to be polished and a gear provided on the outer periphery of the holding member. , The upper and lower lapping plates are rotated with the lower and upper stools sandwiching the polished body, and the main surface of the polished body is subjected to lapping and / or polishing to polish the polished body. In the polishing method for polishing, the polishing carrier according to any one of the first to fourth inventions is used as the polishing carrier.

According to a sixth aspect of the present invention, information is provided in a holding hole of a polishing carrier having a holder to be polished having a holding hole for holding a member to be polished and a gear provided on the outer periphery of the holder to be polished. A recording medium substrate is inserted, and the upper and lower platens are rotated while the information recording medium substrate is sandwiched between the lower platen and the upper platen, and the main surface of the information recording medium substrate is subjected to lapping and / or polishing to obtain information. In a method for manufacturing an information recording medium substrate having a polishing step of polishing a recording medium substrate, the information carrier according to any one of the first to fourth inventions is used as the polishing carrier. This is a method for manufacturing a medium substrate.

With the above-described structure, the life of the polishing carrier can be significantly prolonged. In addition, since there is almost no risk of a cutting accident during polishing, it is possible to make full use of the service life and use it, thereby enabling a significant cost reduction.

The process leading to the present invention is as follows. That is, the present inventors have conducted detailed investigations and studies on the conventional cases such as the cutting accident of the polishing carrier. As a result, it was found that the cut portions tended to concentrate on a specific portion. That is, for example, a straight line A passing through the center of the holding hole arranged at the outermost periphery and the center of the polished body holding portion, and the center of the holding hole adjacent to the holding hole located at the outermost periphery and the polishing target. Straight line B passing through the center of the body holder
It was found that in the case where と coincides, the vicinity thereof is easily cut along these holding holes. In particular, the fragmentation was observed on the outermost peripheral side where the peripheral speed was high.

According to the analysis of the present inventors, it has been found that one of the causes of the cutting accident is related to the arrangement position of the holding holes. The present invention has been made as a result of various trials and errors based on the results of this elucidation. In the present invention, by adopting the above configuration, a lapping or polishing apparatus (upper platen, lower platen, internal gear,
In this manner, the stress applied between the holding holes of the polishing carrier from the sun gear) is appropriately dispersed, the risk of breakage due to wear and fatigue is eliminated, and the life of the polishing carrier is significantly improved.

In the polishing carrier of the present invention, a straight line A passing through the center of the holding hole arranged at the outermost periphery and the center of the holding portion of the object to be polished is adjacent to the holding hole located at the outermost periphery. The center of the holding hole and the straight line B passing through the center of the object-to-be-polished holding part are not matched, or the distance between the holding holes arranged on the outermost side and / or the outermost side is arranged. Any arrangement may be used as long as the distance between the holding hole and the gear portion is set to be larger than the distance between the plurality of holding holes.

Generally, it is assumed that the plurality of holding holes are respectively arranged on a plurality of concentric circles having different radii from the center of the holding portion of the object-to-be-polished. By adjusting the distance between the holding holes on each concentric circle for each concentric circle or the like, the above-mentioned arrangement relationship is realized.

Number of rows of retaining holes in the radial direction (number of concentric circles)
Is determined according to an object to be polished such as a glass substrate to be manufactured (polished). For example, in order to arrange 50 glass substrates for one carrier, in the case of a three-row arrangement, the first row has 10 pieces, the second row has 17 pieces, and the third row has 2 pieces from the center side.
Three holding holes are formed. In the case of a 4-row arrangement, the first row is 4 pieces, the second row is 10 pieces, and the third row is 16 pieces from the center side.
In the fourth row, twenty holding holes are formed. The lapping or polishing apparatus has a platen which varies depending on the apparatus, but when 5 carriers are mounted, 5 × 50 = 250 glass substrates can be manufactured by one lapping or polishing step. In addition, as a material of the holder for the object to be polished used in the present invention, aramid fiber, FRP (glass epoxy), PC (polycarbonate) and the like can be mentioned.

[0020]

(Embodiment 1) FIG. 1 is a plan view of a polishing carrier according to Embodiment 1 of the present invention, FIG. 2 is a diagram showing a state where the polishing carrier is mounted on a polishing apparatus, and FIG. FIG.
FIG. Hereinafter, a polishing carrier, a polishing method, and a method for manufacturing a substrate for an information recording medium according to the first embodiment will be described with reference to these drawings. In this embodiment, a 2.5-inch glass substrate for a magnetic recording medium (glass substrate for an information recording medium = polished object) is used by using a polishing carrier capable of mounting 50 polished objects in a 4-row arrangement. This is an example in which the present invention is applied to the case of manufacturing.

In FIG. 1, the polishing carrier 1 is composed of a disc-shaped polished body holding section 2 and a gear section 3 provided on the outer periphery of the polished body holding section. Polishing carrier 1
Is made of a glass epoxy plate having a diameter of 620 mm and a thickness of 0.5-0 mm, and a plurality of (50 in this embodiment) polished body holding holes 2a,.
2a is formed. This polished body holding hole 2a is
It has a size (inner diameter ra; about 65 mm) that can accommodate the 2.5-inch glass substrate 4 for magnetic recording medium (glass substrate for information recording medium = polished body).

The plurality of holding holes 2a are respectively arranged on four concentric circles centered on the center of the holder 2 for the object to be polished. That is, four pieces on a first circle having a diameter r ₁ and a diameter r ₁
10 on ₂ of the second circle, on a third circle having a diameter r ₃ 16
And 20 pieces on the fourth circle having the diameter r ₄ , and a total of 50 pieces are arranged. The intervals between the concentric circles are the same.

The distance between the holding holes 2a arranged on each concentric circle is the distance d ₄ = 10 on the fourth circle.
mm, the distance d ₃ on the _third circle, the distance d ₂ on the _second circle, and the distance d _{1 on} the first circle are d ₄ > d ₃ > d
_2> d ₁ (where, d1> 0) are the become so. Further, the distance d ₀ between the holding hole 2a arranged on the outermost side and the gear portion 3 (tooth bottom) is about 15 mm. Each holding hole is arranged such that an angle formed between straight lines passing through the center of the holding hole and the center of the holder to be polished is at least 1 ° or more.

Next, referring to FIGS. 2 and 3, the polishing carrier 1 is mounted on the polishing apparatus 5, and the polishing or lapping process is performed on the glass substrate 4 for the magnetic recording medium as the object to be polished. Will be described briefly.

The polishing apparatus 5 has an internal gear 51 and a sun gear 52, each of which is driven to rotate at a predetermined rotation ratio.
And an upper surface plate 53 and a lower surface plate 54 which are driven to rotate in opposite directions with respect to the polishing carrier mounting portion.

When a plurality of polishing carriers 1 are set in the polishing carrier mounting portion, the gears of these polishing carriers 1 mesh with the internal gear 51 and the sun gear 52. A glass substrate 4 for a magnetic recording medium, which is an object to be polished, is placed in the object holding hole 2a of each polishing carrier 1.
Is set, and polishing is started, the polishing carrier 1 performs planetary motion due to the difference in rotation speed between the internal gear 51 and the sun gear 52. At the same time, upper platen 53 and lower platen 5
4 rotate in opposite directions to each other, and a polishing pad 5
The front and back surfaces of the glass substrate 4 for a magnetic recording medium are polished or wrapped by 3a and 54a.

Generally, a glass substrate is mirror-finished through a process of roughing → lapping (sanding) → end surface mirroring process → polishing process. Here, the lapping step aims at improving dimensional accuracy and shape accuracy, and the main surface of the glass substrate is processed by a lapping machine. The polishing step aims at improving the smoothness of the surface (reducing the surface roughness) and reducing the processing strain, and usually includes a first polishing step using a hard polisher and a second polishing step using a soft polisher.
A polishing step (final polishing step).

The polishing carrier of the present invention can be used in any of the above-mentioned steps, and is particularly effective in a lapping step in which the processing speed is high. Therefore, the polishing process will be specifically described below.

When performing the polishing process (first polishing step, final polishing step), the teeth 3a of the gear portion 3 formed on the outer peripheral portion of the polishing carrier 1 are connected to the sun gear 52 of the polishing device 5 and the internal gear 51. The polishing carrier 1 is brought into contact with the polishing pad 54 a
Is set on the lower platen 54 on which is attached. Next, the glass substrate 4 for a magnetic recording medium, which is the object to be polished, is placed and held in the object-to-be-polished holding hole 2a.

Next, the glass substrate 4 is placed on a polishing pad 54a.
The lower platen 54 and the upper platen 53 are sandwiched between the lower platen 54 and the upper platen 53 on which the polishing pad 53a is stuck, and the lower platen 54 and the upper platen 53 are rotated in opposite directions while supplying a polishing liquid containing abrasive grains such as cerium oxide. . Thereby, the polishing carrier 1 revolves while rotating by the difference in the rotation speeds of the sun gear 52 and the internal gear 51, and both surfaces of the glass substrate 4 are simultaneously polished.

Examples of the polishing pads 53a and 54a include soft polishers made of suede and velor, and hard polishers made of hard velor, urethane foam, pitch impregnated suede, and the like.

Hereinafter, the manufacturing process of the glass substrate for a magnetic recording medium will be described more specifically. (1) First Lapping Step (First Sanding Step) First, a glass substrate made of aluminosilicate glass cut into a disk shape having a diameter of 66 mmφ and a thickness of 1.1 mm with a grinding wheel from a sheet glass formed by a downdraw method. Was ground with a relatively coarse diamond grindstone to form a diameter of 65 mm (2.5 inches) φ and a thickness of 0.6 mm.

In this case, instead of the down-draw method, a molten glass may be directly pressed using an upper mold, a lower mold, and a body mold to obtain a disk-shaped glass body. Incidentally, as the aluminosilicate glass, 5% of SiO ₂ was expressed in mol%.
7-74%, ZnO ₂ is 0-2.8%, Al ₂ O ₃ is 3
15%, the LiO ₂ 7 to 16%, a Na ₂ O 4 to 14
%, As a main component.

Next, a lapping process was performed on the glass substrate. This lapping step aims at improving dimensional accuracy and shape accuracy. The lapping process was performed using a lapping apparatus, and a carrier made of glass epoxy was used, and the grain size of abrasive grains was set to # 400. More specifically, a load L of 1 was used by using alumina abrasive grains having a grain size of # 400.
By setting the sun gear and the internal gear to about 00 kg and rotating both the sun gear and the internal gear, both sides of the glass substrate housed in the carrier have a surface accuracy of 0 to 1 μm and a surface roughness (Rma).
x) (measured by JIS B0601) Lapping was performed to about 6 μm.

Next, a circular hole (diameter: 20 mmφ) was opened in the center of the glass substrate using a cylindrical grindstone, and a predetermined chamfering process was performed on the outer peripheral end surface and the inner peripheral end surface. At this time, the surface roughness of the inner and outer peripheral end faces of the glass substrate is Rmax
Was about 14 μm.

(2) Edge Polishing Step Next, by polishing the edge of the glass substrate (angular portion, side surface and chamfered portion) while rotating the glass substrate by brush polishing using a slurry, the angular portion is polished. The curved surfaces had a radius of 0.2 to 10 mm, and their surface roughness was about 1 μm in Rmax and about 0.3 μm in Ra. The surface of the glass substrate after the end face polishing step was washed with water.

(3) Second Lapping Step (Second Sanding Step) Next, using a carrier of Example 1 made of glass epoxy using a lapping apparatus, alumina abrasive grains having a particle size of # 1000 and a load L of 100 kg The lapping is performed by rotating the sun gear and the internal gear at a predetermined degree, and the surface roughness (Rmax) of both surfaces of the glass substrate
Was set to about 2 μm. The glass substrate after the second lapping step was washed by sequentially immersing the glass substrate in a neutral detergent and water washing tank.

(4) First Polishing Step (First Polishing Step) Next, a first polishing step was performed. This first polishing step is intended to remove scratches and distortion remaining in the above-described lapping step, and was performed using a polishing apparatus. More specifically, the first polishing step was performed under the following polishing conditions using a hard polisher (cerium pad MHC15: manufactured by Speed Fam) as a polishing pad (polishing cloth) and using the carrier of Example 1 made of glass epoxy. .

Polishing liquid: cerium oxide (average particle size: 1.3 μm) + water Load: 300 kg / cm 2 (L = 238 kg) Polishing time: 15 minutes Removal amount: 30 μm Lower platen rotation speed: 40 rpm Upper platen rotation speed: 35 rpm Sun gear rotation speed: 14 rpm Internal gear rotation speed: 29 rpm The glass substrate that has been subjected to the first polishing step is placed in a cleaning tank of a neutral detergent, pure water, pure water, IPA (isopropyl alcohol), and IPA (steam drying). Soak sequentially,
Washed.

(5) Second Polishing Step (Final Polishing Step) Next, using the polishing apparatus used in the first polishing step, the polishing pad was changed from a hard polisher to a soft polisher (Porelax: manufactured by Speed Fam). The second polishing step was performed using the carrier of Example 1 made of glass epoxy. The polishing conditions were as follows: polishing liquid: cerium oxide (average particle size: 0.8 μm) + water, load 100 g / c
m2, the polishing time was 5 minutes, and the removal amount was 5 μm. After the second polishing step, the glass substrate is subjected to a neutral detergent, a neutral detergent, pure water, pure water, IPA (isopropyl alcohol),
It was immersed in each washing tank of IPA (steam drying) in order and washed. In addition, ultrasonic waves were applied to each cleaning tank.

(6) Chemical Strengthening Step Next, the glass substrate after the lapping and polishing steps was chemically strengthened. For the chemical strengthening, a chemical strengthening solution in which potassium nitrate (60%) and sodium nitrate (40%) are mixed is prepared, and the chemical strengthening solution is heated to 400 ° C., and the cleaned glass substrate preheated to 300 ° C. is washed. 3
It was carried out by soaking for a time. In this immersion, in order to chemically strengthen the entire surface of the glass substrate, the immersion was performed in a state where a plurality of glass substrates were housed in a holder so as to be held at end faces.

As described above, by performing the immersion treatment in the chemical strengthening solution, the lithium ions and the sodium ions on the surface layer of the glass substrate become the sodium ions in the chemical strengthening solution,
The glass substrate is strengthened by being respectively substituted by potassium ions. The thickness of the compressive stress layer formed on the surface of the glass substrate was about 100 to 200 μm. The glass substrate after the chemical strengthening is immersed in a water bath at 20 ° C. and rapidly cooled,
Maintained for about 10 minutes. After the quenched glass substrate,
Washing was performed by immersion in concentrated sulfuric acid heated to about 40 ° C. Further, the glass substrate after the sulfuric acid cleaning is purified water, pure water,
Washing was performed by sequentially immersing in each of IPA (isopropyl alcohol) and IPA (steam drying) washing tanks. In addition, ultrasonic waves were applied to each cleaning tank.

(Evaluation) The surface roughness of the main surface of the glass substrate for a magnetic recording medium obtained through the above steps was 3.2 nm in Rmax and 0.3 nm in Ra (AFM (atomic force microscope) )). When the polishing carrier of the present invention was used in the lapping step for 100 hours or more, there was no breakage between the holding holes due to abrasion, and no breakage of the glass substrate occurred.

Comparative Example 1 A glass substrate for a magnetic recording medium was produced in the same manner as in Example 1 except that the carrier used in the second lapping step was the conventional carrier shown in FIG. As a result, the surface roughness of the main surface of the obtained glass substrate was almost the same. However, when the lapping process is performed a plurality of times and about 10 hours have passed, the points aligned in the center direction (the straight lines passing through the center of each holding hole and the center of the holder to be polished coincide with each other; In some cases, the gap between the holding holes having an angle of 0) is broken by abrasion, and the glass substrate deviating from the holding holes is broken.

Although the present invention has been described with reference to the preferred embodiments, the present invention is not necessarily limited to the above embodiments. For example, although the glass is mentioned as the material of the object to be polished, the material is not limited to this, and a brittle material such as glass ceramics, ceramics, silicon, carbon, or a metal such as aluminum may be used. In addition, although a disc-shaped substrate has been described as the shape of the object to be polished, the shape is not limited to this and may be a rectangular shape. in this case,
The holding hole of the carrier has a rectangular shape having substantially the same size. Further, the shape is not limited to the substrate shape, and may be a block shape.

In the above example, the polishing carrier of the present invention is embodied at a good bottom of the lapping step and the polishing step. However, the present invention is not limited to this, and the polishing carrier is used only in the lapping step having a high processing speed. Is also good. In addition, at least a straight line A passing through the center of the holding hole arranged at the outermost periphery and the center of the polished body holding portion, and the center of the holding hole adjacent to the holding hole located at the outermost periphery and the polished object. If the straight line B passing through the center of the body holding portion does not match, it may be matched on the circumferential side of the polished body holding hole.

[0047]

As described in detail above, the present invention is characterized in that a straight line A passing through the center of the holding hole arranged at least on the outermost periphery and the center of the holder for the object to be polished is located on the outermost periphery. The center of the holding hole adjacent to the holding hole and the straight line B passing through the center of the polished body holding portion, or the distance and / or the distance between the holding holes arranged on the outermost peripheral side. The distance between the holding hole arranged on the outer peripheral side and the gear portion is set to be larger than the distance between the plurality of holding holes, thereby providing excellent durability and manufacturing. A polishing carrier, a polishing method, and a method of manufacturing a substrate for an information recording medium, which can reduce costs, have been obtained.

[Brief description of the drawings]

FIG. 1 is a plan view of a polishing carrier according to Example 1 of the present invention.

FIG. 2 is a view showing a state in which a polishing carrier is mounted on a polishing apparatus.

FIG. 3 is a partial sectional view of FIG.

FIG. 4 is a plan view showing a conventional polishing carrier.

FIG. 5 is a plan view showing a conventional polishing carrier.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Polishing carrier, 2 ... Polishing object holding part, 3 ... Gear part, 4 ... Glass substrate for magnetic recording media, 5 ... Polishing device, 2
a ... Polishing object holding hole.

Claims (6)

[Claims] 1. A polishing carrier having a polished body holding portion having a plurality of holding holes for holding a polished body, and a gear portion provided on an outer periphery of the polished body holding portion, wherein: The plurality of holes are arranged on a plurality of concentric circles having different radii about the center of the polished body holding portion, and at least the center of the holding hole arranged at the outermost periphery and the polished body holding portion. And the straight line A passing through the center of the holding member adjacent to the holding hole positioned at the outermost periphery and the center of the holding portion of the object-to-be-polished, so that the straight line A does not coincide with the center of the holding member. A polishing carrier, characterized in that stress applied to a holder to be polished is prevented from being concentrated on a specific portion of the holder, and a possibility of destruction of the specific portion is prevented. 2. The polishing carrier according to claim 1, wherein the angle between the straight line A and the straight line B is 1 ° or more. 3. The distance between the holding holes arranged on the outermost periphery and / or the distance between the holding holes arranged on the outermost periphery and the gear portion may be determined by changing the distance between the plurality of holding holes. 2. The distance set to be larger than the distance between the two.
Or the polishing carrier according to 2. 4. A polishing carrier having a polished body holding portion having a plurality of holding holes for holding a polished body, and a gear portion provided on an outer periphery of the polished body holding portion, wherein the plurality of holding members are provided. A plurality of holes are arranged on a plurality of concentric circles having different radii about the center of the object-to-be-polished body holding portion, and are arranged at a distance between holding holes arranged at the outermost periphery and / or at an outermost periphery. By setting the distance between the holding hole and the gear portion larger than the distance between the plurality of holding holes, the stress applied to the polished body holding portion during polishing can specify the polished body holding portion. A polishing carrier characterized in that the carrier is prevented from concentrating on the portion, thereby preventing the specific portion from being fatigue-ruptured. 5. A polishing body holding portion having a plurality of holding holes for holding a body to be polished and a gear portion provided on an outer periphery of the polishing body holding portion. A polishing method in which the upper and lower lapping plates are placed and the upper and lower lapping plates are sandwiched between the upper and lower lapping plates, and the upper and lower lapping plates are rotated to lap and / or polish the main surface of the lapping target members to polish the polished polishing members. 5. The polishing method according to claim 1, wherein the polishing carrier according to claim 1 is used as the polishing carrier. 6. An information recording medium substrate in a holding hole of a polishing carrier having a polished body holding portion having a holding hole for holding a polished body and a gear portion provided on an outer periphery of the polished body holding portion. And the upper and lower platens are rotated while the lower and upper platens sandwich the information recording medium substrate, and the main surface of the information recording medium substrate is subjected to lapping and / or polishing to perform the information recording medium substrate. A method for producing a substrate for an information recording medium, comprising: a polishing step of polishing a substrate for an information recording medium, wherein the carrier for polishing according to any one of claims 1 to 4 is used as the carrier for polishing. Method.