CN104169799B

CN104169799B - Exposure plotting device and exposure plotting method

Info

Publication number: CN104169799B
Application number: CN201380013189.1A
Authority: CN
Inventors: 桥口昭浩
Original assignee: ADITECH ENGINEERING Co Ltd
Current assignee: ADITECH ENGINEERING Co Ltd
Priority date: 2012-03-14
Filing date: 2013-02-25
Publication date: 2016-06-29
Anticipated expiration: 2033-02-25
Also published as: JP2013190660A; TWI578111B; CN104169799A; KR20140141589A; KR102039373B1; TW201339768A; JP5940328B2; WO2013136959A1

Abstract

The present invention provides a kind of exposure plotting device that can not carry out unwanted exposure-processed with doing one's utmost when continuously performing multiple operation and suppress unnecessary production line to stop.Possess: exposure-processed performance element, set information substrate respectively, based on the multiple exposure-processed requirements requiring exposure-processed, substrate is performed successively each exposure-processed；Detection unit, the information substrate of the substrate of detection exposure-processed object；And comparing unit, detection information substrate and executory exposure-processed are required that in set execution, information substrate compares, result based on the comparison, in next becoming the detection information substrate of substrate of exposure-processed object and performing, information substrate is identical, next the substrate becoming exposure-processed object is continued executing with executory exposure-processed requirement, when the information substrate that information substrate in detecting information substrate and performing is different and set with the requirement of next exposure-processed is identical, terminate executory exposure-processed to require and start to perform next exposure-processed requirement.

Description

Exposure plotting device and exposure plotting method

Technical field

The present invention relates to exposure plotting device and exposure plotting method, particularly relate to by being exposed base plate exposure light beam and describe the exposure plotting device of circuit pattern, the program performed by exposure plotting device and by the exposure plotting method being exposed base plate exposure light beam and describing circuit pattern.

Background technology

In the past, when the device such as image recording structure and exposure plotting device being continuously performed multiple process and requiring, require to sum up using multiple process of each association once required and as 1 operation, perform multiple operation continuously successively according to processing the order requiring to occur.Now, in the stage of the process processing number set in finishing operation in commission, terminate active job and start to perform next operation.

But, when performing multiple operation, when become not enough as the record medium processing object or transmit come the record kind of medium, size with operation sets record medium different, it is impossible to continue with, therefore make a mistake and make process stop.Particularly, when device is exposure plotting device, if making exposure-processed stop for the time being because of mistake etc., then recover to need the regular hour, it is desirable to do not stop exposure-processed as far as possible and be continued until last.

As the method solving this problem, in Japanese Unexamined Patent Publication 11-162827 publication (patent documentation 1), disclose following technology: when the operation implementing to process setting in advance is different, dummy activity exposure-processed is registered, thus the production line stopping produced because mistake occurs, secondary damage are suppressed.In this technology, when the job login data come from upstream transmission and formula are not the formula in recipe file, dummy activity being registered, and will register this situation of dummy activity to operator notification, the event that enters into waits.This dummy activity is replaced with normal operation by the notified operator that dummy activity has carried out registering this situation, even if thus reaching the stage performing this operation, it also is able to normally continue exposure-processed, and can continue when not interrupting exposure-processed.

Summary of the invention

The problem that invention to solve

In the technology of above-mentioned patent documentation 1, need before this dummy activity of execution, dummy activity to replace with normal operation after registration dummy activity, when having little time to replace, namely allow to not make exposure-processed to interrupt and continue, there is also the problem of useless exposure-processed that can produce to cause because of dummy activity.

The present invention proposes in view of the above problems, it is therefore intended that provide exposure plotting device, program and the exposure plotting method that can do one's utmost not carry out unwanted exposure-processed and suppress unnecessary production line to stop when continuously performing multiple operation.

For solving the means of problem

In order to achieve the above object, the exposure plotting device involved by one mode of the present invention possesses: exposure-processed performance element, set the information substrate representing the kind being exposed substrate respectively, based on the multiple exposure-processed requirements requiring the exposure-processed corresponding with exposure information, perform each exposure-processed successively to being exposed substrate；Detection unit, the information substrate being exposed substrate of detection exposure-processed object；To the detection information substrate detected by described detection unit and executory exposure-processed, comparing unit, requires that in set execution, information substrate compares；And switch unit, comparative result based on described comparing unit, require to switch over to the exposure-processed performed by described exposure-processed performance element, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with information substrate in execution, the described substrate that is exposed next becoming exposure-processed object is continued executing with executory exposure-processed requirement, and when the information substrate that information substrate in detecting information substrate and performing is different and set with the requirement of next exposure-processed is identical, terminate described executory exposure-processed to require and start to perform next exposure-processed requirement described.

According to this exposure plotting device, utilize exposure-processed performance element to set the information substrate representing the kind being exposed substrate respectively, based on the multiple exposure-processed requirements requiring the exposure-processed corresponding with exposure information, perform each exposure-processed successively to being exposed substrate.

Here, in one mode of the present invention, utilize detection unit that the information substrate being exposed substrate of exposure-processed object is detected, and utilize the comparing unit detection information substrate to being detected by described detection unit and executory exposure-processed to require that in set execution, information substrate compares.

Additionally, in one mode of the present invention, utilize switch unit, comparative result based on described comparing unit, require to switch over to the exposure-processed performed by described exposure-processed performance element, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with information substrate in execution, the described substrate that is exposed next becoming exposure-processed object is continued executing with executory exposure-processed requirement, and when the information substrate that information substrate in detecting information substrate and performing is different and set with the requirement of next exposure-processed is identical, terminate described executory exposure-processed to require and start to perform next exposure-processed requirement described.

So, the exposure plotting device involved by a mode according to the present invention, when continuously performing multiple exposure-processed and requiring (operation), according to next as the information substrate being exposed substrate processing object, the substrate that uses in this operation being exposed during substrate is not carried out but next operation use when being exposed substrate, terminating active job and start next operation, result can not carry out unwanted exposure-processed and suppress unnecessary production line to stop with doing one's utmost.

Additionally, in one mode of the present invention, can also be, each exposure-processed requirement that the plurality of exposure-processed requires sets the number information processing number representing substrate respectively, described switch unit is when the predetermined number that the exposure-processed number performed by described exposure-processed performance element is that the process number set by the requirement of executory exposure-processed specifies, comparative result based on described comparing unit, require to switch over to the exposure-processed performed by described exposure-processed performance element, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with information substrate in execution, the described substrate that is exposed next becoming exposure-processed object is continued executing with executory exposure-processed requirement, and when the information substrate that information substrate in detecting information substrate and performing is different and set with the requirement of next exposure-processed is identical, terminate described executory exposure-processed to require and start to perform next exposure-processed requirement described.Thereby, it is possible to determine whether suitable opportunity operation to be switched over.

Additionally, in order to arrive above-mentioned purpose, the exposure plotting device involved by one mode of the present invention possesses: exposure-processed performance element, set the information substrate representing the kind being exposed substrate respectively, based on the multiple exposure-processed requirements requiring the exposure-processed corresponding with exposure information, perform each exposure-processed successively to being exposed substrate；Detection unit, the information substrate being exposed substrate of detection exposure-processed object；To the exposure-processed after the detection information substrate detected by described detection unit and switching, comparing unit, requires that set switching information substrate compares；And switch unit, by terminate executory exposure-processed to require and after switching in the way of starting to perform the requirement of next exposure-processed, comparative result based on described comparing unit, require to switch over to the exposure-processed performed by described exposure-processed performance element, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with switching information substrate, the described substrate that is exposed next becoming exposure-processed object is performed the exposure-processed requirement after switching, and when detect information substrate different with switching information substrate and with switching before information substrate set by performed exposure-processed requirement identical, the described substrate that is exposed next becoming exposure-processed object is continued executing with the front performed exposure-processed requirement of switching.

So, the exposure plotting device involved by a mode according to the present invention, when continuously performing multiple exposure-processed and requiring (operation), after operation is switched over, according to next as the information substrate being exposed substrate processing object, when this be exposed the substrate that uses of operation after substrate is not switching but before operation use when being exposed substrate, continuing executing with the operation before switching, result can not carry out unwanted exposure-processed and suppress unnecessary production line to stop with doing one's utmost.

Additionally, in one mode of the present invention, can also be, each exposure-processed requirement that the plurality of exposure-processed requires sets the number information processing number representing substrate respectively, described switch unit by terminate executory exposure-processed to require and after switching in the way of starting to perform the requirement of next exposure-processed, when the exposure-processed number performed by described exposure-processed performance element is the predetermined number that the process number set by the requirement of executory exposure-processed specifies, comparative result based on described comparing unit, require to switch over to the exposure-processed performed by described exposure-processed performance element, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with switching information substrate, the described substrate that is exposed next becoming exposure-processed object is performed the exposure-processed requirement after switching, and when detect information substrate different with switching information substrate and with switching before information substrate set by performed exposure-processed requirement identical, the described substrate that is exposed next becoming exposure-processed object is continued executing with the front performed exposure-processed requirement of switching.Thereby, it is possible to determine whether suitable opportunity operation to be switched over.

Additionally, in one mode of the present invention, can also be, it is also equipped with receiving unit, accept allowable exposure and process the input of the number being exposed substrate described in the switching required, set by executory exposure-processed, process number and the number that received by described receiving unit, specify described predetermined number.Thereby, it is possible to determine whether to process the number being exposed substrate of the switching required according to allowable exposure and operation is switched over.

Additionally, in one mode of the present invention, can also be, it is also equipped with receiving unit, accept allowable exposure and process the input of the number being exposed substrate described in the switching required, the exposure-processed number that described switch unit performs in being required by described exposure-processed performance element exposure-processed in commission is to deduct the number received by described receiving unit and when more than the number adding 1 and obtaining from the number that processes set by executory exposure-processed, comparative result based on described comparing unit, require to switch over to the exposure-processed performed by described exposure-processed performance element, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with switching information substrate, the described substrate that is exposed next becoming exposure-processed object is performed the exposure-processed requirement after switching, and when detect information substrate different with switching information substrate and with switching before the information substrate of setting is identical in performed exposure-processed requirement, the described substrate that is exposed next becoming exposure-processed object is continued executing with the front performed exposure-processed requirement of switching.The present invention can also be, it is also equipped with receiving unit, accept allowable exposure and process the input of the number being exposed substrate described in the switching required, when the exposure-processed number that described switch unit performs in being required by described exposure-processed performance element exposure-processed in commission is below the number received by described receiving unit, comparative result based on described comparing unit, require to switch over to the exposure-processed performed by described exposure-processed performance element, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with switching information substrate, the described substrate that is exposed next becoming exposure-processed object is performed the exposure-processed requirement after switching, and when detect information substrate different with switching information substrate and with switching before information substrate set by performed exposure-processed requirement identical, the described substrate that is exposed next becoming exposure-processed object is continued executing with the front performed exposure-processed requirement of switching.Thereby, it is possible to determine whether to process the number being exposed substrate of the switching required according to allowable exposure and operation is switched over.

It addition, in a mode of the present invention, it is also possible to it is be also equipped with output unit, exports prespecified information when the described switch unit exposure-processed to being performed by described exposure-processed performance element requires and carried out and having switched.Thereby, it is possible to operation will have been carried out switching this situation to inform operator.

Additionally, in one mode of the present invention, can also be, described information substrate is the information of the size comprising substrate, the position of alignment mark being formed at substrate and kind, described detection unit detect described exposure-processed object the size being exposed substrate, be formed at the position of the alignment mark being exposed substrate and be formed at the alignment mark that is exposed substrate plant at least one of apoplexy due to endogenous wind as information substrate.Thereby, it is possible to simply the information substrate being exposed substrate is detected.

Additionally, in one mode of the present invention, can also be, it is also equipped with deliverying unit, when the information substrate that described detection information substrate is different from information substrate in execution and set with next exposure-processed described requirement is different, the described substrate that is exposed next becoming exposure-processed object is discharged to device outside and is not exposed process.Additionally, the present invention can also be, it is also equipped with deliverying unit, different from switching information substrate at described detection information substrate and with switching before performed exposure-processed require that set information substrate is different, by the described substrate that is exposed next becoming exposure-processed object, to be discharged to device outside and be not exposed process.Thereby, it is possible to avoid when exposure-processed cannot be proceeded carrying out useless exposure-processed.

Additionally, in one mode of the present invention, can also be, next described detection unit becomes being exposed when substrate is moved into and the size being exposed substrate of described exposure-processed object being detected of exposure-processed object described, described exposure plotting device is also equipped with deliverying unit, comparative result based on described comparing unit, when the information substrate that information substrate in detecting information substrate and performing is different and set with the requirement of next exposure-processed is different, the described substrate that is exposed next becoming exposure-processed object is discharged to device outside as former state and is not exposed process.Additionally, the present invention can also be, next described detection unit becomes being exposed when substrate is moved into and the size being exposed substrate of described exposure-processed object being detected of exposure-processed object described, described exposure plotting device is also equipped with deliverying unit, comparative result based on described comparing unit, when detect information substrate different with switching information substrate and with switching before information substrate set by performed exposure-processed requirement different, the described substrate that is exposed next becoming exposure-processed object is discharged to device outside as former state and is not exposed process.Thereby, it is possible to avoid when exposure-processed cannot be proceeded carrying out useless exposure-processed.

On the other hand, in order to achieve the above object, the program involved by a mode of the present invention make computer as the comparing unit in above-mentioned exposure plotting device and switch unit function.

Therefore, the program involved by a mode according to the present invention, owing to computer can be made to play a role in the same manner as exposure plotting device, therefore act in the same manner as exposure plotting device, it is thus possible in the same manner as exposure plotting device, do not carry out unwanted exposure-processed and suppress unnecessary production line to stop with doing one's utmost when continuously performing multiple operation.

On the other hand, in order to reach above-mentioned order, the exposure plotting method involved by one mode of the present invention includes: exposure-processed performs step, set the information substrate representing the kind being exposed substrate respectively, based on the multiple exposure-processed requirements requiring the exposure-processed corresponding with exposure information, perform each exposure-processed successively to being exposed substrate；Detecting step, the information substrate being exposed substrate of detection exposure-processed object；To the detection information substrate detected in described detecting step and executory exposure-processed, comparison step, requires that in set execution, information substrate compares；And switch step, comparative result based on described comparison step, the exposure-processed performing described exposure-processed to perform in step requires to switch over, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with information substrate in execution, the described substrate that is exposed next becoming exposure-processed object is continued executing with executory exposure-processed requirement, and when the information substrate that information substrate in detecting information substrate and performing is different and set with the requirement of next exposure-processed is identical, terminate described executory exposure-processed to require and start to perform next exposure-processed requirement described.

Therefore, the exposure plotting method involved by a mode according to the present invention, owing to acting in the same manner as exposure plotting device, therefore in the same manner as exposure plotting device, when continuously performing multiple operation can not carry out unwanted exposure-processed and suppress unnecessary production line to stop with doing one's utmost.

Additionally, in order to achieve the above object, the exposure plotting method involved by one mode of the present invention includes: exposure-processed performs step, set the information substrate representing the kind being exposed substrate respectively, based on the multiple exposure-processed requirements requiring the exposure-processed corresponding with exposure information, perform each exposure-processed successively to being exposed substrate；Detecting step, the information substrate being exposed substrate of detection exposure-processed object；To the exposure-processed after the detection information substrate detected in described detecting step and switching, comparison step, requires that set switching information substrate compares；And switch step, by terminate executory exposure-processed to require and after switching in the way of starting to perform the requirement of next exposure-processed, comparative result based on described comparison step, the exposure-processed performing described exposure-processed to perform in step requires to switch over, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with switching information substrate, the described substrate that is exposed next becoming exposure-processed object is performed the exposure-processed requirement after switching, and when detect information substrate different with switching information substrate and with switching before information substrate set by performed exposure-processed requirement identical, the described substrate that is exposed next becoming exposure-processed object is continued executing with the front performed exposure-processed requirement of switching.

Invention effect

In accordance with the invention it is possible to reach following effect: when continuously performing multiple operation can not carry out unwanted exposure-processed and suppress unnecessary production line to stop with doing one's utmost.

Accompanying drawing explanation

Fig. 1 indicates that the structure chart of the overall structure of the exposure plotting system involved by embodiment.

Fig. 2 indicates that the axonometric chart of the internal structure of the exposure plotting device involved by embodiment.

Fig. 3 indicates that the approximate vertical view arranging position of the substrate size measurement unit of the exposure plotting device involved by embodiment.

Fig. 4 indicates that the block diagram of the structure of the electrical system of the exposure plotting device involved by embodiment.

Fig. 5 indicates that the block diagram of the structure of the electrical system controlling device of the exposure plotting system involved by embodiment.

Fig. 6 indicates that the flow chart of the flow process of the process of the operation setting program involved by embodiment.

Fig. 7 (A) indicates that the schematic diagram of an example of the execution job information in the exposure plotting system involved by embodiment, and (B) indicates that the schematic diagram of an example of the substrate type information in the exposure plotting system involved by embodiment.

Fig. 8 is for the exposure plotting in the exposure plotting system involved by embodiment processes the concept map illustrated.

Fig. 9 indicates that the first exposure supervision involved by the first embodiment processes the flow chart of the flow process of the process of program.

Figure 10 (A) and (B) are for the first supervision in the exposure plotting system involved by the first embodiment is processed the concept map illustrated.

Figure 11 (A) and (B) are the concept maps illustrated for other examples that the first supervision in the exposure plotting system involved by the first embodiment is processed.

Figure 12 indicates that the second exposure supervision involved by the first embodiment processes the flow chart of the flow process of the process of program.

Figure 13 (A) and (B) are for the second supervision in the exposure plotting system 1 involved by the first embodiment is processed the concept map illustrated.

Figure 14 represents that the 3rd exposure supervision involved by the second embodiment processes the flow chart of the flow process of the process of program.

Detailed description of the invention

(the first embodiment)

Hereinafter, the exposure plotting system involved by the first embodiment, use accompanying drawing to be described in detail.Additionally, in first embodiment, as exposure plotting system 1, illustrating for following system, this system is as being exposed substrate and being exposed the system described in the one or two sides being exposed substrate using the flat panel substrate such as printed wiring board and glass substrate for plane display device.

Fig. 1 indicates that the structure chart of the overall structure of the exposure plotting system 1 involved by the first embodiment.As it is shown in figure 1, exposure plotting system 1 possesses: be exposed substrate (described later be exposed substrate C) exposing light beam and describing the exposure plotting device 2 of the images such as circuit pattern and the control device 3 that the exposure plotting based on exposure plotting device 2 is controlled.

Fig. 2 indicates that the axonometric chart of the internal structure of the exposure plotting device 2 involved by the first embodiment.Additionally, below, the direction gage that pedestal 10 moves is decided to be Y-direction, direction gage orthogonal with this Y-direction in horizontal plane is decided to be X-direction, direction gage orthogonal with Y-direction in vertical guide is decided to be Z-direction, additionally, the direction of rotation being rotated in a clockwise direction centered by Z axis is defined as θ direction.

As in figure 2 it is shown, exposure plotting device 2 possesses for the fixing flat pedestal 10 being exposed substrate C.When being exposed the substrate C upper surface being placed in pedestal 10, the air that is exposed between substrate C and pedestal 10 being sucked, thus the substrate C vac sorb upper surface at pedestal 10 being exposed.

Pedestal 10 is supported in flat base station 12, and this flat base station 12 is movably disposed in the upper surface of the matrix 11 of table-like.At the upper surface of matrix 11, it is provided with 1 or many (in present embodiment being 2) guide rail 14.Base station 12 is supported for and can move freely in the Y direction along guide rail 14, utilizes the pedestal drive division (pedestal drive division 41 described later) being made up of motor etc. to move.Further, pedestal 10 is supported on the upper surface of this moveable base station 12, thus moving along guide rail 14 with the mobile linkage of base station 12.It addition, the substrate C that is exposed being fixed on pedestal 10 moves to exposure position along with moving of pedestal 10, utilize exposure portion 16 illumination beam described later, thus the images such as circuit pattern are described.

At the upper surface of matrix 11, to erect the door frame 15 arranging gate in the way of guide rail 14, the exposure portion 16 that the surface being exposed substrate C being placed in pedestal 10 is exposed is installed at this door frame 15.Exposure portion 16 comprises multiple (in present embodiment being 16) photohead 16a and constitutes, and fixed configurations is on the mobile route of pedestal 10.At exposure portion 16, it is connected to the optical fiber 18 from light source cell 17 described later pull-out and the signal cable 20 from graphics processing unit 19 described later pull-out.

Each photohead 16a has the DMD (DMD) of the spatial optical modulation element as reflection-type, based on the view data inputted from graphics processing unit 19, DMD is controlled and the light beam from light source cell 17 is modulated.Exposure plotting device 2 is exposed substrate C by being irradiated to by the light beam after this modulation and is exposed description.It addition, as spatial optical modulation element, it is possible to use the spatial optical modulation element of the infiltration types such as liquid crystal.

At the upper surface of matrix 11, further to be provided with door frame 22 in the way of guide rail 14.On door frame 22, being provided with one or more (in present embodiment being 2) photography portions 23, it is for photographing to the alignment mark being exposed Expose f iotaducials set on substrate C being placed in pedestal 10.Photography portion 23 is the CCD camera etc. being built-in with an extremely short flash lamp of fluorescent lifetime.Each photography portion 23 is movably disposed along the direction (X-direction) vertical with the moving direction of pedestal 10 (Y-direction) in horizontal plane.

Exposure plotting device 2 has and is transported to the upper surface of pedestal 10 and the substrate C that is exposed of end exposure is transported to from pedestal 10 the automatic transporting hands (hereinafter referred to as AC hands) 24 of the second trucking department 6 by the substrate C that is exposed being moved to the first trucking department 5 from outside.AC hands 24 is formed as tabular, and is movably disposed in horizontal direction and vertical.It addition, the lower surface at AC hands 24 is provided with: adsorbing mechanism, its have utilize by air is attracted vac sorb to be exposed substrate C carry out absorption keep adsorption section 25；And pressing mechanism, it has and will be exposed the substrate C press section 26 moved up and down freely pressed downwards.AC hands 24 utilizes adsorbing mechanism that the unexposed substrate C that is exposed being placed in the first trucking department 5 is carried out absorption and kept thus lifting upward, will be exposed the substrate C prespecified position being placed in the upper surface of pedestal 10 after being lifted.

AC hands 24 is when making to be exposed substrate C and being placed in pedestal 10, pressing mechanism is utilized to press being exposed substrate C to pedestal 10 and the absorption based on adsorption section 25 released, substrate C vac sorb will be exposed at pedestal 10, substrate C will be exposed and be absorbed and fixed at pedestal 10.Additionally, AC hands 24 utilizes the substrate C that is exposed of the end exposure of the adsorbing mechanism upper surface to being placed in pedestal 10 to carry out absorption maintenance thus lifting upward, to after being lifted be exposed substrate C carry out absorption keep state be moved to the second trucking department 6 after, absorption based on adsorbing mechanism is released, so that being exposed substrate C to move to the second trucking department 6.The substrate C that is exposed being moved to the second trucking department 6 is discharged to the outside of exposure plotting device 2.

It addition, at the upper surface of the first trucking department 5, be provided with carrying and be exposed the conveyor portion 5a of substrate C.Conveyor portion 5a has multiple rotating roller and the driving motor making rotating roller rotate.Many rotating rollers are laid abreast, sprocket or coaster that the revolving force utilizing conveyer belt or cable transmission is born are installed in one end of rotating roller.As the unit that the revolving force driving motor making rotating roller rotate is transmitted, it also is able to adopt the transmission method based on cylindric magnet except conveyer belt or cable.It addition, at conveyor portion 5a, be provided with the substrate size measurement unit 27 that the size being exposed substrate C is measured.Substrate size measurement unit 27 has the width measurement unit 27a that the width (minor face) being exposed substrate C is measured and the length measurement unit 27b that the length (long limit) being exposed substrate C is measured.

Fig. 3 indicates that the approximate vertical view arranging position of the substrate size measurement unit 27 of the exposure plotting device 2 involved by the first embodiment.No matter as it is shown on figure 3, width measurement unit 27a is arranged at the upper surface at conveyor portion 5a is exposed substrate C size and near the central authorities that must pass through.When being exposed substrate C and carry at conveyor portion 5a, the handling time being exposed substrate C is measured by width measurement unit 27a, and derives, with the long-pending of the handling time being exposed substrate C, the width being exposed substrate C from transporting velocity.

On the other hand, length measurement unit 27b is movably disposed multiple (in present embodiment being 2) at the upper surface of conveyor portion 5a along Y-direction.When substrate C will be exposed to be carried in X direction at conveyor portion 5a, multiple length measurement unit 27b are exposed substrate C from sandwich in the Y direction in the way of abutting with the side being respectively exposed substrate C, distance between each length measurement unit 27b is measured, derives the length being exposed substrate C from the distance measured.

Fig. 4 indicates that the block diagram of the structure of the electrical system of the exposure plotting device 2 involved by the first embodiment.As shown in Figure 4, at exposure plotting device 2, being provided with the systems control division 40 electrically connected respectively with each portion of device, each portion is intensively controlled by this systems control division 40.AC hands 24 is controlled and is exposed substrate C and moves into action and the discharging operation from pedestal 10 to pedestal 10 by systems control division 40.It addition, systems control division 40 obtains the information representing the size (width and length) being exposed substrate from substrate size measurement unit 27.In addition, pedestal drive division 41 is controlled and makes pedestal 10 move by systems control division 40, and make photography portion 23 move via mobile control division 43 described later and carry out being exposed the photography of the alignment mark of substrate C thus exposure position is adjusted, and light source cell 17 and graphics processing unit 19 are controlled and make photohead 16a be exposed processing.Additionally, systems control division 40 is receiving the opportunity for the signal indicating exposure to start from control device 3, start the exposure-processed being exposed substrate C, and receiving the opportunity for the signal indicating exposure to stop, when finish now to carry out to when being exposed the exposure-processed of substrate C, stop exposure-processed.

It addition, exposure plotting device 2 possesses operation device 42.Operation device 42 is had the control utilizing systems control division 40 and shows the display part of information and inputted the input portion of information by user operation.This input portion is such as operated by user when inputting the pressure stopping instruction etc. to the exposure-processed being exposed substrate C.

Additionally, exposure plotting device 2 possesses mobile control division 43.The mobile driving in photography portion 23, based on the instruction of systems control division 40, is controlled by mobile control division 43 so that be exposed the alignment mark of substrate C when pedestal 10 moves by the central authorities of any one in multiple photography portions 23 or each photographing region.

Fig. 5 indicates that the block diagram of the structure of the electrical system controlling device 3 of the exposure plotting system 1 involved by the first embodiment.As it is shown in figure 5, exposure plotting system 1 possesses: control portion 50, the exposure-processed in exposure plotting system 1 is controlled by it；Storage part 51, it has ROM and HDD etc. that the exposure treating programme needed for the exposure-processed based on control portion 50, various data are stored；Based on the control in control portion 50 and the display part 52 such as display of video data；The input portions 53 such as the keyboard being inputted data by user operation；And communication interface 54, it carries out the transmitting-receiving of the data to exposure plotting device 2 based on the control in control portion 50.

Here, exposure plotting device 2 involved by present embodiment is receiving and is requiring (following for same kind of multiple substrate C that are exposed with the blanket exposure-processed that identical image is exposed describing by identical conditions from controlling device 3, also referred to as " operation ") time, according to the content of the operation received, multiple substrate C that are exposed are performed exposure-processed.Additionally, exposure plotting device 2 possesses following function: when receiving multiple operation from control device 3 with the state specifying execution sequence, according to the execution sequence of specified operation, it is exposed the corresponding each operation of substrate C is exposed continuously processing to multiple.

Operator is when to make exposure plotting device 2 be consecutively carried out multiple operation, controlling device 3, for each operation, input the substrate type being exposed substrate C as object, process number, surface image, back side image and image multiplying power etc., and input the execution sequence of each operation.Controlling device 3 and carry out operation setting process, described operation setting process sets each operation in the way of the multiple operations carrying out inputting according to the execution sequence inputted.

Here, the flow process of the operation setting process based on the exposure plotting system 1 involved by the first embodiment is illustrated.

Fig. 6 indicates that the flow chart of the flow process of the process of the operation setting program involved by the first embodiment, and this program is stored in advance in the presumptive area of the ROM recording medium possessed as the storage part 51 controlling device 3.

The control portion 50 controlling device 3 performs this operation setting program with prespecified opportunity (in present embodiment, operator making for indicating the opportunity of the prespecified operation of the setting of operation via input portion 53).

First, in step S101, control portion 50 determines whether the generation instruction that be have input operation by operator via input portion 53.The instruction that generates of this operation is transfused to by the prespecified operation in input portion 53.Not inputting when generating instruction of operation in step S101, control portion 50 is standby to the generation instruction that have input operation.

Have input when generating instruction of operation in step S101, in step S103, the substrate C that is exposed being instructed to become in the operation of generation exposure object in step S101 is accepted the input of substrate type by control portion 50.The information relevant to multiple substrate type can also being pre-stored within storage part 51, any one in the plurality of substrate type is selected by user via input portion 53, thus the information of input substrate kind.It addition, at storage part 51, corresponding every kind of substrate type, storage has the size (width and length etc.) of this substrate and the position of alignment mark and kind etc. (following, also referred to as " position etc. ").

In step S105, control portion 50 accepts the input processing number being exposed substrate C in the operation being instructed to generate in step S101.Additionally, in step S107, control portion 50 accepts to be instructed in step S101 in the operation generated to (following as first of the interarea being exposed substrate C, also referred to as surface) it is exposed the surface image described and to as the input being exposed the back side image described with second of first C1 interarea in opposite directions (following, also referred to as the back side).

In step S109, control portion 50 accepts the input of the conditions of exposure in the operation being instructed to generate in step S101.The conditions of exposure now inputted is the multiplying power etc. of the image being exposed description.In step S111, control portion 50 accepts to be instructed in step S101 the input of the execution sequence of the operation of generation.The execution sequence now inputted indicates that the information being exposed order when processing.

In step S113, control portion 50 is instructed to the operation generated based on the information inputted in step S103 to S111 in generation step S101, and the information relevant to the operation generated is stored in storage part 51.

Fig. 7 (A) indicates that the schematic diagram of an example of the execution job information 60 in the exposure plotting system involved by the first embodiment, and Fig. 7 (B) indicates that the schematic diagram of an example of the substrate type information 70 in the exposure plotting system involved by the first embodiment.Control device 3 using the information relevant to a series of operation continuously performed as performing job information 60 and being stored in storage part 51.

As shown in Fig. 7 (A), performing job information 60 is establish corresponding information with following information respectively for each operation: represent the sequence of operation information 61 of the execution sequence of operation, for the operation identification information 62 that this operation is identified, represent the process number information 63 processing number being exposed substrate C in this operation, represent in this operation at the surface image information 64 of the image of the surface exposure plotting being exposed substrate C, represent the back side image information 65 of the image described at the back-exposure being exposed substrate C, expression is in the magnification information 66 of the multiplying power of the image being exposed substrate C exposure plotting, and represent the substrate identification information 67 etc. of the kind being exposed substrate C of exposure object.Suitably store the information of other exposure gap representing image it addition, perform job information 60 for each operation, represent the information etc. using material.Control device 3 based on this execution job information 60, according to predetermined execution sequence (being recorded in the order in sequence of operation information 61), continuously multiple substrate C that are exposed are switched operation and carry out exposure-processed.

It addition, storage part 51 is previously stored with the substrate type information 70 of the feature of the substrate representing every kind of substrate type.As shown in Fig. 7 (B), substrate type information 70 is to establish corresponding information with following information respectively for the substrate identification information 67 representing substrate type: represent the dimension information 72 representing substrate size of the width of substrate, length and thickness；And represent the label information 73 of position and the kind (such as form and dimension) etc. of preformed alignment mark on substrate.In exposure plotting system 1, according to the position etc. of the size being exposed substrate C or the alignment mark being exposed substrate C, control portion 50 can determine that this is exposed the substrate type of substrate C.

Further, in step S115, control portion 50 determines whether to continue with, and namely determines whether to generate next operation.Now, control portion 50 is when such as having carried out the operation for generating next operation via input portion 53, it is determined that for generating next operation.

When control portion 50 is judged to generate next operation in step sl 15, next operation is carried out the process of step S101 to S115, on the other hand, when being judged to not generate next operation in step sl 15, control portion 50 performs exposure-processed based on performing job information 60 in step S117.It addition, control portion 50 can also not perform exposure-processed in step S117 and performs exposure-processed when be have input the execution instruction of exposure-processed separately via input portion 53 by operator.

Fig. 8 is for the exposure plotting in the exposure plotting system 1 involved by the first embodiment processes the concept map illustrated.In exposure plotting system 1 involved in the present invention, according to performing job information 60, it is consecutively carried out multiple operation based on execution sequence.Such as, in the exposure-processed based on execution job information 60 shown in Fig. 7 (A), perform operation with the execution sequence of operation A (processing number 10), operation B (processing number 15), operation C (process number 20).And, when being consecutively carried out multiple operation, the process number and the actual number being exposed substrate C being exposed processing performing setting in job information 60 is compared, in the stage finishing the exposure-processed being exposed substrate C processing number set in active job, operation is switched over, terminates active job and start to perform next operation.

Operator is according to the execution sequence set in performing job information 60, to being exposed the kind of substrate C in each operation in multiple operations, process number and confirm, and the substrate C that is exposed as exposure object is configured at the position making it standby and substrate position of readiness.On the other hand, exposure plotting device 2 obtain successively be configured at substrate position of readiness be exposed substrate C, and be exposed according to being recorded in the content performing job information 60 processing.

Additionally, in step S119, control portion 50 performs multiple operation in step S117, perform whether performed operation processes (the first exposure supervision described later processes, the second exposure supervision processes and the 3rd exposure supervision of the second embodiment processes) according to the supervision monitored that is performed like that performing to set in job information 60.

So, operator implement job information 60 and to as exposure object be exposed the kind of substrate C, number confirms and manual configuration is in the position for putting into exposure plotting device 2, therefore consider not note due to operator and mistaken by the number being exposed substrate C and configure this situation.In this case, existing exposure plotting device can make a mistake and stop exposure-processed.

Particularly, when the number being exposed substrate C is counted by operator, the situation of majority (or minority) 1 is inferior, even if correctly setting and performing job information, the substrate C that is exposed owing to being configured by operator only differs from 1, therefore the switching of operation also cannot be correctly identified by exposure plotting device, it may occur that mistake.If exposure plotting device stops because of mistake etc., then recovery process requires time for, it is desirable to make exposure-processed continue when not stopping exposure-processed as far as possible until last.

Therefore, in exposure plotting system 1 involved by present embodiment, control device 3 based on the position etc. measuring the size being exposed substrate C obtained and the alignment mark being exposed substrate C before exposure, and carry out the first exposure supervision and process and the second exposure supervision process, described first exposure supervision processes and the second exposure supervision processes the substrate type to the substrate type being exposed substrate C and set operation that become exposure object and compares, thus monitoring whether performed operation and set operation be consistent.

Fig. 9 indicates that the first exposure supervision involved by the first embodiment processes the flow chart of the flow process of the process of program, and this program is stored in advance in the presumptive area of the ROM recording medium possessed as the storage part 51 controlling device 3.

Control the control portion 50 of device 3 with prespecified opportunity (in present embodiment, step S119 etc. making the opportunity started based on the exposure-processed of exposure plotting device 2), perform this exposure supervision and process program.

Additionally, in present embodiment, for operation switch before k open (process number be in the N operation opened, open from N-k+1 and open to the N k opened) and operation switching after k open (process number be the N operation opened, open from the 1st k opened to kth), it is determined whether it is by the opportunity of operation switching.The value of k is the value (when such as N be 10 k be 2 or 3) less than N and is inputted and be stored in storage part 51 via input portion 53 in advance by operator.

First, step S117 performs exposure-processed, in step s 201, when the overall process number of current active job being set to N and opening, control portion 50 judges next to be exposed more than whether substrate C open as N-k+1 in current active job as what process object.

Being judged to it is N-k+1 when opening above in step s 201, in step S203, control portion 50 obtains next as the size measured being exposed substrate C processing object.Now, following as processing when being exposed substrate C of object utilizing the first trucking department 5 to carry, control portion 50 obtains the information relevant to the size being exposed substrate C measured by the substrate size measurement unit 27 of exposure plotting device 2.

In step 205, control portion 50 obtains the following position etc. as the alignment mark being exposed substrate C processing object.Now, systems control division 40, according to utilizing photography portion 23 to next detecting alignment mark as processing being exposed the substrate C photographs photographed of object, generates the information of the position etc. representing the alignment mark detected.Control portion 50 obtains by receiving the information of the position etc. representing this alignment mark from systems control division 40.

In step S207, the position etc. of the alignment mark being exposed substrate obtained in the size being exposed substrate C obtained in step S203 and step S205 is compared by control portion 50 with the size of each substrate type being pre-stored within storage part 51 and the position etc. of alignment mark, thus to next judging as the substrate type being exposed substrate C processing object.

In step S209, control portion 50 following compares as processing the substrate type set in the substrate type being exposed substrate C of object and active job what determined by step S207, thus judging that substrate type is appropriate for the operation performing to set in job information 60.Now, when the following substrate type being exposed substrate C as process object is consistent with the substrate type set in active job, control portion 50 is judged to the operation in being adapted for carrying out.

Step S209 is judged to the operation in being adapted for carrying out, in step S211, the direct operation in commission in control portion 50 continues exposure-processed.

Step S209 is judged to be not suitable for active job, in step S213, control portion 50 following compares as processing the substrate type set in the next operation of the substrate type being exposed substrate C of object and active job what determined by step S207, thus judging that substrate type is if appropriate for next operation.

Step S213 is judged to be suitable for next operation, in step S215, control portion 50 is judged as that the number being exposed substrate C for active job is not enough, is switched to next operation to next becoming being exposed in the way of substrate C performs the next operation of active job of exposure object making current active job advance one.

Figure 10 (A) and (B) are for the first supervision in the exposure plotting system 1 involved by the first embodiment is processed the concept map illustrated.It addition, Figure 10 represents the situation that k is set as more than 1.As shown in Figure 10 (A), when N (=N-1+1) that process number is the N operation A opened being exposed substrate C and being exposed processing, when this be exposed substrate C be substrate for operation B, as shown in Figure 10 (B), control portion 50 makes stagger forward 1 the opportunity being switched to operation B from operation A, the N of operation A is opened and is exposed substrate C and is exposed substrate C as the 1st of operation B, and terminate operation A at this moment and start operation B.

Figure 11 (A) and (B) are the concept maps illustrated for other examples that the first supervision in the exposure plotting system 1 involved by the first embodiment is processed.It addition, Figure 11 represents the situation being set as more than k=3.As shown in Figure 11 (A), it is exposed when substrate C is exposed processing same with N-2 (=N-3+1) that to process number is the N operation A opened, when this be exposed substrate C be substrate for operation B, as shown in Figure 11 (B), control portion 50 makes stagger forward 3 the opportunity being switched to operation B from operation A, the N-2 of operation A is opened and is exposed substrate C and is exposed substrate C as the 1st of operation B, and terminate operation A at this moment and start operation B.

In step S217, control portion 50 exports owing to the number being exposed substrate C of operation A is less and make operation advance this content, in step S211, continues exposure-processed in next operation.The method exporting its content can be the method showing its content at display part 52, it is also possible to be the method utilizing its content of voice output.

When being judged to be not suitable for next operation in step S213, in step S219, control portion 50 is judged as continuing exposure-processed, will be exposed substrate C and be discharged to the outside of exposure plotting device 2.

So, in exposure plotting system 1 involved by first embodiment, when continuously performing multiple operation, judge that whether performed operation is consistent with set operation according to the size being exposed substrate C, in different situations, judge that whether performed operation is consistent with the next operation of set operation further, when consistent, the next operation of set operation is switched to make to perform continuation the operation performing object such that it is able to do one's utmost not carry out unwanted exposure-processed and suppress unnecessary production line to stop.

Figure 12 indicates that the second exposure supervision involved by the first embodiment processes the flow chart of the flow process of the process of program, and this program is stored in advance in the presumptive area of the ROM recording medium possessed as the storage part 51 controlling device 3.

Control the control portion 50 of device 3 and process program performing this exposure supervision prespecified opportunity (in present embodiment, starting based on the opportunity of the exposure-processed of exposure plotting device 2 in step S119 etc.).

First, step S117 performs exposure-processed, in step S301, the overall process number at current active job is N when opening, and control portion 50 judges next to be exposed substrate C in current active job whether as below kth opens as what process object.

Being judged to it is kth when opening following in step S301, in step S303, control portion 50, with the method same with step S203, obtains next as the size being exposed substrate C processing object.It addition, in step 305, control portion 50, with the method same with step S205, obtains the position etc. next as the alignment mark being exposed substrate C processing object.

In step S307, the position etc. of the alignment mark being exposed substrate C obtained in the size being exposed substrate C obtained in step S303 and step S305 is compared by control portion 50 with the size of each substrate type being stored in advance in storage part 51 and the position etc. of alignment mark, thus to next judging as the substrate type being exposed substrate C processing object.

In step S309, control portion 50 is with the method same with the process of step S209, the substrate type set in operation after the following substrate type being exposed substrate C as process object determined by step S307 and switching is compared, thus judging that substrate type is appropriate for the operation after switching.

Step S309 is judged to the operation after being suitable for switching, in step S311, the direct operation after handover in control portion 50 continues exposure-processed.

When step S309 is judged to the operation after being not suitable for switching, in step S313, control portion 50 to determined by step S307 following as process object the substrate type being exposed substrate C and switching after operation previous operation in set substrate type compare, thus judge substrate type be appropriate for before operation.

Step S313 is judged to the operation before being suitable for, in step S315, control portion 50 be judged as the operation after switching before the number being exposed substrate C of operation more, namely the switching time becoming operation does not switch operation yet, makes active job return one and the previous operation of the operation after switching is set.

Figure 13 (A) and (B) are for the second supervision in the exposure plotting system 1 involved by the first embodiment is processed the concept map illustrated.It addition, Figure 13 represents the situation that k is set as more than 1.As shown in Figure 13 (A), when the 1st that process number is the N operation B opened being exposed substrate C and being exposed processing, when this be exposed substrate C be substrate for operation A, as shown in Figure 13 (B), the opportunity switching to operation B from operation A is staggered 1 by control portion 50 backward, the 1st of operation B is exposed substrate C and is exposed substrate C as the last of operation A, do not start operation B at this moment and switch to operation A to perform.

In step S317, owing to the number being exposed substrate C of operation A is more, output makes operation return (not advancing) this content in control portion 50, in step S311, continues to be exposed processing in operation before.The method exporting its content can be the method showing its content at display part 52, it is also possible to be the method utilizing its content of voice output.

When being judged to be not suitable for next operation in step S313, in step S319, control portion 50 is judged as proceeding exposure-processed, will be exposed substrate C and be discharged to the outside of exposure plotting device 2.

So, in exposure plotting system 1 involved by first embodiment, when continuously performing multiple operation, position etc. according to the size and alignment mark that are exposed substrate C judges that whether performed operation is consistent with set operation, judge that whether performed operation is consistent with the next operation of set operation in different situations further, when consistent, the next operation of set operation is switched to make to perform continuation the operation performing object, it is thus possible to do not carry out unwanted exposure-processed and suppress unnecessary production line to stop with doing one's utmost.

Additionally, in exposure plotting system 1 involved by first embodiment, when continuously performing multiple operation, position etc. according to the size and alignment mark that are exposed substrate C judges that whether performed operation is consistent with set operation, in different situations, judge that whether performed operation is consistent with the operation before set operation further, when consistent, by perform object operation switch to set operation before operation and make to perform continuation, it is thus possible to do not carry out unwanted exposure-processed and suppress unnecessary production line to stop with doing one's utmost.

In addition, in exposure plotting system 1 involved by first embodiment, it is set to the opportunity that operation is monitored open until the k after having carried out the switching of operation opens from the k before the opportunity of the switching subscribing operation, can be properly carried out setting to the value of k by operator, thereby, it is possible to avoid unnecessarily carrying out the switching of operation.It addition, when being set as k=0, be impermissible for upon execution the switching time of the operation set in execution job information 60 being modified.

In addition, in exposure plotting system 1 involved by first embodiment, in step S207 (S307), the both sides using the position etc. of the size being exposed substrate C obtained by step S203 (S303) and the alignment mark obtained by step S205 (S305) judge substrate type, even if be therefore exposed substrate C equivalently-sized during the operation continuously performed, it also is able to judge exactly operation, thereby, it is possible to carry out the switching of operation exactly.

Additionally, in exposure plotting device 2 involved by first embodiment, although have input the information relevant to operation, but be not limited to this, can also be selected to be stored in advance in the execution job information of storage part 51 by operator via input portion 53, thus be set as the operation performing object.

Additionally, in exposure plotting system 1 involved by first embodiment, in step S207 (S307), substrate type is judged by the position etc. using the size being exposed substrate C obtained by step S203 (S303) and the alignment mark obtained by step S205 (S305), but it is not limited to this, in step S207 (S307), can also use and be exposed the size of substrate C, be formed at the position of the alignment mark being exposed substrate C, be formed at planting at least one of apoplexy due to endogenous wind and substrate type being judged of the alignment mark that is exposed substrate C.

(the second embodiment)

Hereinafter, with reference to accompanying drawing, the exposure plotting system 1 involved by the second embodiment is described in detail.It addition, the exposure plotting system 1 involved by the second embodiment is same with the exposure plotting system 1 involved by the first embodiment, there is the structure shown in Fig. 1 to Fig. 5, therefore by relevant to this structure and the explanation that repeats is omitted.

In exposure plotting system 1 involved by first embodiment, when performing multiple operation according to prespecified execution sequence, the substrate type being exposed substrate C is speculated by the position etc. according to the size and alignment mark that are exposed substrate C, when the substrate type deduced is different from the substrate type set in operation, it is judged to that operation is different, but, in exposure plotting system 1 involved by second embodiment, the substrate type being exposed substrate C is speculated by the size being exposed substrate C becoming exposure object, when the substrate type deduced is different from the substrate type set in operation, it is judged to that operation is different.

In exposure plotting system 1 involved by second embodiment, according to the execution job information 60 of the first embodiment, continuously perform multiple operation, and perform whether different the 3rd exposure supervision monitored of the operation now performed and set operation is processed.

The flow process that the 3rd exposure supervision in exposure plotting system 1 involved by second embodiment is processed illustrates.

Figure 14 indicates that the 3rd exposure supervision involved by the second embodiment processes the flow chart of the flow process of the process of program, and this program is stored in advance in the presumptive area of the ROM recording medium possessed as the storage part 51 controlling device 3.

Control the control portion 50 of device 3 with prespecified opportunity (in present embodiment, step S119 etc. starting based on the opportunity of the exposure-processed of exposure plotting device 2), perform this exposure supervision and process program.

Additionally, in present embodiment, for operation switch before k open (process number be in the N operation opened, open until the k that N opens opens from N-k+1) and operation switching after k open (process number be the N operation opened, open from the 1st k opened to kth), it is determined whether it is by the opportunity of operation switching.The value of k is the value less than N, and is input and stored in storage part 51 via input portion 53 in advance by operator.

First, in step S401, when performing exposure-processed in step S117, the overall process number at current active job is N when opening, and control portion 50 judges next to be exposed whether substrate C is more than N-k+1 opens in current active job as what process object.

Being judged to it is N-k+1 when opening above in step S401, in step S403, control portion 50 obtains next as the size being exposed substrate C processing object using the same method that processes with step S201.

In step S405, the size of the size being exposed substrate C of acquirement in step S403 with each substrate type being stored in advance in storage part 51 is compared by control portion 50, thus to next judging as the substrate type being exposed substrate C processing object.

In step S405, when being judged to the operation in being adapted for carrying out, in step 407, control portion 50 is with the same method that processes with step S205, and acquirement is next as the position etc. of the alignment mark being exposed substrate C processing object.

In step S409, the position etc. of the alignment mark being exposed substrate obtained in step S407 is compared by control portion 50 with the position etc. of the alignment mark in being pre-stored within storage part 51, it is determined whether the operation in being adapted for carrying out.

Step S409 is judged to the operation in being adapted for carrying out, in step S411, control portion 50 operation in commission directly proceeds with exposure-processed.

Step S409 is judged to be not suitable for active job, in step S413, control portion 50 following compares as processing the substrate type set in the next operation of the substrate type being exposed substrate C of object and active job what determined by step S409, thus judging that substrate type is appropriate for next operation.

Step S413 is judged to be suitable for next operation, in step S415, control portion 50 is judged as that the number being exposed substrate C for active job is not enough, and to make current active job advance one switch in the way of the next operation being exposed substrate C execution active job of process object following.

In step S417, control portion 50 exports and makes owing to the number being exposed substrate C of operation A is few operation advance this content, in step S411, continues to be exposed processing in next operation.The method exporting its content can be the method making display part 52 show its content, it is also possible to be the method utilizing its content of voice output.

On the other hand, step S405 is judged to be not suitable for active job, in step S419, the following size as the substrate set in the next operation of the size being exposed substrate C and active job that process object determined by step S409 is compared by control portion 50, thus judging that substrate type is appropriate for next operation.

When being judged to be suitable for next operation in step S419, in step S421, control portion 50 is with the same method that processes with step S205, and acquirement is next as the position etc. of the alignment mark being exposed substrate C processing object.

In step S421, the position etc. of the alignment mark being exposed substrate C obtained in step S419 is compared by control portion 50 with the position etc. of the alignment mark being stored in advance in storage part 51, thus the next operation of the operation determined whether in being adapted for carrying out.Step S423 is judged to be suitable for next operation, transfer to step S415.

When being judged to be not suitable for next operation in step S419 or step S423, in step S425, control portion 50 is judged as proceeding exposure-processed, next will be discharged to the outside of exposure plotting device 2 as the substrate C that is exposed processing object.

So, in exposure plotting system 1 involved by second embodiment, the stage that substrate C carrying comes will be exposed, judge that whether performed operation and set operation be different according to the size being exposed substrate C, therefore, it is possible to whether different judge being exposed in the stage after substrate C moves into operation, when being judged to that operation is different, it is possible to when not being exposed processing, (will not be exposed substrate C and be placed in pedestal 10) promptly will be exposed substrate C and be discharged to the outside of exposure plotting device 2.

Additionally, in exposure plotting system 1 involved by second embodiment, the stage that substrate C carrying comes will be exposed, judge whether that the operation being exposed substrate C to carrying switches over (by being exposed the stage before substrate C is placed in pedestal 10) in advance, therefore, it is possible to make the beginning that view data switches shift to an earlier date opportunity.Particularly need the regular hour in the switching of the bigger situation hypograph data of the data capacity of the view data of exposure object image, but be able to shorten the stand-by time of the switching for this view data.

Additionally, in exposure plotting system 1 involved by second embodiment, to judging that before operation switches substrate type is appropriate for that the situation (expose supervision with first and process corresponding) of next operation is illustrated, but be not limited to this, it is also possible to operation switch after judge substrate type be appropriate for before operation (with second expose supervision process corresponding).In this case, in step S401, whether the process number that determination processing number is current in the N operation opened is below kth is opened, step S409 is utilized to determine whether the operation after being suitable for switching, in step S413, S419 and S423, it is determined that substrate type is appropriate for the operation before the operation after switching, operation before making the return of the operation after switching one set in step S415, it addition, in step S417, output makes operation return this content.

Alternatively, it is also possible to be exposed substrate C be exposed process period to this be exposed substrate C following as exposure object be exposed substrate C carry out first exposure supervision process, second exposure supervision process and the 3rd supervision process.Thereby, it is possible to carried out the judgement of the switching of operation before starting exposure-processed in advance.

It is generally introduced in this specification by referring to by the disclosure of Japanese publication Patent 2012-057467.

About the whole documents recorded in this specification, patent application and technical specification, with by each document, patent application and technical specification by referring to and introduce situation that this situation specifically and respectively describes to same extent by referring to and be incorporated in this specification.

Description of reference numerals

1 ... exposure plotting system, 2 ... exposure plotting device, 3 ... control device, 5 ... the first trucking department, 5a ... conveyor portion, 6 ... the second trucking department, 10 ... pedestal, 11 ... matrix, 12 ... base station, 14 ... guide rail, 15 ... door frame, 16 ... exposure portion, 16a ... photohead, 17 ... light source cell, 18 ... optical fiber, 19 ... graphics processing unit, 20 ... signal cable, 22 ... door frame, 23 ... photography portion, 24 ... AC hands, 25 ... adsorption section, 26 ... press section, 27 ... substrate size measurement unit, 27a ... width measurement unit, 27b ... length measurement unit, 40 ... systems control division, 41 ... pedestal drive division, 42 ... operation device, 43 ... mobile drive division, 50 ... control portion, 51 ... storage part, 52 ... display part, 53 ... input portion, 54 ... communication interface, 60 ... perform job information, 70 ... substrate type information, C ... be exposed substrate.

Claims

1. an exposure plotting device, possesses:

Exposure-processed performance element, sets the information substrate representing the kind being exposed substrate respectively, based on the multiple exposure-processed requirements requiring the exposure-processed corresponding with exposure information, performs each exposure-processed successively to being exposed substrate；

Detection unit, the information substrate being exposed substrate of detection exposure-processed object；

To the detection information substrate detected by described detection unit and executory exposure-processed, comparing unit, requires that in set execution, information substrate compares；And

Switch unit, comparative result based on described comparing unit, require to switch over to the exposure-processed performed by described exposure-processed performance element, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with information substrate in execution, the described substrate that is exposed next becoming exposure-processed object is continued executing with executory exposure-processed requirement, and when the information substrate that information substrate in detecting information substrate and performing is different and set with the requirement of next exposure-processed is identical, terminate described executory exposure-processed to require and start to perform next exposure-processed requirement described.

2. exposure plotting device according to claim 1, wherein,

Each exposure-processed requirement that the plurality of exposure-processed requires sets the number information processing number representing substrate respectively,

Described switch unit is when the predetermined number that the exposure-processed number performed by described exposure-processed performance element is that the process number set by the requirement of executory exposure-processed specifies, comparative result based on described comparing unit, require to switch over to the exposure-processed performed by described exposure-processed performance element, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with information substrate in execution, the described substrate that is exposed next becoming exposure-processed object is continued executing with executory exposure-processed requirement, and when the information substrate that information substrate in detecting information substrate and performing is different and set with the requirement of next exposure-processed is identical, terminate described executory exposure-processed to require and start to perform next exposure-processed requirement described.

3. an exposure plotting device, possesses:

To the exposure-processed after the detection information substrate detected by described detection unit and switching, comparing unit, requires that set switching information substrate compares；And

Switch unit, by terminate executory exposure-processed to require and after switching in the way of starting to perform the requirement of next exposure-processed, comparative result based on described comparing unit, require to switch over to the exposure-processed performed by described exposure-processed performance element, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with switching information substrate, the described substrate that is exposed next becoming exposure-processed object is performed the exposure-processed requirement after switching, and when detect information substrate different with switching information substrate and with switching before information substrate set by performed exposure-processed requirement identical, the described substrate that is exposed next becoming exposure-processed object is continued executing with the front performed exposure-processed requirement of switching.

4. exposure plotting device according to claim 3, wherein,

Described switch unit by terminate executory exposure-processed to require and after switching in the way of starting to perform the requirement of next exposure-processed, when the exposure-processed number performed by described exposure-processed performance element is the predetermined number that the process number set by the requirement of executory exposure-processed specifies, comparative result based on described comparing unit, require to switch over to the exposure-processed performed by described exposure-processed performance element, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with switching information substrate, the described substrate that is exposed next becoming exposure-processed object is performed the exposure-processed requirement after switching, and when detect information substrate different with switching information substrate and with switching before information substrate set by performed exposure-processed requirement identical, the described substrate that is exposed next becoming exposure-processed object is continued executing with the front performed exposure-processed requirement of switching.

5. the exposure plotting device according to claim 2 or 4, wherein,

It is also equipped with receiving unit, accepts allowable exposure and process the input of the number being exposed substrate described in the switching required,

Set by executory exposure-processed process number and the number that received by described receiving unit specifies described predetermined number.

6. exposure plotting device according to claim 2, wherein,

The exposure-processed number that described switch unit performs in being required by described exposure-processed performance element exposure-processed in commission is to deduct the number received by described receiving unit and when more than the number adding 1 and obtaining from the number that processes set by executory exposure-processed, comparative result based on described comparing unit, require to switch over to the exposure-processed performed by described exposure-processed performance element, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with switching information substrate, the described substrate that is exposed next becoming exposure-processed object is performed the exposure-processed requirement after switching, and when detect information substrate different with switching information substrate and with switching before information substrate set by performed exposure-processed requirement identical, the described substrate that is exposed next becoming exposure-processed object is continued executing with the front performed exposure-processed requirement of switching.

7. exposure plotting device according to claim 4, wherein,

When the exposure-processed number that described switch unit performs in being required by described exposure-processed performance element exposure-processed in commission is below the number received by described receiving unit, comparative result based on described comparing unit, require to switch over to the exposure-processed performed by described exposure-processed performance element, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with switching information substrate, the described substrate that is exposed next becoming exposure-processed object is performed the exposure-processed requirement after switching, and when detect information substrate different with switching information substrate and with switching before information substrate set by performed exposure-processed requirement identical, the described substrate that is exposed next becoming exposure-processed object is continued executing with the front performed exposure-processed requirement of switching.

8. exposure plotting device according to claim 1, wherein,

Being also equipped with output unit, this output unit exports prespecified information when the described switch unit exposure-processed to being performed by described exposure-processed performance element requires and carried out and having switched.

9. exposure plotting device according to claim 1, wherein,

Described information substrate is the information of the size comprising substrate, the position of alignment mark being formed at substrate and kind,

Described detection unit detect described exposure-processed object the size being exposed substrate, be formed at the position of the alignment mark being exposed substrate and be formed at the alignment mark that is exposed substrate plant at least one of apoplexy due to endogenous wind as information substrate.

10. exposure plotting device according to claim 1 and 2, wherein,

It is also equipped with deliverying unit, when the information substrate that described detection information substrate is different from information substrate in execution and set with next exposure-processed described requirement is different, the described substrate that is exposed next becoming exposure-processed object is discharged to device outside and is not exposed process.

11. the exposure plotting device according to claim 3 or 4, wherein,

It is also equipped with deliverying unit, different from switching information substrate at described detection information substrate and with switching before performed exposure-processed require that set information substrate is different, by the described substrate that is exposed next becoming exposure-processed object, to be discharged to device outside and be not exposed process.

12. exposure plotting device according to claim 1 and 2, wherein,

Next described detection unit becomes being exposed when substrate is moved into and the size being exposed substrate of described exposure-processed object being detected of exposure-processed object described,

Described exposure plotting device is also equipped with deliverying unit, comparative result based on described comparing unit, information substrate is different and different with the information substrate set by the requirement of next exposure-processed in detection information substrate and execution, the described substrate that is exposed next becoming exposure-processed object is discharged to device outside as former state and is not exposed process.

13. the exposure plotting device according to claim 3 or 4, wherein,

Described exposure plotting device is also equipped with deliverying unit, comparative result based on described comparing unit, when detect information substrate different with switching information substrate and with switching before performed exposure-processed require that set information substrate is different, the described substrate that is exposed next becoming exposure-processed object is discharged to device outside as former state and is not exposed process.

14. an exposure plotting method, including:

Exposure-processed performs step, sets the information substrate representing the kind being exposed substrate respectively, based on the multiple exposure-processed requirements requiring the exposure-processed corresponding with exposure information, performs each exposure-processed successively to being exposed substrate；

Detecting step, the information substrate being exposed substrate of detection exposure-processed object；

To the detection information substrate detected in described detecting step and executory exposure-processed, comparison step, requires that in set execution, information substrate compares；And

Switch step, comparative result based on described comparison step, the exposure-processed performing described exposure-processed to perform in step requires to switch over, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with information substrate in execution, the described substrate that is exposed next becoming exposure-processed object is continued executing with executory exposure-processed requirement, and when the information substrate that information substrate in detecting information substrate and performing is different and set with the requirement of next exposure-processed is identical, terminate described executory exposure-processed to require and start to perform next exposure-processed requirement described.

15. an exposure processing method, including:

To the exposure-processed after the detection information substrate detected in described detecting step and switching, comparison step, requires that set switching information substrate compares；And

Switch step, by terminate executory exposure-processed to require and after switching in the way of starting to perform the requirement of next exposure-processed, comparative result based on described comparison step, the exposure-processed performing described exposure-processed to perform in step requires to switch over, make when the detection information substrate being exposed substrate next becoming exposure-processed object is identical with switching information substrate, the described substrate that is exposed next becoming exposure-processed object is performed the exposure-processed requirement after switching, and when detect information substrate different with switching information substrate and with switching before information substrate set by performed exposure-processed requirement identical, the described substrate that is exposed next becoming exposure-processed object is continued executing with the front performed exposure-processed requirement of switching.