CN104167396A - Novel integrated water cooled thyristor - Google Patents
Novel integrated water cooled thyristor Download PDFInfo
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- CN104167396A CN104167396A CN201310184626.8A CN201310184626A CN104167396A CN 104167396 A CN104167396 A CN 104167396A CN 201310184626 A CN201310184626 A CN 201310184626A CN 104167396 A CN104167396 A CN 104167396A
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- thyristor
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- cooled
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Abstract
The invention relates to a novel integrated water cooled thyristor comprising a tube seat and a tube cover, and a chip having a protection layer is arranged between the tube seat and the tube cover; the other end of the tube seat is connected with a heat dissipation device. Through external press mounting force, the bottom face of the tube seat of the thyristor is enabled to be connected with the heat dissipation device; the base seat and the heat dissipation device share a face, contact thermal resistance between a conventional thyristor and the heat dissipation device can be reduced, and therefore heat can be transmitted to the heat dissipation device from a chip of the thyristor; heat dissipation efficiency can be improved.
Description
Technical field:
The present invention relates to a kind of thyristor, specifically relate to a kind of integrated water-cooling thyristor.
Background technology:
Current 6 inches of high-power thyristors are mainly used in extra-high voltage direct-current transmission converter valve, switching component as converter valve, in actual motion, can pass into the electric current up to 5kA, can bring compared with lossy to thyristor in this case, the heat that loss produces can cause the rising of thyristor chip temperature.For avoiding thyristor chip excess Temperature to lose efficacy, conventionally to thyristor, be equipped with water-filled radiator heat is taken away in time, its chip temperature is controlled in safe range.
Inventor's long-term observation finds that existing radiator and thyristor are independent design, manufacture, during use, under external force, radiator is connected with thyristor, heat is mainly from contact-making surface between the two from thyristor to heat sink, and then taken away by the coolant in radiator.
The junction temperature of thyristor determines to the thermal resistance cooling fluid by loss, coolant temperature and the chip of chip, and chip loss and coolant temperature have been determined when system, and the object that reduces junction temperature mainly relies on and reduces thermal resistance and improve radiating efficiency and realize.
Summary of the invention:
The object of this invention is to provide a kind of novel all-in-one water-cooled thyristor, this thyristor adopts radiator and thyristor integrated design, has reduced the contact heat resistance between existing thyristor and radiator.
For achieving the above object, the present invention by the following technical solutions: a kind of novel all-in-one water-cooled thyristor, described thyristor comprises base and Guan Gai, is provided with the chip with protective layer therebetween, the other end of described base is connected with radiator.
A kind of novel all-in-one water-cooled thyristor provided by the invention, described chip comprises anode-side molybdenum sheet, silicon chip and the cathode side molybdenum sheet setting gradually; Described silicon chip comprises and sets gradually Kuo Lin district N+, short base P1, growing base area N, short base P2He heavily doped region P+; Described Kuo Lin district N+ is provided with negative electrode and gate pole, and described heavily doped region P+ is provided with anode; Described silicon chip is provided with divider wall, and described divider wall surface is provided with hole; Described anode, negative electrode and gate pole are respectively equipped with radially lead-out wire.
A kind of novel all-in-one water-cooled thyristor provided by the invention, described radiator is coaxial with described thyristor, the circulating cooling water channel that it comprises housing and is arranged on enclosure interior along described housing axis direction, described cooling water channel two ends are respectively water inlet and delivery port.
Another preferred a kind of novel all-in-one water-cooled thyristor provided by the invention, is provided with projection along the axis direction of described cooling water channel, and described projection is rectangle, zigzag or polygon.
A preferred a kind of novel all-in-one water-cooled thyristor more provided by the invention, the one end being connected with radiator at described base is connected with described housing by external force.
Another preferred a kind of novel all-in-one water-cooled thyristor provided by the invention, is filled with inert gas by described thyristor.
Another preferred a kind of novel all-in-one water-cooled thyristor provided by the invention, described inert gas is the mist of helium and nitrogen, prevents from managing interior burning.
Another preferred a kind of novel all-in-one water-cooled thyristor provided by the invention, described chip outer is surrounded by rubber sleeve.
Another preferred a kind of novel all-in-one water-cooled thyristor provided by the invention, described thyristor is 6 inch thyristors
Owing to having adopted technique scheme, the beneficial effect that the present invention obtains is:
1, in the present invention, on thyristor base, design radiator, eliminated the contact heat resistance between original thyristor and radiator;
2, in the present invention, the wall that thyristor contacts with radiator has been saved in Novel thyristor design, and has excavated part radiator material while slotting, and makes device integral body more succinct, economical;
3, in the present invention, Novel thyristor has improved the radiating efficiency of itself greatly;
4, the Novel thyristor in the present invention and the contact heat resistance between radiator reduce 20%;
5, thyristor divider wall of the present invention is provided with radial hole, has accelerated divider wall and has diffuseed to form speed;
6, microchannel heat sink of the present invention makes thermal resistance reduce 11.5%-46%;
7, the rate of heat dissipation of microchannel heat sink of the present invention and the shape of projection, size, length and quantity have very large relation;
8, thyristor of the present invention has been strengthened anti-seismic performance.
Accompanying drawing explanation
The integrated water-cooled thyristor structure of Fig. 1 schematic diagram;
Fig. 2 is thyristor structure schematic diagram;
Fig. 3 is cooling water channel structure schematic diagram;
Fig. 4 is micro-channel schematic diagram;
Wherein, 1-thyristor, 2-housing, 3-water inlet, 4-delivery port;
1.1-base, 1.2-protective layer, 1.3-chip, the outlet of 1.4-gate lead, 1.5-manages lid;
2.1-cooling water channel, 2.2-micro-channel.
Embodiment
Below in conjunction with embodiment, the invention will be described in further detail.
Embodiment 1:
As Figure 1-3, the invention of this example is mainly carried out 6 inches of integrated water-cooling thyristors, and described thyristor 1 comprises that the base 1.1, porcelain toroidal shell, protective layer 1.2, chip 1.3 and the pipe that set gradually vertically cover 1.5; Described chip 1.3 outers are surrounded by rubber sleeve; Described protective layer 1.2 and chip buckle in porcelain toroidal shell successively; At described base 1.1 axial directions, have radiator.
Described chip 1.3 comprises the anode-side molybdenum sheet axially arranging successively, silicon chip and cathode side molybdenum sheet; Described silicon chip comprises Kuo Lin district N+, short base P1, growing base area N, short base P2He heavily doped region P+ is axially set successively; Described Kuo Lin district N+ is provided with negative electrode and gate pole, and described heavily doped region P+ is provided with anode; Described silicon chip surrounding is provided with divider wall, and described divider wall surface is provided with axial hole; And being respectively equipped with described anode lead wire, cathode terminal and gate pole lead-out wire, along silicon chip radial direction, the gate lead outlet 1.4 by thyristor base 1.1 edge radial holes passes described gate lead.Described thyristor 1 is put into cold pressure welding machine, the interior gas of thyristor 1 is vacuumized simultaneously, then pour the mist of helium and nitrogen, prevent from managing interior burning.
Described radiator comprises housing 2 and along described housing axis direction, is arranged on the spiral type cooling water channel 2.1 of body interior, and described cooling water channel 2.1 two ends are respectively water inlet 3 and delivery port 4, and are connected to outside housing 2.Described coolant flow channel 2.1 along its axis direction within it wall be provided with projection 2.3, this projection 2.3 can be rectangle, zigzag or polygon.
Described housing 2 is uncovered cylindrical shell, one end that described base 1.1 is connected with radiator is arranged on the open-mouth of described housing 2 by outside pressure assembling force, make it to form the upper cover of housing 2, thereby thyristor 1 is well connected with radiator and make the thyristor 1 in integrated water-cooling thyristor reduce 20% with the contact heat resistance of radiator.
While using 6 inches of integrated water-cooling thyristors, by outside pressure assembling force, make base 1.1 bottom surfaces of thyristor 1 and close contact of radiator realize heat and pass to radiator from the chip 1.3 of thyristor 1.Adopt after new design, radiator is made and just on the base 1.1 of thyristor 1, is carried out, and forms a thyristor 1 that carries radiator, forms integrated water-cooling thyristor, and the use of can directly connecting in DC converter valve.
Microchannel heat sink thermal resistance reduced rate of the present invention sees the following form:
As can be seen here, this microchannel heat sink can improve radiating efficiency greatly.
Finally should be noted that: above embodiment is only in order to illustrate that technical scheme of the present invention is not intended to limit, although the present invention is had been described in detail with reference to above-described embodiment, those of ordinary skill in the field are to be understood that: still can modify or be equal to replacement the specific embodiment of the present invention, and do not depart from any modification of spirit and scope of the invention or be equal to replacement, it all should be encompassed in the middle of this claim scope.
Claims (9)
1. a novel all-in-one water-cooled thyristor, described thyristor comprises base and Guan Gai, is provided with the chip with protective layer therebetween, it is characterized in that: the other end of described base is connected with radiator.
2. a kind of novel all-in-one water-cooled thyristor as claimed in claim 1, is characterized in that: described chip comprises anode-side molybdenum sheet, silicon chip and the cathode side molybdenum sheet setting gradually; Described silicon chip comprises and sets gradually Kuo Lin district N+, short base P1, growing base area N, short base P2He heavily doped region P+; Described Kuo Lin district N+ is provided with negative electrode and gate pole, and described heavily doped region P+ is provided with anode; Described silicon chip is provided with divider wall, and described divider wall surface is provided with hole; Described anode, negative electrode and gate pole are respectively equipped with radially lead-out wire.
3. a kind of novel all-in-one water-cooled thyristor as claimed in claim 1, it is characterized in that: described radiator is coaxial with described thyristor, the circulating cooling water channel that it comprises housing and is arranged on enclosure interior along described housing axis direction, described cooling water channel two ends are respectively water inlet and delivery port.
4. a kind of novel all-in-one water-cooled thyristor as claimed in claim 3, is characterized in that: the axis direction along described cooling water channel is provided with projection, and described projection is rectangle, zigzag or polygon.
5. a kind of novel all-in-one water-cooled thyristor as claimed in claim 3, is characterized in that: the one end being connected with radiator at described base is connected with described housing by external force.
6. a kind of novel all-in-one water-cooled thyristor as claimed in claim 1, is characterized in that: described thyristor is filled with to inert gas.
7. a kind of novel all-in-one water-cooled thyristor as claimed in claim 6, is characterized in that: described inert gas is the mist of helium and nitrogen, prevents from managing interior burning.
8. a kind of novel all-in-one water-cooled thyristor as claimed in claim 1, is characterized in that: described chip outer is surrounded by rubber sleeve.
9. a kind of novel all-in-one water-cooled thyristor as claimed in claim 1, is characterized in that: described thyristor is 6 inch thyristors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310184626.8A CN104167396A (en) | 2013-05-17 | 2013-05-17 | Novel integrated water cooled thyristor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310184626.8A CN104167396A (en) | 2013-05-17 | 2013-05-17 | Novel integrated water cooled thyristor |
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| Publication Number | Publication Date |
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| CN104167396A true CN104167396A (en) | 2014-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310184626.8A Pending CN104167396A (en) | 2013-05-17 | 2013-05-17 | Novel integrated water cooled thyristor |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107872213A (en) * | 2017-12-06 | 2018-04-03 | 苏州喷声电子科技有限公司 | A kind of thyristor switch that there is radiating and be switched fast |
| CN108493175A (en) * | 2018-05-22 | 2018-09-04 | 杭州汉安半导体有限公司 | A kind of integrated heat dissipation thyristor with multiple flow passages |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07249721A (en) * | 1994-03-10 | 1995-09-26 | Fuji Electric Co Ltd | Cooling body for power semiconductor element |
| JPH1028377A (en) * | 1996-07-08 | 1998-01-27 | Toshiba Corp | Power converter |
| JP2000164779A (en) * | 1998-11-30 | 2000-06-16 | Mitsubishi Electric Corp | Water-cooled cooling fin for semiconductor element |
| CN201838571U (en) * | 2010-08-27 | 2011-05-18 | 中国电力科学研究院 | Novel thyristor water-cooling radiator |
| CN202888149U (en) * | 2012-11-12 | 2013-04-17 | 湖北台基半导体股份有限公司 | Full-pressure-welding packaging high-voltage semiconductor device |
-
2013
- 2013-05-17 CN CN201310184626.8A patent/CN104167396A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07249721A (en) * | 1994-03-10 | 1995-09-26 | Fuji Electric Co Ltd | Cooling body for power semiconductor element |
| JPH1028377A (en) * | 1996-07-08 | 1998-01-27 | Toshiba Corp | Power converter |
| JP2000164779A (en) * | 1998-11-30 | 2000-06-16 | Mitsubishi Electric Corp | Water-cooled cooling fin for semiconductor element |
| CN201838571U (en) * | 2010-08-27 | 2011-05-18 | 中国电力科学研究院 | Novel thyristor water-cooling radiator |
| CN202888149U (en) * | 2012-11-12 | 2013-04-17 | 湖北台基半导体股份有限公司 | Full-pressure-welding packaging high-voltage semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107872213A (en) * | 2017-12-06 | 2018-04-03 | 苏州喷声电子科技有限公司 | A kind of thyristor switch that there is radiating and be switched fast |
| CN108493175A (en) * | 2018-05-22 | 2018-09-04 | 杭州汉安半导体有限公司 | A kind of integrated heat dissipation thyristor with multiple flow passages |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 100031 Xicheng District West Chang'an Avenue, No. 86, Beijing Applicant after: State Grid Corporation of China Applicant after: STATE GRID SMART GRID Research Institute Applicant after: CHINA-EPRI ELECTRIC POWER ENGINEERING Co.,Ltd. Applicant after: STATE GRID SHANDONG ELECTRIC POWER Co. Address before: 100031 Xicheng District West Chang'an Avenue, No. 86, Beijing Applicant before: State Grid Corporation of China Applicant before: STATE GRID SMART GRID Research Institute Applicant before: CHINA-EPRI ELECTRIC POWER ENGINEERING Co.,Ltd. Applicant before: SHANDONG ELECTRIC POWER Corp. |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20170531 Address after: 100031 Xicheng District West Chang'an Avenue, No. 86, Beijing Applicant after: State Grid Corporation of China Applicant after: CHINA-EPRI ELECTRIC POWER ENGINEERING Co.,Ltd. Applicant after: STATE GRID SHANDONG ELECTRIC POWER Co. Address before: 100031 Xicheng District West Chang'an Avenue, No. 86, Beijing Applicant before: State Grid Corporation of China Applicant before: STATE GRID SMART GRID Research Institute Applicant before: CHINA-EPRI ELECTRIC POWER ENGINEERING Co.,Ltd. Applicant before: STATE GRID SHANDONG ELECTRIC POWER Co. |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141126 |
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| RJ01 | Rejection of invention patent application after publication |