CN104163030A - A method of manufacturing a halogen-free high-conductivity high-heat resistance copper-clad metal substrate - Google Patents
A method of manufacturing a halogen-free high-conductivity high-heat resistance copper-clad metal substrate Download PDFInfo
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- CN104163030A CN104163030A CN201410301575.7A CN201410301575A CN104163030A CN 104163030 A CN104163030 A CN 104163030A CN 201410301575 A CN201410301575 A CN 201410301575A CN 104163030 A CN104163030 A CN 104163030A
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Abstract
A method of manufacturing a halogen-free high-conductivity high-heat resistance copper-clad metal substrate is disclosed. Components of a glue liquid comprise resin A, a flexibilizer B, a curing agent, a promoter, a coupling agent, silicon dioxide, aluminum nitride and a solvent in a mass ratio of 995-1050: 10-30: 300-400: 1-1.5: 2.1-2.5: 100-150: 100-150: 100-300. Properties of the high-conductivity high-heat resistance metal substrate prepared by the method are that: 1) no bubble or layering occurs to plate materials in 300 s; 2) the heat-conducting property is higher than 2.0 w/m.k; 3) the peeling strength (the peeling strength of HOZ copper foil is increased to 1.0-1.5 N/mm, and the peeling strength of 1OZ copper foil is usually 1.5-2.5 N/mm, wherein detection is performed according to the IPC-TM-650-2.4.8 standard); and 4) the flame retardant property reaches V-0.
Description
Technical field
The present invention relates to a kind of high heat-resisting method of covering copper metal substrate of height of leading of Halogen of making.
Background technology
Along with electronic equipment is constantly integrated into more powerful function in less assembly, temperature has become the most important factor of reliability that affects.And along with the actively promoting of the enforcement, particularly environmental protection organization of electron wastes management decree, the non-halogen process of propelling that world electronics firm does one's utmost, the promotion that heat radiation requires to sheet material of the requirement of set Halogen and market multi-layered high-density.
Halogen product fragility is large, and adhesive property is bad, and high heat filling amount is large, and heat conduction is high, and PP gets over Bao Yuehao, but the glue amount of thin PP is little, poor with the adhesive property of Copper Foil and aluminium sheet.Above performance for a change, improve the adhesive property of product, just need to be in formula introducing-OH, hydroxyl has obvious effect to adhesive property, need in phenolic resin curative, sneak into the material that improves toughness simultaneously, the filler of high heat conduction need to be determined according to cost and feasibility condition, improve the oxidation effectiveness of aluminium sheet.
Summary of the invention
The object of this invention is to provide a kind of high heat-resisting method of covering copper metal substrate of height of leading of Halogen of making.
The technical solution used in the present invention is: a kind of high heat-resisting method of covering copper metal substrate of height of leading of Halogen of making, and step is as follows:
A, Resin A, flexibilizer B, curing agent, promoter, coupling agent and the silica of processing with silanes surface conditioning agent, aluminium hydroxide and appropriate stirring solvent are evenly become to liquid;
B, the mixture making is coated on 7628 electron level glass cloth;
C, in 150-170 ℃ of baking oven, toast 5-8Min and make PP sheet;
D, folded join, suppress;
Described glue component comprises Resin A, flexibilizer B, curing agent, promoter, coupling agent, silica, aluminium nitride and solvent, this component in mass ratio: 995-1050 part: 10-30 part: 300-400 part: 1-1.5 part: 2.1-2.5 part: 100-150 part: 100-150 part; 100-300 part.
As a further improvement on the present invention, described component in mass ratio: 1000 parts: 20 parts: 350 parts: 1.5 parts: 2 parts: 150 parts: 150 parts; 150 parts.
The invention has the beneficial effects as follows: the height that uses this invention to make is led high heating resisting metal substrate, its performance:
1) sheet material 300s is non-foaming not stratified;
2) more than heat conductivility 2.0w/m.k;
3) (its peel strength of HOZ Copper Foil is promoted to 1.0-1.5N/mm to peel strength; Its peel strength of 1OZ Copper Foil is generally 1.5-2.5 N/mm, according to IPC-TM-650-2.4.8 standard detection);
4) fire resistance reaches V-0(UL94 standard);
5) although PP matrix resin has been used adding of more expensive novel mixed type solidifying agent and appropriate toughening material, but taked other to optimize board cost mode: 1, through test of many times, searched out the maximum adding quantity of aluminium nitride and preparing spherical SiO 2, before comparing, in glue, increased preparing spherical SiO 2 filer content, the amount that has reduced expensive aluminium nitride, has reduced cost; 2, formed good passage of heat, simultaneously for not adopting glass cloth to provide good reference value as carrier in the future.
The specific embodiment
Matrix resin is 1000 parts of epoxy resin A (epoxide equivalent 350-450, content of inorganic chlorine≤350ppm, bromine content≤20ppm), and matrix resin also available multiple halogen-free epoxy resin mixes according to a certain percentage; Flexibilizer B 10-30 part, the optional acrylonitrile-butadiene rubber of flexibilizer, conventional CTBN are epoxy resin toughened, one or more in liquid polysulfide rubber, Polyurethane, silicon rubber, Pioloform, polyvinyl acetal, polysulfones PSF, polyether sulfone, nano silicon; Aluminium nitride 100-150 part (using silanes surface conditioning agent to carry out surface treatment, particle diameter≤5 μ m); Silica 1 00-150 part (use silanes surface conditioning agent to carry out surface treatment, particle diameter≤3 μ m, spherical); Curing agent is electron level composite type phenol aldehydes curing agent 300-400 part, and promoter is 0.5 part of tertiary amines promoter, and coupling agent is 2.5 parts of KH560 type silane coupling agents, solvent (in acetone, butanone, alcohol a kind of or several) 150-300 part.Resin A, flexibilizer B, curing agent, promoter, coupling agent and the silica of processing with silanes surface conditioning agent, aluminium hydroxide and appropriate stirring solvent are evenly become to liquid; Glue index: GT(gelation time, 171 ℃) 280-320s is coated in the mixture making on 7628 electron level glass cloth, to toast 5-8Min in 150-170 ℃ of baking oven and make PP sheet (prepreg), PP sheet GT(171 ℃) 110-130S.
According to folded formula formula, put into vacuum press lamination, first in hot press, after hot pressing, proceed in cold press and cold pressing.
In glue proportioning, best proportioning is: glue component comprises Resin A, flexibilizer B, curing agent, promoter, coupling agent, silica, aluminium nitride and solvent, this component in mass ratio: 1000 parts: 20 parts: 350 parts: 1.5 parts: 2 parts: 150 parts: 150 parts; 150 parts.
Above embodiments of the present invention are described, but the invention is not restricted to above-mentioned embodiment, in the ken possessing at affiliated technical field those of ordinary skill, can also under the prerequisite that does not depart from aim of the present invention, make a variety of changes.
Claims (2)
1. make the high heat-resisting method of covering copper metal substrate main gel of height of leading of Halogen, it is characterized in that: step is as follows:
Resin A, flexibilizer B, curing agent, promoter, coupling agent and the silica of processing with silanes surface conditioning agent, aluminium hydroxide and appropriate stirring solvent are evenly become to liquid;
The mixture making is coated on 7628 electron level glass cloth;
In 150-170 ℃ of baking oven, toast 5-8Min and make PP sheet;
Fold and join, suppress;
Described glue component comprises Resin A, flexibilizer B, curing agent, promoter, coupling agent, silica, aluminium nitride and solvent, this component in mass ratio: 995-1050 part: 10-30 part: 300-400 part: 1-1.5 part: 2.1-2.5 part: 100-150 part: 100-150 part; 100-300 part.
2. a kind of high heat-resisting method of covering copper metal substrate of height of leading of Halogen of making according to claim 1, is characterized in that described component in mass ratio: 1000 parts: 20 parts: 350 parts: 1.5 parts: 2 parts: 150 parts: 150 parts; 150 parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410301575.7A CN104163030A (en) | 2014-06-30 | 2014-06-30 | A method of manufacturing a halogen-free high-conductivity high-heat resistance copper-clad metal substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410301575.7A CN104163030A (en) | 2014-06-30 | 2014-06-30 | A method of manufacturing a halogen-free high-conductivity high-heat resistance copper-clad metal substrate |
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| CN104163030A true CN104163030A (en) | 2014-11-26 |
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| CN201410301575.7A Pending CN104163030A (en) | 2014-06-30 | 2014-06-30 | A method of manufacturing a halogen-free high-conductivity high-heat resistance copper-clad metal substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105196649A (en) * | 2015-09-02 | 2015-12-30 | 铜陵翔宇商贸有限公司 | Copper-clad plate manufacturing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08103984A (en) * | 1994-10-04 | 1996-04-23 | Toshiba Chem Corp | Copper-clad laminated plate |
| CN103074019A (en) * | 2013-01-22 | 2013-05-01 | 浙江华正新材料股份有限公司 | Halogen-free epoxy adhesive and flexible copper-clad plate prepared from same |
| CN103450836A (en) * | 2013-09-04 | 2013-12-18 | 九江福莱克斯有限公司 | Environmental-friendly, flexible, heat-conducting epoxy resin adhesive and high-heat-conduction flexible base material prepared by using same |
| CN103612437A (en) * | 2013-11-28 | 2014-03-05 | 铜陵浩荣电子科技有限公司 | Novel halogen-free composite type base plate and manufacture method thereof |
| CN103694644A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof |
-
2014
- 2014-06-30 CN CN201410301575.7A patent/CN104163030A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08103984A (en) * | 1994-10-04 | 1996-04-23 | Toshiba Chem Corp | Copper-clad laminated plate |
| CN103074019A (en) * | 2013-01-22 | 2013-05-01 | 浙江华正新材料股份有限公司 | Halogen-free epoxy adhesive and flexible copper-clad plate prepared from same |
| CN103450836A (en) * | 2013-09-04 | 2013-12-18 | 九江福莱克斯有限公司 | Environmental-friendly, flexible, heat-conducting epoxy resin adhesive and high-heat-conduction flexible base material prepared by using same |
| CN103612437A (en) * | 2013-11-28 | 2014-03-05 | 铜陵浩荣电子科技有限公司 | Novel halogen-free composite type base plate and manufacture method thereof |
| CN103694644A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105196649A (en) * | 2015-09-02 | 2015-12-30 | 铜陵翔宇商贸有限公司 | Copper-clad plate manufacturing method |
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Application publication date: 20141126 |