CN103612437A - Novel halogen-free composite type base plate and manufacture method thereof - Google Patents
Novel halogen-free composite type base plate and manufacture method thereof Download PDFInfo
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- CN103612437A CN103612437A CN201310613234.9A CN201310613234A CN103612437A CN 103612437 A CN103612437 A CN 103612437A CN 201310613234 A CN201310613234 A CN 201310613234A CN 103612437 A CN103612437 A CN 103612437A
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Abstract
The invention relates to a novel halogen-free composite type base plate and a manufacture method of the novel halogen-free composite type base plate. The manufacture method comprises the steps of preparing glue solution, coating, drying and carrying out hot-press molding. The base plate is composed of a first steel plate, a first copper foil, a first semi-cured sheet, a second semi-cured sheet, a third semi-cured sheet, a fourth semi-cured sheet, a second copper foil and a second steel plate from top to bottom. The manufacture method has the characteristics that the heat resistance of the processed CEM-3 halogen-free base plate can reach 80-110s and is improved by about 50s as compared with the heat resistance of the base plate processed by the existing method, and the combustibility of the base plate is promoted into V-0 level. The novel halogen-free composite type base plate uses epoxy resin with low price and aluminium hydroxide fillers with high proportion to control the cost, meets the market requirement, and has remarkable economic benefit and implementation effect.
Description
Technical field
The present invention relates to the compound substrate of a kind of novel halogen-free, and the preparation method of this substrate, printed-board technology field belonged to.
Background technology
At present, at copper-clad plate production field, halogen-free type sheet material more and more becomes leading type sheet material, and the demand in market is increasing, but the compound substrate of Halogen, if model is CEM-3 halogen-free type substrate, in actual machine-shaping process, heat resistance and the flammability of control sheet material that still cannot be good, its heat resistance is only that 30s ~ 40s(is according to IPC-TM-650-2.4.8 examination criteria), flammability is V-2 level (according to U.S. UL-94 examination criteria), cannot meet the actual demand in market.
Summary of the invention
The deficiency that the present invention exists for prior art just, provides a kind of novel halogen-free compound substrate, and the preparation method of this substrate.
For addressing the above problem, the technical solution used in the present invention is as follows:
A preparation method for the compound substrate of novel halogen-free, comprises the following steps:
According to weight portion, prepare following material:
Halogen-free type epoxy resin A:200 ~ 250 part of phosphorus flame retardant
Foundation ring epoxy resins B:100 ~ 150 part
Trifunctional type epoxy resin C:20 ~ 50 part
Aluminium hydroxide: 200 ~ 400 parts
Dicyandiamide class curing agent: 10 ~ 15 parts
Tertiary amines promoter: 0.1 ~ 1.0 part
Organophosphor, boron based flame retardant: 0.03 ~ 1 part
Solvent: 100 ~ 200 parts, choose any one kind of them in dimethyl formamide, acetone, three kinds of materials of butanone;
Material in step 1 is stirred into liquid state, forms mixture, then mixture is evenly coated on electron level glass cloth and glass felt and is dried into film, form prepreg;
Step 3, hot-forming;
To the prepreg forming in step 2, carry out hot-forming, it is respectively from top to bottom: the first steel plate, the first Copper Foil, the first prepreg, the second prepreg, the 3rd prepreg, the 4th prepreg, the second Copper Foil, the second steel plate, and the first steel plate is identical with the second steel plate, the first Copper Foil is identical with the second Copper Foil, the first prepreg is identical with the 4th prepreg, main body is used electronic grade glass cloth, and in step 2, forms prepreg; The second prepreg, the 3rd prepreg are identical, and main body is used electron level glass felt, and in step 2, forms prepreg.
As the improvement of technique scheme, content of inorganic chlorine≤150ppm of described halogen-free type epoxy resin A.
As the improvement of technique scheme, described foundation ring epoxy resins B content of inorganic chlorine≤180ppm.
As the improvement of technique scheme, described trifunctional type epoxy resin C content of inorganic chlorine≤100ppm.
As the improvement of technique scheme, described aluminium hydroxide is used silanes surface conditioning agent to carry out surface treatment, and particle diameter≤5 μ m.
The compound substrate of a kind of novel halogen-free, described substrate is respectively from top to bottom: the first steel plate, the first Copper Foil, the first prepreg, the second prepreg, the 3rd prepreg, the 4th prepreg, the second Copper Foil, the second steel plate, and the first steel plate is identical with the second steel plate, the first Copper Foil is identical with the second Copper Foil, the first prepreg is identical with the 4th prepreg, and main body is used electronic grade glass cloth and formed prepreg; The second prepreg, the 3rd prepreg are identical, and main body is used electron level glass felt also to form prepreg.
Compared with prior art, implementation result of the present invention is as follows in the present invention:
Preparation method of the present invention, the CEM-3 halogen-free type substrate heat resistance processing reaches 80s ~ 110s, and the substrate heat resistance processing than existing method promotes 50s left and right, and flammability is promoted to V-0 level.The present invention uses less expensive foundation ring epoxy resins and a high proportion of filling aluminium hydrate to control cost, and product has met market demands simultaneously, has significant economic benefit, and implementation result is remarkable.
Accompanying drawing explanation
Fig. 1 is the compound substrate heat laminated structure of novel halogen-free of the present invention schematic diagram.
The specific embodiment
Content of the present invention is described below in conjunction with specific embodiments.
The preparation method of the compound substrate of novel halogen-free of the present invention, comprises the following steps:
According to weight portion, prepare following material:
Halogen-free type epoxy resin A:200 ~ 250 of phosphorus flame retardant part (epoxide equivalent 300 ~ 400g/eq)
Foundation ring epoxy resins B:100 ~ 150 part (epoxide equivalent 100 ~ 200g/eq)
Trifunctional type epoxy resin C:20 ~ 50 part (epoxide equivalent 200 ~ 300g/eq)
Aluminium hydroxide: 200 ~ 400 parts
Dicyandiamide class curing agent: 10 ~ 15 parts
Tertiary amines promoter: 0.1 ~ 1.0 part
Organophosphor, boron based flame retardant: 0.03 ~ 1 part
Solvent: 100 ~ 200 parts, choose any one kind of them in dimethyl formamide, acetone, three kinds of materials of butanone;
Wherein, content of inorganic chlorine≤150ppm of halogen-free type epoxy resin A, foundation ring epoxy resins B content of inorganic chlorine≤180ppm, trifunctional type epoxy resin C content of inorganic chlorine≤100ppm, aluminium hydroxide is used silanes surface conditioning agent to carry out surface treatment, and particle diameter≤5 μ m.
Material in step 1 is stirred into liquid state, forms mixture, then mixture is evenly coated on electron level glass cloth and glass felt and is dried into film, form prepreg.
Step 3, hot-forming
As shown in Figure 1, the prepreg forming in step 2 is carried out hot-forming, it is respectively from top to bottom: the first steel plate 1, the first Copper Foil 2, the first prepreg 3, the second prepreg 4, the 3rd prepreg 5, the 4th prepreg 6, the second Copper Foil 7, the second steel plate 8.Wherein, the first steel plate 1 is identical with the second steel plate 8, all hot-press base plate is played a protective role, and the first Copper Foil 2 is identical with the second Copper Foil 7, is electrolytic copper foil.The first prepreg 3 is identical with the 4th prepreg 6, and main body is used electronic grade glass cloth, and in step 2, forms prepreg.The second prepreg 4, the 3rd prepreg 5 are identical, and main body is used electron level glass felt, and in step 2, forms prepreg.By hot-forming above, get final product to obtain the compound substrate of novel halogen-free of the present invention.
Above-described embodiment is to stick electrolytic copper foil and carry out hot-formingly with two sides, in fact, in one side, sticks electrolytic copper foil and carries out hot-formingly, can obtain equally the compound substrate of novel halogen-free of the present invention, but this does not depart from essence of the present invention.
Claims (6)
1. a preparation method for the compound substrate of novel halogen-free, is characterized in that, comprises the following steps:
Step 1, prepare glue;
According to weight portion, prepare following material:
Halogen-free type epoxy resin A:200 ~ 250 part of phosphorus flame retardant
Foundation ring epoxy resins B:100 ~ 150 part
Trifunctional type epoxy resin C:20 ~ 50 part
Aluminium hydroxide: 200 ~ 400 parts
Dicyandiamide class curing agent: 10 ~ 15 parts
Tertiary amines promoter: 0.1 ~ 1.0 part
Organophosphor, boron based flame retardant: 0.03 ~ 1 part
Solvent: 100 ~ 200 parts, choose any one kind of them in dimethyl formamide, acetone, three kinds of materials of butanone;
Step 2, coating and oven dry;
Material in step 1 is stirred into liquid state, forms mixture, then mixture is evenly coated on electron level glass cloth and glass felt and is dried into film, form prepreg;
Step 3, hot-forming;
To the prepreg forming in step 2, carry out hot-forming, it is respectively from top to bottom: the first steel plate (1), the first Copper Foil (2), the first prepreg (3), the second prepreg (4), the 3rd prepreg (5), the 4th prepreg (6), the second Copper Foil (7), the second steel plate (8), and the first steel plate (1) is identical with the second steel plate (8), the first Copper Foil (2) is identical with the second Copper Foil (7), the first prepreg (3) is identical with the 4th prepreg (6), main body is used electronic grade glass cloth, and in step 2, form prepreg, the second prepreg (4), the 3rd prepreg (5) are identical, and main body is used electron level glass felt, and in step 2, forms prepreg.
2. the preparation method of the compound substrate of a kind of novel halogen-free as claimed in claim 1, is characterized in that, content of inorganic chlorine≤150ppm of described halogen-free type epoxy resin A.
3. the preparation method of the compound substrate of a kind of novel halogen-free as claimed in claim 1, is characterized in that, described foundation ring epoxy resins B content of inorganic chlorine≤180ppm.
4. the preparation method of the compound substrate of a kind of novel halogen-free as claimed in claim 1, is characterized in that, described trifunctional type epoxy resin C content of inorganic chlorine≤100ppm.
5. the preparation method of the compound substrate of a kind of novel halogen-free as claimed in claim 1, is characterized in that, described aluminium hydroxide is used silanes surface conditioning agent to carry out surface treatment, and particle diameter≤5 μ m.
6. the compound substrate of novel halogen-free, it is characterized in that, described substrate is respectively from top to bottom: the first steel plate (1), the first Copper Foil (2), the first prepreg (3), the second prepreg (4), the 3rd prepreg (5), the 4th prepreg (6), the second Copper Foil (7), the second steel plate (8), and the first steel plate (1) is identical with the second steel plate (8), the first Copper Foil (2) is identical with the second Copper Foil (7), the first prepreg (3) is identical with the 4th prepreg (6), and main body is used electronic grade glass cloth and formed prepreg; The second prepreg (4), the 3rd prepreg (5) are identical, and main body is used electron level glass felt also to form prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310613234.9A CN103612437A (en) | 2013-11-28 | 2013-11-28 | Novel halogen-free composite type base plate and manufacture method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310613234.9A CN103612437A (en) | 2013-11-28 | 2013-11-28 | Novel halogen-free composite type base plate and manufacture method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104163030A (en) * | 2014-06-30 | 2014-11-26 | 铜陵浩荣华科复合基板有限公司 | A method of manufacturing a halogen-free high-conductivity high-heat resistance copper-clad metal substrate |
| CN106494034A (en) * | 2016-10-26 | 2017-03-15 | 江门市龙兴电子材料有限公司 | A kind of method and copper-clad plate for producing copper-clad plate using unqualified prepreg |
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| JP2001179762A (en) * | 1999-12-28 | 2001-07-03 | Shin Kobe Electric Mach Co Ltd | Method for producing laminated plate and plate for molding laminated plate |
| CN101343401A (en) * | 2008-08-22 | 2009-01-14 | 腾辉电子（苏州）有限公司 | Halogen-free glue solution, halogen-free flame-proof cover copper foil substrate using the glue solution and preparation method thereof |
| CN101418205A (en) * | 2008-12-10 | 2009-04-29 | 华烁科技股份有限公司 | Halogen-free flameproof adhesive and application thereof in prepreg and multiple layer printed plate aspect |
| CN101457012A (en) * | 2008-12-31 | 2009-06-17 | 广东生益科技股份有限公司 | Resin composition and copper clad laminate prepared by metal foil coated with resin composition |
| JP2011162621A (en) * | 2010-02-08 | 2011-08-25 | Nippon Steel Chem Co Ltd | Method for producing phosphorus-containing epoxy resin, epoxy resin composition, and cured product of the epoxy resin composition |
| CN102428092A (en) * | 2009-05-19 | 2012-04-25 | 雅宝公司 | Dopo Derivative Flame Retardants |
| CN203697608U (en) * | 2013-11-28 | 2014-07-09 | 铜陵浩荣电子科技有限公司 | Novel halogen-free composite substrate |
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2013
- 2013-11-28 CN CN201310613234.9A patent/CN103612437A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2001179762A (en) * | 1999-12-28 | 2001-07-03 | Shin Kobe Electric Mach Co Ltd | Method for producing laminated plate and plate for molding laminated plate |
| CN101343401A (en) * | 2008-08-22 | 2009-01-14 | 腾辉电子（苏州）有限公司 | Halogen-free glue solution, halogen-free flame-proof cover copper foil substrate using the glue solution and preparation method thereof |
| CN101418205A (en) * | 2008-12-10 | 2009-04-29 | 华烁科技股份有限公司 | Halogen-free flameproof adhesive and application thereof in prepreg and multiple layer printed plate aspect |
| CN101457012A (en) * | 2008-12-31 | 2009-06-17 | 广东生益科技股份有限公司 | Resin composition and copper clad laminate prepared by metal foil coated with resin composition |
| CN102428092A (en) * | 2009-05-19 | 2012-04-25 | 雅宝公司 | Dopo Derivative Flame Retardants |
| JP2011162621A (en) * | 2010-02-08 | 2011-08-25 | Nippon Steel Chem Co Ltd | Method for producing phosphorus-containing epoxy resin, epoxy resin composition, and cured product of the epoxy resin composition |
| CN203697608U (en) * | 2013-11-28 | 2014-07-09 | 铜陵浩荣电子科技有限公司 | Novel halogen-free composite substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104163030A (en) * | 2014-06-30 | 2014-11-26 | 铜陵浩荣华科复合基板有限公司 | A method of manufacturing a halogen-free high-conductivity high-heat resistance copper-clad metal substrate |
| CN106494034A (en) * | 2016-10-26 | 2017-03-15 | 江门市龙兴电子材料有限公司 | A kind of method and copper-clad plate for producing copper-clad plate using unqualified prepreg |
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Application publication date: 20140305 |