CN104157937A - Lost foam substrate integrated waveguide band pass filter loaded with rectangular metal body - Google Patents
Lost foam substrate integrated waveguide band pass filter loaded with rectangular metal body Download PDFInfo
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- CN104157937A CN104157937A CN201410397431.6A CN201410397431A CN104157937A CN 104157937 A CN104157937 A CN 104157937A CN 201410397431 A CN201410397431 A CN 201410397431A CN 104157937 A CN104157937 A CN 104157937A
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- metal body
- rectangular metal
- brush layer
- printing brush
- pass filter
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Abstract
The present invention relates to a lost foam substrate integrated waveguide band pass filter, in particular to a lost foam substrate integrated waveguide band pass filter loaded with a rectangular metal body. In order to solve the problems that the general substrate integrated waveguide band pass filter is very high in working frequency and very narrow in relative bandwidth, and can not be applied to a mobile communication system, the lost foam substrate integrated waveguide band pass filter loaded with the rectangular metal body comprises a first metal printing layer, a medium substrate, a second metal printing layer and two balance microstrip lines. The medium substrate is an I-shaped plate body, and the first metal printing layer, the medium substrate and the second metal printing layer are arranged orderly from top to bottom, and the two balance microstrip lines are arranged on the upper surface of the medium substrate. The lost foam substrate integrated waveguide band pass filter loaded with the rectangular metal body of the present invention is used in the wireless communication field.
Description
Technical field
The present invention relates to a kind of evaporative pattern substrate integration wave-guide band pass filter, be specifically related to a kind of evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body, belong to wireless communication field.
Background technology
Medium integrated waveguide is a kind of waveguiding structure that is similar to metal rectangular waveguide characteristic of realizing on dielectric substrate, because this structure has low radiation, filter with low insertion loss, miniaturization, is easy to the advantages such as integrated, become the focus of research, the design being also widely used with filter.By means of printed circuit technology, the batch production of the low cost of the filter based on medium integrated waveguide becomes possibility.But the operating frequency of common substrate integration wave-guide band pass filter is very high, relative bandwidth is very narrow, and this has restricted its development in mobile communication system.
Summary of the invention
The present invention is that the operating frequency of the common substrate integration wave-guide band pass filter of solution is very high, and relative bandwidth is very narrow, cannot be applied to the problem in mobile communication system, and then proposes a kind of evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body.
The present invention addresses the above problem the technical scheme of taking to be: the present invention includes the first metal printing brush layer, medium substrate, the second metal printing brush layer and two balance microstrip lines, medium substrate is I-shaped plate body, the first metal printing brush layer, medium substrate, the second metal printing brush layer from top to bottom sets gradually, two balance microstrip lines are printed on the upper surface of medium substrate, and two balance microstrip lines are positioned at the two ends of the first metal printing brush layer, the middle part of one end of each balance microstrip line end margin corresponding with medium substrate connects, the other end of each balance microstrip line connects with the middle part of first corresponding one end of metal printing brush layer, first each side of metal printing brush layer has several metallization via holes along its edge, and each metallization via hole is from top to bottom successively through the first metal printing brush layer, medium substrate, the second metal printing brush layer, the middle part of medium substrate upper surface and the middle part of lower surface are all embedded with the first rectangular metal body successively by one end to the other end of medium substrate, the second rectangular metal body, the 3rd rectangular metal body, the 4th rectangular metal body, the 5th rectangular metal body, the 6th rectangular metal body.
Technique effect of the present invention is: simulation and experiment result shows, working band covering of the present invention 1.8～2.6GHz, and relative bandwidth can reach more than 36.4%.This filter is printed form structure, have section low, lightweight, be easy to feature integrated, broader bandwidth, can be widely used in the 4th Generation Mobile Communication System.Simulation result shows, passband of the present invention is 1.8～2.6GHz, and relative bandwidth reaches 36.4%.According to simulation result, made filter in kind, test result demonstration, the bandwidth of filter is 1.76～2.61GHz, relative bandwidth reaches 38.9%.
Accompanying drawing explanation
Fig. 1 is front view of the present invention, and Fig. 2 is the vertical view of Fig. 1, and Fig. 3 is the upward view of Fig. 1, and Fig. 4 is S parameters simulation result schematic diagram of the present invention, and Fig. 5 is S parameter testing result schematic diagram of the present invention.
Embodiment
Embodiment one: present embodiment is described in conjunction with Fig. 1 to Fig. 5, described in present embodiment, a kind of evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body comprises the first metal printing brush layer 1, medium substrate 2, the second metal printing brush layer 3 and two balance microstrip lines 4, medium substrate 2 is I-shaped plate body, the first metal printing brush layer 1, medium substrate 2, the second metal printing brush layer 3 from top to bottom sets gradually, two balance microstrip lines 4 are printed on the upper surface of medium substrate 2, and two balance microstrip lines 4 are positioned at the two ends of the first metal printing brush layer 1, one end of each balance microstrip line 4 connects with the middle part of the corresponding end margin of medium substrate 2, the other end of each balance microstrip line 4 connects with the middle part of first metal printing brush layer 1 corresponding one end, first metal printing brush layer 1 each side has several metallization via holes 5 along its edge, and each metallization via hole 5 is from top to bottom successively through the first metal printing brush layer 1, medium substrate 2, the second metal printing brush layer 3, the middle part of medium substrate 2 upper surfaces and the middle part of lower surface are all embedded with the first rectangular metal body 6 successively by one end to the other end of medium substrate 2, the second rectangular metal body 7, the 3rd rectangular metal body 8, the 4th rectangular metal body 9, the 5th rectangular metal body 10, the 6th rectangular metal body 11.
Each is connected with a coaxial fitting respectively at the two ends of present embodiment medium substrate 2.
Embodiment two: present embodiment is described in conjunction with Fig. 1 to Fig. 3; described in present embodiment, a kind of each balance microstrip line 4 that loads the evaporative pattern substrate integration wave-guide band pass filter of rectangular metal body is comprised of rectangle section 4-1 and trapezoidal sections 4-2; one end of rectangle section 4-1 connects with the middle part of the corresponding end margin of medium substrate 2; the other end of rectangle section 4-1 is connected with the short base of trapezoidal sections 4-2, and the long base of trapezoidal sections 4-2 connects with the middle part of first metal printing brush layer 1 corresponding one end.
The technique effect of present embodiment is: so arrange, can make feed line is transition line form, thereby reduces electromagnetic energy reflection, improves level of impedance match.Other composition and annexation are identical with embodiment one.
Embodiment three: present embodiment is described in conjunction with Fig. 1 to Fig. 3; described in present embodiment, a kind of thickness of medium substrate 2 of the evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body is 4.5mm; the width of medium substrate 2 is 46mm; the length L 1 of medium substrate 2 both sides strip breach is 125mm, and the relative dielectric constant of medium substrate 2 is 4.4.
The technique effect of present embodiment is: so arrange, can make filter be operated in mobile communication frequency range.Other composition and annexation are identical with embodiment one.
Embodiment four: present embodiment is described in conjunction with Fig. 1 to Fig. 3, described in present embodiment, a kind of the first metal printing brush layer 1 that loads the evaporative pattern substrate integration wave-guide band pass filter of rectangular metal body is I-shaped thin plate, the thickness of the first metal printing brush layer 1 is 0.018mm～0.035mm, the middle part length of the first metal printing brush layer 1 is 125mm, the middle part width of the first metal printing brush layer 1 is 35mm, the length L 2 of first metal printing brush layer 1 each end 1-1 is 46mm, the width W 1 of first metal printing brush layer 1 each end is 18.5mm, the length of the second metal printing brush layer 3 is 192mm, the width of the second metal printing brush layer 3 is 46mm, the thickness of the second metal printing brush layer 3 is 0.018mm～0.035mm.
The technique effect of present embodiment is: so arrange, can form evaporative pattern working method, and alleviate the weight of metal.Other composition and annexation are identical with embodiment one.
Embodiment five: present embodiment is described in conjunction with Fig. 1 to Fig. 3; described in present embodiment, the length of a kind of rectangle section 4-1 of each balance microstrip line 4 of the evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body is 10mm; the width of the rectangle section 4-1 of each balance microstrip line 4 is 9mm; the length on the short base of the trapezoidal sections 4-2 of each balance microstrip line 4 is 9mm; the length on the long base of the trapezoidal sections 4-2 of each balance microstrip line 4 is 30mm, and the height of the trapezoidal sections 4-2 of each balance microstrip line 4 is 5mm.
The technique effect of present embodiment is: so arrange, can realize good feeder line gradual change form and feed port matching degree.Other composition and annexation are identical with embodiment two.
Embodiment six: present embodiment is described in conjunction with Fig. 1 to Fig. 3; described in present embodiment, a kind of diameter of each metallization via hole 5 of the evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body is 0.6mm, and the centre-to-centre spacing between adjacent two metallization via holes 5 are 1mm.
The technique effect of present embodiment is: so arrange, the electromagnetic energy that can effectively shield waveguide inside also can strengthen the mechanical strength of waveguide.Other composition and annexation are identical with embodiment one.
Embodiment seven: present embodiment is described in conjunction with Fig. 1 to Fig. 3, described in present embodiment, a kind of the first rectangular metal body 6 of the evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body and the length of the 6th rectangular metal body 11 are 6mm, the width of the first rectangular metal body 6 and the 6th rectangular metal body 11 is 8mm, the length of the second rectangular metal body 7 and the 5th rectangular metal body 10 is 6mm, the width of the second rectangular metal body 7 and the 5th rectangular metal body 10 is 10mm, the length of the 3rd rectangular metal body 8 and the 4th rectangular metal body 9 is 6mm, the width of the 3rd rectangular metal body 8 and the 4th rectangular metal body 9 is 10mm, the first rectangular metal body 6, the second rectangular metal body 7, the 3rd rectangular metal body 8, the 4th rectangular metal body 9, the 5th rectangular metal body 10, the degree of depth h of the 6th rectangular metal body 11 is 1.5mm.
The technique effect of present embodiment is: so arrange, can make the rectangular metal body loading in the frequency range of appointment, be equivalent to needed capacity cell, in conjunction with other parameters, realize pass band filter characteristic.Other composition and annexation are identical with embodiment one.
Embodiment eight: present embodiment is described in conjunction with Fig. 1 to Fig. 3, described in present embodiment, a kind of the first rectangular metal body 6 of the evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body and the distance d1 between the second rectangular metal body 7 are 12mm, distance d2 between the second rectangular metal body 7 and the 3rd rectangular metal body 8 is 15mm, distance d3 between the 3rd rectangular metal body 8 and the 4th rectangular metal body 9 is 15mm, distance d4 between the 4th rectangular metal body 9 and the 5th rectangular metal body 10 is 15mm, distance d5 between the 5th rectangular metal body 10 and the 6th rectangular metal body 11 is 12mm.
The technique effect of present embodiment is: so arrange, waveguide between the rectangular metal body that can make to load can be equivalent to needed inductance element network in the frequency range of appointment, in conjunction with other parameters realize other composition of pass band filter characteristic and annexation identical with embodiment one.
Operation principle
The broadband bandpass characteristics of evaporative pattern substrate integral wave guide filter of the present invention is mainly to realize by load rectangular metal body on evaporative pattern substrate integration wave-guide, and evaporative pattern substrate integration wave-guide can be equivalent to inductance network within the scope of certain frequency; And load rectangular metal body structure, can be equivalent to electric capacity within the scope of certain frequency, therefore, both combinations will produce bandpass characteristics.
Claims (8)
1. an evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body, it is characterized in that: described a kind of evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body comprises the first metal printing brush layer (1), medium substrate (2), the second metal printing brush layer (3) and two balance microstrip lines (4), medium substrate (2) is I-shaped plate body, the first metal printing brush layer (1), medium substrate (2), the second metal printing brush layer (3) from top to bottom sets gradually, two balance microstrip lines (4) are printed on the upper surface of medium substrate (2), and two balance microstrip lines (4) are positioned at the two ends of the first metal printing brush layer (1), one end of each balance microstrip line (4) connects with the middle part of the corresponding end margin of medium substrate (2), the other end of each balance microstrip line (4) connects with the middle part of first corresponding one end of metal printing brush layer (1), first each side of metal printing brush layer (1) has several metallization via holes (5) along its edge, and each metallization via hole (5) is from top to bottom successively through the first metal printing brush layer (1), medium substrate (2), the second metal printing brush layer (3), the middle part of medium substrate (2) upper surface and the middle part of lower surface are all embedded with the first rectangular metal body (6) successively by one end to the other end of medium substrate (2), the second rectangular metal body (7), the 3rd rectangular metal body (8), the 4th rectangular metal body (9), the 5th rectangular metal body (10), the 6th rectangular metal body (11).
2. a kind of evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body according to claim 1; it is characterized in that: each balance microstrip line (4) has rectangle section (4-1) and trapezoidal sections (4-2) to form; one end of rectangle section (4-1) connects with the middle part of the corresponding end margin of medium substrate (2); the other end of rectangle section (4-1) is connected with the short base of trapezoidal sections (4-2), and the long base of trapezoidal sections (4-2) connects with the middle part of first corresponding one end of metal printing brush layer (1).
3. a kind of evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body according to claim 1; it is characterized in that: the thickness of medium substrate (2) is 4.5mm; the width of medium substrate (2) is 46mm; the length (L1) of medium substrate (2) both sides strip breach is 125mm, and the relative dielectric constant of medium substrate (2) is 4.4.
4. a kind of evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body according to claim 1; it is characterized in that: the first metal printing brush layer (1) is I-shaped thin plate; the thickness of the first metal printing brush layer (1) is 0.018mm～0.035mm; the middle part length of the first metal printing brush layer (1) is 125mm, and the middle part width of the first metal printing brush layer (1) is 35mm.The length (L2) of first each end of metal printing brush layer (1) (1-1) is 46mm, the width (W1) of first each end of metal printing brush layer (1) is 18.5mm, the length of the second metal printing brush layer (3) is 192mm, the width of the second metal printing brush layer (3) is 46mm, and the thickness of the second metal printing brush layer (3) is 0.018mm～0.035mm.
5. a kind of evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body according to claim 2; it is characterized in that: the length of the rectangle section (4-1) of each balance microstrip line (4) is 10mm; the width of the rectangle section (4-1) of each balance microstrip line (4) is 9mm; the length on the short base of the trapezoidal sections (4-2) of each balance microstrip line (4) is 9mm; the length on the long base of the trapezoidal sections (4-2) of each balance microstrip line (4) is 30mm, and the height of the trapezoidal sections (4-2) of each balance microstrip line (4) is 5mm.
6. a kind of evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body according to claim 1; it is characterized in that: the diameter of each metallization via hole (5) is 0.6mm, the centre-to-centre spacing between adjacent two metallization via holes (5) is 1mm.
7. a kind of evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body according to claim 1, it is characterized in that: the length of the first rectangular metal body (6) and the 6th rectangular metal body (11) is 6mm, the width of the first rectangular metal body (6) and the 6th rectangular metal body (11) is 8mm, the length of the second rectangular metal body (7) and the 5th rectangular metal body (10) is 6mm, the width of the second rectangular metal body (7) and the 5th rectangular metal body (10) is 10mm, the length of the 3rd rectangular metal body (8) and the 4th rectangular metal body (9) is 6mm, the width of the 3rd rectangular metal body (8) and the 4th rectangular metal body (9) is 10mm, the first rectangular metal body (6), the second rectangular metal body (7), the 3rd rectangular metal body (8), the 4th rectangular metal body (9), the 5th rectangular metal body (10), the degree of depth (h) of the 6th rectangular metal body (11) is 1.5mm.
8. a kind of evaporative pattern substrate integration wave-guide band pass filter that loads rectangular metal body according to claim 1, it is characterized in that: the distance (d1) between the first rectangular metal body (6) and the second rectangular metal body (7) is 12mm, distance (d2) between the second rectangular metal body (7) and the 3rd rectangular metal body (8) is 15mm, distance (d3) between the 3rd rectangular metal body (8) and the 4th rectangular metal body (9) is 15mm, distance (d4) between the 4th rectangular metal body (9) and the 5th rectangular metal body (10) is 15mm, distance (d5) between the 5th rectangular metal body (10) and the 6th rectangular metal body (11) is 12mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410397431.6A CN104157937A (en) | 2014-08-13 | 2014-08-13 | Lost foam substrate integrated waveguide band pass filter loaded with rectangular metal body |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410397431.6A CN104157937A (en) | 2014-08-13 | 2014-08-13 | Lost foam substrate integrated waveguide band pass filter loaded with rectangular metal body |
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| CN104157937A true CN104157937A (en) | 2014-11-19 |
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| CN201410397431.6A Pending CN104157937A (en) | 2014-08-13 | 2014-08-13 | Lost foam substrate integrated waveguide band pass filter loaded with rectangular metal body |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105070994A (en) * | 2015-09-06 | 2015-11-18 | 哈尔滨工业大学 | Half-mode evanescent-mode substrate integrated waveguide wideband band-pass filter |
| CN106887661A (en) * | 2017-03-15 | 2017-06-23 | 电子科技大学 | Slow wave substrate integration wave-guide based on the loading of lumped parameter inductance |
| CN107546448A (en) * | 2017-08-03 | 2018-01-05 | 电子科技大学 | A kind of inclined-plane based on SIW transmission lines absorbs array-supported |
| CN111755784A (en) * | 2020-07-02 | 2020-10-09 | 电子科技大学 | Hybrid electromagnetic coupling compact SIW filter based on evanescent mode loading |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105070994A (en) * | 2015-09-06 | 2015-11-18 | 哈尔滨工业大学 | Half-mode evanescent-mode substrate integrated waveguide wideband band-pass filter |
| CN106887661A (en) * | 2017-03-15 | 2017-06-23 | 电子科技大学 | Slow wave substrate integration wave-guide based on the loading of lumped parameter inductance |
| CN107546448A (en) * | 2017-08-03 | 2018-01-05 | 电子科技大学 | A kind of inclined-plane based on SIW transmission lines absorbs array-supported |
| CN107546448B (en) * | 2017-08-03 | 2019-11-05 | 电子科技大学 | A kind of inclined-plane absorption based on SIW transmission line is array-supported |
| CN111755784A (en) * | 2020-07-02 | 2020-10-09 | 电子科技大学 | Hybrid electromagnetic coupling compact SIW filter based on evanescent mode loading |
| CN111755784B (en) * | 2020-07-02 | 2021-12-31 | 电子科技大学 | Hybrid electromagnetic coupling compact SIW filter based on evanescent mode loading |
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Application publication date: 20141119 |