CN104241741B - A kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure - Google Patents
A kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure Download PDFInfo
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- CN104241741B CN104241741B CN201410397450.9A CN201410397450A CN104241741B CN 104241741 B CN104241741 B CN 104241741B CN 201410397450 A CN201410397450 A CN 201410397450A CN 104241741 B CN104241741 B CN 104241741B
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Abstract
Loading a half module substrate integrated wave guide bandpass filter for L-shaped defect ground structure, it relates to a kind of half module substrate integrated wave guide bandpass filter, is specifically related to a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure. The present invention is very high in order to solve the operating frequency of common substrate integration wave-guide bandpass filter, relative smaller bandwidth, the problem that cannot be applied in mobile communication system. The present invention comprises the first metal printing brush layer, medium substrate, the 2nd metal printing brush layer and two balance microstrip line, medium substrate is rectangle plate body, first metal printing brush layer is rectangle metal sheet, first metal printing brush layer, medium substrate, the 2nd metal printing brush layer be superposition setting successively from top to bottom, first metal printing brush layer is printed on the middle part of medium substrate upper surface, 2nd metal printing brush layer is printed on the lower surface of medium substrate, and two balance microstrip line are the lateral edges that a font is printed on medium substrate upper surface. The invention belongs to wireless communication field.
Description
Technical field
The present invention relates to a kind of half module substrate integrated wave guide bandpass filter, it is specifically related to a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure, belongs to wireless communication field.
Background technology
Medium integrated waveguide a kind of realizes being similar to the waveguiding structure of metal rectangular guided transmission characteristic on dielectric substrate, owing to this structure has Low emissivity, filter with low insertion loss, miniaturization, is easy to the advantage such as integrated, becoming the focus of research, be also widely used the design with wave filter. By means of printed circuit technology, the low cost batch production based on the wave filter of medium integrated waveguide becomes possibility. But, the operating frequency of common substrate integration wave-guide bandpass filter is very high, relative smaller bandwidth, this restrict its development in mobile communication system.
Summary of the invention
The present invention is that to solve the operating frequency of common substrate integration wave-guide bandpass filter very high, relative smaller bandwidth, the problem that cannot be applied in mobile communication system, and then proposes a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure.
The present invention is the technical scheme taked that solves the problem: the present invention comprises the first metal printing brush layer, medium substrate, 2nd metal printing brush layer and two balance microstrip line, medium substrate is rectangle plate body, first metal printing brush layer is rectangle metal sheet, first metal printing brush layer, medium substrate, 2nd metal printing brush layer is superposition setting successively from top to bottom, first metal printing brush layer is printed on the middle part of medium substrate upper surface, 2nd metal printing brush layer is printed on the lower surface of medium substrate, two balance microstrip line are the lateral edges that a font is printed on medium substrate upper surface, and two balance microstrip line lay respectively at the two ends of the first metal printing brush layer, one end edge conjunction that one end of each balance microstrip line is corresponding with medium substrate, one end connection that the other end of each balance microstrip line is corresponding with the first metal printing brush layer, the side of the first metal printing brush layer has a row and metallized hole, and each metallized hole from top to bottom successively through the first metal printing brush layer, medium substrate, 2nd metal printing brush layer, the middle part of the 2nd metal printing brush layer side is provided with the first L-shaped defect ground structure group, described first L-shaped defect ground structure group comprises three the first L-shaped defect ground structures being arranged side by side, the both sides of described first L-shaped defect ground structure group are respectively equipped with two the 2nd L-shaped defect ground structures, the vertical end of each the first L-shaped defect ground structure and a side edge contact of the 2nd metal printing brush layer, the vertical end of each the 2nd L-shaped defect ground structure and a side edge contact of the 2nd metal printing brush layer.
The invention has the beneficial effects as follows: show according to the test result of wave filter material object, the work frequency band of wave filter is 1.75～2.61GHz, and relative bandwidth reaches 39.4%. This wave filter is printed form structure, has that section is low, weight is light, be easy to integrated, has the feature of broader bandwidth, it is possible to be widely used in forth generation mobile communication system. The work frequency band of the present invention covers 1.8～2.6GHz, and relative bandwidth can reach 36.4%. This wave filter is printed form structure, has that section is low, weight is light, be easy to integrated, has the feature of broader bandwidth, it is possible to be widely used in forth generation mobile communication system.
Accompanying drawing explanation
Fig. 1 is the front view of the present invention, and Fig. 2 is the vertical view of Fig. 1, and Fig. 3 is the upward view of Fig. 1, and Fig. 4 is S parameter test result schematic diagram of the present invention.
Embodiment
Embodiment one: composition graphs 1 to Fig. 4 illustrates present embodiment, described in present embodiment, a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure comprises the first metal printing brush layer 1, medium substrate 2, 2nd metal printing brush layer 3 and two balance microstrip line 4, medium substrate 2 is rectangle plate body, first metal printing brush layer 1 is rectangle metal sheet, first metal printing brush layer 1, medium substrate 2, 2nd metal printing brush layer 3 is superposition setting successively from top to bottom, first metal printing brush layer 1 is printed on the middle part of medium substrate 2 upper surface, 2nd metal printing brush layer 3 is printed on the lower surface of medium substrate 2, two balance microstrip line 4 are printed on a lateral edges of medium substrate 2 upper surface in a font, and two balance microstrip line 4 lay respectively at the two ends of the first metal printing brush layer 1, one end edge conjunction that one end of each balance microstrip line 4 is corresponding with medium substrate 2, one end connection that the other end of each balance microstrip line 4 is corresponding with the first metal printing brush layer 1, the side of the first metal printing brush layer 1 has a row and metallized hole 5, and each metallized hole 5 from top to bottom successively through the first metal printing brush layer 1, medium substrate 2, 2nd metal printing brush layer 3, the middle part of the 2nd metal printing brush layer 3 side is provided with the first L-shaped defect ground structure group, described first L-shaped defect ground structure group comprises three the first L-shaped defect ground structures 6 being arranged side by side, the both sides of described first L-shaped defect ground structure group are respectively equipped with two the 2nd L-shaped defect ground structures 7, the vertical end of each the first L-shaped defect ground structure 6 and a side edge contact of the 2nd metal printing brush layer 3, the vertical end of each the 2nd L-shaped defect ground structure 7 and a side edge contact of the 2nd metal printing brush layer 3.
The two ends of present embodiment medium substrate 2 are respectively connected with shaft adapter with one respectively.
Embodiment two: composition graphs 1 to Fig. 3 illustrates present embodiment, each balance microstrip line 4 of a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure described in present embodiment is connected to form successively by the first rectangular configuration section 4-1, right-angled trapezium section 4-2 and the 2nd rectangular configuration section 4-3 head and the tail.
The technique effect of present embodiment is: so arrange, it is possible to make feeder line be the linear formula of gradual change, thus reduces electromagnetic energy reflection, it is to increase level of impedance match. Other composition and the relation of connection are identical with embodiment one.
Embodiment three: composition graphs 1 to Fig. 3 illustrates present embodiment; described in present embodiment, the width of the first rectangular configuration section 4-1 of a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure is 1.9mm; the width of the 2nd rectangular configuration section 4-3 is 5mm; the length on the short base of right-angled trapezium section 4-2 is 1.9mm; the length on the long base of right-angled trapezium section 4-2 is 5mm, and the length of right-angled trapezium section 4-2 is 60mm.
The technique effect of present embodiment is: so arrange, it is possible to realize good feeder line gradual change form and feed port matching degree. Other composition and the relation of connection are identical with embodiment two.
Embodiment four: composition graphs 1 to Fig. 3 illustrates present embodiment; described in present embodiment, the length of the medium substrate 2 of a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure is 270mm; the width of medium substrate 2 is 32.8mm; the thickness of medium substrate 2 is 0.5mm, and the specific inductivity of medium substrate 2 is 2.2.
The technique effect of present embodiment is: so arrange, it is possible to makes wave filter enough wide at the passband of mobile communication frequency range, and can reduce dielectric loss. Other composition and the relation of connection are identical with embodiment one.
Embodiment five: composition graphs 1 to Fig. 3 illustrates present embodiment; described in present embodiment, the length of the first metal printing brush layer 1 of a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure is 120mm; the width of the first metal printing brush layer 1 is 32.8mm; the thickness of the first metal printing brush layer 1 is 0.018mm～0.035mm; the length of the 2nd metal printing brush layer 3 is 270mm; the width of the 2nd metal printing brush layer 3 is 32.8mm, and the thickness of the 2nd metal printing brush layer 3 is 0.018mm～0.035mm.
The technique effect of present embodiment is: so arrange, it is possible to makes the passband of wave filter enough wide, and can alleviate the weight of metal. Other composition and the relation of connection are identical with embodiment one.
Embodiment six: composition graphs 1 to Fig. 3 illustrates present embodiment, described in present embodiment, the length m1 of the vertical slots of each the first L-shaped defect ground structure 6 of a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure is 11.5mm, the width W 1 of the vertical slots of each the first L-shaped defect ground structure 6 is 2.4mm, the length m2 of the horizontal groove of each the first L-shaped defect ground structure 6 is 4mm, the width W 2 of the horizontal groove of each the first L-shaped defect ground structure 6 is 3mm, the length m3 of the vertical slots of each the 2nd L-shaped defect ground structure 7 is 8mm, the width W 3 of the vertical slots of each the 2nd L-shaped defect ground structure 7 is 2.4mm, the length m4 of the horizontal groove of each the 2nd L-shaped defect ground structure 7 is 4mm, the width W 4 of the horizontal groove of each the 2nd L-shaped defect ground structure 7 is 2.2mm.
The technique effect of present embodiment is: so arrange, it is possible to enables the defect ground structure of loading be equivalent to required inductance element in the range of frequency specified, realizes pass band filter characteristic in conjunction with other parameters. Other composition and the relation of connection are identical with embodiment one.
Embodiment seven: composition graphs 1 to Fig. 3 illustrates present embodiment; described in present embodiment, the diameter in each hole 5 of metallizing of a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure is 1.6mm, and adjacent two width between centers between hole 5 that metallized are 2.5mm.
The technique effect of present embodiment is: so arrange, it is possible to effectively the electromagnetic energy of shielding waveguide inside and the physical strength of waveguide can be strengthened. Other composition and the relation of connection are identical with embodiment one.
Embodiment eight: composition graphs 3 illustrates present embodiment; distance J between adjacent two first L-shaped defect ground structures 6 of a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure described in present embodiment is 15mm; distance J between adjacent two the 2nd L-shaped defect ground structures 7 is 15mm, and the distance J between adjacent two the first L-shaped defect ground structures 6 and the 2nd L-shaped defect ground structure 7 is 15mm.
The technique effect of present embodiment is: so arrange, it is possible to makes the waveguide between defect ground be equivalent to electric capacity element in designated frequency range, realizes band-pass filtering property in conjunction with other parameters. Other composition and the relation of connection are identical with embodiment one.
Principle of work
The logical characteristic of the broadband belt of the present invention mainly by loading L-shaped defect ground structure on half module substrate integrated wave guide, and namely special-shaped slot crack structure realizes, and it is similar that half module substrate integrated wave guide fills rectangular waveguide to traditional sucrose, has high pass characteristic; And L-shaped defect ground structure has low-pass characteristic, therefore, both combinations will the logical characteristic of generating strap.
Claims (7)
1. one kind loads the half module substrate integrated wave guide bandpass filter of L-shaped defect ground structure, it comprises the first metal printing brush layer (1), medium substrate (2), 2nd metal printing brush layer (3) and two balance microstrip line (4), medium substrate (2) is rectangle plate body, first metal printing brush layer (1) is rectangle metal sheet, first metal printing brush layer (1), medium substrate (2), 2nd metal printing brush layer (3) is superposition setting successively from top to bottom, first metal printing brush layer (1) is printed on the middle part of medium substrate (2) upper surface, 2nd metal printing brush layer (3) is printed on the lower surface of medium substrate (2), two balance microstrip line (4) are printed on a lateral edges of medium substrate (2) upper surface in a font, and two balance microstrip line (4) lay respectively at the two ends of the first metal printing brush layer (1), one end edge conjunction that one end of each balance microstrip line (4) is corresponding with medium substrate (2), one end connection that the other end of each balance microstrip line (4) is corresponding with the first metal printing brush layer (1), the side of the first metal printing brush layer (1) has a row and metallized hole (5), and each hole of metallizing (5) is from top to bottom successively through the first metal printing brush layer (1), medium substrate (2), 2nd metal printing brush layer (3), the middle part of the 2nd metal printing brush layer (3) side is provided with the first L-shaped defect ground structure group, described first L-shaped defect ground structure group comprises three the first L-shaped defect ground structures (6) being arranged side by side, the both sides of described first L-shaped defect ground structure group are respectively equipped with two the 2nd L-shaped defect ground structures (7), the vertical end of each the first L-shaped defect ground structure (6) and a side edge contact of the 2nd metal printing brush layer (3), the vertical end of each the 2nd L-shaped defect ground structure (7) and a side edge contact of the 2nd metal printing brush layer (3), it is characterized in that: the length (m1) of the vertical slots of each the first L-shaped defect ground structure (6) is 11.5mm, the width (W1) of the vertical slots of each the first L-shaped defect ground structure (6) is 2.4mm, the length (m2) of the horizontal groove of each the first L-shaped defect ground structure (6) is 4mm, the width (W2) of the horizontal groove of each the first L-shaped defect ground structure (6) is 3mm, the length (m3) of the vertical slots of each the 2nd L-shaped defect ground structure (7) is 8mm, the width (W3) of the vertical slots of each the 2nd L-shaped defect ground structure (7) is 2.4mm, the length (m4) of the horizontal groove of each the 2nd L-shaped defect ground structure (7) is 4mm, the width (W4) of the horizontal groove of each the 2nd L-shaped defect ground structure (7) is 2.2mm.
2. a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure according to claim 1, it is characterised in that: each balance microstrip line (4) is connected to form successively by the first rectangular configuration section (4-1), right-angled trapezium section (4-2) and the 2nd rectangular configuration section (4-3) head and the tail.
3. a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure according to claim 2; it is characterized in that: the width of the first rectangular configuration section (4-1) is 1.9mm; the width of the 2nd rectangular configuration section (4-3) is 5mm; the length on the short base of right-angled trapezium section (4-2) is 1.9mm; the length on the long base of right-angled trapezium section (4-2) is 5mm, and the length of right-angled trapezium section (4-2) is 60mm.
4. a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure according to claim 1; it is characterized in that: the length of medium substrate (2) is 270mm; the width of medium substrate (2) is 32.8mm; the thickness of medium substrate (2) is 0.5mm, and the specific inductivity of medium substrate (2) is 2.2.
5. a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure according to claim 1; it is characterized in that: the length of the first metal printing brush layer (1) is 120mm; the width of the first metal printing brush layer (1) is 32.8mm; the thickness of the first metal printing brush layer (1) is 0.018mm～0.035mm; the length of the 2nd metal printing brush layer (3) is 270mm; the width of the 2nd metal printing brush layer (3) is 32.8mm, and the thickness of the 2nd metal printing brush layer (3) is 0.018mm～0.035mm.
6. a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure according to claim 1; it is characterized in that: the diameter in each hole of metallizing (5) is 1.6mm, the width between centers between adjacent two holes of metallizing (5) is 2.5mm.
7. a kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure according to claim 1; it is characterized in that: the distance (J) between adjacent two the first L-shaped defect ground structures (6) is 15mm, and the distance (J) between adjacent two the 2nd L-shaped defect ground structures (7) is 15mm.
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| CN201410397450.9A CN104241741B (en) | 2014-08-13 | 2014-08-13 | A kind of half module substrate integrated wave guide bandpass filter loading L-shaped defect ground structure |
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| CN105356017B (en) * | 2015-12-02 | 2018-05-15 | 中国计量学院 | A kind of substrate integration wave-guide low-pass filter |
| CN110720159B (en) * | 2017-06-27 | 2023-01-10 | 上海诺基亚贝尔股份有限公司 | Microwave device structure and implementation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1925211A (en) * | 2006-09-22 | 2007-03-07 | 东南大学 | Half-modular substrate integral wave guide filter |
| CN203367454U (en) * | 2013-08-19 | 2013-12-25 | 国家电网公司 | Band-pass filter based on half mode substrate integrated waveguide |
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| US8648676B2 (en) * | 2011-05-06 | 2014-02-11 | The Royal Institution For The Advancement Of Learning/Mcgill University | Tunable substrate integrated waveguide components |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1925211A (en) * | 2006-09-22 | 2007-03-07 | 东南大学 | Half-modular substrate integral wave guide filter |
| CN203367454U (en) * | 2013-08-19 | 2013-12-25 | 国家电网公司 | Band-pass filter based on half mode substrate integrated waveguide |
Non-Patent Citations (1)
| Title |
|---|
| 《A Novel Bandpass Filter based on Half-Mode Substrate integratedWaveguide(HMSIW)》;Ding-wang Yu等;《International conference on Microwave and Millimeter Wave Technology 2012》;20120508;1-4页 * |
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