CN104157771A - 一种彩光led封装结构 - Google Patents

一种彩光led封装结构 Download PDF

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Publication number
CN104157771A
CN104157771A CN201410376373.9A CN201410376373A CN104157771A CN 104157771 A CN104157771 A CN 104157771A CN 201410376373 A CN201410376373 A CN 201410376373A CN 104157771 A CN104157771 A CN 104157771A
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China
Prior art keywords
encapsulating structure
led encapsulating
light wafer
white
white light
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CN201410376373.9A
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English (en)
Inventor
姬志刚
贾海亮
姬志强
杜志刚
王亚涛
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Priority to CN201410376373.9A priority Critical patent/CN104157771A/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

一种彩光LED封装结构,包括一个固定在一承载体上的白光晶片,一对相互分隔的导电支架,上述导电支架分别与白光晶片的正负电极电连接,在白光晶片和导电支架的顶端覆盖设置一个容置腔体,容置腔体内部设有调色剂。采用上述技术方案,LED可以根据需要调整调色剂,从而发出不同颜色的光线,结构简单,造价低廉。

Description

一种彩光LED封装结构
技术领域
本发明涉及一种LED封装结构,特别涉及一种彩光LED封装结构。 
背景技术
LED又称发光二极管,能够将电能直接转化为光能,当在半导体内部正负极两端施加电压,导致电流流通,使得电子与空穴相结合,结合过程中产生的剩余能量会以光的形式释放出来。由于所使用的材料不同,光子会产生不同波长的光,人眼会感受到不同的颜色。现有技术中,只能根据发光晶片的眼的来产生特定的颜色,或者添加荧光粉来激发特定的颜色,但由于材料限制,还无法发出各种颜色的光线。 
发明内容
本发明的发明目的是设计一种能够发出各种颜色的彩光LED封装结构,其具体的技术方案是: 
一种彩光LED封装结构,包括一个固定在一承载体上的白光晶片,一对相互分隔的导电支架,上述导电支架分别与白光晶片的正负电极电连接,在白光晶片和导电支架的顶端覆盖设置一个容置腔体,容置腔体内部设有调色剂。 
进一步的,所述承载体为LED驱动电路板。 
采用上述技术方案,LED可以根据需要调整调色剂,从而发出不同颜色的光线,结构简单,造价低廉。 
附图说明
图1彩光LED封装结构示意图。 
其中,10-白光晶片;20-导电支架;30-容置腔体;31-调色剂;40-承载体。 
具体实施方式
下面阐述的实施例代表允许本领域技术人员实践本发明的必要信息,并且示出实践本发明的最佳方式。一旦根据附图阅读了以下的描述,本领域技术人员就将理解本发明的构思并且将认识到此处未特别阐明的这些构思的应用。应当理解,这些构思和应用落入本公开和所附权利要求书的范围。 
参照附图1所示的一种彩光LED封装结构,包括一个固定在一承载体40上的白光晶片10,所述承载体40为LED驱动电路板,一对相互分隔的导电支架20,上述导电支架20分别与白光晶片10的正负电极电连接,在白光晶片10和导电支架20的顶端覆盖设置一个容置腔体30,容置腔体30内部设有调色剂31。LED可以根据需要调整调色剂31的颜色,从而发出不同颜色的光线,结构简单,造价低廉。 
显然,上述实施例仅仅是为清楚地说明本发明所作的举例,而并非是对本发明的实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而这些属于本发明的精神所引伸出的显而易见的变化或变动仍处于本发明的保护范围之中。 

Claims (2)

1.一种彩光LED封装结构,包括一个固定在一承载体上的白光晶片,一对相互分隔的导电支架,其特征是上述导电支架分别与白光晶片的正负电极电连接,在白光晶片和导电支架的顶端覆盖设置一个容置腔体,容置腔体内部设有调色剂。
2.如权利要求1所述的一种彩光LED封装结构,其特征是所述承载体为LED驱动电路板。
CN201410376373.9A 2014-08-03 2014-08-03 一种彩光led封装结构 Pending CN104157771A (zh)

Priority Applications (1)

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CN201410376373.9A CN104157771A (zh) 2014-08-03 2014-08-03 一种彩光led封装结构

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101101942A (zh) * 2006-07-07 2008-01-09 亿光电子工业股份有限公司 多色彩的led封装方法及其封装结构
CN102237480A (zh) * 2010-04-20 2011-11-09 深圳市富士新华电子科技有限公司 一种用于lcd背/侧光板的白光led的pcb及制作方法
CN103062657A (zh) * 2012-12-30 2013-04-24 四川新力光源股份有限公司 可调色温的led照明装置
CN203023896U (zh) * 2012-12-30 2013-06-26 四川新力光源股份有限公司 可调色温的led照明装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101101942A (zh) * 2006-07-07 2008-01-09 亿光电子工业股份有限公司 多色彩的led封装方法及其封装结构
CN102237480A (zh) * 2010-04-20 2011-11-09 深圳市富士新华电子科技有限公司 一种用于lcd背/侧光板的白光led的pcb及制作方法
CN103062657A (zh) * 2012-12-30 2013-04-24 四川新力光源股份有限公司 可调色温的led照明装置
CN203023896U (zh) * 2012-12-30 2013-06-26 四川新力光源股份有限公司 可调色温的led照明装置

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Application publication date: 20141119