CN104157731B - 一种切片机辅助轨道支架 - Google Patents

一种切片机辅助轨道支架 Download PDF

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CN104157731B
CN104157731B CN201410357681.7A CN201410357681A CN104157731B CN 104157731 B CN104157731 B CN 104157731B CN 201410357681 A CN201410357681 A CN 201410357681A CN 104157731 B CN104157731 B CN 104157731B
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side panel
bearing
plate
auxiliary track
track support
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CN104157731A (zh
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秦太权
陆继波
王禄堡
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Jiangsu Meike Solar Technology Co Ltd
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Zhenjiang Huantai Silicon Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

本发明涉及一种轨道支架，特别是针对梅耶博格切片机上下棒的辅助轨道支架，通过滚轴轨道设计将辅助轨道支架从原来的倒T形结构设置为“门”型结构，有效的解决了现有倒T形辅助轨道支架易产生上下晶棒时卡住、掉落的现象，大大提高了切片机在运营过程中的生产效率，降低了机器磨损的风险，并且本发明提供的辅助轨道支架结构简单易用，便于制造和组装，在进行维修时也有利于拆卸和替换。

Description

一种切片机辅助轨道支架
技术领域
本发明涉及一种切片机辅助轨道支架，特别是针对光伏行业切片机上下棒的的辅助轨道支架。
背景技术
光伏产业的切片机在切片运作过程中存在上下棒的流程，在此流程运作的过程中，机器的工件平台和上下棒车之间有一个辅助轨道，由于车和工件平台之间有45cm的距离，所以在将晶棒移到车上和将晶棒移到工件平台上的时候，就需要一个辅助轨道，由于晶棒重量达50kg，为了防止晶棒在移动的过程中晶棒掉落，现有切片机的辅助轨道就设计成倒T形的，在晶棒的导轨上的设计了倒T形槽，由于辅助轨道设计的过长，导致在导轨在通过轨道时，容易发生卡住的现象，造成在上下棒的时候比较费力，进而形象了整机运行效率，加大了损坏风险。
发明内容
为了解决这个问题，本发明将辅助的轨道改成了通过两侧提供滚轴的轨道设计，从而避免了轨道卡住的现象，具体的发明设计方案如下：
一种切片机辅助轨道支架，其特征在于所述辅助轨道支架包括：台面板(1)、侧面板A(2)、侧面板B(3)、支撑板(4)、横板(5)、轴承A(6)、轴承B(7)；台面板(1)、侧面板A(2)、侧面板B(3)、横板(5)为7mm厚*20mm宽*143mm长的钢板，支撑板(4)为7mm厚*20mm宽*80mm长的钢板；台面板(1)两端分别与侧面板A(2)、 侧面板B(3)的顶端保持同一水平面焊接；在距离台面板80mm的平行位置，横板(5)两端分别与侧面板A(2)、侧面板B(3)的板面焊接；在平行的台面板(1)与横板(5)之间，支撑板(4)在中间点位置分别与台面板(1)与横板(5)焊接，且分别相对于侧面板A(2)、侧面板B(3)平行；在分别距离台面板(1)两端34.75mm处的中心点处，以中点为圆心，钻有直径为8.5mm的安装孔，用于奖辅助轨道支架固定在切片机组上；在分别距侧面板A(2)、侧面板B(3)底端6.25mm处的中心点处，以中点为圆心，钻有直径为8.5mm的固定孔；轴承A(6)、轴承B(7)通过螺栓式分别固定在侧面板A(2)、侧面板B(3)的固定孔上。
其中，轴承A、轴承B的型号为6082。
本发明提出的技术方案相比较现有的技术具有以下有益效果：
1.本发明提出的切片机辅助轨道支架采用提供滚轴的轨道设计，能够有效避免现有的倒T形轨道在上下晶棒的过程中卡住的现象，有效的提高了整机的运行效率，降低了整机运作时出现磨损的风险。
2.本发明提出的切片机辅助轨道支架采用钢板、轴承等低成本零件组装而成，有效降低了制作的成本和难度。
3.本发明提出的切片机辅助轨道支架，结构简单易用，便于制造和组装，在进行维修时也有利于拆卸和替换。
附图说明
图1是本发明的结构示意图
具体实施方式
如图1所示的切片机辅助轨道支架，包括：台面板1、侧面板A2、侧面板B3、支撑板4、横板5、轴承A6、轴承B7；台面板1、侧面板A2、侧面板B3、横板5为7mm厚*20mm宽*143mm长的钢板，支撑板4为7mm厚*20mm宽*80mm长的钢板；台面板1两端分别与侧面板A2、侧面板B3的顶端保持同一水平面焊接；在距离台面板80mm的平行位置，横板5两端分别与侧面板A2、侧面板B3的板面焊接；在平行的台面板1与横板5之间，支撑板4在中间点位置分别与台面板1与横板5焊接，且分别相对于侧面板A2、侧面板B3平行；分别以距离台面板1两端34.75mm处的中心点为圆心，钻有直径为8.5mm的安装孔；分别以距侧面板A2、侧面板B3底端6.25mm处的中心点为圆心，钻有直径为8.5mm的固定孔；轴承A6、轴承B7均为6082型号轴承，并通过螺栓式分别固定在侧面板A2、侧面板B3的固定孔上。
本切片机辅助轨道支架，利用台面板上的两个安装孔，用螺丝固定安装在梅耶博格公司生产的264型号或者271型号的切片机上下晶棒轨道上即可运作。

Claims (2)

1.一种切片机辅助轨道支架，其特征在于所述辅助轨道支架包括：台面板（1）、侧面板A（2）、侧面板B（3）、支撑板（4）、横板（5）、轴承A（6）、轴承B（7）；台面板（1）、侧面板A（2）、侧面板B（3）、横板（5）为7mm厚*20mm宽*143mm长的钢板，支撑板（4）为7mm厚*20mm宽*80mm长的钢板；台面板（1）两端分别与侧面板A（2）、侧面板B（3）的顶端保持同一水平面焊接；在距离台面板80mm的平行位置，横板（5）两端分别与侧面板A（2）、侧面板B（3）的板面焊接；在平行的台面板（1）与横板（5）之间，支撑板（4）在中间点位置分别与台面板（1）与横板（5）焊接，且分别相对于侧面板A（2）、侧面板B（3）平行；在分别距离台面板（1）两端34.75mm处的中心点，以中心点为圆心，钻有直径为8.5mm的安装孔；分别以距侧面板A（2）、侧面板B（3）底端6.25mm处的中心点，以中心点为圆心，钻有直径为8.5mm的固定孔；轴承A（6）、轴承B（7）通过螺栓式分别固定在侧面板A（2）、侧面板B（3）的固定孔上。
2.如权利要求1所述的切片机辅助轨道支架，其特征在于所述轴承A、轴承B的型号为6082。
CN201410357681.7A 2014-07-24 2014-07-24 一种切片机辅助轨道支架 Active CN104157731B (zh)

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