CN104157731B - 一种切片机辅助轨道支架 - Google Patents

一种切片机辅助轨道支架 Download PDF

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CN104157731B
CN104157731B CN201410357681.7A CN201410357681A CN104157731B CN 104157731 B CN104157731 B CN 104157731B CN 201410357681 A CN201410357681 A CN 201410357681A CN 104157731 B CN104157731 B CN 104157731B
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side panel
auxiliary track
track support
bearing
deck plate
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CN104157731A (zh
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秦太权
陆继波
王禄堡
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Jiangsu Meike Solar Technology Co Ltd
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Zhenjiang Huantai Silicon Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
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Abstract

本发明涉及一种轨道支架，特别是针对梅耶博格切片机上下棒的辅助轨道支架，通过滚轴轨道设计将辅助轨道支架从原来的倒T形结构设置为“门”型结构，有效的解决了现有倒T形辅助轨道支架易产生上下晶棒时卡住、掉落的现象，大大提高了切片机在运营过程中的生产效率，降低了机器磨损的风险，并且本发明提供的辅助轨道支架结构简单易用，便于制造和组装，在进行维修时也有利于拆卸和替换。

Description

一种切片机辅助轨道支架
技术领域
本发明涉及一种切片机辅助轨道支架，特别是针对光伏行业切片机上下棒的的辅助轨道支架。
背景技术
光伏产业的切片机在切片运作过程中存在上下棒的流程，在此流程运作的过程中，机器的工件平台和上下棒车之间有一个辅助轨道，由于车和工件平台之间有45cm的距离，所以在将晶棒移到车上和将晶棒移到工件平台上的时候，就需要一个辅助轨道，由于晶棒重量达50kg，为了防止晶棒在移动的过程中晶棒掉落，现有切片机的辅助轨道就设计成倒T形的，在晶棒的导轨上的设计了倒T形槽，由于辅助轨道设计的过长，导致在导轨在通过轨道时，容易发生卡住的现象，造成在上下棒的时候比较费力，进而形象了整机运行效率，加大了损坏风险。
发明内容
为了解决这个问题，本发明将辅助的轨道改成了通过两侧提供滚轴的轨道设计，从而避免了轨道卡住的现象，具体的发明设计方案如下：
一种切片机辅助轨道支架，其特征在于所述辅助轨道支架包括：台面板(1)、侧面板A(2)、侧面板B(3)、支撑板(4)、横板(5)、轴承A(6)、轴承B(7)；台面板(1)、侧面板A(2)、侧面板B(3)、横板(5)为7mm厚*20mm宽*143mm长的钢板，支撑板(4)为7mm厚*20mm宽*80mm长的钢板；台面板(1)两端分别与侧面板A(2)、 侧面板B(3)的顶端保持同一水平面焊接；在距离台面板80mm的平行位置，横板(5)两端分别与侧面板A(2)、侧面板B(3)的板面焊接；在平行的台面板(1)与横板(5)之间，支撑板(4)在中间点位置分别与台面板(1)与横板(5)焊接，且分别相对于侧面板A(2)、侧面板B(3)平行；在分别距离台面板(1)两端34.75mm处的中心点处，以中点为圆心，钻有直径为8.5mm的安装孔，用于奖辅助轨道支架固定在切片机组上；在分别距侧面板A(2)、侧面板B(3)底端6.25mm处的中心点处，以中点为圆心，钻有直径为8.5mm的固定孔；轴承A(6)、轴承B(7)通过螺栓式分别固定在侧面板A(2)、侧面板B(3)的固定孔上。
其中，轴承A、轴承B的型号为6082。
本发明提出的技术方案相比较现有的技术具有以下有益效果：
1.本发明提出的切片机辅助轨道支架采用提供滚轴的轨道设计，能够有效避免现有的倒T形轨道在上下晶棒的过程中卡住的现象，有效的提高了整机的运行效率，降低了整机运作时出现磨损的风险。
2.本发明提出的切片机辅助轨道支架采用钢板、轴承等低成本零件组装而成，有效降低了制作的成本和难度。
3.本发明提出的切片机辅助轨道支架，结构简单易用，便于制造和组装，在进行维修时也有利于拆卸和替换。
附图说明
图1是本发明的结构示意图
具体实施方式
如图1所示的切片机辅助轨道支架，包括：台面板1、侧面板A2、侧面板B3、支撑板4、横板5、轴承A6、轴承B7；台面板1、侧面板A2、侧面板B3、横板5为7mm厚*20mm宽*143mm长的钢板，支撑板4为7mm厚*20mm宽*80mm长的钢板；台面板1两端分别与侧面板A2、侧面板B3的顶端保持同一水平面焊接；在距离台面板80mm的平行位置，横板5两端分别与侧面板A2、侧面板B3的板面焊接；在平行的台面板1与横板5之间，支撑板4在中间点位置分别与台面板1与横板5焊接，且分别相对于侧面板A2、侧面板B3平行；分别以距离台面板1两端34.75mm处的中心点为圆心，钻有直径为8.5mm的安装孔；分别以距侧面板A2、侧面板B3底端6.25mm处的中心点为圆心，钻有直径为8.5mm的固定孔；轴承A6、轴承B7均为6082型号轴承，并通过螺栓式分别固定在侧面板A2、侧面板B3的固定孔上。
本切片机辅助轨道支架，利用台面板上的两个安装孔，用螺丝固定安装在梅耶博格公司生产的264型号或者271型号的切片机上下晶棒轨道上即可运作。

Claims (2)

1.一种切片机辅助轨道支架，其特征在于所述辅助轨道支架包括：台面板（1）、侧面板A（2）、侧面板B（3）、支撑板（4）、横板（5）、轴承A（6）、轴承B（7）；台面板（1）、侧面板A（2）、侧面板B（3）、横板（5）为7mm厚*20mm宽*143mm长的钢板，支撑板（4）为7mm厚*20mm宽*80mm长的钢板；台面板（1）两端分别与侧面板A（2）、侧面板B（3）的顶端保持同一水平面焊接；在距离台面板80mm的平行位置，横板（5）两端分别与侧面板A（2）、侧面板B（3）的板面焊接；在平行的台面板（1）与横板（5）之间，支撑板（4）在中间点位置分别与台面板（1）与横板（5）焊接，且分别相对于侧面板A（2）、侧面板B（3）平行；在分别距离台面板（1）两端34.75mm处的中心点，以中心点为圆心，钻有直径为8.5mm的安装孔；分别以距侧面板A（2）、侧面板B（3）底端6.25mm处的中心点，以中心点为圆心，钻有直径为8.5mm的固定孔；轴承A（6）、轴承B（7）通过螺栓式分别固定在侧面板A（2）、侧面板B（3）的固定孔上。
2.如权利要求1所述的切片机辅助轨道支架，其特征在于所述轴承A、轴承B的型号为6082。
CN201410357681.7A 2014-07-24 2014-07-24 一种切片机辅助轨道支架 Active CN104157731B (zh)

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CN202264315U (zh) * 2011-10-21 2012-06-06 嘉兴顺联橡塑机械有限公司 一种硅棒台固定调节装置

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