CN104142724A - Micro heat pipe structure applied to computer case - Google Patents
Micro heat pipe structure applied to computer case Download PDFInfo
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- CN104142724A CN104142724A CN201410378621.3A CN201410378621A CN104142724A CN 104142724 A CN104142724 A CN 104142724A CN 201410378621 A CN201410378621 A CN 201410378621A CN 104142724 A CN104142724 A CN 104142724A
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- heat pipe
- heat
- tube core
- micro
- pipe structure
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Abstract
The invention belongs to the technical field of computers, and particularly relates to a micro heat pipe structure applied to a computer case. The micro heat pipe structure comprises a heat pipe and cooling fins. The condensation end of the heat pipe is provided with the cooling fins. The heat pipe comprises a heat pipe shell and a heat pipe core. The heat pipe shell wraps the heat pipe core. The inner wall of the heat pipe core is provided with a groove structure. The heat pipe core is fully filled with a working medium. The micro heat pipe structure has the advantages that no turbulence phenomenon occurs, heat dissipation is rapid and sufficient, heat transfer of the heat pipe is almost constant-temperature heat transfer, and heat generated on a CPU and other chips is rapidly transferred so that the heat can be prevented from being dissipated into the computer case.
Description
Technical field
The invention belongs to field of computer technology, relate in particular to a kind of micro heat pipe structure that is applied to cabinet.
Background technology
Along with the development of electronic technology, the speed of computer operation is more and more faster, and the frequency of operation of the core component CPU of computer is more and more higher, and the integrated circuit of cabinet inside expansion is more and more, and its thermal value and power consumption also increase thereupon.The frequency of up-to-date CPU improves the use voltage of circuit when overclocking, and its thermal value is huge.So many heat is distributed rapidly, is to guarantee the stable major issue of computer work.
Summary of the invention
For the problems referred to above that will solve, the invention provides a kind of micro heat pipe structure that is applied to cabinet.
Technical scheme of the present invention: a kind of micro heat pipe structure that is applied to cabinet, it is characterized in that comprising heat pipe and heat radiation fin, the condensation end of described heat pipe is provided with heat radiation fin, described heat pipe comprises heat pipe shell and heat tube core, described heat pipe shell is wrapped in outside described heat tube core, described heat tube core inwall has groove structure, in described heat tube core, is full of working medium.
Described heat radiation fin comprises 8 fins, and 8 described fins are determined angle setting.
Described groove structure comprises teeth groove and cell wall, and described teeth groove and described cell wall are regularly arranged along described heat tube core inwall.
Beneficial effect of the present invention: without turbulent phenomenon, its radiating effect is fast, fully, the heat transfer of heat pipe is almost isothermal heat transfer, by the transfer of heat producing on CPU and other chip to air channel, by air channel, distribute very soon, avoided the shortcoming that heat is fallen apart in cabinet.
Accompanying drawing explanation
Fig. 1 is structural drawing of the present invention.
Fig. 2 is the structural representation of heat pipe.
Fig. 3 is the structural representation of heat radiation fin.
Fig. 4 is heat pipe cross section structure figure
In figure, 1, heat pipe, 2, heat radiation fin, 3, heat pipe shell, 4, heat tube core, 5, fin, 6, working medium, 7, groove structure.
Embodiment
Below in conjunction with 1,2,3 and 4 pairs of a kind of embodiments of the present invention of accompanying drawing, explain.
The present invention relates to a kind of micro heat pipe structure that is applied to cabinet, comprise heat pipe 1 and heat radiation fin 2, the condensation end of heat pipe 1 is provided with heat radiation fin 2, and heat pipe 1 does not have heat to pass the restriction of direction, evaporation ends and condenser can be exchanged, heat pipe 1 comprises heat pipe shell 3 and heat tube core 4, and heat pipe shell 3 is wrapped in outside heat tube core 4, and heat tube core 4 inwalls have groove structure 7, groove structure 7 has good power ratio principal characteristic, in heat tube core 4, be full of working medium 6, heat conduction efficiency is high, and heat conducting speed is fast.Lightweight and simple structure is without turbulent phenomenon, and its radiating effect is fast, fully, and the heat transfer of heat pipe 1 is almost isothermal heat transfer, and the heat producing on CPU and other chip is shifted rapidly, has avoided the shortcoming that heat is fallen apart in cabinet.
Heat radiation fin 2 comprises that 5,8 fins 5 of 8 fins determine angle setting, is convenient to dissipation of heat.
Groove structure 7 comprises teeth groove and cell wall, and teeth groove and cell wall be alternate to be arranged along heat tube core 4 inwalls regularly arrangedly, has good power ratio principal characteristic.
Example: heat pipe 1 is the heat transfer element that dependence self internal working medium 6 phase transformations realize heat transfer, working medium 6 is sealed up for safekeeping in heat pipe 1, in heat pipe 1, in evacuated situation, pack work 6 matter into, thereby just can conduct heat at lower temperature, play cooling effect.In view of the range of temperature of CPU is conventionally below 120 ℃, therefore select normal temperature duty heat pipe 1, working medium 6 adopts water, heat pipe shell 3 use copper are made material, heat tube core 4 can be done by silk screen or nickel felt, 30～250 ℃ of working temperatures, heat pipe 1 does not have heat to pass the restriction of direction, evaporation ends and condenser can be exchanged, under the minimum temperature difference, just amount of heat can be reached to the other end from one end of pipe, heat radiation fin 2 is arranged on the condensation end of heat pipe 1, heat radiation fin 2 comprises 8 fins 5, 8 fins 5 are determined angle setting, be convenient to dissipation of heat, groove structure 7 comprises teeth groove and cell wall, teeth groove and cell wall be alternate arrange along heat tube core 4 inwalls regularly arranged, there is good power ratio principal characteristic, the external diameter of heat pipe shell 3 is larger, heat transmission is faster, the teeth groove of groove structure 7 is more, dissipation of heat is faster, restriction due to chassis space and structural arrangement, through test of many times, measure, heat pipe shell 3 external diameters are 4mm, the teeth groove number of groove structure 7 is 16, comprehensive radiating effect is best, can avoid well heat to fall apart to the overall operation efficiency that affects body in cabinet.
Above an example of the present invention is had been described in detail, but described content is only preferred embodiment of the present invention, can not be considered to for limiting practical range of the present invention.All equalization variations of doing according to the present patent application scope and improvement etc., within all should still belonging to patent covering scope of the present invention.
Claims (3)
1. a micro heat pipe structure that is applied to cabinet, comprise heat pipe and heat radiation fin, the condensation end that it is characterized in that described heat pipe is provided with heat radiation fin, described heat pipe comprises heat pipe shell and heat tube core, described heat pipe shell is wrapped in outside described heat tube core, described heat tube core inwall has groove structure, in described heat tube core, is full of working medium.
2. a kind of micro heat pipe structure that is applied to cabinet according to claim 1, is characterized in that described heat radiation fin comprises 8 fins, and 8 described fins are determined angle setting.
3. a kind of micro heat pipe structure that is applied to cabinet according to claim 1, is characterized in that described groove structure comprises teeth groove and cell wall, and described teeth groove and described cell wall are regularly arranged along described heat tube core inwall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410378621.3A CN104142724A (en) | 2014-07-31 | 2014-07-31 | Micro heat pipe structure applied to computer case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410378621.3A CN104142724A (en) | 2014-07-31 | 2014-07-31 | Micro heat pipe structure applied to computer case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104142724A true CN104142724A (en) | 2014-11-12 |
Family
ID=51851926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410378621.3A Pending CN104142724A (en) | 2014-07-31 | 2014-07-31 | Micro heat pipe structure applied to computer case |
Country Status (1)
| Country | Link |
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| CN (1) | CN104142724A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105955428A (en) * | 2015-12-23 | 2016-09-21 | 天津科企融生产力促进有限公司 | Heat conduction and dissipation device for computers |
| CN105955429A (en) * | 2015-12-23 | 2016-09-21 | 天津科企融生产力促进有限公司 | High efficiency CPU radiator |
| CN105955427A (en) * | 2015-12-23 | 2016-09-21 | 天津科企融生产力促进有限公司 | High efficiency computer radiator |
| CN106066674A (en) * | 2016-05-27 | 2016-11-02 | 东莞市联洲知识产权运营管理有限公司 | A kind of superconductive radiating quiet case |
-
2014
- 2014-07-31 CN CN201410378621.3A patent/CN104142724A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105955428A (en) * | 2015-12-23 | 2016-09-21 | 天津科企融生产力促进有限公司 | Heat conduction and dissipation device for computers |
| CN105955429A (en) * | 2015-12-23 | 2016-09-21 | 天津科企融生产力促进有限公司 | High efficiency CPU radiator |
| CN105955427A (en) * | 2015-12-23 | 2016-09-21 | 天津科企融生产力促进有限公司 | High efficiency computer radiator |
| CN106066674A (en) * | 2016-05-27 | 2016-11-02 | 东莞市联洲知识产权运营管理有限公司 | A kind of superconductive radiating quiet case |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141112 |