CN205450940U - Computer heat conduction radiation device - Google Patents
Computer heat conduction radiation device Download PDFInfo
- Publication number
- CN205450940U CN205450940U CN201521095955.6U CN201521095955U CN205450940U CN 205450940 U CN205450940 U CN 205450940U CN 201521095955 U CN201521095955 U CN 201521095955U CN 205450940 U CN205450940 U CN 205450940U
- Authority
- CN
- China
- Prior art keywords
- heat
- fin
- heat sink
- fixed wings
- fin body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 title abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000741 silica gel Substances 0.000 claims description 9
- 229910002027 silica gel Inorganic materials 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model belongs to the computer realm especially relates to a computer heat conduction radiation device, including heat sink device, the conducting strip, the heat conduction support, base plate and heat pipe, the conducting strip sets up on heat sink device, the heat conduction support sets up on the conducting strip, the base plate sets up on the heat conduction support, heat pipe one end is connected with heat sink device, heat pipe other end substrate connection, heat sink device includes the several fin, fin parallel arrangement, the fin includes fin body and fixed wing, fixed wing is a plurality of, a plurality of fixed wings set up the edge at the fin body respectively, fixed wing and fin body parallel arrangement, fixed wing is provided with protruded structure, protruded structure sets up with fixed wing is perpendicular, it has the fixed orifices to open corresponding to protruded structure's position at the fin body, the several fin passes through protruded structure and constitutes heat sink device with the fixed orifices cooperation. The beneficial effect of the utility model: simple structure, reasonable in design has strengthened surrounding air and has flowed, makes it change in the heat dissipation, and the radiating efficiency is high.
Description
Technical field
It is exactly computer realm that this utility model belongs to, and particularly relates to a kind of computer heat conducting and heat radiating device.
Background technology
Along with the development of electronic technology, the speed that computer runs is increasingly faster, and the operating frequency of the core component CPU of computer is more and more higher, and the integrated circuit of cabinet inside extension gets more and more, and its caloric value and power consumption increase the most therewith.The frequency of up-to-date CPU improves the use voltage of circuit when overclocking, and its caloric value is huge.So many heat is distributed rapidly, is to ensure that the major issue that computer work is stable.
Utility model content
For the problems referred to above to be solved, this utility model provides a kind of computer heat conducting and heat radiating device.
nullThe technical solution of the utility model: a kind of computer heat conducting and heat radiating device，Including heat sink assembly，Conducting strip、Heat conduction support、Substrate，It is characterized in that described conducting strip is arranged on described heat sink assembly，Described heat conduction support is arranged on described conducting strip，Described substrate is arranged on described heat conduction support，Described heat pipe one end is connected with described heat sink assembly，Substrate described in the described heat pipe other end connects，Described heat sink assembly includes several fin，Described fin be arranged in parallel，Described fin includes fin body and fixed wings，Described fixed wings is multiple，Multiple described fixed wings are separately positioned on the limit of fin body，Described fixed wings be arranged in parallel with described fin body，Described fixed wings is provided with prominent structure，Described prominent structure is vertically arranged with described fixed wings，The position corresponding to described prominent structure in described fin body has fixing hole，Several described fin coordinate the described heat sink assembly of composition by described prominent structure with described fixing hole.
Described fin body is rectangle, and described fixed wings is 4, and 4 described fixed wings are arranged on the corner of described fin body.
Described prominent structure and described fixing hole are rectangle.
Arranging heat conductive silica gel between described conducting strip and described heat sink assembly, arrange heat conductive silica gel between described heat conduction support and described conducting strip, described fixed plate and described heat conduction support arrange heat conductive silica gel.
The tail end of described heat pipe is provided with heat sink assembly, described heat pipe includes heat pipe shell and heat tube core, described heat pipe shell is wrapped in outside described heat tube core, described heat tube core inwall has bulge-structure, working medium it is full of in described heat tube core, the cross section of described bulge-structure is semicircle, and described bulge-structure determines angle arrangement along described heat tube core inwall.
This utility model provides the benefit that: simple in construction, reasonable in design, strengthens surrounding air flowing so that it is be easier to heat radiation, and radiating efficiency is high.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model
Fig. 2 is heat sink assembly structural representation of the present utility model.
Fig. 3 is the cross sectional representation of heat pipe of the present utility model.
In figure:
1. heat sink assembly 2. fin body
3. fixed wings 4. highlights structure
5. fixing hole 6. conducting strip
7. heat conduction support 8. substrate
9. heat pipe 10. heat pipe shell
11. heat tube core 12. bulge-structures
13. working medium
Detailed description of the invention
Below in conjunction with the accompanying drawings a kind of detailed description of the invention of the present utility model is explained.
nullThis utility model relates to a kind of computer heat conducting and heat radiating device，Including heat sink assembly 1、Conducting strip 6、Heat conduction support 7、Substrate 8 and heat pipe 9 are that conducting strip is arranged on heat sink assembly 1，Heat conduction support 7 is arranged on conducting strip 6，Substrate 8 is arranged on heat conduction support，Heat pipe 9 one end is connected with heat sink assembly 1，Heat pipe 9 other end substrate 8 connects，Heat sink assembly 1 includes several fin，Fin be arranged in parallel，Fin includes fin body 2 and fixed wings 3，Fixed wings 3 is multiple，Multiple fixed wings 3 are separately positioned on the limit of fin body 2，Fixed wings 3 be arranged in parallel with fin body 2，Fixed wings 3 is provided with prominent structure 4，Prominent structure 4 is vertically arranged with fixed wings 3，Fixing hole 5 is had corresponding to the position highlighting structure 4 in fin body 2，Several fin coordinate composition heat sink assembly 1 by prominent structure 4 with fixing hole 5.Fin body 1 is rectangle, and fixed wings 3 is 4, and 4 fixed wings 3 are arranged on the corner of fin body 2.Prominent structure 4 and fixing hole 5 are rectangle.
Arranging heat conductive silica gel between conducting strip 6 and heat sink assembly 1, arrange heat conductive silica gel between heat conduction support 7 and conducting strip 6, fixed plate 8 and heat conduction support 7 arrange heat conductive silica gel.
Heat pipe 9 includes heat pipe shell 10 and heat tube core 11, and heat pipe shell 10 is wrapped in outside heat tube core 11, and heat tube core 11 inwall has bulge-structure 12, is full of working medium 13 in heat tube core 11, and the cross section of bulge-structure 12 is semicircle, and bulge-structure 12 determines angle arrangement along heat tube core inwall.
Make use-case: thermal source such as CPU or memorizer are fixing on the substrate 8 by fixed structure such as fixation clamp, heat pipe 9 one end is connected with heat sink assembly 1, heat pipe 9 other end substrate 8 connects, the heat part that thermal source produces passes to heat sink assembly 1 by heat pipe 9, another part thermal pathways conducting strip 6 and heat conduction support 7 pass to heat sink assembly 1, heat pipe 9 includes heat pipe shell 10 and heat tube core 11, heat pipe shell 10 is wrapped in outside heat tube core 11, heat tube core 11 inwall has bulge-structure 12, working medium 13 it is full of in heat tube core 11, the cross section of bulge-structure 12 is semicircle, bulge-structure 12 determines angle arrangement along heat tube core inwall.Heat pipe 6 is dependent on therein working medium 10 phase transformation and realizes the heat transfer element of heat transfer, and working medium 10 is sealed up for safekeeping in heat pipe 6, loads working medium 13, thus just can conduct heat at a lower temperature, play the effect of cooling in heat pipe 9 in the case of being evacuated.In view of the range of temperature of CPU is generally below 120 DEG C, therefore the working medium 13 of room temperature duty heat pipe 9 is selected to use water, heat pipe shell 10 makees material with copper, heat tube core 11 silk screen felt is made, operating temperature 30～250 DEG C, heat pipe 9 does not has heat to pass the restriction in direction, evaporation ends and condenser can be exchanged, under the minimum temperature difference, just amount of heat can be reached the other end from one end of pipe, heat pipe shell 10 external diameter is 4mm, bulge-structure 12 cross section is semicircle, and working medium 13 is clashed into inside heat pipe 9 by not stall during heat pipe 6, improves heat transfer efficiency.
Heat sink assembly 1 is made up of several fin, fin includes fin body 2 and fixed wings 3, fixed wings 3 is provided with prominent structure 4, fin body 2 is provided with the fixing hole 5 corresponding with highlighting structure 4, several fin coordinate composition to be assembled into heat sink assembly 1 by prominent structure 4 with fixing hole 5, the bonding strength of heat sink assembly 1 is big, after assembling after heat sink assembly 1, certain space is formed between fin, it is easy to air circulation, be conducive to heat radiation, fin is unlikely to deform, transport assembling is not easily broken and scatters, prominent structure 4 and fixing hole 5, simple in construction, it is readily produced, do not waste raw material.
Overall structure is simple, good heat dissipation effect.
Above an example of the present utility model is described in detail, but content has been only preferred embodiment of the present utility model, it is impossible to be considered for limiting practical range of the present utility model.All impartial changes made according to this utility model application range and improvement etc., within all should still belonging to patent covering scope of the present utility model.
Claims (5)
- null1. a computer heat conducting and heat radiating device，Including heat sink assembly、Conducting strip、Heat conduction support、Substrate and heat pipe，It is characterized in that described conducting strip is arranged on described heat sink assembly，Described heat conduction support is arranged on described conducting strip，Described substrate is arranged on described heat conduction support，Described heat pipe one end is connected with described heat sink assembly，Substrate described in the described heat pipe other end connects，Described heat sink assembly includes several fin，Described fin be arranged in parallel，Described fin includes fin body and fixed wings，Described fixed wings is multiple，Multiple described fixed wings are separately positioned on the limit of fin body，Described fixed wings be arranged in parallel with described fin body，Described fixed wings is provided with prominent structure，Described prominent structure is vertically arranged with described fixed wings，The position corresponding to described prominent structure in described fin body has fixing hole，Several described fin coordinate the described heat sink assembly of composition by described prominent structure with described fixing hole.
- A kind of computer heat conducting and heat radiating device the most according to claim 1, it is characterised in that described fin body is rectangle, and described fixed wings is 4, and 4 described fixed wings are arranged on the corner of described fin body.
- A kind of computer heat conducting and heat radiating device the most according to claim 1, it is characterised in that described prominent structure and described fixing hole are rectangle.
- A kind of computer heat conducting and heat radiating device the most according to claim 1, it is characterized in that arranging heat conductive silica gel between described conducting strip and described heat sink assembly, arranging heat conductive silica gel between described heat conduction support and described conducting strip, described fixed plate and described heat conduction support arrange heat conductive silica gel.
- A kind of computer heat conducting and heat radiating device the most according to claim 1, it is characterized in that described heat pipe includes heat pipe shell and heat tube core, described heat pipe shell is wrapped in outside described heat tube core, described heat tube core inwall has bulge-structure, working medium it is full of in described heat tube core, the cross section of described bulge-structure is semicircle, and described bulge-structure determines angle arrangement along described heat tube core inwall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521095955.6U CN205450940U (en) | 2015-12-23 | 2015-12-23 | Computer heat conduction radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521095955.6U CN205450940U (en) | 2015-12-23 | 2015-12-23 | Computer heat conduction radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205450940U true CN205450940U (en) | 2016-08-10 |
Family
ID=56577862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521095955.6U Expired - Fee Related CN205450940U (en) | 2015-12-23 | 2015-12-23 | Computer heat conduction radiation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205450940U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110418555A (en) * | 2019-07-20 | 2019-11-05 | 中国船舶重工集团公司第七二四研究所 | The annular heat radiation apparatus of containing heat pipe inside |
-
2015
- 2015-12-23 CN CN201521095955.6U patent/CN205450940U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110418555A (en) * | 2019-07-20 | 2019-11-05 | 中国船舶重工集团公司第七二四研究所 | The annular heat radiation apparatus of containing heat pipe inside |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160810 Termination date: 20161223 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |