CN104138820A - Gluing method for screen bonding of electronic product - Google Patents
Gluing method for screen bonding of electronic product Download PDFInfo
- Publication number
- CN104138820A CN104138820A CN201310164806.XA CN201310164806A CN104138820A CN 104138820 A CN104138820 A CN 104138820A CN 201310164806 A CN201310164806 A CN 201310164806A CN 104138820 A CN104138820 A CN 104138820A
- Authority
- CN
- China
- Prior art keywords
- glue
- guide rail
- direction guide
- gluing
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention relates to the field of gluing equipment, in particular to a gluing method and application. A hot melt glue body is put in a card type glue barrel, and is heated by a heater to melt; the temperature of the hot melt glue body is invariable through the control of a temperature controller; glue water is pressurized through a screw rod valve controller adjusting a screw rod valve; the movement locus of a needle head is controlled through an X direction guide rail, a Y direction guide rail and a Z direction guide rail; and the glue water is evenly coated on the set locus after being extruded out from the needle head. The gluing method can realize even coating of the glue water in the set locus from a plane and an inclined surface through automatic gluing, has the advantages of no dropping of the glue water, no overflow of the glue water, high gluing strength and high tightness, achieves such effects as dust prevention, shock resistance and water resistance, and can reduce the material cost; and in addition, the full-automatic mechanical operation is adopted, so that the complex operation step is prevented, the product pass percent is improved, and the high manpower cost is reduced.
Description
Technical field
What the present invention relates to is automatic double surface gluer field, particularly relates to a kind of gluing adhesive means and application.
Background technology
At present, in the 3C Product fields such as smart mobile phone, panel computer, notebook computer, television indicator, automobile, air-conditioning, the place of much making firmware need to complete with screw, or cut with adhesive tape, laminating, stamp, then the contraposition pressing again of fitting completes the stickup of electronic product screen, but so often cannot accurately control dispensing area and coating weight, and required step is complicated, wasted a lot of materials and parts in addition, existing taping process generally all needs manual work, so fraction defective is very high.
Therefore, for above-mentioned situation, design comprehensive glue of energy, accurately control dispensing area and coating weight, and can improve a kind of gluing adhesive means of pasting for electronic product screen of qualification rate, just inventor's problem to be solved.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of gluing adhesive means of pasting for electronic product screen, can comprehensive automatically dropping glue, and accurately control dispensing area and coating weight, and can improve qualification rate.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is:
Adhesive means of the present invention, comprise the steps: hot melt colloid to put into cassette glue bucket, through heater, heat, hot melt colloid melts, by temperature controller, control PUR temperature constant, by screw-down valve controller adjusting screw(rod) valve, to glue, pressurize, and control syringe needle movement locus by X-direction guide rail, Y-direction guide rail and Z-direction guide rail, glue is uniformly coated on the track of setting from syringe needle is extruded.
The invention has the beneficial effects as follows:
1, the present invention is originally coated with by automatically dropping glue, can realize glue is uniformly coated on the track of setting from plane, inclined-plane, glue do not hang down stream, overflow glue, adhesion strength is high, sealing is high, thereby reach dustproof, shockproof, waterproof texts, also can save material cost;
2, in addition, adopt full automatic mechanical work, both avoided complicated operating procedure, improved again product percent of pass, meanwhile, also reduced a large amount of costs of labor.
The specific embodiment
Adhesive means of the present invention, comprise the steps: hot melt colloid to put into cassette glue bucket, through heater, heat, hot melt colloid melts, by temperature controller, control PUR temperature constant, by screw-down valve controller adjusting screw(rod) valve, to glue, pressurize, and control syringe needle movement locus by X-direction guide rail, Y-direction guide rail and Z-direction guide rail, glue is uniformly coated on the track of setting from syringe needle is extruded.
The present invention is coated with by automatically dropping glue, can realize glue is uniformly coated on the track of setting from plane, inclined-plane, glue do not hang down stream, overflow glue, adhesion strength is high, sealing is high, thereby reach dustproof, shockproof, waterproof texts, also can save material cost; In addition, adopt full automatic mechanical work, both avoided complicated operating procedure, improved again product percent of pass, meanwhile, also reduced a large amount of costs of labor.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (1)
1. a gluing adhesive means of pasting for electronic product screen, it is characterized in that: the method comprises the steps: hot melt colloid to put into cassette glue bucket, through heater, heat, hot melt colloid melts, by temperature controller, control PUR temperature constant, by screw-down valve controller adjusting screw(rod) valve, to glue, pressurize, and control syringe needle movement locus by X-direction guide rail, Y-direction guide rail and Z-direction guide rail, glue is uniformly coated on the track of setting from syringe needle is extruded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310164806.XA CN104138820A (en) | 2013-05-08 | 2013-05-08 | Gluing method for screen bonding of electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310164806.XA CN104138820A (en) | 2013-05-08 | 2013-05-08 | Gluing method for screen bonding of electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104138820A true CN104138820A (en) | 2014-11-12 |
Family
ID=51848256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310164806.XA Pending CN104138820A (en) | 2013-05-08 | 2013-05-08 | Gluing method for screen bonding of electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104138820A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112275575A (en) * | 2020-10-31 | 2021-01-29 | 深圳市高创自动化技术有限公司 | Method for controlling amount of adhesive for adhering curved-surface screen of mobile phone with high precision and low cost |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0824756A (en) * | 1994-07-12 | 1996-01-30 | Yazaki Corp | Method for injecting hot-melt resin material and device threfor |
| JPH09173917A (en) * | 1995-12-21 | 1997-07-08 | Mitsubishi Heavy Ind Ltd | Apparatus for producing hot melt foam |
| US5788128A (en) * | 1997-06-30 | 1998-08-04 | Hickey; Patrick J. | High viscosity low pressure non-contact glue-dispenser |
| CN202893611U (en) * | 2012-11-12 | 2013-04-24 | 昆山超邦胶粘制品有限公司 | Glue spreading machine for adhering screen of electronic product |
| CN103801484A (en) * | 2012-11-12 | 2014-05-21 | 昆山超邦胶粘制品有限公司 | Glue coating machine and gluing method |
-
2013
- 2013-05-08 CN CN201310164806.XA patent/CN104138820A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0824756A (en) * | 1994-07-12 | 1996-01-30 | Yazaki Corp | Method for injecting hot-melt resin material and device threfor |
| JPH09173917A (en) * | 1995-12-21 | 1997-07-08 | Mitsubishi Heavy Ind Ltd | Apparatus for producing hot melt foam |
| US5788128A (en) * | 1997-06-30 | 1998-08-04 | Hickey; Patrick J. | High viscosity low pressure non-contact glue-dispenser |
| CN202893611U (en) * | 2012-11-12 | 2013-04-24 | 昆山超邦胶粘制品有限公司 | Glue spreading machine for adhering screen of electronic product |
| CN103801484A (en) * | 2012-11-12 | 2014-05-21 | 昆山超邦胶粘制品有限公司 | Glue coating machine and gluing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112275575A (en) * | 2020-10-31 | 2021-01-29 | 深圳市高创自动化技术有限公司 | Method for controlling amount of adhesive for adhering curved-surface screen of mobile phone with high precision and low cost |
| CN112275575B (en) * | 2020-10-31 | 2021-08-13 | 深圳市高创自动化技术有限公司 | Method for controlling amount of adhesive for adhering curved-surface screen of mobile phone with high precision and low cost |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103801484B (en) | A kind of glue spreader and adhesive means | |
| CN202893611U (en) | Glue spreading machine for adhering screen of electronic product | |
| EP3196018A1 (en) | Substrate bonding method, touch control substrate and display device | |
| CN203140253U (en) | Dispensing mechanism of UV (Ultraviolet) adhesive laminating equipment | |
| US20120006400A1 (en) | Solar module device and edge sealing coating method thereof | |
| CN102981301B (en) | Manufacture method of display equipment | |
| CN106113528A (en) | The preparation method of fan blade of wind generating set web | |
| CN203301870U (en) | Combined double-head multifunctional surface mounting machine | |
| CN109960435A (en) | The full attaching process and device of touch-control display module | |
| CN109377869A (en) | A kind of applying method and display module of backlight | |
| CN202738377U (en) | Device for bonding IC (Integrated Circuit), FPC (Flexible Printed Circuit) and panel and bonding equipment | |
| CN202008565U (en) | Frame sealing glue solidifying equipment | |
| CN104138820A (en) | Gluing method for screen bonding of electronic product | |
| CN101318169B (en) | Glue spreading apparatus, using and maintaining method for the glue spreading apparatus | |
| CN104494277B (en) | Air conditioner panel pasting process and air conditioner | |
| CN203389825U (en) | Hot melt adhesive supply pressure control device | |
| CN206229597U (en) | A kind of full-automatic horizontal glue-injection machine with preheating function | |
| CN208796583U (en) | A kind of display module and terminal | |
| CN104015324A (en) | Preparation technology for edge-sealing strip subjected to co-extrusion molding | |
| CN104210218A (en) | Substrate adhesion method | |
| CN107911936B (en) | The processing method and electronic equipment of a kind of circuit board, circuit board | |
| CN104004457A (en) | Bonding method | |
| CN205209473U (en) | Even foil strain gauge of thickness | |
| CN104570451A (en) | Method for manufacturing display equipment | |
| CN203426558U (en) | High-precision pulse heating reflow soldering equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141112 |