CN202738377U - Device for bonding IC (Integrated Circuit), FPC (Flexible Printed Circuit) and panel and bonding equipment - Google Patents
Device for bonding IC (Integrated Circuit), FPC (Flexible Printed Circuit) and panel and bonding equipment Download PDFInfo
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- CN202738377U CN202738377U CN 201220306708 CN201220306708U CN202738377U CN 202738377 U CN202738377 U CN 202738377U CN 201220306708 CN201220306708 CN 201220306708 CN 201220306708 U CN201220306708 U CN 201220306708U CN 202738377 U CN202738377 U CN 202738377U
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Abstract
The utility model discloses a device for bonding an IC (Integrated Circuit), a FPC (Flexible Printed Circuit) and a panel and bonding equipment. The bonding device comprises a control rod, a first adsorption module, a second adsorption module, a FPC adsorption section and an IC adsorption section, wherein the control rod is connected with the first adsorption module or the second adsorption module; the first adsorption module is connected with the second adsorption module for picking up the FPC and bonding the FPC on the panel; the second adsorption module is connected with the first adsorption module for picking up the IC and bonding the IC on the panel; the FPC adsorption section is located at the bottom surface of the first adsorption module for adsorbing the FPC; and the IC adsorption section is located at the bottom surface of the second adsorption module for adsorbing the IC. By adopting the bonding device and the bonding equipment, the production efficiency and the product yield rate can be improved.
Description
Technical field
The utility model relates to LCD Technology, relate in particular to a kind of IC (Integrated Circuit, chip) and the binding (bonding) of FPC (Flexible Printed Circuit, flexible print circuit) and panel device and bound device.
Background technology
At present, that each large panel of LCD producer uses all is COG (Chip On Glass, chip is manufactured on glass) and FOG (FPC On Glass, flexible print circuit and glass circuit board tipping) twice technique, with two equipment IC and FPC are tied on the panel respectively, the binding of carrying out first IC is made into COG, and the binding of carrying out again FPC is made into FOG.
Owing to having adopted technique twice, the production efficiency of existing process is restricted, and IC and FPC binding position is very approaching on panel, all can heat effect be arranged to IC in twice binding procedure, thereby affect the performance of conducting resinl, ACF (Anisotropic Conductive Film, anisotropic conductive film) for example causes to show bad or in the hot and humid product function inefficacy that waits under the extreme environment.At present, bad the mainly containing of demonstration that therefore occurs: bright line, concealed wire and all over the screen unusual etc.
The utility model content
In view of this, main purpose of the present utility model is to provide binding device and the bound device of a kind of IC and FPC and panel, can improve yields and production efficiency.
For achieving the above object, the technical solution of the utility model is achieved in that
The binding device of a kind of IC and FPC and panel comprises:
The first adsorption module, the second adsorption module and control lever;
One end of control lever is connected with the first adsorption module or the second adsorption module;
The first adsorption module is connected with the second adsorption module, and the bottom surface of described the first adsorption module is provided with the FPC binding domain, and the first adsorption module binding domain is used for picking up FPC and FPC being bundled in panel;
The second adsorption module is connected with the first adsorption module, and the bottom surface of described the second adsorption module is provided with the IC binding domain, and the second adsorption module binding domain is used for picking up IC and IC being bundled in panel.
Above-mentioned binding device also comprises: control unit, and described control unit is connected with the other end of described control lever, and described control unit is used for the control control lever, to realize the position movement of the first adsorption module and the second adsorption module.
Above-mentioned binding device also comprises: slide rail, described slide rail are positioned at the first adsorption module of being connected with control lever or the side of the second adsorption module, and slide rail is used for regulating the relative altitude of the adsorption module that slide rail is not set.
Above-mentioned binding device also comprises: air intake duct, described air intake duct is connected with described FPC binding domain and described IC binding domain.
Above-mentioned binding device also comprises: servo motor, described servo motor are positioned at the first adsorption module or the second adsorption module, and servo motor is regulated another adsorption module relative altitude along described slide rail.
A kind of bound device comprises: the binding device of above-mentioned arbitrary described IC and FPC and panel.
The IC that provides by the utility model and binding device and the bound device of FPC and panel are united COG and two kinds of techniques of FOG, once finish; So, can be when enhancing productivity, deadweight loss and the bad generation of avoiding secondary operations to cause, thus improve yields.
In addition, this binding device can be regulated the first adsorption module and the second adsorption module relative altitude by slide rail, thereby adapts to different IC and different product, has good flexibility, strong adaptability, has greatly saved equipment cost.
Description of drawings
Schematic cross-section when Fig. 1 carries out disposable binding for the binding device of the IC that adopts the utility model and provide and FPC and panel;
Vertical view when Fig. 2 carries out disposable binding for the binding device of the IC that adopts the utility model and provide and FPC and panel;
The perspective view of the binding device of the IC that Fig. 3 the utility model provides and FPC and panel;
The front schematic view of the binding device of the IC that Fig. 4 the utility model provides and FPC and panel;
The side schematic view of the binding device of the IC that Fig. 5 the utility model provides and FPC and panel;
The upward view vacuum suction district schematic diagram of the binding device of the IC that Fig. 6 the utility model provides and FPC and panel;
Main element symbol description among the figure:
1: binding device; 2:IC; 3:FPC; 4: panel;
5: conducting resinl; 11: the first adsorption modules; 12: the second adsorption modules;
13: control lever; 14: slide rail;
The 15:IC binding domain; The 16:FPC binding domain.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, by the following examples and with reference to accompanying drawing, the utility model is further described.
The utility model the first embodiment provides the binding device of a kind of IC and FPC and panel, comprising: the first adsorption module, the second adsorption module and control lever; One end of control lever is connected with the first adsorption module or the second adsorption module; The first adsorption module is connected with the second adsorption module, and the bottom surface of described the first adsorption module is provided with the FPC binding domain, and the first adsorption module binding domain is used for picking up FPC and FPC being bundled in panel; The second adsorption module is connected with the first adsorption module, and the bottom surface of described the second adsorption module is provided with the IC binding domain, and the second adsorption module binding domain is used for picking up IC and IC being bundled in panel.
The utility model the second embodiment provides the binding device of a kind of IC and FPC and panel, comprising: the first adsorption module, the second adsorption module, control lever and control unit; One end of control lever is connected with the first adsorption module or the second adsorption module; The first adsorption module is connected with the second adsorption module, and the bottom surface of described the first adsorption module is provided with the FPC binding domain, and the first adsorption module binding domain is used for picking up FPC and FPC being bundled in panel; The second adsorption module is connected with the first adsorption module, the bottom surface of described the second adsorption module is provided with the IC binding domain, the second adsorption module binding domain is used for picking up IC and IC being bundled in panel, described control unit is connected with the other end of described control lever, described control unit is used for the control control lever, to realize the position movement of the first adsorption module and the second adsorption module.
The utility model the 3rd embodiment provides the binding device of a kind of IC and FPC and panel, comprising: the first adsorption module, the second adsorption module, control lever, control unit and slide rail; One end of control lever is connected with the first adsorption module or the second adsorption module; The first adsorption module is connected with the second adsorption module, and the bottom surface of described the first adsorption module is provided with the FPC binding domain, and the first adsorption module binding domain is used for picking up FPC and FPC being bundled in panel; The second adsorption module is connected with the first adsorption module, the bottom surface of described the second adsorption module is provided with the IC binding domain, the second adsorption module binding domain is used for picking up IC and IC being bundled in panel, described control unit is connected with the other end of described control lever, described control unit is used for the control control lever, to realize the position movement of the first adsorption module and the second adsorption module, described slide rail is positioned at the first adsorption module of being connected with control lever or the side of the second adsorption module, and slide rail is used for regulating the relative altitude of the adsorption module that slide rail is not set.
The utility model the 4th embodiment provides the binding device of a kind of IC and FPC and panel, comprising: the first adsorption module, the second adsorption module, control lever, control unit, slide rail and air intake duct; One end of control lever is connected with the first adsorption module or the second adsorption module; The first adsorption module is connected with the second adsorption module, and the bottom surface of described the first adsorption module is provided with the FPC binding domain, and the first adsorption module binding domain is used for picking up FPC and FPC being bundled in panel; The second adsorption module is connected with the first adsorption module, the bottom surface of described the second adsorption module is provided with the IC binding domain, the second adsorption module binding domain is used for picking up IC and IC being bundled in panel, described control unit is connected with the other end of described control lever, described control unit is used for the control control lever, to realize the position movement of the first adsorption module and the second adsorption module, described slide rail is positioned at the first adsorption module of being connected with control lever or the side of the second adsorption module, slide rail is used for regulating the relative altitude of the adsorption module that slide rail is not set, and described air intake duct is connected with described FPC binding domain and described IC binding domain.
The utility model the 5th embodiment provides the binding device of a kind of IC and FPC and panel, comprising: the first adsorption module, the second adsorption module, control lever, control unit, slide rail, air intake duct and servo motor; One end of control lever is connected with the first adsorption module or the second adsorption module; The first adsorption module is connected with the second adsorption module, and the bottom surface of described the first adsorption module is provided with the FPC binding domain, and the first adsorption module binding domain is used for picking up FPC and FPC being bundled in panel; The second adsorption module is connected with the first adsorption module, the bottom surface of described the second adsorption module is provided with the IC binding domain, the second adsorption module binding domain is used for picking up IC and IC being bundled in panel, described control unit is connected with the other end of described control lever, described control unit is used for the control control lever, to realize the position movement of the first adsorption module and the second adsorption module, described slide rail is positioned at the first adsorption module of being connected with control lever or the side of the second adsorption module, slide rail is used for regulating the relative altitude of the adsorption module that slide rail is not set, described air intake duct is connected with described FPC binding domain and described IC binding domain, described servo motor is positioned at the first adsorption module or the second adsorption module, and servo motor is regulated another adsorption module relative altitude along described slide rail.
The utility model the 6th embodiment provide a kind of bound device, and described bound device is to be provided with the IC of above-mentioned arbitrary embodiment and the binding device of FPC and panel.
Schematic cross-section when Fig. 1 carries out disposable binding for the binding device of the IC that adopts the utility model and provide and FPC and panel, as can be seen from Fig. 1, the utility model is by adopting binding device 1 to cohere fixing namely being bundled on the panel 4 that is coated with conducting resinl with IC2 and FPC3 are disposable.
Vertical view when Fig. 2 carries out disposable binding for the binding device of the IC that adopts the utility model and provide and FPC and panel.In the binding procedure of the present utility model, coating method to conducting resinl also improves, twice coated with conductive glue is respectively changed to disposable accurate coated with conductive glue to the appointed area of panel 4, after conducting resinl 5 is applied the binding zone that covers IC2 and FPC3, after the binding device 1 (by the mode of absorption) that uses the utility model to provide picks up IC2 and FPC3, can disposable binding finish FOG.Can enhance productivity by the binding device that the utility model provides, and IC part the repeating when carrying out the FPC binding that can avoid in the traditional handicraft binding to finish be heated, thereby from production process, stop the bad generation that causes because of post bake.
The perspective view of the IC that Fig. 3 provides for the utility model and the binding device of FPC and panel, this binding device 1 comprises:
The first adsorption module 11, the second adsorption module 12 and control lever 13, one end of control lever 13 is fixedly connected with the first adsorption module 11 or the second adsorption module 12, the first adsorption module 11 is connected with the second 12 of moulds of absorption, the binding domain that the bottom surface of described the first adsorption module 11 is provided with FPC binding domain 16, the first adsorption modules 11 is used for picking up FPC3 and FPC3 being bundled in panel 4;
The second adsorption module 12 is connected with the first adsorption module 11, and the binding domain that the bottom surface of described the second adsorption module 12 is provided with IC binding domain 15, the second adsorption modules 12 is used for picking up IC2 and IC2 being bundled in panel 4.
Further, described binding device also comprises the control unit (not shown), the other end of described control lever 13 is connected with control unit, control unit is used for the control control lever, realize locating accurately and realizing the position movement of the first adsorption module 11 and the second adsorption module 12, thereby can with FPC3 and IC2 is disposable be bundled on the panel 4.
Further, described binding device also comprises slide rail 14, is positioned at the first adsorption module 11 of being connected with control lever 13 or the side of the second adsorption module 12, is used for regulating the relative altitude of the adsorption module that slide rail is not set.
As shown in Figure 3 and Figure 4, among this embodiment, the first adsorption module 11 is connected with control lever 13, slide rail 14 is positioned at the first adsorption module 11 1 sides of the first adsorption module 11 and the second adsorption module 12 contact-making surfaces, can regulate by slide rail 14 height of the second adsorption module 12, thereby the IC of corresponding different size, different products.
Further, described IC binding domain 15 is connected with the FPC binding domain and also is connected with air intake duct respectively, and described air intake duct can pass through control lever 13 cablings, also can be external separately, and not shown in the accompanying drawings.
Further, the utility model does not limit the first adsorption module 11 and the concrete connected mode of the second adsorption module 12, as long as can make that both are stable, link together closely.The utility model does not limit the regulative mode of the first adsorption module 11 or the second adsorption module 12 yet, for example: take Fig. 3 as example, the relative altitude that can regulate the second adsorption module 12 by the servo motor that is positioned at the first adsorption module 11 inside, servo motor can be connected with the control system signal of telecommunication by control lever 13.
In described the first adsorption module 11 and the second adsorption module 12, the size that is used for the binding domain of absorption FPC3 and IC2 is determined according to the size of FPC3 and IC2.
The utility model also provides a kind of bound device, this bound device comprises above-mentioned binding device 1, wherein, control unit is connected with control lever 13, be used for controlling above-mentioned binding device 1 by the binding flow process and pick up ready IC2 and FPC3, accurate location binding position, and the disposable respective regions that IC2 and FPC3 is tied to panel 4.This bound device is a FOG equipment with original COG equipment and FOG integration of equipments, has improved production efficiency.
The binding device 1 that the utility model provides can be regulated the first adsorption module 11 and the second adsorption module 12 relative altitudes by slide rail 14, thereby adapts to the specification of different IC2, has good flexibility.
The binding device 1 that the utility model provides can be done corresponding adjustment according to different use approach and adapt to afterwards different products, for example can be used for NB product, MNT product, mobile display product, the IC2 of these products and the size of FPC3, relative position differ greatly, the utility model only need to be done suitable adjustment to the mode of picking up of binding device 1 and precision can adapt to these different products, strong adaptability has greatly been saved equipment cost.
The above is preferred embodiment of the present utility model only, is not be used to limiting protection range of the present utility model.
Claims (6)
1. the binding device of an IC and FPC and panel is characterized in that, comprising:
The first adsorption module, the second adsorption module and control lever;
One end of control lever is connected with the first adsorption module or the second adsorption module;
The first adsorption module is connected with the second adsorption module, and the bottom surface of described the first adsorption module is provided with the FPC binding domain, and the first adsorption module binding domain is used for picking up FPC and FPC being bundled in panel;
The second adsorption module is connected with the first adsorption module, and the bottom surface of described the second adsorption module is provided with the IC binding domain, and the second adsorption module binding domain is used for picking up IC and IC being bundled in panel.
2. binding device according to claim 1 is characterized in that, also comprises: control unit,
Described control unit is connected with the other end of described control lever, and described control unit is used for the control control lever, to realize the position movement of the first adsorption module and the second adsorption module.
3. binding device according to claim 2 is characterized in that, also comprises: slide rail,
Described slide rail is positioned at the first adsorption module of being connected with control lever or the side of the second adsorption module, and slide rail is used for regulating the relative altitude of the adsorption module that slide rail is not set.
4. binding device according to claim 3 is characterized in that, also comprises: air intake duct,
Described air intake duct is connected with described FPC binding domain and described IC binding domain.
5. binding device according to claim 4 is characterized in that, also comprises: servo motor,
Described servo motor is positioned at the first adsorption module or the second adsorption module, and servo motor is regulated another adsorption module relative altitude along described slide rail.
6. a bound device is characterized in that, comprising:
Binding device such as each described IC of claim 1 to 5 and FPC and panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220306708 CN202738377U (en) | 2012-06-27 | 2012-06-27 | Device for bonding IC (Integrated Circuit), FPC (Flexible Printed Circuit) and panel and bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220306708 CN202738377U (en) | 2012-06-27 | 2012-06-27 | Device for bonding IC (Integrated Circuit), FPC (Flexible Printed Circuit) and panel and bonding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202738377U true CN202738377U (en) | 2013-02-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220306708 Expired - Lifetime CN202738377U (en) | 2012-06-27 | 2012-06-27 | Device for bonding IC (Integrated Circuit), FPC (Flexible Printed Circuit) and panel and bonding equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN202738377U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105044956A (en) * | 2015-09-08 | 2015-11-11 | 京东方科技集团股份有限公司 | Display panel manufacturing method, binding and cutting device |
| CN108072988A (en) * | 2017-05-25 | 2018-05-25 | 东莞合安机电有限公司 | A kind of self-balancing FPC pressure-maintaining machines |
| CN108983449A (en) * | 2018-07-04 | 2018-12-11 | 武汉华星光电半导体显示技术有限公司 | Adhering device, applicator system and attaching method |
| CN111225514A (en) * | 2020-01-19 | 2020-06-02 | 京东方科技集团股份有限公司 | Pressure welding device and pressure welding method |
| CN112165796A (en) * | 2020-09-30 | 2021-01-01 | 霸州市云谷电子科技有限公司 | Pressure head and turn over a equipment |
| CN112188830A (en) * | 2020-10-16 | 2021-01-05 | Tcl华星光电技术有限公司 | Adsorption mechanism, pressing device and pressing method of display module |
-
2012
- 2012-06-27 CN CN 201220306708 patent/CN202738377U/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105044956A (en) * | 2015-09-08 | 2015-11-11 | 京东方科技集团股份有限公司 | Display panel manufacturing method, binding and cutting device |
| WO2017041436A1 (en) * | 2015-09-08 | 2017-03-16 | 京东方科技集团股份有限公司 | Display panel preparation method, and binding and cutting apparatus |
| CN105044956B (en) * | 2015-09-08 | 2018-01-26 | 京东方科技集团股份有限公司 | The preparation method of display panel, binding cutter device |
| US10186490B2 (en) | 2015-09-08 | 2019-01-22 | Boe Technology Group Co., Ltd. | Manufacturing method of display panel and bonding cutting device |
| CN108072988A (en) * | 2017-05-25 | 2018-05-25 | 东莞合安机电有限公司 | A kind of self-balancing FPC pressure-maintaining machines |
| CN108072988B (en) * | 2017-05-25 | 2020-11-20 | 泗县智来机械科技有限公司 | Self-balancing FPC pressurizer |
| CN108983449A (en) * | 2018-07-04 | 2018-12-11 | 武汉华星光电半导体显示技术有限公司 | Adhering device, applicator system and attaching method |
| CN111225514A (en) * | 2020-01-19 | 2020-06-02 | 京东方科技集团股份有限公司 | Pressure welding device and pressure welding method |
| CN111225514B (en) * | 2020-01-19 | 2022-04-15 | 京东方科技集团股份有限公司 | Pressure welding device and pressure welding method |
| CN112165796A (en) * | 2020-09-30 | 2021-01-01 | 霸州市云谷电子科技有限公司 | Pressure head and turn over a equipment |
| CN112188830A (en) * | 2020-10-16 | 2021-01-05 | Tcl华星光电技术有限公司 | Adsorption mechanism, pressing device and pressing method of display module |
| CN112188830B (en) * | 2020-10-16 | 2021-09-03 | Tcl华星光电技术有限公司 | Adsorption mechanism, pressing device and pressing method of display module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150702 Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20150702 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150702 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE TECHNOLOGY GROUP Co.,Ltd. Patentee after: BEIJING BOE OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 100176 Beijing city in Western Daxing District economic and Technological Development Zone, Road No. 8 Patentee before: BEIJING BOE OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130213 |