CN104134746B - 一种半导体温差感应发电芯片及其制作方法 - Google Patents
一种半导体温差感应发电芯片及其制作方法 Download PDFInfo
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- CN104134746B CN104134746B CN201410388235.2A CN201410388235A CN104134746B CN 104134746 B CN104134746 B CN 104134746B CN 201410388235 A CN201410388235 A CN 201410388235A CN 104134746 B CN104134746 B CN 104134746B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 184
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 82
- 229910052751 metal Inorganic materials 0.000 claims abstract description 82
- 239000000919 ceramic Substances 0.000 claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 239000011159 matrix material Substances 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 10
- 238000005516 engineering process Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 7
- 238000010276 construction Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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CN201410388235.2A CN104134746B (zh) | 2014-08-08 | 2014-08-08 | 一种半导体温差感应发电芯片及其制作方法 |
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CN201410388235.2A CN104134746B (zh) | 2014-08-08 | 2014-08-08 | 一种半导体温差感应发电芯片及其制作方法 |
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CN104134746B true CN104134746B (zh) | 2017-08-22 |
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CN110416399A (zh) * | 2019-08-16 | 2019-11-05 | 韦良东 | 一种半导体制冷制热芯片结构 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1595674A (zh) * | 2004-06-21 | 2005-03-16 | 浙江大学 | 一种薄片型热电转换装置的制备方法 |
CN1641901A (zh) * | 2004-01-18 | 2005-07-20 | 财团法人工业技术研究院 | 微型热电冷却装置的结构及制造方法 |
CN200941396Y (zh) * | 2006-08-28 | 2007-08-29 | 邓贤金 | 大功率半导体热电芯片组件 |
US20110290293A1 (en) * | 2010-05-26 | 2011-12-01 | Samsung Electro-Mechanics Co. | Thermoelectric module and method for manufacturing the same |
CN102931337A (zh) * | 2012-11-14 | 2013-02-13 | 江苏物联网研究发展中心 | 柔性热电发生器及其制造方法 |
CN204022484U (zh) * | 2014-06-05 | 2014-12-17 | 鞠复勇 | 一种氧化铝气态悬浮焙烧炉烧制ɑ氧化铝的设备 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06169108A (ja) * | 1992-02-19 | 1994-06-14 | Nippon Inter Electronics Corp | 熱電素子 |
JPH08222771A (ja) * | 1995-02-10 | 1996-08-30 | Tokyo Gas Co Ltd | 熱電発電素子及び熱電発電装置 |
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- 2014-08-08 CN CN201410388235.2A patent/CN104134746B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1641901A (zh) * | 2004-01-18 | 2005-07-20 | 财团法人工业技术研究院 | 微型热电冷却装置的结构及制造方法 |
CN1595674A (zh) * | 2004-06-21 | 2005-03-16 | 浙江大学 | 一种薄片型热电转换装置的制备方法 |
CN200941396Y (zh) * | 2006-08-28 | 2007-08-29 | 邓贤金 | 大功率半导体热电芯片组件 |
US20110290293A1 (en) * | 2010-05-26 | 2011-12-01 | Samsung Electro-Mechanics Co. | Thermoelectric module and method for manufacturing the same |
CN102931337A (zh) * | 2012-11-14 | 2013-02-13 | 江苏物联网研究发展中心 | 柔性热电发生器及其制造方法 |
CN204022484U (zh) * | 2014-06-05 | 2014-12-17 | 鞠复勇 | 一种氧化铝气态悬浮焙烧炉烧制ɑ氧化铝的设备 |
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Effective date of registration: 20180321 Address after: 553001 Hongqiao New Area Yan Jia Zhai village, Hongqiao Economic Development Zone, Liupanshui City, Guizhou Province Patentee after: Guizhou Kangpu Technology Co. Ltd. Address before: Zazo Town, Xiuwen County of Guizhou Province in 550000 concentric bookstore in Guiyang City Co-patentee before: Gu Wei Patentee before: Wang Lin Co-patentee before: Chen Zhiming |
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Effective date of registration: 20190702 Address after: 650000 Lufu Street Office, Shilin Yi Autonomous County, Kunming City, Yunnan Province, North of the First Industrial Avenue in Shilin Eco-industrial Concentrated Area Patentee after: Zhongxintai Semiconductor Technology Co., Ltd. Address before: 553001 Yanjiazhai Village, Hongqiao New District, Zhongshan Economic Development Zone, Liupanshui City, Guizhou Province Patentee before: Guizhou Kangpu Technology Co. Ltd. |