CN104113795B - It is configured with the Handless wireless device of microphone or microphone array - Google Patents
It is configured with the Handless wireless device of microphone or microphone array Download PDFInfo
- Publication number
- CN104113795B CN104113795B CN201410201145.8A CN201410201145A CN104113795B CN 104113795 B CN104113795 B CN 104113795B CN 201410201145 A CN201410201145 A CN 201410201145A CN 104113795 B CN104113795 B CN 104113795B
- Authority
- CN
- China
- Prior art keywords
- carrier
- upper plate
- face
- chip
- microphone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
It is configured with the Handless wireless device of microphone or microphone array, it is by loudspeaker, attachment means and communication device are formed, and communicating circuit and microphone are configured with communication device, by attachment means by loudspeaker, it is electrically connected between communicating circuit and microphone, the Handless wireless device is characterised by that microphone includes carrier, chip, first mask of carrier is fluted, chip has the opening run through, film is covered in the opening of the chip first side of chip, the chip first side of chip and the face of carrier first of carrier connect, and the carrier contact on the first face of film and carrier is electrically connected with, carrier contact extends to the face of carrier second through the through hole on carrier and forms multiple outer contacts, multiple external points are further electrically connected with communicating circuit.
Description
Technical field
The present invention is on a kind of Handless wireless device, has micro-electromechanical technology (MEMS) wheat especially with regard to one kind
The Handless wireless device of gram wind encapsulating structure.
Background technology
Portable phone allows people to use phone whenever and wherever possible, but receiving calls needs with hand grip phone,
It can many times bring inconvenience, such as when driving or holding other articles on hand, therefore handfree receiver unit quilt
Invent, through handfree receiver unit, user need not hold phone, can also receive calls, especially radio transmission device
After maturation, wireless handfree receiver unit is using upper more convenient.
As the equipment of voice communication, the microphone efficiency of Handless wireless device is quite important, especially simultaneous
Caring for principle easy to use needs the enough good microphone of the enough small, efficiency of volume.
Micro-electro-mechanical microphone refers to use micro-electromechanical technology (Micro Electrical Mechanical System；
MEMS microphone made of), it is the one kind for belonging to capacitance microphone in principle, the sense audio of microphone is used as generally using chip
Component, change chip vibration by sound and electric capacity and then send out electric signal, micro-electro-mechanical microphone built-in can be simulated-counted
Word converter, make that micro-electro-mechanical microphone exports for digital signal, be more conducively connected with electronic product.
As it was previously stated, Handless wireless device is because of its characteristic, in the state of ideal, the microcomputer of its internal institute device
The size of electric microphone should reduce as far as possible, to meet characteristic light, thin, short, small as other consumption electronic products, so
And micro-electro-mechanical microphone now is by among the encapsulating structure of the chip buried micro-electro-mechanical microphone of sensing, as the U.S. is public mostly
Patent US8624384 is accused, it is considered herein that such design can be such that the size of micro-electro-mechanical microphone does not reduce further, because
This has improved necessity.
The content of the invention
According to the demand, the invention provides a kind of Handless wireless device, and used micro-electro-mechanical microphone will
Chip as sensor is placed in the outside of micro-electro-mechanical microphone packaging structure, to reduce the volume of micro-electro-mechanical microphone；Together
When the inner surface of carrier can also be surface-treated, and microphone is formed array each other, to increase the effect of microphone.
According to object above, the present invention proposes a kind of Handless wireless device for being configured with microphone, by loudspeaker,
Attachment means and communication device are formed, and communicating circuit and microphone are configured with communication device, will be raised by attachment means
It is electrically connected between sound device, communicating circuit and microphone, Handless wireless device is characterised by that microphone includes:Carrier,
With the face of carrier first and carrier second face relative with the face of carrier first, and have and multiple carrier is through to by the face of carrier first
The through hole in two faces, there is metal column in each through hole, the mask of carrier first is fluted, and the face of carrier first simultaneously has multiple
Carrier contact, the face of carrier second have multiple outer contacts, and each carrier contact is all through in one of metal column and wherein
One outer contact is electrically connected with；Chip, there is chip first side and chip second face relative with chip first side, chip first
Face simultaneously has multiple pads, and the chip first side of chip is relative with the face of carrier first of carrier so that each pad all and its
In carrier contact be electrically connected with to form stack architecture, the partial area of chip has is through to chip by chip first side
The opening in the second face, and make opening in the top of groove；Film, there are multiple electrical contacts, be configured at the chip first of chip
Face simultaneously covers opening, and each electrical contact is electrically connected with metal material and one of pad respectively, film and shape
Into capacitance structure.
According to object above, the present invention has also been proposed a kind of Handless wireless device for being configured with microphone, by raising one's voice
Device, attachment means and communication device are formed, and communicating circuit and microphone are configured with communication device, will by attachment means
It is electrically connected between loudspeaker, communicating circuit and microphone, Handless wireless device is characterised by that microphone includes:Carry
Tool, has the face of carrier first and carrier second face relative with the face of carrier first, and has and multiple be through to load by the face of carrier first
Have the through hole in the second face, there is metal column in each through hole, the mask of carrier first is fluted, and the face of carrier first simultaneously has
Multiple carrier contacts, the face of carrier second have multiple outer contacts, and each carrier contact is all through one of metal column and its
In an outer contact be electrically connected with；Carrier upper plate, there is the face of carrier upper plate first and the carrier relative with the face of carrier upper plate first
The face of upper plate second, carrier upper plate further there are multiple upper plates for being through to the face of carrier upper plate second by the face of carrier upper plate first to wear
Hole and the upper plate opening that the face of carrier upper plate second is through to by the face of carrier upper plate first, all there is metal in the perforation of each upper plate
Material, the face of carrier upper plate first and the face of carrier upper plate second have multiple upper plate contacts respectively, the face of carrier upper plate first it is each
Individual upper plate contact electrically connects through one of metal material with one of upper plate contact on the face of carrier upper plate second respectively
Connect, the face of carrier upper plate second of carrier upper plate is relative with the face of carrier first of carrier, the upper plate of the carrier of each carrier upper plate
Contact is electrically connected with one of carrier contact of carrier respectively, and upper plate opening connects with groove；Chip, there is chip the
Simultaneously and chip second face relative with chip first side, chip first side simultaneously have multiple pads, the chip first side of chip
It is relative with the face of carrier upper plate first of carrier upper plate so that each pad all with the face of carrier upper plate first of carrier upper plate its
In upper plate contact be electrically connected with to form stack architecture, the partial area of chip has is through to chip by chip first side
The opening in the second face, and be open in upper plate opening and the top of groove；Film, there are multiple electrical contacts, be configured at chip
Chip first side simultaneously covers opening, and each electrical contact is electrically connected with metal material and one of pad respectively,
Film simultaneously forms capacitance structure.
The present invention has also been proposed a kind of Handless wireless device for being configured with microphone array, is filled by loudspeaker, connection
Put and communication device is formed, and communicating circuit and microphone are configured with communication device, by attachment means by loudspeaker, logical
It is electrically connected between news circuit and microphone, Handless wireless device is characterised by that microphone array includes:Multiple Mikes
Wind encapsulating structure, each microphone packaging scheme include：Carrier, there is the face of carrier first and the load relative with the face of carrier first
Have the second face, and there are multiple through holes that the face of carrier second is through to by the face of carrier first, there is metal in each through hole
Post, the mask of carrier first is fluted, and the face of carrier first simultaneously has multiple carrier contacts, and the face of carrier second has multiple outer contacts,
Each carrier contact is all electrically connected with through one of metal column and one of them outer contact；Chip, there is chip first
Face and chip second face relative with chip first side, chip first side simultaneously have multiple pads, the chip first side of chip with
The face of carrier first of carrier is relative so that each pad is all electrically connected with one of carrier contact to form storehouse knot
Structure, the partial area of chip has the opening that the face of chip second is through to by chip first side, and makes opening in the top of groove；
Film, there are multiple electrical contacts, be configured at the chip first side of chip and cover opening, and each electrical contact is distinguished
It is electrically connected with metal material and one of pad, film simultaneously forms capacitance structure.
The present invention has also been proposed a kind of Handless wireless device for being configured with microphone array, is by loudspeaker, connection
Device and communication device are formed, and communicating circuit and microphone are configured with communication device, by attachment means by loudspeaker,
It is electrically connected between communicating circuit and microphone, Handless wireless device is characterised by that microphone array includes:Multiple wheats
Gram wind encapsulating structure, each microphone packaging scheme include：Carrier, there is the face of carrier first and relative with the face of carrier first
The face of carrier second, and have multiple through holes that the face of carrier second is through to by the face of carrier first, there is gold in each through hole
Belong to post, the mask of carrier first is fluted, and the face of carrier first simultaneously has multiple carrier contacts, and the face of carrier second has multiple external
Point, each carrier contact are all electrically connected with through one of metal column and one of them outer contact；Carrier upper plate, have and carry
Have the face of upper plate first and carrier upper plate second face relative with the face of carrier upper plate first, carrier upper plate further has multiple by carrying
Tool upper plate first face is through to the upper plate perforation in the face of carrier upper plate second and is through to carrier upper plate the by the face of carrier upper plate first
The upper plate opening in two faces, all there is metal material, the face of carrier upper plate first and the face of carrier upper plate second in the perforation of each upper plate
There are multiple upper plate contacts respectively, each upper plate contact in the face of carrier upper plate first respectively through one of metal material with
One of upper plate contact on the face of carrier upper plate second is electrically connected with, the face of carrier upper plate second of carrier upper plate and the load of carrier
Have that the first face is relative, the one of carrier contact of the upper plate contact of each carrier upper plate carrier respectively with carrier electrically connects
Connect, and upper plate opening connects with groove；Chip, there is chip first side and chip second face relative with chip first side, core
The face of piece first simultaneously has multiple pads, and the chip first side of chip is relative with the face of carrier upper plate first of carrier upper plate so that every
One pad is all electrically connected with to form stack architecture with one of upper plate contact in the face of carrier upper plate first of carrier upper plate,
The partial area of chip, which has, is through to the opening in the face of chip second by chip first side, and is open in upper plate opening and groove
Top；Film, there are multiple electrical contacts, be configured at the chip first side of chip and cover opening, and each is electrically connected with
Point is electrically connected with metal material and one of pad respectively, and film simultaneously forms capacitance structure.
Preferably, the Handless wireless device for being configured with microphone array of the invention, it is characterised in that on chip
It is open as geometry.
Preferably, the Handless wireless device for being configured with microphone array of the invention, it is characterised in that groove floor
Further there are multiple projections.
Preferably, the Handless wireless device for being configured with microphone array of the invention characterized in that, carrier it is recessed
At least one wall of groove is made up of two sides, and angle is formed between two sides；Preferably, angle is less than 180 °.
The Handless wireless device for being configured with microphone array proposed by the invention, microphone therein will be used as and pass
The chip of sensor is placed in the outside of microphone packaging scheme, in addition to making whole encapsulating structure and reducing, also causes inside carrier
As the resonator of complete without hindrance block material, the efficiency of microphone packaging scheme can be enhanced.
The Handless wireless device for being configured with microphone array proposed by the invention, microphone therein is in resonator
Inside adds micro-structural, to form similar diffusion board structure so that sound produces the effect of scattering in resonator, further allows
Microphone packaging scheme can reduce the acoustic echo time to obtain preferable definition.
Brief description of the drawings
The carrier upper schematic diagram of Figure 1A present invention；
Schematic diagram is regarded under the carrier of Figure 1B present invention；
Schematic diagram is regarded under the chip of Fig. 2 present invention；
Schematic diagram is regarded under the chip of Fig. 3 one embodiment of the invention；
The microphone packaging scheme schematic cross-sectional view of Fig. 4 first embodiment of the invention；
The carrier upper plate schematic diagram of Fig. 5 one embodiment of the invention；
The microphone packaging scheme schematic cross-sectional view of Fig. 6 second embodiment of the invention；
The microphone packaging scheme schematic cross-sectional view of Fig. 7 third embodiment of the invention；
The microphone packaging scheme schematic cross-sectional view of Fig. 8 fourth embodiment of the invention；
The wafer schematic diagram of Fig. 9 one embodiment of the invention；
The carrier array schematic diagram of Figure 10 one embodiment of the invention；
The microphone array schematic diagram of Figure 11 fifth embodiment of the invention；
The microphone array schematic diagram of Figure 12 sixth embodiment of the invention；
The microphone packaging scheme encapsulation schematic flow sheet of Figure 13 present invention；
The microphone packaging scheme of Figure 14 present invention is used in the schematic diagram on electronic apparatus；
The microphone packaging scheme of Figure 15 present invention is used in the schematic diagram on notebook；
The microphone packaging scheme of Figure 16 present invention is with schematic diagram on the wireless device；And
The microphone packaging scheme of Figure 17 present invention is used in the schematic diagram on intelligent glasses.
【Primary clustering symbol description】
The chip first side of 12 chip 121
122 123 the second faces of chip of opening
The electrical contact of 124 film 1240
The metal material of 125 pad 128
14 carrier 14b carriers
The seal assembly of 14c carriers 140
The die contacts of 141 the first face of carrier 142
143 the second face of carrier, 144 outer contact
The wall of 145 groove 1450
1450a sides 1450b sides
1452 bottom surface 1452a projections
147 carriers, 148 metal columns of perforation
The first face of carrier upper plate of 16 carrier upper plate 160
The upper plate opening of 161 the second face of carrier upper plate 162
The microphone packaging scheme of 164 upper plate contact 2
2a microphone packaging scheme 2b microphone packaging schemes
2c microphone packaging scheme 2d microphone arrays
The electronic installation of 2e microphone arrays 20
The carrier array of 3 wafer 4
The electronic apparatus of θ angles 6
The process circuit of 60 touch screen 61
62 loudspeakers 64 switch
The step of 66 audio signal reception device 601~604
The screen of 7 notebook 70
The mainboard of 72 keyboard 74
The loudspeaker of 8 wireless device 80
The communication device of 82 attachment means 84
86 communicating circuit, 9 intelligent glasses
The picture frame of 90 display unit 91
The eyeglass of 93 mirror holder 95
Embodiment
To make the purpose of the present invention, technical characteristic and advantage, more correlative technology field personnel it can understand and be able to reality
The present invention is applied, coordinates institute's accompanying drawings herein, illustrates the technical characteristic and embodiment of the present invention in follow-up specification, and enumerate
Preferred embodiment further illustrates that right following examples explanation is not limited to the present invention, and the figure hereinafter to compare
Formula, it is the expression signal relevant with feature of present invention.
It is the upper schematic diagram of carrier 14 of the invention please first to refer to Figure 1A and Figure 1B, Figure 1A simultaneously, and Figure 1B is of the invention
Carrier regards schematic diagram 14 times.As illustrated in figures 1A and ib, carrier 14 of the invention has the first face of carrier 141 and carrier first
Relative the second face of carrier 143 in face 141 and multiple through holes 147 that the second face of carrier 143 is extended through by the first face of carrier 141,
On the first face of carrier 141 and further fluted 145 and multiple carrier contacts 142, the second face of carrier 143 have multiple outer contacts
144, wherein, the carrier contact 142 in the first face of carrier 141 and the outer contact 144 in the second face of carrier 143 are to pass through to pass through each other
Metal column 148 in perforation 147 is electrically connected with mutually；Wherein, carrier 14 can be printed circuit board (PCB), and can be to be injected into
The mode of type is formed as illustrated in figures 1A and ib, and the metal column 148 in carrier contact 142, outer contact 144 and through hole 147
Can be formed with the technology of bonding wire (wire bond).
Then, referring to Fig. 2, being that the lower of chip 12 of the invention regards schematic diagram.As shown in Fig. 2 chip 12 has chip
First face 121, chip second face 123 relative with chip first side 121 and the face of chip second is through to by chip first side 121
123 opening 122, there are multiple pads 125, the number and the carrier of carrier 14 of pad 125 in the chip first side 121 of chip 12
Simultaneously the number of the carrier contact 142 on 141 is identical；In addition, opening 122 can be circular hole, square hole or other geometries, this hair
It is bright not to be any limitation as.
Then, referring to Fig. 3, being that the chip of one embodiment of the invention regards schematic diagram 12 times.As shown in figure 3, chip 12
Chip first side 121 further has film 124, and the opening 122 on chip 12 is completely covered film 124, meanwhile, film
There are multiple electrical contacts 1240 on 124, each electrical contact 1240 is all through metal wire 128 and one of electricity of pad 125
Property connection, film 124 is electrically connected with chip 12；In addition, signal processing electricity can be included in the chip 12 of the present invention
Road and sensor (not shown in the figures), and sensor therein can pass through metal wire 128 and is electrically connected with film 124；In addition,
In preferred embodiment, film 124 is soft and flexible, and its material can be silicon nitride or compound crystal silicon.
Then, referring to Fig. 4, being the schematic cross-sectional view of the microphone packaging scheme 2 of first embodiment of the invention.Such as Fig. 4
Shown, microphone packaging scheme 2 has the carrier 14 as shown in Figure 1A, Figure 1B, and the chip as shown in Figure 3 containing film 124
12, wherein, the chip first side 121 of chip 12 is relative with the first face of carrier 141 of carrier 14 and connects, meanwhile, chip 12
Each pad 125 is all relative with one of carrier contact 142 of carrier 14 and in a manner of chip bonding (flip chip)
Electrical connection is formed, simultaneously groove 145 is completely covered for chip 12.In addition, in the present embodiment, the wall 1450 of groove 145 and
Bottom surface 1452 is configured in a manner of perpendicular to one another, and wall 1450 and bottom surface 1452 are all smooth smooth planes；Mike
Wind encapsulating structure 2 is using chip 12 as sensor, resonator is used as using groove 145 in operation.For example, sound is worked as
It after entering resonator after opening 122, can vibrate the film 124 in opening 122；Due to the vibration of film 124
And the capacitance of the capacitance structure of the formation of film 124 can be changed so that sound signal is vibrated by film 124 to be transformed into electronics
Signal；Then, electric signal is handled by chip 12, and by the electric signal after processing through electrical with pad 125
The carrier contact 142 of connection is spread out of, and thereby can obtain the change of acoustic pressure；Under preferred embodiment, further wrapped in chip 12
Containing integrated circuit (non-schema), this integrated circuit can be a kind of amplifier circuit；In addition, in preferred embodiment, chip
12 further have seal assembly 140 with the outer rim of the joint of carrier 14, then, space between chip 12 and carrier 14 can with it is outer
Boundary completely cuts off；The microphone packaging scheme 2 of component Configuration is completed, can further configure and be placed in others on pedestal (not shown),
And contact 144 and placement rack electric connection (not shown) in addition.
Then, referring to Fig. 5, being the schematic diagram of carrier upper plate 16 of one embodiment of the invention.As shown in figure 5, carrier upper plate
16 have relative the first face of carrier upper plate 160 and the second face of carrier upper plate 161, and have upper plate opening 162 and multiple upper plates to wear
Hole (not shown) is through to the second face of carrier upper plate 161 of carrier upper plate 16 by the first face of carrier upper plate 160 of carrier upper plate 16,
Wherein, upper plate opening 162 and the opening of chip 12 122 are relative, the first face of carrier upper plate 160 of carrier upper plate 16 and carrier upper plate
Simultaneously there are multiple upper plate contacts 164 in second face 161 respectively, the number and carrier of the upper plate contact 164 on the first face of carrier upper plate 160
The number of 14 carrier contact 142 and the number of the pad 125 of chip 12 are identical, it will be apparent that, on the second face of carrier upper plate 161
The number of upper plate contact 164 is also identical with the number of the number of the carrier contact 142 of carrier 14 and the pad 125 of chip 12, carries
Each upper plate contact 164 on the first face of tool upper plate 160 all (is not schemed through the metal material in upper plate perforation (not shown)
Show) and one of upper plate contact 164 in the second face of carrier upper plate 161 be electrically connected with；In preferred embodiment, carrier upper plate
16 can be printed circuit board (PCB), and can be formed in a manner of injection molding, as shown in Figure 5.
Then, referring to Fig. 6, being the microphone packaging scheme 2a schematic cross-sectional views of second embodiment of the invention.Such as Fig. 6 institutes
Showing, microphone packaging scheme 2a includes the carrier 14 as shown in Figure 1A, Figure 1B, as shown in Figure 3 the chip 12 containing film 124,
And carrier upper plate 16 as shown in Figure 5；Wherein, one of face of carrier upper plate 16, such as the second face of carrier upper plate 161, and
The first face of carrier 141 of carrier 14 is relative and connects, and each upper plate contact 164 on the second face of carrier upper plate 161 is all
It is relative with one of carrier contact 142 and connect, wherein, upper plate opening 162 simultaneously connects with groove 145；Carrier upper plate 16
Another face, such as the first face of carrier upper plate 160, and the chip first side 121 of chip 12 are relative, and the pad of chip 12
125 and the upper plate contact 164 in the first face of carrier upper plate 160 be to be electrically connected to each other in a manner of chip bonding, wherein, opening
122 in upper plate opening 162 and the top of groove 145；In addition, signal processing circuit and biography can be included in the chip 12 of the present invention
Sensor (not shown in the figures), and sensor therein can pass through metal wire 128 and is electrically connected with film 124；Microphone package
Structure 2a is using chip 12 as sensor, the chamber impaled using groove 145 and carrier upper plate 16 is used as resonance in running
Chamber, for example, sound is had an effect to film 124 vibrates film 124, and the effect of resonator increase vibration simultaneously allows sound
Sound is more smooth, and the capacitance of capacitance structure that vibrating simultaneously can be formed film 124 changes, so make chip 12 produce by
Sound signal changes the electric signal formed, and then chip 12 connects electric signal by the carrier being electrically connected with pad 125
The outflow of point 142, also, the resonator for increasing carrier upper plate 16 can make the average distribution of acoustic pressure, strengthen the effect of resonator, separately
Outside, carrier upper plate 16 preferably encloses resonator, and being avoided that in encapsulation process has impurity to fall into resonator, influences microphone
Encapsulating structure 2a efficiency；In addition, in preferred embodiment, in the outer rim of chip 12 and the joint of carrier upper plate 16, carrier
Plate 16 and the outer rim of the joint of carrier 14 further have seal assembly 140, then, the space between chip 12 and carrier upper plate 16
It can be hedged off from the outer world, the space between carrier upper plate 16 and carrier 14 can also be hedged off from the outer world；Complete the microphone of component Configuration
Encapsulating structure 2a, can further it configure on other placement racks (not shown), and contact 144 and placement rack (are not schemed in addition
Show) it is electrically connected with.
Then, referring to Fig. 7, microphone packaging scheme 2b schematic cross-sectional views for third embodiment of the invention.Such as Fig. 7 institutes
Show, microphone packaging scheme 2b includes chip 12 and carrier 14b, microphone packaging scheme 2b construction and each position component and figure
Microphone packaging scheme 2 shown in 4 is similar, and maximum difference is, carrier 14b wall 1450 is not smooth burnishing surface,
But there is micro-structural, in an embodiment, micro-structural can be that the wall 1450 of side is by side 1450a and side
1450b is formed, side 1450a one end and carrier 14b the first face of carrier 141 connect, the other end and side 1450b its
Middle one end connects, and bottom surface 1452 of the side 1450b other end then with groove 145 connects, side 1450a, 1450b joint
Form an angle theta, θ<180°；It will be evident that groove 145 has multiple walls 1450, can be it in an embodiment of the present invention
In a wall 1450 there is foregoing micro-structural, can be that two relative walls 1450 have foregoing micro- knot
Structure or each wall 1450 have foregoing micro-structural, but the present invention is not any limitation as.With micro- knot
The wall 1450 of structure can strengthen the resonance effect of the groove 145 as resonator, as microphone packaging scheme 2b operation feelings
Condition is similar with microphone packaging scheme 2,2a, therefore is no longer described in detail；The microphone packaging scheme 2b of component Configuration is completed, can be further
Configuration is on other placement racks (not shown), and contact 144 and placement rack electric connection (not shown) in addition.To be illustrated
It is that the micro-structural that angle is formed is configured with resonator so that the sound in resonator can be scattered, and then cause resonance
The acoustic pressure at each position in chamber is identical, uniform sound field can be formed in resonator, therefore can improve the effect of sound.
Then, referring to Fig. 8, microphone packaging scheme 2c schematic cross-sectional views for fourth embodiment of the invention.Such as Fig. 8 institutes
Show, microphone packaging scheme 2c includes chip 12 and carrier 14c, microphone packaging scheme 2c construction and each position component and figure
Microphone packaging scheme 2 shown in 4 is similar, and maximum difference is, the carrier 14c bottom surface 1452 of groove 145 is not smooth flat
Whole surface, but there is micro-structural, wherein, in an embodiment, micro-structural can have multiple projections on bottom surface 1452
1452a, projection 1452a can be proper alignment or random alignment on bottom surface 1452, and the present invention is not to the micro- of bottom surface 1452
Structural shape restricts；Foregoing micro-structural, can be formed in the lump or smooth in injection moulding
Formed in plane in a manner of etching, the present invention is not any limitation as to this；Wall 1452 with micro-structural can strengthen conduct
The resonance effect of the groove 145 of resonator, function situation and microphone packaging scheme 2,2a as microphone packaging scheme 2c,
2b is similar, therefore is no longer described in detail；The microphone packaging scheme 2c of component Configuration is completed, can further be configured in other placement racks
On (not shown), and contact 144 and placement rack electric connection (not shown) in addition.
In addition, in microphone packaging scheme 2a as shown in Figure 6, micro-structural can be also added, for example, microphone package knot
Structure 2a carrier 14 can add wall 1450a, 1450b as shown in Figure 7 micro-structural, micro- knot of bottom surface as shown in Figure 8 1452
Structure, meanwhile, projection 1452a as shown in Figure 8 can be also added in the second face of the first face of carrier 161 of carrier upper plate 16 using as micro-
Structure.It is noted that the micro-structural that angle is formed is configured with resonator so that the sound in resonator can be dissipated
Penetrate, and then make it that the acoustic pressure at each position in resonator is identical, uniform sound field can be formed in resonator, therefore can improve
The effect of sound.
In preferred embodiment, carrier 14 of the present invention, 14b, 14c length is 1 millimeter~1.6 millimeters, wide
It is 0.5 millimeter~1 millimeter to spend for 2 millimeters~2.8 millimeters, thickness, and in a most preferred embodiment, length is 1.4 millimeters, width is
2.4 millimeters, thickness be 0.6 millimeter；In addition, in preferred embodiment, the thickness of chip 12 of the present invention is 0.2~0.5
Millimeter；In addition, in preferred embodiment, the thickness of carrier upper plate 16 of the present invention is 0.2~0.5 millimeter.
According to microphone packaging scheme 2 provided by the present invention, 2a, 2b, 2c because by chip 12 be placed in carrier 14,
14b, 14c outside, the volume of whole encapsulating structure can be effectively reduced；In addition, present invention provides in microphone package knot
Structure 2,2a, 2b, 2c resonator in add the design of micro-structural, microphone packaging scheme 2,2a, 2b, 2c efficiency can be strengthened.
Then, referring to Fig. 9, the schematic diagram of wafer 3 for one embodiment of the invention.As shown in figure 9, wafer 3 can be beaten
Upper multiple openings 122, and add film 124 as shown in Figure 3, pad 125 and metal material in each opening 122 and periphery
128 grade components, and then wafer 3 can be made to be divided into multiple chips 12.
Followed by referring to Fig. 10, the schematic diagram of carrier array 4 for one embodiment of the invention.As shown in Figure 10, using note
The preparation methods such as shaping are penetrated, a carrier array 4 can be formed, carrier array 4 has multiple carriers as shown in Figure 1A, Figure 1B
14, it will be apparent that, carrier array 4 can also be by multiple carrier 14b as shown in Figure 7 or by multiple carrier 14c as shown in Figure 8
Formed.
Wafer 3 shown in Fig. 9 is engaged with the carrier array 4 shown in Figure 10, makes the pad 125 of each chip 12 can
It is electrically connected with the die contacts 142 of one of carrier 14, then wafer 3 and carrier array 4 is cut simultaneously, just can be obtained
To microphone packaging scheme 2 as shown in Figure 4；As it was previously stated, carrier array 4 can also be by multiple carriers as shown in Figure 7
14b is made up of multiple carrier 14c as shown in Figure 8, what the carrier upper plate 16 that can also be added as shown in Figure 5 was formed
Plate array (non-icon) on carrier, so can also connect by by wafer 3 from different carrier arrays 4, and obtain microphone envelope
Assembling structure 2a, 2b, 2c；In addition, according to the of different sizes of cutting, can also combining wafer 3 and carrier array 4 be cut into as
Shown in Figure 11, by more than one microphone packaging scheme 2 microphone array 2d arranged in parallel formed, it can also be cut into such as figure
The microphone array 2e of 2x2 matrix forms shown in 12, it will be apparent that, microphone array 2e can be the NxN matrixes of other high powers
Form.Microphone array 2d, 2e compared to single existing microphone packaging scheme 2,2b, 2c, can have preferable three-dimensional degree,
Diffusance.
Please referring next to Figure 13, for the method for packing schematic flow sheet of the microphone packaging scheme of the present invention, including：
Step 601：A wafer 3 is provided, wafer 3 is divided into multiple chips 12, and each of which chip 12 has one respectively
Chip opening 122, as shown in figure 9, each chip 12 and having film 124 as shown in Figure 3, pad 125 and metal material 128
Deng component；Wherein, signal processing circuit and sensor (not shown in the figures) can be included in chip 12 of the invention, and wherein
Sensor can pass through metal wire 128 be electrically connected with film 124；
Step 602：The carrier array 4 with multiple carriers 14 is provided, as shown in Figure 10；Wherein, carrier array 4 can be
Formed with injection molding mode；Wherein, in preferred embodiment, it is further provided plate array on a carrier, on carrier
Plate array is divided into multiple carrier upper plates 16, and each carrier upper plate 16 has upper plate opening 162 as shown in Figure 5, multiple upper plates
Contact 164, the second face 161 of each carrier upper plate 16 connect with the first face of carrier 141 of one of carrier 14, and often
The upper plate contact 164 in one the first face of carrier upper plate 160 is electrically connected with a die contacts 142 respectively；
Step 603：Engage wafer 3 and carrier array 4, each described chip 12 can be with one of phase of carrier 14
It is corresponding, and the pad 125 of each chip 12 can be electrically connected with the die contacts 142 of one of carrier 14；Compared with
In good embodiment, before wafer 3 is engaged with carrier array 4, carrier array 4 is first set to be engaged with plate array on carrier, and often
The pad 125 of one chip 12 is electrically connected with through the upper plate contact 164 of carrier upper plate 16 and the die contacts 142 of carrier 14；
And
Step 604：Wafer 3 and carrier array 4 are cut simultaneously, obtain microphone packaging scheme 2,2a, 2b, 2c；
On a carrier is further provided in the embodiment of plate array, also plate array on carrier is cut simultaneously when cutting；It is during cutting
Cut according to the size for each chip 12 being divided on wafer 3；In other examples, also can by wafer 3 and
Carrier array 4 cuts into microphone array 2d, 2e, makes have multiple chips 12 and multiple in each microphone array 2d, 2e
Carrier 14, even more than carrier upper plate 16.
Via microphone packaging scheme 2 set forth above, 2a, 2b, 2c preparation method, it is only necessary to by correction once
Engagement, make microphone packaging scheme 2,2a, 2b, 2c making more convenient, and for by multiple microphone packaging schemes 2,
Microphone array 2d, 2e that 2a, 2b, 2c are combined into, such processing procedure can make the knot between different microphone monomers
Close more firm
Then, Figure 14 is referred to, the schematic diagram being used in for microphone packaging scheme of the invention on electronic apparatus.
As shown in figure 14, an electronic apparatus (mobile terminal electronic device) 6, such as：Intelligent hand
Machine, tablet PC etc., including the component such as touch screen 60, process circuit 61, loudspeaker 62, switch 64, audio signal reception device 66, its
In, at least one process circuit 61 of the inside of electronic apparatus 6, process circuit 61 and touch screen 60, loudspeaker 62, switch
64th, the component electrical communication such as audio signal reception device 66, and the signal from each component can be received, and it is suitable to control each component to make signal
When reaction, for example, when user presses lower switch 64, processor, which will send signal, makes touch screen start or close；Wherein,
Audio signal reception device 66 can use the microphone packaging scheme or microphone array of the present invention.Audio signal reception device 66 is device in movement
In electronic installation 6 anywhere, as it was previously stated, other electronic building bricks inside audio signal reception device 66 and electronic apparatus 3 (not
Icon) electrical communication, enable audio signal reception device 66 to receive audio and send other electronic building bricks (non-icon) to make other processing；This
The microphone packaging scheme 2 of invention can make electronic apparatus 6 have more preferable radio reception ability.
Then, Figure 15 is referred to, the schematic diagram being used in for microphone packaging scheme of the invention on notebook.
As shown in figure 15, notebook 7 includes LCD Panel 70 and keyboard 72, LCD Panel 70 and keyboard 72 be with
The electrical communication of mainboard 74 inside notebook 7, via the input signal of keyboard 72, then after processing by mainboard 74, energy
Control signal is sent to LCD Panel 70 and other assemblies, wherein, it is further configured with the present invention on notebook 7
Microphone packaging scheme or microphone array, and microphone packaging scheme or microphone array can be with devices in notebook
On computer 7 anywhere, for example, it may be outer rim embedded in LCD Panel 70；It is identical with other electronic building bricks, wheat
Gram wind encapsulating structure or microphone array as notebook 7 audio signal reception device and and notebook 7 mainboard
74 are electrically connected with, and microphone packaging scheme or microphone array is received audio and is sent mainboard to and make other processing；This
Invention is configured with microphone packaging scheme or the notebook 7 of microphone array and can have more preferable radio reception ability.
Then, Figure 16 is referred to, the microphone packaging scheme for the present invention is used on the wireless device of Handless
Schematic diagram.As shown in figure 16, the wireless device 8 of Handless is by 84 loudspeaker 80, attachment means 82 and communication device groups
Into, wherein, loudspeaker 80 and communication device 84 are formed by attachment means 82 and connected.In an embodiment of the present invention, communication dress
Communicating circuit 86 and microphone 2 are configured with putting 84；, it is clear that the wireless device 8 of Handless can be by attachment means
82 will be electrically connected between loudspeaker 80, communicating circuit 86 and microphone.Herein it is however emphasized that, microphone package of the invention
Structure or microphone array are to can be only fitted on communication device 84 anywhere, in preferred embodiment, microphone
Encapsulating structure or microphone array be device in the end of communication device 84, therefore when user will be without traditional thread binding with loudspeaker 80
Put when being fixed on ear, microphone packaging scheme or microphone array can be closer to the face of user, the effect of making radio reception compared with
It is good.In addition, after microphone packaging scheme or microphone array are electrically connected with communication device 84, communication device 84 can be wheat
The audio that gram wind encapsulating structure or microphone array receive is further conveyed to other devices；The microphone package of the present invention
Structure 2 can make wireless device 8 have more preferable radio reception ability.
Then, Figure 17 is referred to, the schematic diagram being used in for microphone packaging scheme of the invention on intelligent glasses.Such as
Shown in Figure 17, intelligent glasses 9 are made up of picture frame 91 and a mirror holder 93, wherein, mirror holder 93 is connected with picture frame 91 and position
In the centre position of picture frame 91, contacted for the bridge of the nose with user, meanwhile, electronic installation 20 is configured with mirror holder 93, to conduct
The control of the various displays of intelligent glasses 9.The microphone packaging scheme or microphone array of the present invention can be with device in intelligence
On the mirror holder 93 of energy type glasses 9, and it is electrically connected with electronic installation 20, is used as audio signal reception device.In embodiments of the invention
In, do not limited for the position of microphone packaging scheme or microphone array configuration on mirror holder 93, but would generally try one's best
Be installed in the lower section close to mirror holder 93, with shorten between microphone packaging scheme or microphone array and user's face away from
From so that microphone packaging scheme of the invention or microphone array can make intelligent glasses 9 have more preferable radio reception ability.
In preferred embodiment, picture frame 91 and mirror holder 93 on intelligent glasses 9 are integral injection moldings, and in retaining Mike on mirror holder 93
The space that wind encapsulating structure or microphone array and electronic installation 20 configure；In addition, in the preferred embodiment, can be further
Ground configures a pair of lenses 95 between picture frame 91 and mirror holder 93, can show image signal via the control of electronic installation 20
In eyeglass 95.
Although the present invention is disclosed above with foregoing preferred embodiment, so it is not limited to the present invention, any to be familiar with
The art person, without departing from the spirit and scope of the invention, when a little change and retouching, therefore the present invention can be made
Claim must be defined depending on the appended claim scope institute defender of this specification.
Claims (7)
1. a kind of Handless wireless device for being configured with microphone, is made up of loudspeaker, attachment means and communication device, and
Communicating circuit and microphone are configured with the communication device, it is by the attachment means that the loudspeaker, the communication is electric
It is electrically connected between road and the microphone, the Handless wireless device is characterised by that the microphone includes:
Carrier, there is the face of carrier first and carrier second face relative with the face of carrier first, and have multiple by the carrier
First face is through to the through hole in the face of carrier second, has metal column, the mask of carrier first in each through hole
Fluted, the face of carrier first simultaneously has multiple carrier contacts, and the face of carrier second has multiple outer contacts, each load
Have contact to be all electrically connected with through one of metal column and one of them outer contact；
Carrier upper plate, there is the face of carrier upper plate first and carrier upper plate second face relative with the face of carrier upper plate first, institute
Stating carrier upper plate further there are multiple upper plates for being through to the face of carrier upper plate second by the face of carrier upper plate first to wear
Hole and the upper plate opening that the face of carrier upper plate second is through to by the face of carrier upper plate first, in the perforation of each upper plate all
With metal material, the face of carrier upper plate first and the face of carrier upper plate second have multiple upper plate contacts respectively, described
Each upper plate contact in the face of carrier upper plate first is respectively through on one of metal material and the face of carrier upper plate second
One of upper plate contact be electrically connected with, the face of carrier upper plate second of the carrier upper plate and the load of the carrier
Have that the first face is relative, the upper plate contact in the face of carrier upper plate second of each carrier upper plate respectively with the carrier
One of carrier contact is electrically connected with, and the upper plate opening connects with the groove；
Chip, there is chip first side and chip second face relative with the chip first side, the chip first side simultaneously to have
There are multiple pads, the chip first side of the chip is relative with the face of carrier upper plate first of the carrier upper plate, makes
Each pad be all electrically connected with one of upper plate contact in the face of carrier upper plate first of the carrier upper plate with
Stack architecture is formed, the partial area of the chip has is through to opening for the face of chip second by the chip first side
Mouthful, and the opening is in the upper plate opening and the top of the groove；
Film, there are multiple electrical contacts, be configured at the chip first side of the chip and cover the opening, and often
One electrical contact is electrically connected with metal material and one of pad respectively, and the film simultaneously forms capacitance structure.
2. the as claimed in claim 1 Handless wireless device for being configured with microphone, it is characterised in that the carrier it is recessed
Groove bottom further has multiple projections.
3. the Handless wireless device as claimed in claim 1 for being configured with microphone, it is characterised in that the institute of the carrier
At least one wall for stating groove is made up of two sides, and forms angle between two side.
A kind of 4. Handless wireless device for being configured with microphone array, by loudspeaker, attachment means and communication device institute group
Into, and communicating circuit and microphone are configured with the communication device, it is through described device that the loudspeaker, the communication is electric
It is electrically connected between road and the microphone, the Handless wireless device is characterised by that the microphone array includes:
Multiple microphone packaging schemes, each microphone packaging scheme include：
Carrier, there is the face of carrier first and carrier second face relative with the face of carrier first and have multiple by the carrier the
The through hole in the face of carrier second is simultaneously through to, there is metal column in each through hole, the face of carrier first has
Groove, the face of carrier first simultaneously have multiple carrier contacts, and the face of carrier second has multiple outer contacts, each carrier
Contact is all electrically connected with through one of metal column and one of them outer contact；
Carrier upper plate, there is the face of carrier upper plate first and carrier upper plate second face relative with the face of carrier upper plate first, institute
StateCarrier upper plateFurther there are multiple upper plates for being through to the face of carrier upper plate second by the face of carrier upper plate first to wear
Hole and the upper plate opening that the face of carrier upper plate second is through to by the face of carrier upper plate first, in the perforation of each upper plate all
With metal material, the face of carrier upper plate first and the face of carrier upper plate second have multiple upper plate contacts respectively, described
Each upper plate contact in the face of carrier upper plate first is respectively through on one of metal material and the face of carrier upper plate second
One of upper plate contact be electrically connected with, the face of carrier upper plate second of the carrier upper plate and the load of the carrier
Have that the first face is relative, the upper plate contact in the face of carrier upper plate second of each carrier upper plate respectively with the carrier
One of carrier contact is electrically connected with, and the upper plate opening connects with the groove；
Chip, there is chip first side and chip second face relative with the chip first side, the chip first side simultaneously to have
There are multiple pads, the chip first side of the chip is relative with the face of carrier upper plate first of the carrier upper plate, makes
Each pad be all electrically connected with one of upper plate contact in the face of carrier upper plate first of the carrier upper plate with
Stack architecture is formed, the partial area of the chip has is through to opening for the face of chip second by the chip first side
Mouthful, and the opening is in the upper plate opening and the top of the groove；
Film, there are multiple electrical contacts, be configured at the chip first side of the chip and cover the opening, and often
One electrical contact is electrically connected with metal material and one of pad respectively, and the film simultaneously forms capacitance structure.
5. the Handless wireless device as claimed in claim 4 for being configured with microphone array, it is characterised in that the carrier
Groove floor further there are multiple projections.
6. the Handless wireless device as claimed in claim 4 for being configured with microphone array, it is characterised in that the carrier
At least one wall of the groove be made up of two sides, and form angle between two side.
7. the Handless wireless device as claimed in claim 6 for being configured with microphone array, it is characterised in that the angle
Less than 180 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410201145.8A CN104113795B (en) | 2014-05-13 | 2014-05-13 | It is configured with the Handless wireless device of microphone or microphone array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410201145.8A CN104113795B (en) | 2014-05-13 | 2014-05-13 | It is configured with the Handless wireless device of microphone or microphone array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104113795A CN104113795A (en) | 2014-10-22 |
| CN104113795B true CN104113795B (en) | 2018-01-02 |
Family
ID=51710404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410201145.8A Expired - Fee Related CN104113795B (en) | 2014-05-13 | 2014-05-13 | It is configured with the Handless wireless device of microphone or microphone array |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104113795B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2817236Y (en) * | 2005-03-24 | 2006-09-13 | 立科富科技股份有限公司 | Bluetooth hand-free receiver device |
| CN1937438A (en) * | 2005-09-23 | 2007-03-28 | 三星电子株式会社 | Multi-functional bluetooth headset |
| CN201467440U (en) * | 2009-04-30 | 2010-05-12 | 比亚迪股份有限公司 | Encapsulating structure of MEMS microphone |
| CN101998213A (en) * | 2009-08-22 | 2011-03-30 | 比亚迪股份有限公司 | Packaging structure of MEMS (Micro Electro Mechanical Systems) microphone and wafer packaging method thereof |
| CN102726065A (en) * | 2010-12-30 | 2012-10-10 | 歌尔声学股份有限公司 | A MEMS microphone and method for packaging the same |
| US8624384B1 (en) * | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Bottom port surface mount silicon condenser microphone package |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101426164B (en) * | 2007-11-01 | 2012-10-03 | 财团法人工业技术研究院 | Electroacoustic sensing apparatus |
-
2014
- 2014-05-13 CN CN201410201145.8A patent/CN104113795B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8624384B1 (en) * | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Bottom port surface mount silicon condenser microphone package |
| CN2817236Y (en) * | 2005-03-24 | 2006-09-13 | 立科富科技股份有限公司 | Bluetooth hand-free receiver device |
| CN1937438A (en) * | 2005-09-23 | 2007-03-28 | 三星电子株式会社 | Multi-functional bluetooth headset |
| CN201467440U (en) * | 2009-04-30 | 2010-05-12 | 比亚迪股份有限公司 | Encapsulating structure of MEMS microphone |
| CN101998213A (en) * | 2009-08-22 | 2011-03-30 | 比亚迪股份有限公司 | Packaging structure of MEMS (Micro Electro Mechanical Systems) microphone and wafer packaging method thereof |
| CN102726065A (en) * | 2010-12-30 | 2012-10-10 | 歌尔声学股份有限公司 | A MEMS microphone and method for packaging the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104113795A (en) | 2014-10-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205912258U (en) | Micro electromechanical microphone and electronic system | |
| CN104113809B (en) | Microphone packaging scheme | |
| CN101426164B (en) | Electroacoustic sensing apparatus | |
| CN210986419U (en) | MEMS microphone and electronic device | |
| US9517928B2 (en) | Micromechanical functional apparatus, particularly a loudspeaker apparatus, and appropriate method of manufacture | |
| CN103561376B (en) | MEMS microphone and manufacture method thereof | |
| CN104066041B (en) | The method for packing of microphone and microphone array | |
| CN209526835U (en) | A kind of encapsulating structure of microphone and environmental sensor | |
| CN209072736U (en) | A kind of directive property MEMS microphone | |
| CN202799144U (en) | Micro-electromechanical systems (MEMS) microphone | |
| CN104113795B (en) | It is configured with the Handless wireless device of microphone or microphone array | |
| CN104144365B (en) | Notebook computer configured with microphone or microphone array | |
| CN104080035B (en) | It is configured with the electronic apparatus of microphone or microphone array | |
| WO2023160719A1 (en) | Vibration sensor, electronic device, and vibration detection method | |
| CN104469639B (en) | Microphone array | |
| CN104076529B (en) | Be configured with the intelligent glasses of microphone or microphone array | |
| CN104754480B (en) | MEMS microphone and its manufacturing method | |
| CN204145748U (en) | A kind of MEMS microphone | |
| TW201626526A (en) | Lead frame-based chip carrier used in the fabrication of MEMS transducer packages | |
| CN105744449A (en) | Film speaker and manufacturing method thereof | |
| KR102307550B1 (en) | A microphone package | |
| CN204578775U (en) | A kind of MEMS microphone monomer | |
| CN204291392U (en) | A kind of directive property MEMS microphone of monophone hole | |
| CN203206468U (en) | Mems microphone | |
| CN201898590U (en) | Sounder device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 200060 Shanghai city Xuhui District 7 Guangxi Jinglu No. 3 Building 5 floor Applicant after: Crown Research (Shanghai) Patent Technology Co., Ltd. Address before: 200060 Shanghai city Xuhui District 7 Guangxi Jinglu No. 3 Building 5 floor Applicant before: Hat grinds (Shanghai) Consultancy for Enterprise Management Co., Ltd |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180102 Termination date: 20200513 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |