CN104080035B - It is configured with the electronic apparatus of microphone or microphone array - Google Patents
It is configured with the electronic apparatus of microphone or microphone array Download PDFInfo
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- CN104080035B CN104080035B CN201410201424.4A CN201410201424A CN104080035B CN 104080035 B CN104080035 B CN 104080035B CN 201410201424 A CN201410201424 A CN 201410201424A CN 104080035 B CN104080035 B CN 104080035B
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- carrier
- upper plate
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- microphone
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Abstract
The electronic apparatus of microphone or microphone array, including process circuit are configured with, process circuit and Touch Screen, loudspeaker, switch and microphone, the electronic apparatus are characterised by：Microphone includes carrier, chip, the mask of carrier first of carrier is fluted, chip has the opening run through, covered in the opening of the chip first side of chip with film, the chip first side of chip and the face of carrier first of carrier connect, and the carrier contact on the first face of film and carrier is electrically connected with, the through hole on carrier contact and process carrier extends to the second face and forms multiple outer contacts, and external point is further electrically connected with process circuit.
Description
Technical field
The present invention is on a kind of microphone array, especially with regard to a kind of micro-electromechanical technology (MEMS) microphone package
The array that structure is formed.
Background technology
Microphone is a kind of device converted the sound into as electric signal, can be divided into electrodynamic microphone according to the difference of construction
(Dynamic Microphone), capacitance microphone (Condenser Microphone), electret microphone (Electret
Microphone), carbon leads microphone (Carbon Microphone), aluminium band type microphone (Ribbon Microphone), though
The period so developed has successively respectively, but because a variety of microphones have different qualities and then have different purposes, it is more
Several microphones is still distinctly used in special field now；Wherein, consumption electronic products in the past more uses electret
Microphone, but then start largely to use micro-electro-mechanical microphone (MEMS Microphone) recently.
Micro-electro-mechanical microphone refers to use micro-electromechanical technology (Micro Electrical Mechanical System；
MEMS microphone made of), it is the one kind for belonging to capacitance microphone in principle, the sense audio of microphone is used as generally using chip
Component, chip vibration is changed electric capacity by sound, and then send out electric signal, micro-electro-mechanical microphone built-in can simulate-
Digital quantizer, make that micro-electro-mechanical microphone exports for digital signal, be more conducively connected with electronic product.
As it was previously stated, micro-electro-mechanical microphone is widely used in consumption electronic products, and therefore, in the state of ideal,
The size of micro-electro-mechanical microphone should reduce as far as possible, to meet consumption electronic products are light, thin, short, small characteristic, but now
Micro-electro-mechanical microphone be by among the encapsulating structure of the chip buried micro-electro-mechanical microphone of sensing, such as U.S. Publication patent mostly
US8624384, it is considered herein that such design can be such that the size of micro-electro-mechanical microphone does not reduce further, therefore have and change
The necessity entered.
The content of the invention
According to the demand, the invention provides a kind of method for packing of microphone, when forming microphone packaging scheme,
Chip as sensor is placed in the outside of micro-electro-mechanical microphone packaging structure, to reduce the volume of micro-electro-mechanical microphone；
The inner surface of carrier can also be surface-treated simultaneously, and microphone is formed array each other, to increase the efficiency of microphone.
According to object above, the present invention proposes a kind of electronic apparatus for being configured with microphone, electronic apparatus
In be configured with process circuit, this process circuit and Touch Screen, loudspeaker, switch and microphone are electrically connected with, mobile electron dress
Put and be characterised by that microphone includes：Carrier, there is the face of carrier first and carrier second face relative with the face of carrier first and have
Multiple through holes that the face of carrier second is through to by the face of carrier first, there is metal column, the face of carrier first in each through hole
With a groove, the face of carrier first simultaneously has multiple carrier contacts, and the face of carrier second has multiple outer contacts, and each carrier connects
Point is all electrically connected with through one of metal column and one of them outer contact；Chip, have chip first side and with chip the
The simultaneously relative face of chip second, chip first side simultaneously have multiple pads, the chip first side of chip and the carrier of carrier
It is simultaneously relative so that each pad is all electrically connected with to form stack architecture with one of carrier contact, wherein, chip
Subregion, which has, to be through to the chip opening in the face of chip second by chip first side and makes chip opening in the top of groove；It is thin
Film, there are multiple electrical contacts, be configured at the chip first side of chip and cover opening, and each electrical contact respectively with
Metal material is electrically connected with one of pad, and film simultaneously forms capacitance structure.
According to object above, the present invention has also been proposed a kind of electronic apparatus for being configured with microphone, mobile electron dress
Process circuit is configured with putting, this process circuit is electrically connected with Touch Screen, loudspeaker, switch and microphone, mobile electron
Device is characterised by that microphone includes：Carrier, have the face of carrier first and carrier second face relative with the face of carrier first and
There are multiple through holes that the face of carrier second is through to by the face of carrier first, there is metal column, carrier first in each through hole
Mask is fluted, and the face of carrier first simultaneously has multiple carrier contacts, and the face of carrier second has multiple outer contacts, and each carrier connects
Point is all electrically connected with through one of metal column and one of them outer contact；Carrier upper plate, have the face of carrier upper plate first and
Carrier upper plate second face relative with the face of carrier upper plate first, carrier upper plate are further passed through with multiple by the face of carrier upper plate first
The upper plate opening in the face of carrier upper plate second is worn to the upper plate perforation in the face of carrier upper plate second and is through to by the face of carrier upper plate first,
All there is metal material in the perforation of each upper plate, the face of carrier upper plate first and the face of carrier upper plate second have multiple upper plates respectively
Contact, each upper plate contact in the face of carrier upper plate first is respectively through one of metal material and the face of carrier upper plate second
On one of upper plate contact be electrically connected with, the face of carrier upper plate second of carrier upper plate is relative with the face of carrier first of carrier,
The upper plate contact in the face of carrier upper plate second of each carrier upper plate is electrically connected with one of carrier contact of carrier respectively,
And upper plate opening connects with groove；Chip, there is chip first side and chip second face relative with chip first side, and chip
First face simultaneously has multiple pads, and the chip first side of chip is relative with the face of carrier upper plate first of carrier upper plate so that each
Individual weld pad disk is all electrically connected with to form stack architecture with one of upper plate contact in the face of carrier upper plate first of carrier upper plate,
The subregion of chip has the chip opening that the face of chip second is through to by chip first side, and chip opening is in upper plate opening
And the top of groove；Film, there are multiple electrical contacts, be configured at the chip first side of chip and cover chip opening, and
Each electrical contact is electrically connected with metal material and one of pad respectively, and film simultaneously forms capacitance structure.
The present invention has also been proposed a kind of electronic apparatus for being configured with microphone array, is configured with electronic apparatus
Process circuit, this process circuit are electrically connected with Touch Screen, loudspeaker, switch and microphone array, electronic apparatus
It is characterised by that microphone array includes：Carrier, there is the face of carrier first and carrier second face relative with the face of carrier first and have
Multiple through holes that the face of carrier second is through to by the face of carrier first, there is metal column, the face of carrier first in each through hole
With groove, the face of carrier first simultaneously has multiple carrier contacts, and the face of carrier second has multiple outer contacts, each carrier contact
All it is electrically connected with through one of metal column and one of them outer contact；Carrier upper plate, have the face of carrier upper plate first and with
The relative face of carrier upper plate second in the face of carrier upper plate first, carrier upper plate are further run through with multiple by the face of carrier upper plate first
The upper plate opening in the face of carrier upper plate second is through to the upper plate perforation in the face of carrier upper plate second and by the face of carrier upper plate first, often
All there is metal material, the face of carrier upper plate first and the face of carrier upper plate second respectively there are multiple upper plates to connect in one upper plate perforation
Point, each upper plate contact in the face of carrier upper plate first is respectively through on one of metal material and the face of carrier upper plate second
One of them upper plate contact is electrically connected with, and the face of carrier upper plate second of carrier upper plate is relative with the face of carrier first of carrier, each
The upper plate contact in the face of carrier upper plate second of individual carrier upper plate is electrically connected with one of carrier contact of carrier respectively, and
Upper plate opening connects with groove；Chip, there is chip first side and chip second face relative with chip first side, and chip
Simultaneously and there are multiple pads, the chip first side of chip is relative with the face of carrier upper plate first of carrier upper plate so that each
Pad is all electrically connected with to form stack architecture, chip with one of upper plate contact in the face of carrier upper plate first of carrier upper plate
Subregion have the chip opening in the face of chip second be through to by chip first side, and chip opening is in upper plate opening and recessed
The top of groove；Film, there are multiple electrical contacts, be configured at the chip first side of chip and cover chip opening, and it is each
Individual electrical contact is electrically connected with metal material and one of pad respectively, and film simultaneously forms capacitance structure.
Preferably, electronic apparatus of the invention, it is characterised in that the chip opening on chip is geometry.
Preferably, electronic apparatus of the invention, it is characterised in that groove floor further has multiple projections.
Preferably, electronic apparatus of the invention, it is characterised in that at least one wall of the groove of carrier is by two
Side is formed, and angle is formed between two sides；Preferably, angle is less than 180 °.
Preferably, electronic apparatus of the invention is one of intelligent mobile phone and tablet PC.
The electronic apparatus for being configured with microphone or microphone array proposed by the invention, microphone therein will be made
The outside of microphone packaging scheme is placed in for the chip of sensor, in addition to making whole encapsulating structure and reducing, also causes carrier
The internal efficiency that microphone packaging scheme as the resonator of complete without hindrance block material, can be enhanced.
Brief description of the drawings
The carrier upper schematic diagram of Figure 1A present invention；
Schematic diagram is regarded under the carrier of Figure 1B present invention；
Schematic diagram is regarded under the chip of Fig. 2 present invention；
Schematic diagram is regarded under the chip of Fig. 3 one embodiment of the invention；
The microphone packaging scheme schematic cross-sectional view of Fig. 4 first embodiment of the invention；
The carrier upper plate schematic diagram of Fig. 5 one embodiment of the invention；
The microphone packaging scheme schematic cross-sectional view of Fig. 6 second embodiment of the invention；
The microphone packaging scheme schematic cross-sectional view of Fig. 7 third embodiment of the invention；
The microphone packaging scheme schematic cross-sectional view of Fig. 8 fourth embodiment of the invention；
The wafer schematic diagram of Fig. 9 one embodiment of the invention；
The carrier array schematic diagram of Figure 10 one embodiment of the invention；
The microphone array schematic diagram of Figure 11 fifth embodiment of the invention；
The microphone array schematic diagram of Figure 12 sixth embodiment of the invention；
The microphone packaging scheme encapsulation schematic flow sheet of Figure 13 present invention；
The microphone packaging scheme of Figure 14 present invention is used in the schematic diagram on electronic apparatus；
The microphone packaging scheme of Figure 15 present invention is used in the schematic diagram on notebook；
The microphone packaging scheme of Figure 16 present invention is with schematic diagram on the wireless device；And
The microphone packaging scheme of Figure 17 present invention is used in the schematic diagram on intelligent glasses.
【Primary clustering symbol description】
The chip first side of 12 chip 121
The second face of chip of 122 chip opening 123
The electrical contact of 124 film 1240
The metal material of 125 pad 128
14 carrier 14b carriers
The seal assembly of 14c carriers 140
The die contacts of 141 the first face of carrier 142
143 the second face of carrier, 144 outer contact
The wall of 145 groove 1450
1450a sides 1450b sides
1452 bottom surface 1452a projections
147 carriers, 148 metal columns of perforation
The first face of carrier upper plate of 16 carrier upper plate 160
The upper plate opening of 161 the second face of carrier upper plate 162
The microphone packaging scheme of 164 upper plate contact 2
2a microphone packaging scheme 2b microphone packaging schemes
2c microphone packaging scheme 2d microphone arrays
The electronic installation of 2e microphone arrays 20
The carrier array of 3 wafer 4
The electronic apparatus of θ angles 6
The process circuit of 60 touch screen 61
62 loudspeakers 64 switch
The step of 66 audio signal reception device 601~604
The screen of 7 notebook 70
The mainboard of 72 keyboard 74
The loudspeaker of 8 wireless device 80
The communication device of 82 attachment means 84
86 communicating circuit, 9 intelligent glasses
The picture frame of 90 display unit 91
The eyeglass of 93 mirror holder 95
Embodiment
To make the purpose of the present invention, technical characteristic and advantage, more correlative technology field personnel it can understand and be able to reality
The present invention is applied, coordinates institute's accompanying drawings herein, illustrates the technical characteristic and embodiment of the present invention in follow-up specification, and enumerate
Preferred embodiment further illustrates that right following examples explanation is not limited to the present invention, and the figure hereinafter to compare
Formula, it is the expression signal relevant with feature of present invention.
It is the upper schematic diagram of carrier 14 of the invention please first to refer to Figure 1A and Figure 1B, Figure 1A simultaneously, and Figure 1B is of the invention
Carrier regards schematic diagram 14 times.As illustrated in figures 1A and ib, carrier 14 of the invention has the first face of carrier 141 and carrier first
Relative the second face of carrier 143 in face 141 and multiple through holes 147 that the second face of carrier 143 is extended through by the first face of carrier 141,
On the first face of carrier 141 and further fluted 145 and multiple carrier contacts 142, the second face of carrier 143 have multiple outer contacts
144, wherein, the carrier contact 142 in the first face of carrier 141 and the outer contact 144 in the second face of carrier 143 are to pass through to pass through each other
Metal column 148 in perforation 147 is electrically connected with mutually；Wherein, carrier 14 can be printed circuit board (PCB), and can be to be injected into
The mode of type is formed as illustrated in figures 1A and ib, and the metal column 148 in carrier contact 142, outer contact 144 and through hole 147
Can be formed with the technology of bonding wire (wire bond).
Then, referring to Fig. 2, being that the lower of chip 12 of the invention regards schematic diagram.As shown in Fig. 2 chip 12 has chip
First face 121, chip second face 123 relative with chip first side 121 and the face of chip second is through to by chip first side 121
123 chip opening 122, there are multiple pads 125, the number and the core of carrier 14 of pad 125 in the chip first side 121 of chip 12
The number of carrier contact 142 on the first face of piece 141 is identical；In addition, chip opening 122 can be circular hole, square hole or other geometry
Shape, the present invention are not any limitation as.
Then, referring to Fig. 3, being that the chip of one embodiment of the invention regards schematic diagram 12 times.As shown in figure 3, chip 12
Chip first side 121 further has film 124, and the chip opening 122 on chip 12 is completely covered film 124, meanwhile, it is thin
There are multiple electrical contacts 1240 on film 124, each electrical contact 1240 is all through metal wire 128 and one of pad 125
It is electrically connected with, film 124 is electrically connected with chip 12；Handled in addition, signal can be included in the chip 12 of the present invention
Circuit and sensor (not shown in the figures), and sensor therein can pass through metal wire 128 and is electrically connected with film 124；Separately
Outside, in preferred embodiment, film 124 is soft and flexible, and its material can be silicon nitride or compound crystal silicon.
Then, referring to Fig. 4, being the schematic cross-sectional view of the microphone packaging scheme 2 of first embodiment of the invention.Such as Fig. 4
Shown, microphone packaging scheme 2 has the carrier 14 as shown in Figure 1A, Figure 1B, and the chip as shown in Figure 3 containing film 124
12, wherein, the chip first side 121 of chip 12 is relative with the first face of carrier 141 of carrier 14 and connects, meanwhile, chip 12
Each pad 125 is all relative with one of carrier contact 142 of carrier 14 and in a manner of chip bonding (flip chip)
Electrical connection is formed, simultaneously groove 145 is completely covered for chip 12.In addition, in the present embodiment, the wall 1450 of groove 145 and
Bottom surface 1452 is configured in a manner of perpendicular to one another, and wall 1450 and bottom surface 1452 are all smooth smooth planes；Mike
Wind encapsulating structure 2 is using chip 12 as sensor, resonator is used as using groove 145 in operation.For example, sound is worked as
It after entering resonator after chip opening 122, can vibrate the film 124 in chip opening 122；Due to film
124 vibration and can change film 124 formation capacitance structure capacitance so that sound signal by film 124 vibrate and
It is transformed into electric signal；Then, electric signal is handled by chip 12, and the electric signal after processing is passed through and weldering
The carrier contact 142 that disk 125 is electrically connected with is spread out of, and thereby can obtain the change of acoustic pressure；Under preferred embodiment, in chip 12
Integrated circuit (non-schema) is further included, this integrated circuit can be a kind of amplifier circuit；In addition, in preferred embodiment
In, chip 12 and the outer rim of the joint of carrier 14 further have seal assembly 140, then, the sky between chip 12 and carrier 14
Between can be hedged off from the outer world；The microphone packaging scheme 2 of component Configuration is completed, can further configure and place pedestal (not in others
Diagram) on, and contact 144 and placement rack electric connection (not shown) in addition.
Then, referring to Fig. 5, being the schematic diagram of carrier upper plate 16 of one embodiment of the invention.As shown in figure 5, carrier upper plate
16 have relative the first face of carrier upper plate 160 and the second face of carrier upper plate 161, and have upper plate opening 162 and multiple upper plates to wear
Hole (not shown) is through to the face of carrier upper plate second of carrier upper plate 16 by the carrier upper plate first surface 160 of carrier upper plate 16
161, wherein, the chip opening 122 of upper plate opening 162 and chip 12 is relative, the first face of carrier upper plate 160 of carrier upper plate 16 and
Simultaneously there are multiple upper plate contacts 164 in the second face of carrier upper plate 161 respectively, the number of the upper plate contact 164 on the first face of carrier upper plate 160
The number of mesh and the carrier contact 142 of carrier 14 and the number of the pad 125 of chip 12 are identical, it will be apparent that, carrier upper plate second
The number of upper plate contact 164 on face 161 also with the number of the carrier contact 142 of carrier 14 and the number of the pad 125 of chip 12
Mesh is identical, and each upper plate contact 164 on the first face of carrier upper plate 160 is all through the metal material in upper plate perforation (not shown)
Material (not shown) and one of upper plate contact 164 in the second face of carrier upper plate 161 are electrically connected with；In preferred embodiment,
Carrier upper plate 16 can be printed circuit board (PCB), and can be formed in a manner of injection molding, as shown in Figure 5.
Then, referring to Fig. 6, being the microphone packaging scheme 2a schematic cross-sectional views of second embodiment of the invention.Such as Fig. 6 institutes
Showing, microphone packaging scheme 2a includes the carrier 14 as shown in Figure 1A, Figure 1B, as shown in Figure 3 the chip 12 containing film 124,
And carrier upper plate 16 as shown in Figure 5；Wherein, one of surface of carrier upper plate 16, such as the second face of carrier upper plate 161,
It is relative with the first face of carrier 141 of carrier 14 and connect, and each upper plate contact 164 on the second face of carrier upper plate 161
It is all relative with one of carrier contact 142 and connect, wherein, upper plate opening 162 simultaneously connects with groove 145；Carrier upper plate 16
Another surface, such as the first face of carrier upper plate 160, and the chip first side 121 of chip 12 is relative, and the weldering of chip 12
The upper plate contact 164 of disk 125 and carrier upper plate first surface 160 is electrically connected to each other in a manner of chip bonding, wherein, core
Piece opening 122 is in upper plate opening 162 and the top of groove 145；In addition, signal processing electricity can be included in the chip 12 of the present invention
Road and sensor (not shown in the figures), and sensor therein can pass through metal wire 128 and is electrically connected with film 124；Mike
Wind encapsulating structure 2a is using chip 12 as sensor, the chamber impaled with groove 145 and carrier upper plate 16 is made in running
For resonator, for example, sound is had an effect to film 124 vibrates film 124, the effect of resonator increase vibration
And make sound more smooth, vibrate and the capacitance of the capacitance structure of the formation of film 124 can be made to change, and then make chip 12
Produce by the electric signal that forms of sound signal transformation, then chip 12 by electric signal by being electrically connected with pad 125
Carrier contact 142 is spread out of, also, the resonator for increasing carrier upper plate 16 can make the average distribution of acoustic pressure, strengthen resonator
Effect, in addition, carrier upper plate 16 preferably encloses resonator, being avoided that in encapsulation process has impurity to fall into resonator, shadow
Ring microphone packaging scheme 2a efficiency；In addition, in preferred embodiment, chip 12 is outer with the joint of carrier upper plate 16
Edge, carrier upper plate 16 and the outer rim of the joint of carrier 14 further have seal assembly 140, then, chip 12 and carrier upper plate 16
Between space can be hedged off from the outer world, the space between carrier upper plate 16 and carrier 14 can also be hedged off from the outer world；Component is completed to match somebody with somebody
The microphone packaging scheme 2a put, can further it configure on other placement racks (not shown), and contact 144 and put in addition
Put seat electric connection (not shown).
Then, referring to Fig. 7, microphone packaging scheme 2b schematic cross-sectional views for third embodiment of the invention.Such as Fig. 7 institutes
Show, microphone packaging scheme 2b includes chip 12 and carrier 14b, microphone packaging scheme 2b construction and each position component and figure
Microphone packaging scheme 2 shown in 4 is similar, and maximum difference is, carrier 14b wall 1450 is not smooth burnishing surface,
But there is micro-structural, in an embodiment, micro-structural can be that the wall 1450 of side is by side 1450a and side
1450b is formed, side 1450a one end and carrier 14b the first face of carrier 141 connect, the other end and side 1450b its
Middle one end connects, and bottom surface 1452 of the side 1450b other end then with groove 145 connects, and side 1450a, 1450b connect
Place forms an angle theta, θ<180°；It will be evident that groove 145 has multiple walls 1450, in an embodiment of the present invention, Ke Yishi
One of wall 1450 has foregoing micro-structural, and it is foregoing micro- to be that two relative walls 1450 have
Structure or each wall 1450 have foregoing micro-structural, but the present invention is not any limitation as.With micro-
The wall 1450 of structure can strengthen the resonance effect of the groove 145 as resonator, as microphone packaging scheme 2b operation
Situation is similar with microphone packaging scheme 2,2a, therefore is no longer described in detail；The microphone packaging scheme 2b of component Configuration is completed, one can be entered
Step configuration is on other placement racks (not shown), and contact 144 and placement rack electric connection (not shown) in addition.To be illustrated
It is that the micro-structural that angle is formed is configured with resonator so that the sound in resonator can be scattered, and then cause resonance
The acoustic pressure at each position in chamber is identical, uniform sound field can be formed in resonator, therefore can improve the effect of sound.
Then, referring to Fig. 8, microphone packaging scheme 2c schematic cross-sectional views for fourth embodiment of the invention.Such as Fig. 8 institutes
Show, microphone packaging scheme 2c includes chip 12 and carrier 14c, microphone packaging scheme 2c construction and each position component and figure
Microphone packaging scheme 2 shown in 4 is similar, and maximum difference is, the carrier 14c bottom surface 1452 of groove 145 is not smooth flat
Whole surface, but there is micro-structural, wherein, in an embodiment, micro-structural can have multiple projections on bottom surface 1452
1452a, projection 1452a can be proper alignment or random alignment on bottom surface 1452, and the present invention is not to the micro- of bottom surface 1452
Structural shape restricts；Foregoing micro-structural, can be formed in the lump or smooth in injection moulding
Formed in plane in a manner of etching, the present invention is not any limitation as to this；Wall 1452 with micro-structural can strengthen conduct
The resonance effect of the groove 145 of resonator, function situation and microphone packaging scheme 2,2a as microphone packaging scheme 2c,
2b is similar, therefore is no longer described in detail；The microphone packaging scheme 2c of component Configuration is completed, can further be configured in other placement racks
On (not shown), and contact 144 and placement rack electric connection (not shown) in addition.
In addition, in microphone packaging scheme 2a as shown in Figure 6, micro-structural can be also added, for example, microphone package knot
Structure 2a carrier 14 can add wall 1450a, 1450b as shown in Figure 7 micro-structural, micro- knot of bottom surface as shown in Figure 8 1452
Structure, meanwhile, projection 1452a as shown in Figure 8 can be also added in the second face of carrier upper plate 161 of carrier upper plate 16 to be used as micro- knot
Structure.It is noted that the micro-structural that angle is formed being configured with resonator so that the sound in resonator can be scattered,
And then make it that the acoustic pressure at each position in resonator is identical, uniform sound field can be formed in resonator, therefore sound can be improved
The effect of sound.
In preferred embodiment, carrier 14 of the present invention, 14b, 14c length is 1 millimeter~1.6 millimeters, wide
It is 0.5 millimeter~1 millimeter to spend for 2 millimeters~2.8 millimeters, thickness, and in a most preferred embodiment, length is 1.4 millimeters, width is
2.4 millimeters, thickness be 0.6 millimeter；In addition, in preferred embodiment, the thickness of chip 12 of the present invention is 0.2~0.5
Millimeter；In addition, in preferred embodiment, the thickness of carrier upper plate 16 of the present invention is 0.2~0.5 millimeter.
According to microphone packaging scheme 2 provided by the present invention, 2a, 2b, 2c because by chip 12 be placed in carrier 14,
14b, 14c outside, the volume of whole encapsulating structure can be effectively reduced；In addition, present invention provides in microphone package knot
Structure 2,2a, 2b, 2c resonator in add the design of micro-structural, microphone packaging scheme 2,2a, 2b, 2c efficiency can be strengthened.
Then, referring to Fig. 9, the schematic diagram of wafer 3 for one embodiment of the invention.As shown in figure 9, wafer 3 can be beaten
Upper multiple chip openings 122, and each chip opening 122 and periphery plus film 124 as shown in Figure 3, pad 125 and
The grade component of metal material 128, and then wafer 3 can be made to be divided into multiple chips 12.
Followed by referring to Fig. 10, the schematic diagram of carrier array 4 for one embodiment of the invention.As shown in Figure 10, using note
The preparation methods such as shaping are penetrated, a carrier array 4 can be formed, carrier array 4 has multiple carriers as shown in Figure 1A, Figure 1B
14, it will be apparent that, carrier array 4 can also be by multiple carrier 14b as shown in Figure 7 or by multiple carrier 14c as shown in Figure 8
Formed.
Wafer 3 shown in Fig. 9 is engaged with the carrier array 4 shown in Figure 10, makes the pad 125 of each chip 12 can
It is electrically connected with the die contacts 142 of one of carrier 14, then wafer 3 and carrier array 4 is cut simultaneously, just can be obtained
To microphone packaging scheme 2 as shown in Figure 4；As it was previously stated, carrier array 4 can also be by multiple carriers as shown in Figure 7
14b is made up of multiple carrier 14c as shown in Figure 8, what the carrier upper plate 16 that can also be added as shown in Figure 5 was formed
Plate array (non-icon) on carrier, so can also connect by by wafer 3 from different carrier arrays 4, and obtain microphone envelope
Assembling structure 2a, 2b, 2c；In addition, according to the of different sizes of cutting, can also combining wafer 3 be cut into carrier array 4
As shown in figure 11, by more than one microphone packaging scheme 2 microphone array 2d arranged in parallel formed, can also be cut into as
The microphone array 2e of 2x2 matrix forms shown in Figure 12, it will be apparent that, microphone array 2e can be the NxN squares of other high powers
Formation formula.Microphone array 2d, 2e can have preferably three-dimensional compared to single existing microphone packaging scheme 2,2b, 2c
Degree, diffusance.
Please referring next to Figure 13, for the method for packing schematic flow sheet of the microphone packaging scheme of the present invention, including：
Step 601：A wafer 3 is provided, wafer 3 is divided into multiple chips 12, and each of which chip 12 has one respectively
Chip opening 122, as shown in figure 9, each chip 12 and having film 124 as shown in Figure 3, pad 125 and metal material 128
Deng component；Wherein, signal processing circuit and sensor (not shown in the figures) can be included in chip 12 of the invention, and wherein
Sensor can pass through metal wire 128 be electrically connected with film 124；
Step 602：The carrier array 4 with multiple carriers 14 is provided, as shown in Figure 10；Wherein, carrier array 4 can be
Formed with injection molding mode；Wherein, in preferred embodiment, it is further provided plate array on a carrier, on carrier
Plate array is divided into multiple carrier upper plates 16, and each carrier upper plate 16 has upper plate opening 162 as shown in Figure 5, multiple upper plates
Contact 164, the second face of carrier upper plate 161 of each carrier upper plate 16 and the first face of carrier 141 of one of carrier 14
Connect, and the upper plate contact 164 in each the first face of carrier upper plate 160 is electrically connected with a die contacts 142 respectively；
Step 603：Engage wafer 3 and carrier array 4, each described chip 12 can be with one of phase of carrier 14
It is corresponding, and the pad 125 of each chip 12 can be electrically connected with the die contacts 142 of one of carrier 14；Compared with
In good embodiment, before wafer 3 is engaged with carrier array 4, carrier array 4 is first set to be engaged with plate array on carrier, and often
The pad 125 of one chip 12 is electrically connected with through the upper plate contact 164 of carrier upper plate 16 and the die contacts 142 of carrier 14；
And
Step 604：Wafer 3 and carrier array 4 are cut simultaneously, obtain microphone packaging scheme 2,2a, 2b, 2c；
On a carrier is further provided in the embodiment of plate array, also plate array on carrier is cut simultaneously when cutting；It is during cutting
Cut according to the size for each chip 12 being divided on wafer 3；In other examples, also can by wafer 3 and
Carrier array 4 cuts into microphone array 2d, 2e, makes have multiple chips 12 and multiple in each microphone array 2d, 2e
Carrier 14, even more than carrier upper plate 16.
Via microphone packaging scheme 2 set forth above, 2a, 2b, 2c preparation method, it is only necessary to by correction once
Engagement, make microphone packaging scheme 2,2a, 2b, 2c making more convenient, and for by multiple microphone packaging schemes 2,
Microphone array 2d, 2e that 2a, 2b, 2c are combined into, such processing procedure can make the knot between different microphone monomers
Close more firm.
Then, Figure 14 is referred to, the schematic diagram being used in for microphone packaging scheme of the invention on electronic apparatus.
As shown in figure 14, an electronic apparatus (mobile terminal electronic device) 6, such as：Intelligent hand
Machine, tablet PC etc., including the component such as touch screen 60, process circuit 61, loudspeaker 62, switch 64, audio signal reception device 66, its
In, at least one process circuit 61 of the inside of electronic apparatus 6, process circuit 61 and touch screen 60, loudspeaker 62, switch
64th, the component electrical communication such as audio signal reception device 66, and the signal from each component can be received, and it is suitable to control each component to make signal
When reaction, for example, when user presses lower switch 64, processor, which will send signal, makes touch screen start or close；Wherein,
Audio signal reception device 66 can use the microphone packaging scheme or microphone array of the present invention.Audio signal reception device 66 is device in movement
In electronic installation 6 anywhere, as it was previously stated, other electronic building bricks inside audio signal reception device 66 and electronic apparatus 3 (not
Icon) electrical communication, enable audio signal reception device 66 to receive audio and send other electronic building bricks (non-icon) to make other processing；This
The microphone packaging scheme 2 of invention can make electronic apparatus 6 have more preferable radio reception ability.
Then, Figure 15 is referred to, the schematic diagram being used in for microphone packaging scheme of the invention on notebook.
As shown in figure 15, notebook 7 includes LCD Panel 70 and keyboard 72, LCD Panel 70 and keyboard 72 be with
The electrical communication of mainboard 74 inside notebook 7, via the input signal of keyboard 72, then after processing by mainboard 74, energy
Control signal is sent to LCD Panel 70 and other assemblies, wherein, it is further configured with the present invention on notebook 7
Microphone packaging scheme or microphone array, and microphone packaging scheme or microphone array can be with devices in notebook
On computer 7 anywhere, for example, it may be outer rim embedded in LCD Panel 70；It is identical with other electronic building bricks, wheat
Gram wind encapsulating structure or microphone array as notebook 7 audio signal reception device and and notebook 7 mainboard
74 are electrically connected with, and microphone packaging scheme or microphone array is received audio and is sent mainboard to and make other processing；This
Invention is configured with microphone packaging scheme or the notebook 7 of microphone array and can have more preferable radio reception ability.
Then, Figure 16 is referred to, the microphone packaging scheme for the present invention is used on the wireless device of Handless
Schematic diagram.As shown in figure 16, the wireless device 8 of Handless is by 84 loudspeaker 80, attachment means 82 and communication device groups
Into, wherein, loudspeaker 80 and communication device 84 are formed by attachment means 82 and connected.In an embodiment of the present invention, communication dress
Communicating circuit 86 and microphone 2 are configured with putting 84；, it is clear that the wireless device 8 of Handless can be by attachment means
82 will be electrically connected between loudspeaker 80, communicating circuit 86 and microphone.Herein it is however emphasized that, microphone package of the invention
Structure or microphone array are to can be only fitted on communication device 84 anywhere, in preferred embodiment, microphone
Encapsulating structure or microphone array be device in the end of communication device 84, therefore when user will be without traditional thread binding with loudspeaker 80
Put when being fixed on ear, microphone packaging scheme or microphone array can be closer to the face of user, the effect of making radio reception compared with
It is good.In addition, after microphone packaging scheme or microphone array are electrically connected with communication device 84, communication device 84 can be wheat
The audio that gram wind encapsulating structure or microphone array receive is further conveyed to other devices；The microphone package of the present invention
Structure 2 can make wireless device 8 have more preferable radio reception ability.
Then, Figure 17 is referred to, the schematic diagram being used in for microphone packaging scheme of the invention on intelligent glasses.Such as
Shown in Figure 17, intelligent glasses 9 are made up of picture frame 91 and a mirror holder 93, wherein, mirror holder 93 is connected with picture frame 91 and position
In the centre position of picture frame 91, contacted for the bridge of the nose with user, meanwhile, electronic installation 20 is configured with mirror holder 93, to conduct
The control of the various displays of intelligent glasses 9.The microphone packaging scheme or microphone array of the present invention can be with device in intelligence
On the mirror holder 93 of energy type glasses 9, and it is electrically connected with electronic installation 20, is used as audio signal reception device.In embodiments of the invention
In, do not limited for the position of microphone packaging scheme or microphone array configuration on mirror holder 93, but would generally try one's best
Be installed in the lower section close to mirror holder 93, with shorten between microphone packaging scheme or microphone array and user's face away from
From so that microphone packaging scheme of the invention or microphone array can make intelligent glasses 9 have more preferable radio reception ability.
In one preferred embodiment, picture frame 91 and mirror holder 93 on intelligent glasses 9 are integral injection moldings, and in retaining wheat on mirror holder 93
The space that gram wind encapsulating structure or microphone array and electronic installation 20 configure；In addition, in a preferred embodiment, Ke Yijin
A pair of lenses 95 is configured to one step between picture frame 91 and mirror holder 93, can be via the control of electronic installation 20, by image signal
It is shown in eyeglass 95.
Although the present invention is disclosed above with foregoing preferred embodiment, so it is not limited to the present invention, any to be familiar with
The art person, without departing from the spirit and scope of the invention, when a little change and retouching, therefore the present invention can be made
Claim must be defined depending on the appended claim scope institute defender of this specification.
Claims (8)
1. a kind of electronic apparatus for being configured with microphone, process circuit is configured in the electronic apparatus, this processing electricity
Road is electrically connected with Touch Screen, loudspeaker, switch and microphone, and the electronic apparatus is characterised by：The Mike
Bellows chamber includes：
Carrier, there is the face of carrier first and carrier second face relative with the face of carrier first and have multiple by the carrier the
The through hole in the face of carrier second is simultaneously through to, there is metal column in each through hole, the face of carrier first has
Groove, the face of carrier first simultaneously have multiple carrier contacts, and the face of carrier second has multiple outer contacts, each carrier
Contact is all electrically connected with through one of metal column and one of them outer contact；
Carrier upper plate, there is the face of carrier upper plate first and carrier upper plate second face relative with the face of carrier upper plate first, institute
Stating carrier upper plate further there are multiple upper plates for being through to the face of carrier upper plate second by the face of carrier upper plate first to wear
Hole and the upper plate opening that the face of carrier upper plate second is through to by the face of carrier upper plate first, in the perforation of each upper plate all
With metal material, the face of carrier upper plate first and the face of carrier upper plate second have multiple upper plate contacts respectively, described
Each upper plate contact in the face of carrier upper plate first is respectively through on one of metal material and the face of carrier upper plate second
One of upper plate contact be electrically connected with, the face of carrier upper plate second of the carrier upper plate and the load of the carrier
Have that the first face is relative, the upper plate contact in the face of carrier upper plate second of each carrier upper plate respectively with the carrier
One of carrier contact is electrically connected with, and the upper plate opening connects with the groove；
Chip, there is chip first side and chip second face relative with the chip first side, the chip first side simultaneously to have
There are multiple pads, the chip first side of the chip is relative with the face of carrier upper plate first of the carrier upper plate, makes
Each pad be all electrically connected with one of upper plate contact in the face of carrier upper plate first of the carrier upper plate with
Stack architecture is formed, the subregion of the chip has the chip that the face of chip second is through to by the chip first side
Opening, and the chip opening is in the upper plate opening and the top of the groove；
Film, there are multiple electrical contacts, be configured at the chip first side of the chip and cover the chip opening,
And each electrical contact is electrically connected with metal material and one of pad respectively, the film simultaneously forms capacitance structure.
2. a kind of electronic apparatus for being configured with microphone array, process circuit is configured with the electronic apparatus, institute
State process circuit to be electrically connected with Touch Screen, loudspeaker, switch and microphone array, the feature of the electronic apparatus exists
Include in the microphone array：
Multiple microphone packaging schemes, each microphone packaging scheme include：
Carrier, there is the face of carrier first and carrier second face relative with the face of carrier first and have multiple by the carrier the
The through hole in the face of carrier second is simultaneously through to, there is metal column in each through hole, the face of carrier first has
Groove, the face of carrier first simultaneously have multiple carrier contacts, and the face of carrier second has multiple outer contacts, each carrier
Contact is all electrically connected with through one of metal column and one of them outer contact；
Carrier upper plate, there is the face of carrier upper plate first and carrier upper plate second face relative with the face of carrier upper plate first, institute
Stating carrier upper plate further there are multiple upper plates for being through to the face of carrier upper plate second by the face of carrier upper plate first to wear
Hole and the upper plate opening that the face of carrier upper plate second is through to by the face of carrier upper plate first, in the perforation of each upper plate all
With metal material, the face of carrier upper plate first and the face of carrier upper plate second have multiple upper plate contacts respectively, described
Each upper plate contact in the face of carrier upper plate first is respectively through on one of metal material and the face of carrier upper plate second
One of upper plate contact electric connection, the face of carrier upper plate second of the carrier upper plate is described with the carrier
The face of carrier first is relative, the upper plate contact in the face of carrier upper plate second described in each carrier upper plate respectively with the carrier wherein
One carrier contact is electrically connected with, and the upper plate opening connects with the groove；
Chip, there is chip first side and chip second face relative with the chip first side, the chip first side simultaneously to have
There are multiple pads, the chip first side of the chip is relative with the face of carrier upper plate first of the carrier upper plate, makes
Each pad be all electrically connected with one of upper plate contact in the face of carrier upper plate first of the carrier upper plate with
Stack architecture is formed, the subregion of the chip has the chip that the face of chip second is through to by the chip first side
Opening, and the chip opening is in the upper plate opening and the top of the groove；
Film, there are multiple electrical contacts, be configured at the chip first side of the chip and cover the chip opening,
And each electrical contact is electrically connected with metal material and one of pad respectively, the film simultaneously forms capacitance structure.
3. the electronic apparatus as described in any claim in claim 1 or 2, it is characterised in that on the chip
The chip opening is geometry.
4. the electronic apparatus as described in any claim in claim 1 or 2, it is characterised in that the carrier it is recessed
Groove bottom further has multiple projections.
5. the electronic apparatus as described in any claim in claim 1 or 2, it is characterised in that the institute of the carrier
At least one wall for stating groove is made up of two sides, and angle is formed between two side.
6. electronic apparatus as claimed in claim 5, it is characterised in that the angle is less than 180 °.
7. electronic apparatus as claimed in claim 1 or 2, it is characterised in that the electronic apparatus is intelligent hand
Machine.
8. electronic apparatus as claimed in claim 1 or 2, it is characterised in that the electronic apparatus calculates for flat board
Machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410201424.4A CN104080035B (en) | 2014-05-13 | 2014-05-13 | It is configured with the electronic apparatus of microphone or microphone array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410201424.4A CN104080035B (en) | 2014-05-13 | 2014-05-13 | It is configured with the electronic apparatus of microphone or microphone array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104080035A CN104080035A (en) | 2014-10-01 |
| CN104080035B true CN104080035B (en) | 2018-01-02 |
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ID=51601040
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410201424.4A Expired - Fee Related CN104080035B (en) | 2014-05-13 | 2014-05-13 | It is configured with the electronic apparatus of microphone or microphone array |
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| CN (1) | CN104080035B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110366085B (en) * | 2019-07-05 | 2021-03-12 | Oppo（重庆）智能科技有限公司 | Electronic device and electronic device control method |
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|---|---|---|---|---|
| CN1189078A (en) * | 1997-01-18 | 1998-07-29 | 潘步风 | Granite loudspeaker box |
| CN1387740A (en) * | 1999-09-06 | 2002-12-25 | 微电子有限公司 | Pressure transducer |
| CN201467440U (en) * | 2009-04-30 | 2010-05-12 | 比亚迪股份有限公司 | Encapsulating structure of MEMS microphone |
| CN101998213A (en) * | 2009-08-22 | 2011-03-30 | 比亚迪股份有限公司 | Packaging structure of MEMS (Micro Electro Mechanical Systems) microphone and wafer packaging method thereof |
| CN203225884U (en) * | 2013-02-05 | 2013-10-02 | 苏州百丰电子有限公司 | Ultra-thin MEMS microphone module device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101426164B (en) * | 2007-11-01 | 2012-10-03 | 财团法人工业技术研究院 | Electroacoustic sensing apparatus |
| US8781140B2 (en) * | 2011-04-15 | 2014-07-15 | Knowles Electronics, Llc | Compact, highly integrated microphone assembly |
| CN102932720B (en) * | 2012-11-06 | 2016-05-25 | 山东共达电声股份有限公司 | Mems microphone |
-
2014
- 2014-05-13 CN CN201410201424.4A patent/CN104080035B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1189078A (en) * | 1997-01-18 | 1998-07-29 | 潘步风 | Granite loudspeaker box |
| CN1387740A (en) * | 1999-09-06 | 2002-12-25 | 微电子有限公司 | Pressure transducer |
| CN1205841C (en) * | 1999-09-06 | 2005-06-08 | 声扬灵比股份有限公司 | Pressure transducer |
| CN201467440U (en) * | 2009-04-30 | 2010-05-12 | 比亚迪股份有限公司 | Encapsulating structure of MEMS microphone |
| CN101998213A (en) * | 2009-08-22 | 2011-03-30 | 比亚迪股份有限公司 | Packaging structure of MEMS (Micro Electro Mechanical Systems) microphone and wafer packaging method thereof |
| CN203225884U (en) * | 2013-02-05 | 2013-10-02 | 苏州百丰电子有限公司 | Ultra-thin MEMS microphone module device |
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| CN104080035A (en) | 2014-10-01 |
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