CN104103969B - 电连接器 - Google Patents

电连接器 Download PDF

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CN104103969B
CN104103969B CN201310111721.5A CN201310111721A CN104103969B CN 104103969 B CN104103969 B CN 104103969B CN 201310111721 A CN201310111721 A CN 201310111721A CN 104103969 B CN104103969 B CN 104103969B
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circuit board
electric connector
interior circuit
shielding
insulating carrier
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CN104103969A (zh
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宣万立
陈欢
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to US14/243,135 priority patent/US9136650B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6633—Structural association with built-in electrical component with built-in single component with inductive component, e.g. transformer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/717—Structural association with built-in electrical component with built-in light source
    • H01R13/7175—Light emitting diodes (LEDs)

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

一种电连接器，其包括至少两个对接端口、设有前述对接端口的绝缘本体、安装于绝缘本体内的端子模组及设于相邻对接端口间的屏蔽件，所述端子模组包括绝缘载体、安装于绝缘载体上表面的内电路板、若干与内电路板相连并延伸入对接端口的导电端子及若干将内电路板与外电路板相连的转接端子，所述屏蔽件向下延伸超出内电路板，所述绝缘载体设有缺口，屏蔽件与内电路板于缺口内焊锡连接，由于屏蔽件完整的隔离相邻两个端子模组，从而达到了完好的屏蔽两相邻端子模组之间的电磁干扰。

Description

电连接器
【技术领域】
本发明涉及一种电连接器，尤其涉及其屏蔽结构。
【背景技术】
与发明相关的现有技术，参阅公开号为US8007318的美国公开专利。该公开专利揭示了一种电连接器，其包括设有若干对接端口的屏蔽壳体、收容于屏蔽壳体内的绝缘本体、收容于绝缘本体内的内电路板、安装于内电路板上的若干元件模组及设于相邻元件模组之间的屏蔽片，所述屏蔽片设有安装脚，所述内电路板设有安装孔，所述安装脚穿过安装孔焊接固定，然而，这样的设计屏蔽片只把相邻的元件模组隔开了，而相邻元件模组所对应的内电路板并未被屏蔽片所隔开，因此屏蔽效果不好。
所以，有必要设计出一种新型的电连接器以解决上述技术问题。
【发明内容】
本发明所要解决的技术问题在于提供一种电连接器，该电连接器通过屏蔽片延伸至端子模组下底面，从而更好的屏蔽了相邻端子模组之间的电磁干扰。
为解决上述技术问题，本发明采用如下技术方案: 一种电连接器，其包括至少两个对接端口、设有前述对接端口的绝缘本体、安装于绝缘本体内的端子模组及设于相邻对接端口间的屏蔽件，所述端子模组包括绝缘载体、安装于绝缘载体上表面的内电路板、若干与内电路板相连并延伸入对接端口的导电端子及若干将内电路板与外电路板相连的转接端子，所述屏蔽件向下延伸超出内电路板，所述绝缘载体设有缺口，屏蔽件与内电路板于缺口内焊锡连接。
相较于现有技术，本发明电连接器的屏蔽件延伸至端子模组的下底面，将相邻端子模组的内电路板同样也屏蔽隔离开，从而更好的屏蔽了两相邻端子模组之间的电磁干扰。如下为本发明电连接器的进一步具体设计。
一种电连接器，其包括至少两个对接端口、设有前述对接端口的绝缘本体、安装于绝缘本体内的端子模组及设于相邻对接端口间的屏蔽件，所述端子模组包括绝缘载体、安装于绝缘载体上表面的内电路板、若干与内电路板相连并延伸入对接端口的导电端子及若干将内电路板与外电路板相连的转接端子，所述屏蔽件向下延伸超出内电路板，所述绝缘载体设有缺口，屏蔽件与内电路板于缺口内焊锡连接。
所述屏蔽件延伸到与绝缘载体下底面齐平，所述屏蔽件包括绝缘壳体及部分收容于绝缘壳体内的屏蔽片，所述屏蔽片包括第一侧面及与第一侧面相反的第二侧面，所述第一侧面通过焊锡与第一侧面相邻的内电路板相连，所述第二侧面通过焊锡与第二侧面相邻的内电路板相连。
所述端子模组还包括若干安装于内电路板上的磁性线圈，所述内电路板上设有若干与磁性线圈相连的导电区域及位于导电区域的后端设有并列的两排转接端子，所述转接端子自电路板延伸贯穿绝缘载体。
所述绝缘载体设有凹槽，所述转接端子自绝缘载体的底面向前弯折且收容于凹槽内，以便和外电路板的配合。
所述端子模组的内电路板与相邻端子模组的内电路板是分离的，所述屏蔽件从前至后隔离开两相邻内电路板。
所述屏蔽片设有延伸超出绝缘壳体的铆接片，所述电连接器还包括屏蔽外壳，所述屏蔽外壳设有若干铆接孔，所述铆接片穿过铆接孔与屏蔽外壳铆接。
所述屏蔽外壳设有焊接尾，所述焊接尾与电连接器两侧的内电路板相连。
所述电连接器还包括若干发光二极管，所述发光二极管包括发光部，所述发光部的外侧包设有不透光层，所述不透光层与发光部成型为一体。
所述发光二极管还包括导接脚，所述导接脚安装于端子模组的绝缘载体上。
所述绝缘本体的顶面设有若干开槽，所述屏蔽件收容于开槽内。
【附图说明】
图1所示是本发明电连接器组装在一起的立体图。
图2是图1所示电连接器另一角度的立体图。
图3是图1所示电连接器的爆炸图。
图4所示是本发明电连接器的屏蔽件的立体图。
图5所示是本发明屏蔽件隔离相邻端子模组的立体图。
图6所示是本发明屏蔽件与端子模组配合的立体图。
图7所示是本发明端子模组的爆炸图。
图8是图7所示端子模组另一角度的爆炸图。
【具体实施方式】
如图1所示，一种符合本发明的电连接器100，可以安装在外部电路板(未图示)上，其具有水平并列排布的四个对接端口10，每个对接端口10可供外部设备沿前后方向插入。
如图2至图3所示，电连接器100包括绝缘本体1、从后端装设于绝缘本体1的四个端子模组2及三个设于相邻端子模组之间的屏蔽件3、覆盖于绝缘本体1与端子模组2及中间屏蔽件3的屏蔽外壳4、以及由一发光二极管5和一导光管6组成的指示装置。所述发光二极管5包括发光部51，所述发光部51的外侧包设有不透光层52，所述不透光层52与发光部51成型为一体。所述端子模组2包括绝缘载体21、安装于绝缘载体21上表面的内电路板22、若干与内电路板22相连并延伸入对接端口10的导电端子23及若干将内电路板22与外电路板相连的转接端子24。所述发光二极管5还包括导接脚53，所述导接脚53安装于端子模组2的绝缘载体21上。所述屏蔽外壳4的两侧边上分别设有一焊接尾42，所述焊接尾42分别与其最近的内电路板22通过焊锡焊接。
绝缘本体1大致呈方形，其包括前壁11、底壁12、顶壁13及两侧壁14。对接端口15设置于绝缘本体1的前侧，并向前贯穿前壁11。绝缘本体1的后侧还设置有与对接端口10相贯通的安装端口，所述端子模组2从后向前安装至安装端口与对接端口10。绝缘本体1的顶壁13设有可供导光管6穿至前壁11的通槽131，以及供中间屏蔽件3插入安装的开槽132。相邻两对接端口15之间设有一上述开槽132及安装于开槽132内的中间屏蔽件3，用以屏蔽相邻两对接端口10之间的电磁干扰。
如图4至图5所示，所述屏蔽件3包括绝缘壳体30及部分收容于绝缘壳体30内的屏蔽片31，所述屏蔽片31与绝缘壳体30通过插入成型(insert molding)为一体。所述屏蔽件3向下延伸超出内电路板22与绝缘载体21的下底面齐平，所述绝缘载体21设有缺口210，所述屏蔽片31包括第一侧面311及与第一侧面311相反的第二侧面312，所述焊枪伸入缺口210将第一侧面311与第一侧面311相邻的内电路板22上的接地导电片223焊接导通，将第二侧面312与第二侧面312相邻的内电路板22上的接地导电片223焊接导通。所述端子模组2的内电路板21与相邻端子模组2的内电路板21是分离的，所述屏蔽件3从前至后隔离两相邻内电路板21。所述屏蔽片31设有向上和向后延伸超出绝缘壳体30的铆接片313，所述屏蔽外壳4设有若干铆接孔41，所述铆接片313穿过铆接孔41与屏蔽外壳4铆接。所述电连接器100还包括导电泡棉7，所述导电泡棉7具有弹性且导电性能好，导电泡棉7安装于屏蔽件3的前端，当屏蔽件3抵顶于屏蔽外壳4时，导电泡棉7被挤压，从而使屏蔽片31与屏蔽外壳4的接触更稳定。
如图6至图7所示，所述端子模组2还包括若干安装于内电路板22上的磁性线圈25，所述内电路板22的前端设有若干第一导电片221，后端设有若干第二导电片222，所述通过治具使磁性线圈25与第一导电片221和第二导电片222焊接相连。所述第一导电片221的前端安装有一排导电端子23，所述第二导电片222的后端设有并列的两排转接端子24，所述磁性线圈25与第一、第二导电片221、222是焊接连接的，因此磁性线圈25占据内电路板22的范围较大，导致两排转接端子24靠的比较近，为了使转接端子24与外电路板上相配合，本发明的转接端子25自内电路板22延伸贯穿绝缘载体21，并自绝缘载体21的下底面向前弯折，所述绝缘载体21的下底面设有两排凹槽211，所述转接端子24弯折后收容于凹槽211内，所述两排转接端子24弯折的长度不同，以配合外电路板上供两排转接端子24穿过的通孔间的距离。
相较于现有技术，本发明电连接器100的屏蔽件3延伸至端子模组2的下底面，将相邻端子模组2的内电路板22也隔离开，从而更好的屏蔽了两相邻端子模组2之间的电磁干扰。

Claims (10)

1.一种电连接器，其包括至少两个对接端口、设有前述对接端口的绝缘本体、安装于绝缘本体内的若干相邻且彼此分离的端子模组及设于相邻对接端口间的屏蔽件，所述每一端子模组包括绝缘载体、安装于绝缘载体上的内电路板、若干与内电路板相连并延伸入对接端口的导电端子及若干将内电路板与外电路板相连的转接端子，所述屏蔽件向下延伸超出内电路板，其特征在于：相邻端子模组的绝缘载体设有相互面对的缺口，所述内电路板在所述缺口内设有将所述屏蔽件的侧面与内电路板直接焊锡连接在一起的接地导电片。
2.如权利要求1所述的电连接器，其特征在于：所述屏蔽件延伸到与绝缘载体下底面齐平，所述屏蔽件包括绝缘壳体及部分收容于绝缘壳体内的屏蔽片，所述屏蔽片包括第一侧面及与第一侧面相反的第二侧面，所述第一侧面通过焊锡与第一侧面相邻的内电路板相连，所述第二侧面通过焊锡与第二侧面相邻的内电路板相连。
3.如权利要求1所述的电连接器，其特征在于：所述端子模组还包括若干安装于内电路板上的磁性线圈，所述内电路板上设有若干与磁性线圈相连的导电片及位于导电片的后端设有并列的两排转接端子，所述转接端子自电路板延伸贯穿绝缘载体。
4.如权利要求3所述的电连接器，其特征在于：所述绝缘载体设有凹槽，所述转接端子自绝缘载体的底面向前弯折且收容于凹槽内，以便和外电路板的配合。
5.如权利要求1所述的电连接器，其特征在于：所述屏蔽件从前至后完全隔离开两相邻的端子模组。
6.如权利要求2所述的电连接器，其特征在于：所述屏蔽片设有延伸超出绝缘壳体的铆接片，所述电连接器还包括屏蔽外壳，所述屏蔽外壳设有若干铆接孔，所述铆接片穿过铆接孔与屏蔽外壳铆接。
7.如权利要求6所述的电连接器，其特征在于：所述屏蔽外壳设有焊接尾，所述焊接尾与电连接器两侧的内电路板相连。
8.如权利要求1所述的电连接器，其特征在于：所述电连接器还包括若干发光二极管，所述发光二极管包括发光部，所述发光部的外侧包设有不透光层，所述不透光层与发光部成型为一体。
9.如权利要求8所述的电连接器，其特征在于：所述发光二极管还包括导接脚，所述导接脚安装于端子模组的绝缘载体上。
10.如权利要求1所述的电连接器，其特征在于：所述绝缘本体的顶面设有若干开槽，所述屏蔽件收容于开槽内。
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