CN104101456B - 压力传感器介质隔离封装结构 - Google Patents
压力传感器介质隔离封装结构 Download PDFInfo
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- CN104101456B CN104101456B CN201310123972.5A CN201310123972A CN104101456B CN 104101456 B CN104101456 B CN 104101456B CN 201310123972 A CN201310123972 A CN 201310123972A CN 104101456 B CN104101456 B CN 104101456B
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- 238000009413 insulation Methods 0.000 title claims abstract description 23
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- 239000012530 fluid Substances 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000017 hydrogel Substances 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
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- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 7
- 238000002955 isolation Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 230000006872 improvement Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- NIFIFKQPDTWWGU-UHFFFAOYSA-N pyrite Chemical compound [Fe+2].[S-][S-] NIFIFKQPDTWWGU-UHFFFAOYSA-N 0.000 description 1
- 229910052683 pyrite Inorganic materials 0.000 description 1
- 239000011028 pyrite Substances 0.000 description 1
Abstract
Description
Claims (8)
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CN201310123972.5A CN104101456B (zh) | 2013-04-11 | 2013-04-11 | 压力传感器介质隔离封装结构 |
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CN201310123972.5A CN104101456B (zh) | 2013-04-11 | 2013-04-11 | 压力传感器介质隔离封装结构 |
Publications (2)
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CN104101456A CN104101456A (zh) | 2014-10-15 |
CN104101456B true CN104101456B (zh) | 2016-07-13 |
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CN201310123972.5A Active CN104101456B (zh) | 2013-04-11 | 2013-04-11 | 压力传感器介质隔离封装结构 |
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Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104344923B (zh) * | 2014-11-05 | 2017-05-03 | 天水华天传感器有限公司 | 一种汽车压力传感器及其制作方法 |
US20170153144A1 (en) * | 2015-06-02 | 2017-06-01 | Dongguan Tranesen Optoelectronics Co., Ltd | Pyroelectric sensor |
CN105236343B (zh) * | 2015-09-07 | 2017-07-07 | 苏州敏芯微电子技术有限公司 | 介质隔离式压力传感器封装结构 |
CN107036740A (zh) * | 2017-04-14 | 2017-08-11 | 苏州敏芯微电子技术股份有限公司 | 一种微传感器封装结构及其制作工艺 |
DE102017126121A1 (de) * | 2017-11-08 | 2019-05-09 | Tdk Electronics Ag | Drucksensorsystem mit Schutz vor einfrierendem Medium |
CN108020356A (zh) * | 2017-11-27 | 2018-05-11 | 江西新力传感科技有限公司 | 一种mems压力传感器及其封装方法 |
CN109855789B (zh) * | 2019-01-10 | 2021-12-24 | 北京机械设备研究所 | 一种用于监测水下小型航行器表面压力的传感器 |
CN109946014A (zh) * | 2019-03-29 | 2019-06-28 | 江西新力传感科技有限公司 | 一种小型化数字压力传感器 |
CN110174210A (zh) * | 2019-07-04 | 2019-08-27 | 昆山灵科传感技术有限公司 | 压力传感器及其封装方法 |
CN111855076B (zh) * | 2020-07-24 | 2021-10-08 | 深圳信息职业技术学院 | 用于压力传感器芯片封装测试的封装机构及其封装方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000337983A (ja) * | 1999-05-25 | 2000-12-08 | Nippon Seiki Co Ltd | 圧力検出器及びその製造方法 |
JP2001083030A (ja) * | 1999-09-16 | 2001-03-30 | Tokin Corp | 静電容量型圧力センサ |
CN201340320Y (zh) * | 2008-11-07 | 2009-11-04 | 株洲南车时代电气股份有限公司 | 一种车用压力传感器 |
CN101852668B (zh) * | 2010-06-21 | 2012-01-04 | 东南大学 | 微机械气压传感器芯片的封装结构的制备方法 |
CN203191140U (zh) * | 2013-04-11 | 2013-09-11 | 苏州敏芯微电子技术有限公司 | 压力传感器介质隔离封装结构 |
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Address after: 99 building NW-09 No. 215006 in Jiangsu Province, Suzhou City Industrial Park Jinji Lake Avenue 102 Applicant after: MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) Co.,Ltd. Address before: Suzhou City, Jiangsu Province, Suzhou Industrial Park 215006 Xinghu Street No. 218 BioBAY A2 floor 213B room Applicant before: MEMSENSING MICROSYSTEMS TECHNOLOGY CO.,LTD. |
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GR01 | Patent grant | ||
IP01 | Partial invalidation of patent right | ||
IP01 | Partial invalidation of patent right |
Commission number: 4W109978 Conclusion of examination: On the basis of the amended claims 1-6 submitted by the patentee on February 28, 2020, the invention patent No. 201310123972.5 shall remain valid. Decision date of declaring invalidation: 20200717 Decision number of declaring invalidation: 45393 Denomination of invention: Dielectric isolation packaging structure of pressure sensor Granted publication date: 20160713 Patentee: MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) Co.,Ltd. |
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TR01 | Transfer of patent right | ||
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Effective date of registration: 20230104 Address after: 215300 Building M1A, Building No. 6, 88 Qianjin East Road, Kunshan Development Zone, Suzhou City, Jiangsu Province, 2nd Floor Patentee after: Kunshan Lingke Sensing Technology Co.,Ltd. Address before: Room 102, NW-09, No. 99, Jinjihu Avenue, Suzhou Industrial Park, Jiangsu Province, 215006 Patentee before: MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) Co.,Ltd. |