CN104096978B - Stainless steel chip laser cutting processing and film sticking apparatus - Google Patents
Stainless steel chip laser cutting processing and film sticking apparatus Download PDFInfo
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- CN104096978B CN104096978B CN201410300974.1A CN201410300974A CN104096978B CN 104096978 B CN104096978 B CN 104096978B CN 201410300974 A CN201410300974 A CN 201410300974A CN 104096978 B CN104096978 B CN 104096978B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
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- Optics & Photonics (AREA)
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- Laser Beam Processing (AREA)
Abstract
The present invention relates to a kind of stainless steel chip laser cutting processing and film sticking apparatus, the absorption platform of this device can make X to, Z-direction rectilinear motion and θ to rotary motion at platform base; Fine positioning camera and laser instrument diced system are positioned at the top of absorption platform; The film of putting of automatic coating and automatic film cutting machine structure is taken turns and barrier film winder is taken turns and is arranged on riser, both by link gear with put film and take turns and be connected, can rotate on riser; The pressing wheel of film pressing device can be taken turns on the glue-film stickup of the releasing workpiece on absorption platform by putting film by absorption platform rolls across; The cutting knife of film cutting apparatus can horizontally rotate on absorption platform; Point film bar of point film device can via the top of absorption platform side to the top of opposite side; Useless film winder wheel is arranged on riser, and its rotating shaft is connected with rotary drive mechanism.Laser cutting and film sticking apparatus integrate by the present invention, improve integrated level and the automaticity of equipment, substantially reduce product processing time, reduce production cost.
Description
Technical field
The present invention relates to a kind of stainless steel chip laser cutting processing and film sticking apparatus.
Background technology
Laser cutting is the new technology that a development is exceedingly fast, and has become development new industry, one of key technology of transformation traditional manufacture, is that laser applies the most rising field.The advantages such as laser cutting is wide with its cut coverage, cutting speed is high, joint-cutting is narrow, cut quality is good, heat affected area is little, processing flexibility is large, waited until in modern industry and applied very widely, laser cutting technique also becomes one of laser processing technology technology the most ripe.Along with the development of laser processing technology, Laser Processing is except except traditional industrial application, more and more be applied to more wide retrofit field, as military industry field, electronic product machining field, field of semiconductor processing etc., have higher requirement to laser cutting device in these fields.
Laser cutting technology is applied to electronic label technology field, and tool has an enormous advantage.Along with global economy technology and scientific and technical development, the manufacturing cost of each electronic product is more and more lower, and price becomes the key factor affecting electronic product extensive use.For electronic label technology, other recognition technology relatively, electronic tag tool has an enormous advantage, and has boundless application prospect, but the cost that the one of the main reasons affecting electronic tag use is label.As one of method reducing electronic tag cost, change traditional silicon into stainless steel chip, effectively can reduce the cost of manufacture of electronic tag, but for the cutting of stainless steel chip, very high requirement is proposed to cutting method and cutting technique.
Traditional silicon cutting, usually adopts cutting technique and the method for emery wheel scribing, for the cutting of stainless steel chip, the technique of emery wheel scribing cannot be adopted to carry out.Stainless steel chip requires to cut chip completely, and emery wheel scribing can not cut stainless steel chip, and after cutting, chip can fly, and does not meet the demands.There is the technology mode adopting the cutting of UV laser instrument in existing market, this mode needs first on stainless steel substrate, to paste a skim, then cuts, and pad pasting can be scattered after preventing chip cutting.This mode has a lot of shortcoming, and first, need a special-purpose plaster film device, first pad pasting carries out cutting work again; Secondly, because first pad pasting cuts again, after requiring cutting like this, residue is little, and the many meetings of residue cause severe contamination to chip, and affect chip and use, propose very high requirement to laser instrument like this, thus cause cost high, efficiency is low; In addition, this cutting mode cuts from chip back, and usual chip back does not have image recognition point, and this just needs first to do identification point mark at chip back in addition, then cuts, and lowers efficiency.
Summary of the invention
The technical problem to be solved in the present invention is to provide the stainless steel chip laser cutting processing and film sticking apparatus that a kind of cost of manufacture is low, efficiency is high.
In order to solve the problems of the technologies described above, stainless steel chip laser cutting processing of the present invention and film sticking apparatus comprise absorption platform, fine positioning camera, laser instrument diced system, automatic coating and automatic film cutting machine structure; Described absorption platform is arranged on platform base on to straight-line motion mechanism, Y-direction straight-line motion mechanism and θ to rotational motion mechanism by X, can make X to, Z-direction rectilinear motion and θ to rotary motion at platform base; Fine positioning camera is fixed on the top of absorption platform; Laser instrument diced system is fixed on platform base; Automatic coating and automatic film cutting machine structure comprise riser, and put film wheel, barrier film winder is taken turns, film pressing device, film cutting apparatus, point film device, useless film winder wheel; Riser is fixed on platform base; Putting film wheel is arranged on riser, can rotate on riser; Barrier film winder wheel is arranged on riser, can rotate on riser, and barrier film winder wheel by link gear with put film and take turns and be connected; Film pressing device is positioned at the top of X to motion path of absorption platform, and when absorption platform moves in X direction, the pressing wheel of film pressing device can be taken turns on the workpiece of glue-film stickup on absorption platform of releasing by putting film by absorption platform rolls across; Film cutting apparatus is positioned at the top of X to motion path of absorption platform, and after pad pasting completes, the cutting knife of film cutting apparatus can horizontally rotate on absorption platform; Point film device be positioned on platform base, point film bar wherein can along X to top to the top of opposite side of moving via absorption platform side; Useless film winder wheel is arranged on riser, and its rotating shaft is connected with rotary drive mechanism.
Described film pressing device comprises pressing wheel and press mold elevating mechanism, and pressing wheel is arranged on press mold elevating mechanism.When absorption platform moves to the below of film pressing device in X direction, pressing wheel moves down and is pressed on absorption platform under the drive of press mold elevating mechanism, along with the movement of absorption platform is taken turns putting film on the workpiece of glue-film stickup on absorption platform of releasing by absorption platform rolls across.
Described press mold elevating mechanism is press mold cylinder, and its cylinder body is fixed on riser by fixed cross beam, and piston fixes pressing wheel supporting seat; Pressing wheel is arranged on the below of pressing wheel supporting seat by flexible connection mechanism.
Described film cutting apparatus comprises cutting knife, cutting knife rotating beam, cutter vertical movement mechanism, and cutting knife horizontally rotates driving mechanism; Cutting knife is arranged on cutting knife rotating beam, and cutting knife rotating beam is arranged in cutter vertical movement mechanism, and by transmission mechanism with horizontally rotate driving mechanism and be connected.
Described cutter vertical movement mechanism comprises cuts film cylinder, cuts film crossbeam; The cylinder body cutting film cylinder is fixed on riser, cuts film crossbeam and is fixed on the piston of cutting film cylinder; Cutting knife horizontally rotates driving mechanism and comprises and cut film motor, cuts film motor fixing seat, cutting knife rotating shaft; Cut film motor to be fixed on to cut on film crossbeam by cutting film motor fixing seat, cutting knife rotating shaft is arranged on to be cut on film crossbeam, cuts film motor output shaft and is connected with cutting knife rotating shaft by transmission mechanism; One end of cutting knife rotating beam is fixedly connected with cutting knife rotating shaft, and cutting knife is arranged on the other end of cutting knife rotating beam.
Described film cutting apparatus also comprises cutting knife adjustment seat, cutting knife holder; Cutting knife adjustment seat is arranged on one end away from cutting knife rotating shaft of cutting knife rotating beam, can move on cutting knife rotating beam; Cutting knife holder is fixed in cutting knife adjustment seat; Cutting knife is arranged on cutting knife holder, can rotate on cutting knife holder.
Described point of film device comprises a point film bar, and point film X is to motion; Divide film bar place along Y-direction and be arranged on point film X on motion, can pass through by above absorption platform under point film X drives to motion.
Described point of film X comprises a point film motor, point film motor fixing seat, guide rail holder, line slideway to motion, point film bar holder; Film motor is divided to be arranged on riser by a point film motor fixing seat; Two line slideways are fixed on the both sides of riser respectively by guide rail holder; Two points of film bar fixed seatings are in riser both sides and be connected with two line slideways respectively by slide rail pair; Riser is processed with the elongate holes as point membrane rod slide; Divide film bar to pass by this elongate holes, its part being positioned at riser both sides is connected with two points of film bar holders respectively by bearing; Divide driving pulley fixing on the output shaft of film motor to be connected with the passive belt wheel be arranged on riser by cog belt, be fixedly connected with cog belt by screw with a point film bar holder for point film motor homonymy.
Described automatic coating and automatic film cutting machine structure also comprise two pad pasting support wheels, and two pad pasting support wheels are positioned at the left side of film pressing device one on the other and are fixed on riser.On the left of pressing wheel, absorption platform is come downwards to for enabling to put film wheel releasing glued membrane.
Described automatic coating and automatic film cutting machine structure also comprise oscillating rod device; Oscillating rod device comprises fork connecting rod, the spacing bent plate of fork, fork upper limit position sensor, fork lower limit position sensor, fork, reset tension spring, extension spring fixed leg; Fork connecting rod is connected with riser by pitman shaft, and one end of the spacing bent plate of fork and fork connecting rod is fixing assembles, and fork connecting rod can rotate around pitman shaft; The other end of fork and fork connecting rod is fixing to be assembled; Fork upper limit position sensor and fork lower limit position sensor are separately fixed at upper restraining position and the lower limit position of the spacing bent plate of riser upper pendulum bar; Extension spring fixed leg is fixedly connected with riser, and reset tension spring one end is connected with extension spring fixed leg, and the other end is connected with fork connecting rod.
Described absorption platform comprises: absorption platform transition connecting plate, sucker Connection Block, is positioned at the square Ring like suction disc cover plate of vacuum cup periphery, vacuum cup, sealing ring on sucker, sucker lower seal; Absorption platform transition connecting plate is fixedly connected with the movable member of rotational motion mechanism by absorption platform base; Absorption platform transition connecting plate is processed with screwed hole, and rotary pneumatic pipe joint is connected with this screwed hole; Sucker Connection Block is positioned on absorption platform transition connecting plate, and the end face of absorption platform transition connecting plate is with bulge loop, and this bulge loop embeds the sunk part bottom sucker Connection Block and forms cavity with the bottom surface of this sunk part; Sealed by sucker lower seal at composition surface, both peripheries place of cavity; The upper surface mid portion of described sucker Connection Block is processed with interlaced air flue, and periphery is plane; Vacuum cup is positioned on sucker Connection Block, and the reinforcement of its lower surface is supported in the upper surface of sucker Connection Block; The surrounding composition surface place of sucker Connection Block and vacuum cup is by sealing ring sealing on sucker; Sucker Connection Block is distributed with multiple by the vacuum hole of air flue and cavity connects; The upper surface of vacuum cup is processed with latticed groove, and by the square that the upper surface of whole vacuum cup is divided into ranks to arrange, each square place is processed with the absorption open-work of vertical direction; Sucker cover plate is connected with the periphery of sucker Connection Block, connects the upper surface of upper surface lower than vacuum cup of posterior sucker cover plate.
When needs vacuum, the gas of cavity between absorption platform transition connecting plate and sucker Connection Block, by tracheae and rotary pneumatic pipe joint, is first taken away by extraneous vacuum plant, makes this cavity form vacuum, and makes vacuum homogenizing; Simultaneously, by the vacuum hole on sucker Connection Block and air flue, the vacuum provided by vacuum hole is evenly distributed on the working face of whole vacuum cup bottom, equably vacuum power is acted in cut workpiece by the absorption open-work of vacuum cup again, realize the absorption before to cut workpiece cutting, the absorption of the absorption in cutting process and the rear product formed of cutting, can ensure the positional precision of cutting rear product.Upper surface due to vacuum cup is processed with latticed groove, as cutting and slagging channel, work piece cut can be become the product of different size specification.Because sucker Connection Block upper surface processes interlaced air flue, the reinforcement of vacuum cup lower surface is supported in the upper surface of sucker Connection Block, on the one hand can by the whole working face of vacuum homogenizing at vacuum cup, on the other hand, the effect of supporting vacuum cup can also be played, when avoiding work, due to the effect of vacuum adsorption force, vacuum cup is deformed.
The course of work of the present invention: faced up by stainless steel substrate and be placed on absorption platform, is adsorbed fixing by absorption platform.The identification point of fine positioning camera to stainless steel substrate is accurately located, by the deviation of computer calculate identification point and fine positioning image center, and its X is made all to be adjusted to accurate location to, Y-direction and θ to position according to X to deviation, Y-direction deviation and angular deviation adjustment absorption platform.Open Optical Maser System, by laser cutting head Emission Lasers, carry out the work of stainless steel chip cutting.Controlling absorption platform X moves with θ to rotation to, Y-direction, can realize stainless steel chip laterally, longitudinal cutting.After having cut, absorption platform moves to the below of pressing wheel, and pressing wheel moves downward and to be pressed by the glued membrane below it and to paste on absorption platform.Absorption platform along X to moving, drive glued membrane move thus drives put film take turns rotation put film, pressing wheel rolls across from absorption platform and will obtain after glue-film stickup to laser cutting and be still adsorbed on the stainless steel chip on absorption platform in the process.Barrier film winder wheel rotates and is packed up by barrier film under the drive of link gear simultaneously.After pad pasting completes, absorption platform X is to the below moving to cutting knife, and cutting knife rotating beam moves downward and cutting knife is contacted with glued membrane; Cutting knife rotating beam moves upward after driving cutting knife circumgyration to be cut by glued membrane, makes cutting knife leave film surface, and pressing wheel moves upward and leaves film surface simultaneously.Divide film bar to move to opposite side from side above absorption platform, the glued membrane do not cut off is separated from absorption platform surface.Fork has two positions, upper and the next, and time upper, the spacing bent plate of fork blocks fork upper limit position sensor; Time the next, the spacing bent plate of fork blocks fork lower limit position sensor.Oscillating rod device is equivalent to the signal transducer of useless film winder device, and before not having pad pasting, glued membrane tensioner makes fork be in upper restraining position, and useless film winder wheel does not work; In pad pasting process, constantly put film, glued membrane tension reduces, fork is under the effect of gravity and reset tension spring, lower position is automatically returned to from bit positions, the spacing bent plate of fork blocks fork lower limit position sensor, and useless film winder wheel work, packs up useless film, packing up in useless membrane process, fork moves from bottom to top offset, and when moving to upper completely, the spacing bent plate of fork blocks fork upper limit position sensor, useless film winder device quits work, glued membrane tensioner, circulates with this, realizes reliable pad pasting work.
Beneficial effect of the present invention:
1, by fine positioning camera, the stainless steel chip on absorption platform is identified, and the position of deviation adjusting absorption platform according to identification point and fine positioning image center, the X of stainless steel chip can be made all to be adjusted to accurate location to, Y-direction and θ to position, thus to ensure that the positional precision of laser cutting.
2, in positional dissection process, stainless steel chip back has vacuum hole to adsorb all the time, and the chip therefore after cutting can not be scattered.Meanwhile, during cutting, the Cutting Road internal cutting of laser on sucker, therefore after cutting, chip back does not have residue, and residue also can not pollute the front of chip;
3, rely on the X of absorption platform in pad pasting process, to drive glued membrane to move to motion, make to put film wheel and barrier film winder is taken turns passive rotation thus reaches the object of automatically putting film and automatically packing up barrier film, structure simplification, cost is low.
4, control fork by the lax of useless film and tensioning to rotate, connect two travel switches respectively at upper and lower two restraining position, thus control winder machine operation, the automatic packing up function of useless film can be realized.
5, Laser cutting and film sticking apparatus integrate, and improve the integrated level of equipment, improve the automaticity of equipment, substantially reduce product processing time, effectively reduce production cost.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Fig. 1 is stainless steel chip laser cutting processing of the present invention and film sticking apparatus stereogram.
Fig. 2 is film pressing device stereogram of the present invention.
Fig. 3 is automatic film cutting device stereogram of the present invention.
Fig. 4 is of the present invention point of film lever apparatus stereogram.
Fig. 5 is of the present invention point of film lever apparatus stereogram.
Fig. 6 is oscillating rod device stereogram of the present invention.
Fig. 7 is stainless steel substrate top view.The product obtained after 91. cuttings in figure, 92.X is to cutting tag line, and 93.Y is to cutting tag line, 94. identification points.
Fig. 8 is the stereogram of laser cutting absorption platform of the present invention.
Fig. 9 is the stereogram of absorption platform.
Figure 10 is the sectional view of absorption platform.
Figure 11 is the partial sectional view of absorption platform.
Figure 12 is sucker Connection Block top view.
Figure 13 is vacuum cup stereogram of the present invention.
Detailed description of the invention
As shown in Figure 1, stainless steel chip laser cutting processing of the present invention and film sticking apparatus comprise absorption platform 7, fine positioning camera 63, laser instrument diced system 8, automatic coating and automatic film cutting machine structure.
As depicted in figures 8-13, described absorption platform 7 comprises: absorption platform transition connecting plate 7-02, sucker Connection Block 7-03, is positioned at square Ring like suction disc cover plate 7-04, the vacuum cup 7-05 of vacuum cup periphery, sealing ring 7-07 on sucker, sucker lower seal 7-08.Absorption platform transition connecting plate 7-02 is processed with screwed hole, and rotary pneumatic pipe joint 7-06 is connected with this screwed hole; Design absorption platform transition connecting plate 7-02, effectively can prevent gas leakage, ensure the reliability of absorption.Sucker Connection Block 7-03 is positioned on absorption platform transition connecting plate 7-02, the end face of absorption platform transition connecting plate 7-02 is with bulge loop 7-022, and this bulge loop 7-022 embeds the sunk part bottom sucker Connection Block 7-03 and forms cavity 7-021 with the bottom surface of this sunk part; Sealed by sucker lower seal 7-08 at composition surface, both peripheries place of cavity 7-021, gas leakage can be prevented.Sucker Connection Block 7-03 upper surface is processed with interlaced air flue 7-032; Vacuum cup 7-05 is positioned on sucker Connection Block 7-03, the reinforcement 7-051 of its lower surface is supported in the upper surface of sucker Connection Block 7-03, on the one hand can by the whole working face of vacuum homogenizing at vacuum cup, on the other hand, the effect of supporting vacuum cup can also be played, when avoiding work, due to the effect of vacuum adsorption force, vacuum cup is deformed.The surrounding composition surface place of sucker Connection Block 7-03 and vacuum cup 7-05 is sealed by sealing ring 7-07 on sucker, can prevent gas leakage.Sucker Connection Block 7-03 is distributed with multiple vacuum hole 7-031 be communicated with cavity 7-021 by air flue 7-032.The upper surface of vacuum cup 7-05 is processed with latticed groove 7-053, and by the square 7-052 that the upper surface of whole vacuum cup 7-05 is divided into ranks to arrange, each square 7-052 place is processed with the absorption open-work 7-054 of vertical direction.The upper surface mid portion of described sucker Connection Block 7-03 is processed with interlaced air flue 7-032, and periphery is plane; Sucker cover plate 7-04 is connected with the periphery of sucker Connection Block 7-03, connects the upper surface of upper surface lower than vacuum cup 7-05 of posterior sucker cover plate 7-04, interferes to prevent cut workpiece 9 and sucker cover plate 7-04.Can equably vacuum power be acted in cut workpiece 9 by the absorption open-work 7-054 of vacuum cup, realize the absorption before cut workpiece 9 is cut, the absorption of the absorption in cutting process and the rear product formed of cutting, can ensure the positional precision of cutting rear product.
Described X is connected to the movable member 7-12 of straight-line motion mechanism and the fixed part 7-13 of Y-direction straight-line motion mechanism; θ is connected with the movable member 7-14 of Y-direction straight-line motion mechanism to the fixed part 7-16 of rotational motion mechanism by rotating mechanism connecting plate 7-15, θ is fixedly connected with absorption platform 7 to the movable member 7-17 of rotational motion mechanism by absorption platform base 7-01, realize X to the motion with Y-direction two vertical direction by X to straight-line motion mechanism and Y-direction straight-line motion mechanism, realize 360 degree of rotary motions by θ to rotational motion mechanism.X is connected to drag chain fixed head 7-21 and X to the fixed part 7-11 of straight-line motion mechanism to one end of drag chain 7-23 by an X, and the other end is connected to drag chain fixed head 7-22 and X to the movable member 7-12 of straight-line motion mechanism by the 2nd X; First Y-direction drag chain fixed head 7-24 and X connects to the movable member 7-12 of straight-line motion mechanism, second Y-direction drag chain fixed head 7-25 is connected with the movable member 7-14 of Y-direction straight-line motion mechanism, and the two ends of Y-direction drag chain 7-26 are connected with the first Y-direction drag chain fixed head 7-24 and the second Y-direction drag chain fixed head 7-25 respectively.
Described fine positioning camera 63 is fixed on platform base 1 by fine positioning camera Connection Block 61 and fine positioning camera contiguous block 62, and is positioned at the top of absorption platform 7.When absorption platform 7 moves to the below of fine positioning camera 63, the identification point of fine positioning camera to stainless steel substrate is accurately located, by the deviation of computer calculate identification point and fine positioning image center, and its X is made all to be adjusted to accurate location to, Y-direction and θ to position according to X to deviation, Y-direction deviation and angular deviation adjustment absorption platform.
Described laser instrument diced system 8 is fixed on platform base 1, and its laser cutting head is positioned at the top of absorption platform 7.Laser instrument diced system 8 can adopt laser instrument diced system of the prior art.
Described automatic coating and automatic film cutting machine structure comprise riser 9-1, put film wheel 9-2, barrier film winder wheel 9-3, two pad pasting support wheels 9-9,9-10, film pressing device 9-4, film cutting apparatus 9-5, point film device 9-6, useless film winder wheel 9-7, oscillating rod device 9-8.
Described riser 9-1 is fixed on platform base 1; Putting film wheel 9-2 is arranged on riser 9-1, when absorption platform 7 move drive the glued membrane on it to move time, put film wheel 9-2 and rotate thus realize putting film function; Barrier film winder wheel 9-3 is arranged on riser 9-1, and barrier film winder wheel 9-3 by link gear (as gear drive, chain drive, tape handler etc.) with put film and take turns 9-2 and be connected.When putting film wheel 9-2 rotation and putting film, barrier film winder wheel 9-3 rotates the winder function realizing barrier film 9-11 under link gear drives.Two pad pasting support wheels 9-9,9-10 are positioned at the left side of film pressing device 9-4 one on the other and are fixed on riser 9-1, come downwards to absorption platform 7 for enabling the glued membrane 9-12 putting the releasing of film wheel on the left of film pressing device 9-4.
As shown in Figure 2, described film pressing device 9-4 comprises pressing wheel 9-44 and press mold cylinder 9-42; The cylinder body of press mold cylinder 9-42 is fixed on riser 9-1 by fixed cross beam 9-41, and piston fixes pressing wheel supporting seat 9-43; Pressing wheel 9-44 is arranged on the below of pressing wheel supporting seat 9-43.Press mold cylinder 9-42 can also adopt linear electric motors, line motor isoline displacement drive mechanism substitutes.Pressing wheel 9-44 can be arranged on the below of pressing wheel supporting seat 9-43 to realize the Elastic Contact with absorption platform by flexible connection mechanism.When the right side edge of absorption platform 7 moves to below pressing wheel 9-44, press mold cylinder piston moves downwards through on the glued membrane 9-12 that fixed cross beam 9-41 drives pressing wheel 9-44 to move down to be pressed onto above workpiece, along with glued membrane is pasted onto on workpiece from right-to-left by the movement of absorption platform 7.
As shown in Figure 3, described film cutting apparatus 9-5 comprises cutting knife 9-59, cutting knife rotating beam 9-56, cutter vertical movement mechanism, and cutting knife horizontally rotates driving mechanism; The cylinder body cutting film cylinder 9-51 of described cutter vertical movement mechanism is fixed on riser 9-1, cuts film crossbeam 9-52 and is fixed on piston; The film motor 9-54 that cuts that cutting knife horizontally rotates driving mechanism is fixed on cuts on film crossbeam 9-52 by cutting film motor fixing seat 9-53, cutting knife rotating shaft 9-55 is arranged on and cuts on film crossbeam 9-52, cuts film motor 9-54 output shaft and is connected with cutting knife rotating shaft 9-55 by transmission mechanism (as tape handler); One end of cutting knife rotating beam 9-56 is fixedly connected with cutting knife rotating shaft 9-55, and the other end installs cutting knife adjustment seat 5-57, and cutting knife adjustment seat 5-57 can move on cutting knife rotating beam 9-56.Cutting knife holder 9-58 is fixed on cutting knife adjustment seat 5-57; Cutting knife 9-59 is by bearing and be arranged on cutting knife adjustment seat 5-57.By regulating the position of cutting knife adjustment seat 5-57, the radius that cutting knife rotates can be regulated, realizing the cutting of different large small workpiece glued membrane.Cutting knife 9-59 by bearing to be connected with cutting knife adjustment seat 5-57 can rotation to reduce cutting blade abrasion.When absorption platform moves to below cutting knife rotating beam, the piston cutting film cylinder 9-51 moves down, and cutting knife is contacted with the glued membrane on workpiece, and cutting knife rotates the cutting realizing glued membrane in the horizontal plane.
As shown in Figure 4,5, described point of film device 9-6 comprises a point film bar 9-66, and point film X is to motion; Film X is divided to comprise a point film motor 9-62, point film motor fixing seat 9-61, guide rail holder 9-63, line slideway 9-64 to motion, point film bar holder 9-65; Film motor 9-62 is divided to be arranged on riser 9-1 by a point film motor fixing seat 9-61; Two line slideway 9-64 are fixed on the both sides of riser 9-1 respectively by guide rail holder 9-63; Two points of film bar holder 9-65 are positioned at riser both sides and are connected with two line slideway 9-64 respectively by slide rail pair; Riser 9-1 is processed with the elongate holes 9-67 as point membrane rod slide; Divide film bar 9-66 to pass by this elongate holes 9-67, its part being positioned at riser 9-1 both sides is connected with two points of film bar holder 9-65 respectively by bearing; Divide driving pulley 9-68 fixing on the output shaft of film motor 9-62 to be connected with the passive belt wheel 9-69 be arranged on riser by cog belt 9-70, be fixedly connected with cog belt 9-70 by screw with a point film bar holder 9-65 for point film motor 9-62 homonymy.After pad pasting terminates, point film bar 9-66 moves to opposite side by the side of absorption platform under the drive of point film motor 9-62, is separated by useless film with the glued membrane posted.
As shown in Figure 6, described automatic coating and automatic film cutting machine structure also comprise oscillating rod device 9-8; Oscillating rod device 9-8 comprises fork connecting rod 9-82, the spacing bent plate 9-83 of fork, fork upper limit position sensor 9-85, fork lower limit position sensor 9-86, fork 9-84, reset tension spring 9-87, extension spring fixed leg 9-88; Fork connecting rod 9-82 is connected with riser 9-1 by pitman shaft 9-81, and one end of the spacing bent plate 9-83 of fork and fork connecting rod 9-82 is fixing assembles, and fork connecting rod 9-82 can rotate around pitman shaft 9-81; The other end of fork 9-84 and fork connecting rod 9-82 is fixing to be assembled; Fork upper limit position sensor 9-85 and fork lower limit position sensor 9-86 is separately fixed at upper restraining position and the lower limit position of riser 9-1 upper pendulum bar spacing bent plate 9-83; Extension spring fixed leg is fixedly connected with riser, and reset tension spring one end is connected with extension spring fixed leg, and the other end is connected with fork connecting rod.
Described absorption platform and automatic coating and automatic film cutting machine structure are not limited to above-mentioned embodiment, and absorption platform also can adopt the magnetic absorption platform of prior art or the vacuum absorbing platform of other versions to substitute.Film of putting in automatic coating and automatic film cutting machine structure takes turns 9-2, barrier film winder wheel 9-3, film pressing device 9-4, film cutting apparatus 9-5, point film device 9-6, and useless film winder wheel 9-7 also can be fixed on platform base 1 respectively by independent supporting seat.The position of these parts residing on riser is also not limited to mode as shown in Figure 1, film pressing device 9-4, film cutting apparatus 9-5, point film device 9-6, and useless film winder wheel 9-7 can also be arranged on the top of absorption platform on riser successively according to order from left to right.
Claims (10)
1. stainless steel chip laser cutting processing and a film sticking apparatus, is characterized in that comprising absorption platform (7), fine positioning camera (63), laser instrument diced system (8), automatic coating and automatic film cutting machine structure; Described absorption platform (7) is arranged on platform base (1) by X to straight-line motion mechanism, Y-direction straight-line motion mechanism and θ to rotational motion mechanism, can make X to, Z-direction rectilinear motion and θ to rotary motion in platform base (1); Fine positioning camera (63) is fixed on the top of absorption platform (7); Laser instrument diced system (8) is fixed on platform base (1); Automatic coating and automatic film cutting machine structure comprise riser (9-1), put film wheel (9-2), barrier film winder wheel (9-3), film pressing device (9-4), film cutting apparatus (9-5), divide film device (9-6), useless film winder wheel (9-7); Riser (9-1) is fixed on platform base (1); Putting film wheel (9-2) is arranged on riser (9-1), can in the upper rotation of riser (9-1); Barrier film winder wheel (9-3) is arranged on riser (9-1), can rotate riser (9-1) is upper, and barrier film winder wheel (9-3) by link gear with put film and take turns (9-2) and be connected; Film pressing device (9-4) is positioned at the top of X to motion path of absorption platform (7), and when absorption platform moves in X direction, the pressing wheel of film pressing device (9-4) can be taken turns on the workpiece of (9-2) glue-film stickup of releasing on absorption platform by putting film by absorption platform (7) rolls across; Film cutting apparatus (9-5) is positioned at the top of X to motion path of absorption platform (7), and after pad pasting completes, the cutting knife of film cutting apparatus (9-5) can horizontally rotate on absorption platform; Point film device (9-6) be positioned on platform base (1), point film bar (9-66) wherein can along X to top to the top of opposite side of moving via absorption platform (7) side; Useless film winder wheel (9-7) is arranged on riser (9-1), and its rotating shaft is connected with rotary drive mechanism.
2. stainless steel chip laser cutting processing according to claim 1 and film sticking apparatus, it is characterized in that described film pressing device (9-4) comprises pressing wheel (9-44) and press mold elevating mechanism, pressing wheel (9-44) is arranged on press mold elevating mechanism.
3. stainless steel chip laser cutting processing according to claim 2 and film sticking apparatus, it is characterized in that described press mold elevating mechanism is press mold cylinder (9-42), its cylinder body is fixed on riser (9-1) by fixed cross beam (9-41), and piston fixes pressing wheel supporting seat (9-43); Pressing wheel (9-44) is arranged on the below of pressing wheel supporting seat (9-43) by flexible connection mechanism.
4. stainless steel chip laser cutting processing according to claim 1 and film sticking apparatus, it is characterized in that described film cutting apparatus (9-5) comprises cutting knife (9-59), cutting knife rotating beam (9-56), cutter vertical movement mechanism, cutting knife horizontally rotates driving mechanism; Cutting knife (9-59) is arranged on cutting knife rotating beam (9-56), and cutting knife rotating beam (9-56) is arranged in cutter vertical movement mechanism, and by transmission mechanism with horizontally rotate driving mechanism and be connected.
5. stainless steel chip laser cutting processing according to claim 4 and film sticking apparatus, is characterized in that described cutter vertical movement mechanism comprises and cuts film cylinder (9-51), cut film crossbeam (9-52); The cylinder body cutting film cylinder (9-51) is fixed on riser (9-1), cuts film crossbeam (9-52) and is fixed on the piston of cutting film cylinder (9-51); Cutting knife horizontally rotates driving mechanism and comprises and cut film motor (9-54), cuts film motor fixing seat (9-53), cutting knife rotating shaft (9-55); Cut film motor (9-54) to be fixed on to cut on film crossbeam (9-52) by cutting film motor fixing seat (9-53), cutting knife rotating shaft (9-55) is arranged on to be cut on film crossbeam (9-52), cuts film motor (9-54) output shaft and is connected with cutting knife rotating shaft (9-55) by transmission mechanism; One end of cutting knife rotating beam (9-56) is fixedly connected with cutting knife rotating shaft (9-55), and cutting knife (9-59) is arranged on the other end of cutting knife rotating beam (9-56).
6. stainless steel chip laser cutting processing according to claim 5 and film sticking apparatus, is characterized in that described film cutting apparatus (9-5) also comprises cutting knife adjustment seat (5-57), cutting knife holder (9-58); Cutting knife adjustment seat (5-57) is arranged on one end away from cutting knife rotating shaft (9-55) of cutting knife rotating beam (9-56), can be upper mobile at cutting knife rotating beam (9-56); Cutting knife holder (9-58) is fixed in cutting knife adjustment seat (5-57); Cutting knife (9-59) is arranged on cutting knife holder (9-58), can in the upper rotation of cutting knife holder (9-58).
7. stainless steel chip laser cutting processing according to claim 1 and film sticking apparatus, it is characterized in that a described point film device (9-6) comprises a point film bar (9-66), point film X is to motion; Divide film bar (9-66) place along Y-direction and be arranged on point film X on motion, can be passed through by absorption platform (7) top under point film X drives to motion.
8. stainless steel chip laser cutting processing according to claim 7 and film sticking apparatus, it is characterized in that described point film X comprises a point film motor (9-62), point film motor fixing seat (9-61), guide rail holder (9-63), line slideway (9-64) to motion, point film bar holder (9-65); Film motor (9-62) is divided to be arranged on riser (9-1) by a point film motor fixing seat (9-61); Two line slideways (9-64) are fixed on the both sides of riser (9-1) respectively by guide rail holder (9-63); Two points of film bar holders (9-65) are positioned at riser both sides and are connected with two line slideways (9-64) respectively by slide rail pair; Riser (9-1) is processed with the elongate holes (9-67) as point membrane rod slide; Divide film bar (9-66) to pass by this elongate holes (9-67), its part being positioned at riser (9-1) both sides is connected with two points of film bar holders (9-65) respectively by bearing; Divide driving pulley (9-68) fixing on the output shaft of film motor (9-62) to be connected with the passive belt wheel (9-69) be arranged on riser by cog belt (9-70), be fixedly connected with cog belt (9-70) by screw with a point film bar holder (9-65) for point film motor (9-62) homonymy.
9. stainless steel chip laser cutting processing according to claim 1 and film sticking apparatus, is characterized in that described automatic coating and automatic film cutting machine structure also comprise oscillating rod device (9-8); Oscillating rod device (9-8) comprises fork connecting rod (9-82), the spacing bent plate of fork (9-83), fork upper limit position sensor (9-85), fork lower limit position sensor (9-86), fork (9-84), reset tension spring (9-87), extension spring fixed leg (9-88); Fork connecting rod (9-82) is connected with riser (9-1) by pitman shaft (9-81), the spacing bent plate of fork (9-83) assembles with one end of fork connecting rod (9-82) is fixing, and fork connecting rod (9-82) can rotate around pitman shaft (9-81); Fork (9-84) assembles with the other end of fork connecting rod (9-82) is fixing; Fork upper limit position sensor (9-85) and fork lower limit position sensor (9-86) are separately fixed at upper restraining position and the lower limit position of the spacing bent plate of riser (9-1) upper pendulum bar (9-83); Extension spring fixed leg (9-88) is fixedly connected with riser (9-1), and reset tension spring (9-87) one end is connected with extension spring fixed leg (9-88), and the other end is connected with fork connecting rod (9-82).
10. stainless steel chip laser cutting processing according to claim 1 and film sticking apparatus, it is characterized in that described absorption platform (7) comprising: absorption platform transition connecting plate (7-02), sucker Connection Block (7-03), be positioned at the square Ring like suction disc cover plate (7-04) of vacuum cup periphery, vacuum cup (7-05), sealing ring (7-07) on sucker, sucker lower seal (7-08); Absorption platform transition connecting plate (7-02) is fixedly connected with the movable member (7-17) of rotational motion mechanism by absorption platform base (7-01); Absorption platform transition connecting plate (7-02) is processed with screwed hole, and rotary pneumatic pipe joint (7-06) is connected with this screwed hole; Sucker Connection Block (7-03) is positioned on absorption platform transition connecting plate (7-02), the end face of absorption platform transition connecting plate (7-02) is with bulge loop (7-022), and this bulge loop (7-022) embeds the sunk part of sucker Connection Block (7-03) bottom and forms cavity (7-021) with the bottom surface of this sunk part; Sealed by sucker lower seal (7-08) at composition surface, both peripheries place of cavity (7-021); The upper surface mid portion of described sucker Connection Block (7-03) is processed with interlaced air flue (7-032), and periphery is plane; Vacuum cup (7-05) is positioned on sucker Connection Block (7-03), and the reinforcement (7-051) of its lower surface is supported in the upper surface of sucker Connection Block (7-03); The surrounding composition surface place of sucker Connection Block (7-03) and vacuum cup (7-05) is sealed by sealing ring on sucker (7-07); Sucker Connection Block (7-03) is distributed with multiple vacuum hole (7-031) be communicated with cavity (7-021) by air flue (7-032); The upper surface of vacuum cup (7-05) is processed with latticed groove (7-053), the square (7-052) being divided into ranks to arrange the upper surface of whole vacuum cup (7-05), each square (7-052) place is processed with the absorption open-work (7-054) of vertical direction; Sucker cover plate (7-04) is connected with the periphery of sucker Connection Block (7-03), connects the upper surface of upper surface lower than vacuum cup (7-05) of posterior sucker cover plate (7-04).
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| CN106563883B (en) * | 2016-10-11 | 2019-03-29 | 中国航空工业集团公司北京航空制造工程研究所 | It is cut by laser tooling, the detection method and detection system of patch type state |
| CN109300821B (en) * | 2018-11-08 | 2024-06-18 | 上海海展自动化设备有限公司 | Lead frame film sticking device and working process thereof |
| CN111975222B (en) * | 2020-08-24 | 2021-12-14 | 济南镭迈机械科技有限公司 | Laminating type high-efficiency laser cutting equipment and process |
| CN112277433B (en) * | 2020-11-12 | 2022-06-10 | 立讯智造(浙江)有限公司 | Automatic film tearing device and automatic film tearing method |
| CN118124143B (en) * | 2024-05-06 | 2024-07-12 | 卓越（苏州）自动化设备有限公司 | Film sticking machine and using method of master control device thereof |
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