CN104078400A - Bearing device and ion implantation device - Google Patents
Bearing device and ion implantation device Download PDFInfo
- Publication number
- CN104078400A CN104078400A CN201410293453.8A CN201410293453A CN104078400A CN 104078400 A CN104078400 A CN 104078400A CN 201410293453 A CN201410293453 A CN 201410293453A CN 104078400 A CN104078400 A CN 104078400A
- Authority
- CN
- China
- Prior art keywords
- supporting plate
- temperature sensor
- tubule
- bogey
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
- H01J37/32954—Electron temperature measurement
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a bearing device and an ion implantation device. The bearing device comprises a bearing plate and a temperature sensor, the bearing plate is used for supporting a glass substrate, and the temperature sensor is disposed on the bearing plate and used for measuring temperature of the glass substrate. The ion implantation device comprises the bearing device. According to the technical scheme, the technical problems that ions are high in concentration, temperature of a substrate where the ions are implanted continuously rises due to long-time implantation, and accordingly defects appear are solved. A concentration monitoring method for the ion implantation device is increased through the bearing device, and overall performance of the implantation device is improved.
Description
Technical field
The present invention relates to a kind of equipment, particularly a kind of bogey and ion implantation device of manufacturing or processing solid state device that is specifically designed to.
Background technology
Ion implantation technique is again a kind of material surface modifying technology of flourish and extensive use in the world over nearly 30 years.The basic principle of Implantation is: with the ion beam that energy is 100keV magnitude, incide in material and go, to there is series of physical and chemical interaction in the atom in ion beam and material or molecule, incident ion is off-energy gradually, finally rest in material, and cause that material surface composition, structure and performance change, thereby optimize material surface performance or obtain some new excellent properties.
Implantation has become the mainstream technology of doping in modem semi-conductor devices and low temperature polycrystalline silicon TFT making now.In work, find: under the bombardment of Ion source high energy particle, the photoresist of glass baseplate surface (PR) meeting intensification gradually, after certain hour, PR glue can directly split, this like-particles can be directly injected into the region that does not need injection, cause product to inject uneven, have a strong impact on properties of product.
Summary of the invention
The bogey and the ion implantation device that the object of the present invention is to provide a kind of photoresist of cover glass substrate surface because of intensification, not damage.
Bogey of the present invention, wherein, comprise for the supporting plate of support glass substrate and be arranged on described supporting plate for measuring the temperature sensor of described glass substrate temperature.
Bogey of the present invention, wherein, also comprise the controller that is connected with described temperature sensor and for the cooling system of cooling described glass substrate, described cooling system is connected with described controller, described controller is according to the work of cooling system described in the signal controlling of described temperature sensor.
Bogey of the present invention, wherein, described temperature sensor is a plurality of, a plurality of described temperature sensors are arranged at respectively in a plurality of supports region on described supporting plate correspondingly.
Bogey of the present invention, wherein, the distance between the adjacent described temperature sensor on described supporting plate equates.
Bogey of the present invention, wherein, described temperature sensor is positioned at the top of the support face of described supporting plate, described temperature sensor is connected on described supporting plate by spring, one end of described spring is connected on the support face of described supporting plate, the other end of described spring connects described temperature sensor, and described spring applies elastic force to described temperature sensor, so that described temperature sensor and described glass substrate fit tightly.
Bogey of the present invention, wherein, described cooling system comprises the cooling line on the support face that is arranged at described supporting plate, described cooling line is connected by connecting line with cooling source, on described connecting line, be provided with solenoid electric valve, described solenoid electric valve is connected with described controller, and described controller is controlled the work of described cooling system by described solenoid electric valve.
Bogey of the present invention, wherein, described cooling line comprises a plurality of transverse tubes that are arranged in parallel, described transverse tube is communicated with described connecting line respectively, described cooling line also comprises a plurality of longitudinal tubule (L tubule)s that are arranged in parallel, described longitudinal tubule (L tubule) is perpendicular to described transverse tube, and described longitudinal tubule (L tubule) is communicated with described connecting line respectively, in each the support region on described supporting plate, has at least a transverse tube or longitudinal tubule (L tubule) to pass.
Bogey of the present invention, wherein, distance between adjacent described transverse tube equates, and the distance between adjacent described longitudinal tubule (L tubule) equates, and the distance between adjacent described transverse tube equals the distance between adjacent described longitudinal tubule (L tubule).
Bogey of the present invention, wherein, the back side of supporting plate is provided with connecting rod, described connecting rod and cramp bar can be counterrotating hinged, described cramp bar is used for supporting described supporting plate, the hinged place of described connecting rod and described cramp bar is provided with for measuring the protractor of angle between described connecting rod and described cramp bar, on the support face of described supporting plate, is provided with for gripping the fixture of described glass substrate.
Ion implantation device of the present invention, comprises bogey of the present invention.
Technical scheme of the present invention can solve the higher and long injection of ion concentration and cause being injected into substrate temperature and continue to raise, and occurs thus defect and bad technical problem.Bogey of the present invention can also increase a kind of concentration measurement and control means of ion implantation device, promotes the overall performance of injection device.
Accompanying drawing explanation
Fig. 1 is the front view of structural representation of the supporting plate of ion implantation device of the present invention, shows structure and the position relationship of related components on supporting plate;
Fig. 2 is the temperature sensor of ion implantation device of the present invention and the scheme of installation between supporting plate;
Fig. 3 is the front view of the structural representation of ion implantation device of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described, can be implemented, but illustrated embodiment is not as a limitation of the invention so that those skilled in the art can better understand the present invention also.
As shown in Figure 1, bogey of the present invention, wherein, comprise for the supporting plate 1 of support glass substrate and be arranged on supporting plate 1 for measuring the temperature sensor 2 of glass substrate temperature.
Bogey of the present invention, wherein, also comprises the controller that is connected with temperature sensor 2 and for the cooling system of cooled glass substrate, cooling system is connected with controller, and controller is according to the work of the signal controlling cooling system of temperature sensor 2.
For monitoring more accurately the temperature of glass substrate, bogey of the present invention, wherein, temperature sensor 2 is a plurality of.On the support face 10 of supporting plate 1, divide and have a plurality of supports region 20.A plurality of temperature sensors 2 are arranged at respectively in a plurality of supports region 20 on supporting plate 1 correspondingly.
For further monitoring accurately the temperature of glass substrate, bogey of the present invention, wherein, the distance between the adjacent temperature sensor 2 on supporting plate 1 equates.
For making the further temperature of accurate monitoring glass substrate, must guarantee that temperature sensor and glass substrate fit tightly, shown in Fig. 2, bogey of the present invention, wherein, temperature sensor 2 is positioned at the top of the support face 10 of supporting plate 1, temperature sensor 2 is connected on supporting plate 1 by spring 3, one end of spring 3 is connected on the support face 10 of supporting plate 1, the other end of spring 3 connects temperature sensor 2,3 pairs of temperature sensors 2 of spring apply elastic force, so that temperature sensor 2 fits tightly with glass substrate.
Bogey of the present invention, wherein, cooling system comprises the cooling line on the support face 10 that is arranged at supporting plate 1, cooling line is connected by connecting line 50 with cooling source 40, on connecting line 50, be provided with solenoid electric valve 60, solenoid electric valve 60 is connected with controller, and controller is by the work of solenoid electric valve 60 Controlled cooling systems.
Bogey of the present invention, wherein, cooling line comprises a plurality of transverse tubes that are arranged in parallel 41, transverse tube 41 is communicated with connecting line 50 respectively, cooling line also comprises a plurality of longitudinal tubule (L tubule)s that are arranged in parallel 42, longitudinal tubule (L tubule) 42 is perpendicular to transverse tube 41, and longitudinal tubule (L tubule) 42 is communicated with connecting line 50 respectively, has at least a transverse tube 41 or a longitudinal tubule (L tubule) 42 to pass in each the support region 20 on supporting plate 1.
Bogey of the present invention, wherein, distance between adjacent transverse tube 41 equates, and the distance between adjacent longitudinal tubule (L tubule) 42 equates, and the distance between adjacent transverse tube 41 equals the distance between adjacent longitudinal tubule (L tubule) 42.
Bogey of the present invention, wherein, the back side of supporting plate 1 is provided with connecting rod 5, connecting rod 5 can be counterrotating hinged with cramp bar 6, cramp bar 6 is for supporting supporting plate 1, the hinged place of connecting rod 5 and cramp bar 6 is provided with for measuring the protractor 7 of angle between connecting rod and cramp bar, is provided with for gripping the fixture 90 of glass substrate on the support face 10 of supporting plate 1.
Bogey of the present invention, wherein, controller can be programmable logic controller (PLC) (Programmable Logic Controller, PLC) or microcomputer.
Ion implantation device of the present invention, comprises bogey of the present invention.
The technical scheme of bogey of the present invention is the technological improvement that the upset bogey for Implant (Implantation) equipment in LTPS (polysilicon) industry carries out.Bogey of the present invention can solve the higher and long injection of ion concentration and cause being injected into substrate temperature and continue to raise, and occurs thus defect and bad technical problem.
Bogey of the present invention can also increase a kind of concentration measurement and control means of ion implantation device, promotes the overall performance of injection device.
When bogey of the present invention carries out work, support face 10 tops of the supporting plate 1 being placed to when glass substrate, the temperature sensor 2 ejecting touches the back side of glass substrate, when carrying out, ion implantation technology continues to monitor the temperature of glass substrate, when exceeding design temperature, controller Controlled cooling system is started working, be that coolant flows into cooling line by connecting line 50, coolant circulates in cooling line, glass substrate to its top is cooling, until glass substrate temperature is reduced to below design temperature, controller Controlled cooling system quits work, prevent thus PR cracking on glass substrate,
Temperature sensor and cooling system collaborative work in bogey of the present invention, can not only regulate the temperature of glass substrate, reduces other baneful influences that PR cracking and glass substrate temperature raise to its characteristic; Can also pass through the analysis to temperature curve, the ion concentration of monitoring ion implantation device changes, and the variation by perception ion concentration can be carried out perception or anticipation to ion concentration abnormal, promotes thus the injection efficiency of ion implantation device.
By the ion concentration change curve of ion implantation device and the analogue data graph of a relation of variations in temperature, can learn: along with the variation of the ion concentration of ion implantation device, the temperature simulating also can present a linear change, by to the accumulation of data and analysis, from the fluctuation of temperature curve, just can continue the situation of change of monitoring ion concentration, so more be conducive to the data perception to the amount of the ion of the actual arrival of ion implantation device glass baseplate surface, thereby can judge according to the temperature data of collecting the quality condition of Implantation.
Bogey of the present invention, wherein, the hinged place of connecting rod 5 and cramp bar 6 is provided with for measuring the protractor 7 of angle between connecting rod 5 and cramp bar 6, the angle of inclination of perception supporting plate so very clearly, also can regulate accurately the angle of inclination of supporting plate, thus the width of Implantation be adjusted.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (10)
1. a bogey, is characterized in that, comprise for the supporting plate of support glass substrate and be arranged on described supporting plate for measuring the temperature sensor of described glass substrate temperature.
2. bogey according to claim 1, it is characterized in that, also comprise the controller that is connected with described temperature sensor and for the cooling system of cooling described glass substrate, described cooling system is connected with described controller, and described controller is according to the work of cooling system described in the signal controlling of described temperature sensor.
3. bogey according to claim 2, is characterized in that, described temperature sensor is a plurality of, and a plurality of described temperature sensors are arranged at respectively in a plurality of supports region on described supporting plate correspondingly.
4. bogey according to claim 3, is characterized in that, the distance between the adjacent described temperature sensor on described supporting plate equates.
5. bogey according to claim 4, it is characterized in that, described temperature sensor is positioned at the top of the support face of described supporting plate, described temperature sensor is connected on described supporting plate by spring, one end of described spring is connected on the support face of described supporting plate, the other end of described spring connects described temperature sensor, and described spring applies elastic force to described temperature sensor, so that described temperature sensor and described glass substrate fit tightly.
6. bogey according to claim 5, it is characterized in that, described cooling system comprises the cooling line on the support face that is arranged at described supporting plate, described cooling line is connected by connecting line with cooling source, on described connecting line, be provided with solenoid electric valve, described solenoid electric valve is connected with described controller, and described controller is controlled the work of described cooling system by described solenoid electric valve.
7. bogey according to claim 6, it is characterized in that, described cooling line comprises a plurality of transverse tubes that are arranged in parallel, described transverse tube is communicated with described connecting line respectively, described cooling line also comprises a plurality of longitudinal tubule (L tubule)s that are arranged in parallel, described longitudinal tubule (L tubule) is perpendicular to described transverse tube, and described longitudinal tubule (L tubule) is communicated with described connecting line respectively, in each the support region on described supporting plate, has at least a transverse tube or longitudinal tubule (L tubule) to pass.
8. bogey according to claim 7, is characterized in that, distance between adjacent described transverse tube equates, the distance between adjacent described longitudinal tubule (L tubule) equates, the distance between adjacent described transverse tube equals the distance between adjacent described longitudinal tubule (L tubule).
9. bogey according to claim 8, it is characterized in that, the back side of supporting plate is provided with connecting rod, described connecting rod and cramp bar can be counterrotating hinged, described cramp bar is used for supporting described supporting plate, the hinged place of described connecting rod and described cramp bar is provided with for measuring the protractor of angle between described connecting rod and described cramp bar, on the support face of described supporting plate, is provided with for gripping the fixture of described glass substrate.
10. an ion implantation device, is characterized in that, comprises the bogey as described in claim 1-9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410293453.8A CN104078400B (en) | 2014-06-25 | 2014-06-25 | Bogey and ion implantation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410293453.8A CN104078400B (en) | 2014-06-25 | 2014-06-25 | Bogey and ion implantation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104078400A true CN104078400A (en) | 2014-10-01 |
| CN104078400B CN104078400B (en) | 2017-07-04 |
Family
ID=51599585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410293453.8A Active CN104078400B (en) | 2014-06-25 | 2014-06-25 | Bogey and ion implantation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104078400B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110060913A (en) * | 2019-04-22 | 2019-07-26 | 德淮半导体有限公司 | Ion Implantation Equipment and the method for monitoring Ion Implantation Equipment intermediate ion beam |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0982267A (en) * | 1995-09-08 | 1997-03-28 | Advanced Display:Kk | Ion implanting device |
| US6084240A (en) * | 1998-06-20 | 2000-07-04 | United Integrated Circuits Corp. | Ion implanter |
| CN1488165A (en) * | 2001-01-25 | 2004-04-07 | ���������ƴ���ʽ���� | Method and device for heat treatment |
| CN1822321A (en) * | 2005-02-18 | 2006-08-23 | 松下电器产业株式会社 | Apparatus and method for thermal processing |
| TW200834752A (en) * | 2006-09-23 | 2008-08-16 | Varian Semiconductor Equipment | Techniques for temperature-controlled ion implantation |
| CN101853774A (en) * | 2009-03-31 | 2010-10-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Heating cavity and semiconductor processing device |
-
2014
- 2014-06-25 CN CN201410293453.8A patent/CN104078400B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0982267A (en) * | 1995-09-08 | 1997-03-28 | Advanced Display:Kk | Ion implanting device |
| US6084240A (en) * | 1998-06-20 | 2000-07-04 | United Integrated Circuits Corp. | Ion implanter |
| CN1488165A (en) * | 2001-01-25 | 2004-04-07 | ���������ƴ���ʽ���� | Method and device for heat treatment |
| CN1822321A (en) * | 2005-02-18 | 2006-08-23 | 松下电器产业株式会社 | Apparatus and method for thermal processing |
| TW200834752A (en) * | 2006-09-23 | 2008-08-16 | Varian Semiconductor Equipment | Techniques for temperature-controlled ion implantation |
| CN101853774A (en) * | 2009-03-31 | 2010-10-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Heating cavity and semiconductor processing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110060913A (en) * | 2019-04-22 | 2019-07-26 | 德淮半导体有限公司 | Ion Implantation Equipment and the method for monitoring Ion Implantation Equipment intermediate ion beam |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104078400B (en) | 2017-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1844342B1 (en) | Method and device for testing semiconductor wafers using a chuck device whose temperature can be regulated | |
| CN103962418A (en) | Shaping device | |
| DE102004057215A1 (en) | Method and apparatus for testing semiconductor wafers using a probe card | |
| CN106271316A (en) | Quartz boat automatic sheet-feeding welding fixture | |
| CN104385279B (en) | A kind of manipulator teaching method and system | |
| CN102538676A (en) | Fastening device for casing of linear encoder | |
| CN203888408U (en) | Multi-position-adjusting marking machine | |
| CN103668420A (en) | Automatic resistance adjusting device for resistance strain gauge and resistance adjusting method | |
| CN104078400A (en) | Bearing device and ion implantation device | |
| CN208898098U (en) | Glass substrate takes piece mechanical arm, Qu Pian robot and glass substrate sheet-fetching system | |
| CN203069874U (en) | Microscope stage | |
| CN203683714U (en) | Automated resistance regulating device of resistance strain gauge | |
| CN102290362A (en) | Method for correcting positioning error of wafer during laser processing | |
| CN105138049A (en) | Constant temperature and humidity control method and apparatus in numerical control machine tool | |
| CN204020267U (en) | A kind of encoder basement governor motion of smart card stamp equipment | |
| CN204150653U (en) | A kind of automatic distributing material mechanism | |
| CN203631544U (en) | Static removing apparatus | |
| CN204718927U (en) | A kind of Full-automatic tension tester | |
| CN204965229U (en) | Wet controlling means of constant temperature in digit control machine tool | |
| CN203407068U (en) | Printed circuit board used for rapidly and effectively judging solder resistant film contraposition effect | |
| CN106128984A (en) | Tilting quartz boat carrier | |
| CN106052518A (en) | Quartz boat testing tool | |
| CN104091768B (en) | A kind of monitoring and the method for regulation etching groove level stability | |
| CN205070943U (en) | Solar cell panel's voltage detecting head | |
| CN103715048A (en) | Ion implantation machine vertical direction ion beam angle measurement and control system and measurement method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |