CN104078400B - Bogey and ion implantation device - Google Patents
Bogey and ion implantation device Download PDFInfo
- Publication number
- CN104078400B CN104078400B CN201410293453.8A CN201410293453A CN104078400B CN 104078400 B CN104078400 B CN 104078400B CN 201410293453 A CN201410293453 A CN 201410293453A CN 104078400 B CN104078400 B CN 104078400B
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- CN
- China
- Prior art keywords
- supporting plate
- bogey
- temperature sensor
- tubule
- glass substrate
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
- H01J37/32954—Electron temperature measurement
Abstract
The present invention provides a kind of bogey and ion implantation device, wherein, bogey of the invention includes the temperature sensor for measuring glass substrate temperature for being used for the supporting plate of support glass substrate and being arranged on supporting plate.Ion implantation device of the invention, including bogey of the invention.Technical scheme can solve that ion concentration is higher and prolonged injection causes to be injected into substrate temperature and persistently raises, and defect and bad technical problem thus occur.Bogey of the invention can also increase a kind of concentration measurement and control means of ion implantation device, lift the overall performance of injection device.
Description
Technical field
The present invention relates to a kind of equipment dedicated for manufacturing or processing solid state device, particularly a kind of bogey and
Ion implantation device.
Background technology
Ion implantation technique is again to be flourished in the world over nearly 30 years and a kind of wide variety of material surface modifying
Technology.The general principle of ion implanting is：With in the ion beam incidence that energy is 100keV magnitudes to material, ion beam and material
Atom or molecule in material will occur a series of physical and chemistry interaction, incident ion gradually off-energy, finally
Stop in the material, and cause material surface composition, structure and performance to change, so as to optimize material surface performance or acquisition
Some new excellent properties.
Present ion implanting has become the main flow skill adulterated during modem semi-conductor devices make with low temperature polycrystalline silicon TFT
Art.Found in work：Under the bombardment of Ion source high energy particles, the photoresist (PR) of glass baseplate surface can gradually rise
Temperature, PR glue can directly split after certain hour, and this like-particles can be directly injected into the region that need not be injected, and cause product to inject
Inequality, has a strong impact on properties of product.
The content of the invention
It is an object of the invention to provide the carrying that a kind of photoresist of protective glass substrate surface is not damaged by intensification
Device and ion implantation device.
Bogey of the invention, wherein, including supporting plate for support glass substrate and it is arranged at the support
The temperature sensor for measuring the glass substrate temperature on plate.
Bogey of the invention, wherein, also including the controller that is connected with the temperature sensor and for cooling down
The cooling system of the glass substrate, the cooling system is connected with the controller, and the controller is passed according to the temperature
The signal of sensor controls the work of the cooling system.
Bogey of the invention, wherein, the temperature sensor is multiple, and multiple temperature sensors are corresponded
Be respectively arranged in the multiple seating regions on the supporting plate.
Bogey of the invention, wherein, the distance between adjacent described temperature sensor on the supporting plate is equal.
Bogey of the invention, wherein, the temperature sensor is located at the top in the support face of the supporting plate, described
Temperature sensor is connected on the supporting plate by spring, and one end of the spring is connected to the support face of the supporting plate
On, the other end of the spring connects the temperature sensor, and the spring applies elastic force to the temperature sensor, so that institute
Temperature sensor is stated to be brought into close contact with the glass substrate.
Bogey of the invention, wherein, the cooling system is cold on the support face of the supporting plate including being arranged at
But pipeline, the cooling line is connected with cooling source by connecting line, and solenoid electric valve, institute are provided with the connecting line
State solenoid electric valve to be connected with the controller, the controller controls the work of the cooling system by the solenoid electric valve
Make.
Bogey of the invention, wherein, the cooling line includes multiple transverse tubes arranged in parallel, the transverse tube difference
Connected with the connecting line, the cooling line also includes multiple longitudinal tubule (L tubule)s arranged in parallel, and the longitudinal tubule (L tubule) is perpendicular to the horizontal stroke
Pipe, the longitudinal tubule (L tubule) connects with the connecting line respectively, in each seating region on the supporting plate an at least transverse tube or
Longitudinal tubule (L tubule) is passed through.
Bogey of the invention, wherein, the distance between adjacent described transverse tube is equal, between the adjacent longitudinal tubule (L tubule) away from
From equal, the distance between adjacent described transverse tube is equal to the distance between adjacent described longitudinal tubule (L tubule).
Bogey of the invention, wherein, the back side of supporting plate is provided with connecting rod, and the connecting rod can phase with support rod
To the hinged of rotation, the support rod is used to support the supporting plate, and the connecting rod is hinged with the support rod
Place is provided with the protractor for measuring angle between the connecting rod and the support rod, is set on the support face of the supporting plate
It is equipped with the clamping device for gripping the glass substrate.
Ion implantation device of the invention, including bogey of the invention.
Technical scheme can solve ion concentration it is higher and it is prolonged injection cause to be injected into substrate temperature
Degree is lasting to be raised, and defect and bad technical problem thus occurs.Bogey of the invention can also increase a kind of ion note
Enter the concentration measurement and control means of equipment, lift the overall performance of injection device.
Brief description of the drawings
Fig. 1 is the front view of the structural representation of the supporting plate of ion implantation device of the invention, is shown on supporting plate
The structure and position relationship of related components；
Fig. 2 is the scheme of installation between the temperature sensor and supporting plate of ion implantation device of the invention；
Fig. 3 is the front view of the structural representation of ion implantation device of the invention.
Specific embodiment
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings, so that those skilled in the art can be with
It is better understood from the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
As shown in figure 1, bogey of the invention, wherein, including the supporting plate 1 for support glass substrate and setting
In the temperature sensor 2 for measuring glass substrate temperature on supporting plate 1.
Bogey of the invention, wherein, also including the controller that is connected with temperature sensor 2 and for cooling down glass
The cooling system of substrate, cooling system is connected with controller, and controller controls cooling system according to the signal of temperature sensor 2
Work.
It is the temperature of more accurate monitoring glass substrate, bogey of the invention, wherein, temperature sensor 2 is multiple.
Being divided on the support face 10 of supporting plate 1 has multiple seating regions 20.Multiple temperature sensors 2 are respectively arranged at hold correspondingly
In multiple seating regions 20 on supporting plate 1.
It is the temperature of further accurate monitoring glass substrate, bogey of the invention, wherein, the phase on supporting plate 1
The distance between adjacent temperature sensor 2 is equal.
To make the temperature of further accurate monitoring glass substrate, must ensure that temperature sensor is closely pasted with glass substrate
Close, with reference to shown in Fig. 2, bogey of the invention, wherein, temperature sensor 2 is located at the top in the support face 10 of supporting plate 1,
Temperature sensor 2 is connected on supporting plate 1 by spring 3, and one end of spring 3 is connected on the support face 10 of supporting plate 1, spring
3 other end connection temperature sensor 2, spring 3 applies elastic force to temperature sensor 2, so that temperature sensor 2 and glass substrate
It is brought into close contact.
Bogey of the invention, wherein, cooling system includes the cooling tube being arranged on the support face 10 of supporting plate 1
Road, cooling line is connected with cooling source 40 by connecting line 50, and solenoid electric valve 60, electromagnetism control are provided with connecting line 50
Valve processed 60 is connected with controller, and controller controls the work of cooling system by solenoid electric valve 60.
Bogey of the invention, wherein, cooling line includes multiple transverse tubes 41 arranged in parallel, transverse tube 41 respectively with even
Adapter road 50 connects, and cooling line also includes multiple longitudinal tubule (L tubule)s 42 arranged in parallel, and longitudinal tubule (L tubule) 42 is distinguished perpendicular to transverse tube 41, longitudinal tubule (L tubule) 42
Connected with connecting line 50, an at least transverse tube 41 or a longitudinal tubule (L tubule) 42 are passed through in each seating region 20 on supporting plate 1.
Bogey of the invention, wherein, the distance between adjacent transverse tube 41 is equal, the distance between adjacent longitudinal tubule (L tubule) 42 phase
Deng the distance between adjacent transverse tube 41 is equal to the distance between adjacent longitudinal tubule (L tubule) 42.
Bogey of the invention, wherein, the back side of supporting plate 1 is provided with connecting rod 5, and connecting rod 5 can phase with support rod 6
To the hinged of rotation, support rod 6 is used to support supporting plate 1, connecting rod 5 and the hinged place of support rod 6 be provided with for
The protractor 7 of angle, is provided with for gripping glass on the support face 10 of supporting plate 1 between measurement connecting rod and support rod
The clamping device 90 of substrate.
Bogey of the invention, wherein, controller can be programmable logic controller (PLC) (Programmable Logic
Controller, PLC) or microcomputer.
Ion implantation device of the invention, including bogey of the invention.
The technical scheme of bogey of the invention is directed to Implant (ion implanting) in LTPS (polysilicon) industry and sets
The technological improvement that standby upset bogey is carried out.Bogey of the invention can solve ion concentration it is higher and for a long time
Injection cause to be injected into substrate temperature and persistently raise, thus there is defect and bad technical problem.
Bogey of the invention can also increase a kind of concentration measurement and control means of ion implantation device, lift injection device
Overall performance.
When bogey of the invention is operated, when the top of support face 10 of the supporting plate 1 that glass substrate is placed to,
The temperature sensor 2 of ejection touches the back side of glass substrate, and glass substrate is continued to monitor when ion implantation technology is carried out
Temperature, when beyond design temperature, controller control cooling system is started working, i.e., cooling medium is flowed into cold by connecting line 50
But pipeline, cooling medium in cooling line internal circulation flow, to the glass substrate cooling above it, until glass substrate temperature drop
Low then controller control cooling system is stopped to below design temperature, thus prevents PR on glass substrate from ftractureing,
Temperature sensor cooperates with cooling system in bogey of the invention, can not only adjust the temperature of glass substrate
Degree, reduces other baneful influences of PR crackings and glass substrate temperature rising to its characteristic；Can also be by temperature curve
Analysis, monitors the ion concentration change of ion implantation device, can be to the different of ion concentration by the change for perceiving ion concentration
Normal carrying out perceives or anticipation, thus lifts the injection efficiency of ion implantation device.
Can be learnt with the analogue data graph of a relation of temperature change by the ion concentration change curve of ion implantation device：
With the change of the ion concentration of ion implantation device, the temperature for simulating can also be presented a linear change, by data
Accumulation and analysis, can just continue the situation of change of monitoring ion concentration from the fluctuation of temperature curve, it is right to be so more beneficial for
Ion implantation device is actually reached the data perception of the amount of the ion of glass baseplate surface, such that it is able to according to the temperature being collected into
Data judge the quality condition of ion implanting.
Bogey of the invention, wherein, the hinged place of connecting rod 5 and support rod 6 be provided with for measure connecting rod 5 with
The protractor 7 of angle between support rod 6, the angle of inclination of the perception supporting plate that can so will be apparent that, it is also possible to accurate to adjust
The angle of inclination of supporting plate is saved, thus the width to ion implanting is adjusted.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (9)
1. a kind of bogey, it is characterised in that including the supporting plate for support glass substrate and be arranged at the support
The temperature sensor for measuring the glass substrate temperature on plate, the back side of supporting plate is provided with connecting rod, the connection
Bar is hinged with what support rod can be rotated against, and the support rod is used to support the supporting plate, the connecting rod and institute
The hinged place for stating support rod is provided with protractor for measuring angle between the connecting rod and the support rod；
Also include the controller being connected with the temperature sensor and the cooling system for cooling down the glass substrate, it is described
Cooling system is connected with the controller, and the controller controls the cooling system according to the signal of the temperature sensor
Work；
The cooling system includes the cooling line being arranged on the support face of the supporting plate.
2. bogey according to claim 1, it is characterised in that the temperature sensor is multiple, multiple temperature
Degree sensor is respectively arranged in the multiple seating regions on the supporting plate correspondingly.
3. bogey according to claim 2, it is characterised in that the adjacent described temperature sensor on the supporting plate
The distance between it is equal.
4. bogey according to claim 3, it is characterised in that the temperature sensor is located at holding for the supporting plate
The top of support, the temperature sensor is connected on the supporting plate by spring, and one end of the spring is connected to described
On the support face of supporting plate, the other end of the spring connects the temperature sensor, and the spring is to the temperature sensor
Apply elastic force, so that the temperature sensor is brought into close contact with the glass substrate.
5. bogey according to claim 1, it is characterised in that the cooling line passes through connecting line with cooling source
Connection, is provided with solenoid electric valve on the connecting line, the solenoid electric valve is connected with the controller, the controller
The work of the cooling system is controlled by the solenoid electric valve.
6. bogey according to claim 5, it is characterised in that the cooling line includes multiple horizontal strokes arranged in parallel
Pipe, the transverse tube is connected with the connecting line respectively, and the cooling line also includes multiple longitudinal tubule (L tubule)s arranged in parallel, described vertical
Perpendicular to the transverse tube, the longitudinal tubule (L tubule) is connected pipe with the connecting line respectively, in each seating region on the supporting plate
At least a transverse tube or longitudinal tubule (L tubule) are passed through.
7. bogey according to claim 6, it is characterised in that the distance between adjacent described transverse tube is equal, adjacent
The distance between the longitudinal tubule (L tubule) is equal, and the distance between adjacent described transverse tube is equal to the distance between adjacent described longitudinal tubule (L tubule).
8. bogey according to claim 7, it is characterised in that be provided with for pressing from both sides on the support face of the supporting plate
Hold the clamping device of the fixation glass substrate.
9. a kind of ion implantation device, it is characterised in that including the bogey as described in claim any one of 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410293453.8A CN104078400B (en) | 2014-06-25 | 2014-06-25 | Bogey and ion implantation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410293453.8A CN104078400B (en) | 2014-06-25 | 2014-06-25 | Bogey and ion implantation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104078400A CN104078400A (en) | 2014-10-01 |
| CN104078400B true CN104078400B (en) | 2017-07-04 |
Family
ID=51599585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410293453.8A Active CN104078400B (en) | 2014-06-25 | 2014-06-25 | Bogey and ion implantation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104078400B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110060913A (en) * | 2019-04-22 | 2019-07-26 | 德淮半导体有限公司 | Ion Implantation Equipment and the method for monitoring Ion Implantation Equipment intermediate ion beam |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0982267A (en) * | 1995-09-08 | 1997-03-28 | Advanced Display:Kk | Ion implanting device |
| US6084240A (en) * | 1998-06-20 | 2000-07-04 | United Integrated Circuits Corp. | Ion implanter |
| JP5034138B2 (en) * | 2001-01-25 | 2012-09-26 | 東京エレクトロン株式会社 | Heat treatment method and heat treatment apparatus |
| JP2006229040A (en) * | 2005-02-18 | 2006-08-31 | Matsushita Electric Ind Co Ltd | Method and apparatus for heat treatment |
| US7993698B2 (en) * | 2006-09-23 | 2011-08-09 | Varian Semiconductor Equipment Associates, Inc. | Techniques for temperature controlled ion implantation |
| CN101853774B (en) * | 2009-03-31 | 2012-06-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Heating cavity and semiconductor processing device |
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2014
- 2014-06-25 CN CN201410293453.8A patent/CN104078400B/en active Active
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| Publication number | Publication date |
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| CN104078400A (en) | 2014-10-01 |
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