CN104071573A - 基板移送装置 - Google Patents

基板移送装置 Download PDF

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CN104071573A
CN104071573A CN201310295798.2A CN201310295798A CN104071573A CN 104071573 A CN104071573 A CN 104071573A CN 201310295798 A CN201310295798 A CN 201310295798A CN 104071573 A CN104071573 A CN 104071573A
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郑赞洙
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CHANGSUNG CO LTD
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Abstract

本发明涉及半导体或FPD（Flat Panel Display）制造工程的生产设备将基板（PCB）从前工序搬运到后工序的基板移送装置相关技术，把持基板的夹具动作更加稳定，通过磁力吸住基板，防止机械摩擦磨损的同时也能防止产生的杂质引起基板损伤和污染，同时也能更加精简夹具结构的基板移送装置，本发明的实施例提供一种由呈上下直立形态，内侧留有基板容纳空间的架子和安装在所述架子空间的上下边缘位置，把持外部投放基板的数个夹具组成的一种基板移送装置，所述基板移动装置的夹具包括固定于所述架子端部的固定夹具和安装在架子上通过轴承Block进行转动的启动夹具、安装在一侧架子上的第一磁体、置于所述第一磁体对面，安装在启动夹具一侧的第二磁体。

Description

基板移送装置
技术领域
本发明涉及半导体或FPD（Flat Panel Display）制造工程的生产设备将基板（PCB）从前工序搬运到后工序的基板移送装置（Substratetransfer device）相关技术，进一步讲就是在把持基板的多个夹具（Clamp）上安装磁装置，用磁力把持住基板，同时将多个夹具形成一个组合，同时启动，从而令把持基板的夹具动作更加稳定，通过磁力吸住基板，在防止机械摩擦磨损的同时也能防止产生的杂质引起基板损伤和污染，同时也能更加精简夹具结构的基板移送装置。
背景技术
最近FPD（Flat Panel Display）作为改进显像管CRT（Cathod RayTube）多种缺陷的替代技术受到关注，这种FPD以其薄型化、大型化、轻量化及节电化等优势使用范围越来越广。
FPD制造工程包括基板制造工程、Cell制造工程、模块制造工程等，基板制造工程是在基板上形成Pattern的工程，以洗涤工序为开端，分别执行形成光致抗蚀剂、曝光、显像、蚀刻、清除光致抗蚀剂的Patterning工序后再完成检查工序。
在上述基板制造工程中将基板从前道工序搬运或移送到后道工序的过程是分阶段执行多个工序所必要的，这种过程由基板移送装置执行，所述基板移送装置大部分将基板固定到架子上，在这种状态下用数个搬运滚轮将架子移送到后道工序。
现有基板移送装置的先行技术已有在韩国注册的专利第10-1015937号，所述先行技术包括数个夹具构件和以支撑架及水平架搭载夹具构件的框架，所述夹具构件是由通过基准轴进行旋转，固定于架子上的启动夹子、置于所述启动夹子上端的支撑装置、给所述支撑装置施加压力以转动启动夹子的加压装置、一侧固定于所述架子的支撑Block上，另一侧固定于所述启动夹子上给启动夹子以弹力的弹性体、置于以所述基准轴为中心转动的启动夹子的旋转半径内，和启动夹子的端部相贴合的固定夹子组成。
所述先行技术通过作用于安装在架子和启动夹子之间的弹性体弹簧的弹力转动启动夹子，从而将基板夹到启动夹子和固定夹子之间，而启动夹子的夹住动作保持长时间时由于机械摩擦和磨损会造成基板的损伤及污染。
也就是说启动夹子保持长时间的夹住动作时，会因弹性体的变形和机械摩擦磨损发生杂质，从而造成基板损伤及污染，且启动夹子的夹住动作不够稳定，弹性体和启动夹子及架子之间的持续摩擦会造成异物的出现。
现有技术
专利文献
（专利文献1）韩国注册专利第10-1015937号。
（专利文献2）韩国公开专利第10-2011-0119957号。
发明内容
（一）要解决的技术问题
本发明以改进现有基板移送装置所存在的问题为出发点，提供一种把持基板的夹具的动作更加稳定，通过磁体的磁性把持基板，从而在防止机械摩擦磨损的同时防止异物所造成的基板损伤和污染，为了使夹具的结构更加简单，在把持基板的多数夹具上都安装了磁体，利用磁体的磁性来把持基板，同时多数夹具组成一个组合同时运行的基板移送装置。
（二）技术方案
为解决上述课题，提供一种由呈上下直立形态，内侧留有基板容纳空间的架子和安装在所述架子空间的上下边缘位置，把持外部投放的基板的数个夹具组成的一种基板移送装置。
所述基板移动装置的夹具包括固定于所述架子端部的固定夹具和安装在架子上通过轴承Block转动的启动夹具、安装在一侧架子上的第一磁体、置于所述第一磁体对面，安装在启动夹具一侧的第二磁体。
本发明实施例的特征在于，第一磁体安装在启动夹具的上端部所在的架子的一侧面，在启动夹具的上方安装第二磁体并和所述第一磁体形成相对面。
本发明的另一种特征在于，启动夹具以中孔为基准，下端置于架子的一侧面，对着固定夹具的把持部位，上端贯通架子上形成的长孔，位于对向面的上侧，启动夹具的下端形成圆锥形的施压口，上端部安装可转动加压轮。
（三）有益效果
根据本发明的实施例所提供的基板移动装置其把持基板的多数夹具都安装了磁体，利用磁体的磁性把持基板，同时多数夹具组成一个组合同时启动，从而令把持基板的夹具运作更加稳定。此外，因采用磁体的磁性把持基板，在防止机械摩擦磨损的同时也能防止异物引起的基板损伤和污染，夹具结构也变得更加简单。
附图说明
图1为本发明实施例的安装状态斜视图。
图2为本发明实施例的安装状态侧面图。
图3为本发明实施例的夹具分解斜视图。
图4为本发明实施例的夹具安装状态主截面图。
图5为本发明实施例的夹具动作状态的主截面图。
图6为本发明实施例的基板把持状态主截面图。
图7为本发明的另一种夹具安装状态的斜视图。
附图标记说明
10:架子        20:夹具
21：固定夹具    21a：支撑架
22：启动夹具    22a：中孔
22b：施压口     23：轴承Block
23a：轴承       23b：旋转轴
24：施压轮      25：第一磁体
26：第二磁体    30：启动装置
40：施压轮      41：轴杆
具体实施方式
本发明实施例的主要点是把持基板的夹具动作更加稳定，通过磁体的磁性把持基板，从而在防止机械摩擦磨损的同时防止异物造成的基板损伤和污染，把夹具的结构改进得更加精简。
下面结合附图具体说明本发明。本发明实施例提供一种呈上下直立形态，内侧留有基板P容纳空间的架子10和安装在所述架子10空间的上下边缘位置，把持基板P的数个夹具20组成的一种基板移送装置。
所述夹具20包括固定于所述架子10端部的固定夹具21和安装在架子10上通过轴承Block23转动的启动夹具22、安装在一侧架子10上的第一磁体25、置于所述第一磁体25对面，安装在启动夹具22一侧的第二磁体26。
所述实施例的主要构成中，架子10起到在夹具20把持基板10的状态下移送到后道工序的功能，如图1～图2所示，采用四角架形状呈上下直立状态，内侧留有容纳基板P的空间。
所述架子10内侧的空间要大于基板P的面积以用来容纳基板P，所述空间的上限边缘位置有多数长孔以用于安装夹具20，在架子10的下方安装移送板未图示，所述移送板置于滚轮输送带上移动到后道工序。
所述实施例的主要构件中，夹具20起到把持外部投放基板P的作用，如图1至图4所示，由固定夹具21、启动夹具22、轴承Block23、第一磁体25、第二磁体26组成。
所述固定夹具21用支架21a将下端的把持部位固定安装于空间部位的端部令其置于架子10的空间内，所述启动夹具22安装在架子10空间的边缘位置以便进行转动动作，架子10空间的边缘位置安装具有一定距离的轴承Block23，将旋转轴23b夹装在内置于轴承Block23上的轴承23a和启动夹具22所形成的中孔22a中以令启动夹具22进行转动动作。
所述启动夹具22以中孔22a为基准，下端部在架子10的一侧面，和固定家具21的把持部位相对，上端部贯穿架子10上形成的长孔，以对向面位于上方。
和所述固定夹具21的把持部位相对的启动夹具22的下端部形成圆锥形的施压口22b，在启动家具22的上端部安装可转动的施压轮24。
启动夹具22的上端部形成贯穿的通孔22c，将旋转轴24a夹装在施压轮24和通孔22c之间，以令安装在启动家具22上端部的施压轮24进行转动。
此外，所述第一磁体25和第二磁体26通过相互吸引的磁力起到转动启动夹具22的功能，在置于启动夹具22上端部的架子10的一侧面安装第一磁体25，在启动夹具22的上方安装第二磁体26并和所述第一磁体25相对。
所述第一磁体25和第二磁体26通过相互作用的磁性来吸引，如图4所示，在固定夹具21的把持部位靠近安装压缩状态的启动夹具22施压口22b，启动夹具22转动后施压口22b脱离固定夹具21的把持部位，第一磁体25和第二磁体26的距离拉远时，通过磁力拉近第二磁体26来转动启动夹具22令其回到原位。
此外，安装在架子10上方的夹具20以旋转轴23b为基准令重力重心施加在施压口22b侧，以利用第一磁体25和第二磁体26的磁力轻松转动启动夹具22，从而令施压口22b压缩到固定夹具21的把持部位。与之相反，安装在架子10下方的夹具20以旋转轴23b为基准要把重力重心施加在施压轮24一侧。
由上述结构组成的夹具20的动作过程如图5至图6所示，当位于架子10上方和下方的启动装置30下降或上升时，位于上端或下端的施压轮24被启动装置30以架子10的外侧方向转出去，启动夹具22以旋转轴22b为中心转动，施压口22b就会脱离固定夹具21的把持部位并展开。
此时，由加载装置将基板P以垂直状态投放到架子10的内部空间，同时启动装置30进行上升或下降动作，当所述启动装置脱离施压轮24时，通过第一磁体25和第二磁体26的磁力将启动夹具22转动到原位置，固定夹具21的把持部位咬住启动夹具22的施压口22b从而把持住基板P。
同上所述，在本发明的实施例中，夹具20通过磁体的磁力来转动启动夹具22，并以此来把持基板P，在防止机械摩擦磨损的同时也能防止异物所造成的基板的损伤和污染，夹具的把持动作也能更加稳定。
此外，在本发明的实施例中，数个夹具20形成一个组合同时进行动作，从而能够进行更加精准和稳定的把持动作。如图7所示，也可在启动夹具22的施压口22b所在位置的对向面端部安装轴杆41来连接数个启动夹具22，并在所述轴杆41上安装施压轮40。
所述施压轮40可在轴杆41上插入一对固定件42后在所述一对固定件42之间插入施压轮40来实施转动的动作，这种结构在启动装置30下降或上升时通过带动一个施压轮40来同时转动多数启动夹具22，从而执行更加精准和稳定的把持动作。
同上所述，本发明实施例供参考说明，且并不局限于上述实施例，在本发明所属的技术领域内，由具备相关知识的人在不超出本发明宗旨的范围内，可进行多种变更。

Claims (5)

1.一种基板移送装置，包括：内侧留有基板（P）容纳空间的架子（10）、安装于所述架子（10）空间的上下边缘位置以把持基板（P）的多数夹具（20），其特征在于，所述夹具（20）由安装在架子（10）端部的固定夹具（21）和通过轴承Block（23）进行转动的安装在架子（10）上的启动夹具（22）、安装在架子（10）一侧的第一磁体（25）、和所述第一磁体（25）相对；安装在启动夹具（22）一侧的第二次体（26）组成。
2.根据权利要求1所述的基板移送装置，其特征在于，第一磁体（25）安装在启动夹具（22）上端部所在的架子（10）的一侧，第二磁体（26）和所述第一磁体（25）相对，并安装于启动夹具（22）的上方。
3.根据权利要求2所述的基板移送装置，其特征在于，在启动夹具（22）的施压口（22b）压缩到固定夹具（21）把持部位的状态下，第一磁体（25）和第二磁体（26）靠近放置。
4.根据权利要求1所述的基板移送装置，其特征在于，启动夹具（22）以中孔（22）为基准，下端部在架子（10）的一侧面和固定夹具（21）的把持部位相对，上端部贯穿架子（10）上形成的长孔，以对向面置于上方位置，启动夹具（22）的下端位置形成圆锥形的施压口（22b），上端位置安装了可转动的施压轮（24）。
5.根据权利要求1所述的基板移送装置，其特征在于，在施压口（22b）所在的启动夹具（22）对向侧端部插上轴杆（41）来连接多数启动夹具（22），在所述轴杆（41）上安装施压轮（40）。
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