CN104064659A - LED packaging method - Google Patents
LED packaging method Download PDFInfo
- Publication number
- CN104064659A CN104064659A CN201410341622.0A CN201410341622A CN104064659A CN 104064659 A CN104064659 A CN 104064659A CN 201410341622 A CN201410341622 A CN 201410341622A CN 104064659 A CN104064659 A CN 104064659A
- Authority
- CN
- China
- Prior art keywords
- way mirror
- led
- substrate
- mirror glass
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000011521 glass Substances 0.000 claims abstract description 15
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000011261 inert gas Substances 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 238000004140 cleaning Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 238000012856 packing Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 6
- 229910052753 mercury Inorganic materials 0.000 claims description 5
- 230000010355 oscillation Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000843 powder Substances 0.000 abstract 2
- 238000003466 welding Methods 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 description 5
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 4
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003913 materials processing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910001923 silver oxide Inorganic materials 0.000 description 2
- 238000005987 sulfurization reaction Methods 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED packaging method. The LED packaging method comprises the following steps that mirror glass, an LED chip, fluorescent powder and a transparent close cover are prepared; the mirror glass is cut, cleaned and dried, and the mirror glass is coated with hydrargyrum under the sealing environment and then is coated with a protection layer to obtain a mirror glass substrate; the LED chip is installed on a circuit substrate through die bond and a welding wire; the surface of the LED chip is coated with the fluorescent powder; the transparent close cover is fixed to the position above the mirror glass substrate; air is pumped and the inert gases are injected. According to the LED packaging method, the mirror glass substrate is used for replacing an aluminum substrate, and the overall lighting effect and the luminance of an LED light source can be improved by 10%-20% after packaging.
Description
Technical field
The present invention relates to LED field, be specifically related to a kind of LED method for packing.
Background technology
It is all aluminium substrate that COB in the market encapsulates substrate used, the shortcoming of product is that light efficiency and brightness are inadequate, as promoted again light efficiency and brightness, can only be silver-plated on aluminium base, because silver plating process inevitably needs exposed in air, after the composition generation chemical reactions such as silver coating and airborne oxygen, sulphur, generate the materials such as silver oxide, sulfur dioxide, silver oxide, sulfur dioxide are a kind of materials of grey black, finally cause silver coating blackout phenomenon, the LED light source after encapsulation cannot arrive desirable effect by light efficiency and luminance raising.
Summary of the invention
For addressing the above problem, the invention provides a kind of LED method for packing, with the alternative aluminium substrate of two-way mirror substrate, after encapsulation, LED light source entirety light efficiency and brightness can promote 10%～20%.
For achieving the above object, the technical scheme that the present invention takes is:
A kind of LED method for packing, comprises the steps:
S1, preparation two-way mirror, LED chip, fluorescent material, transparent cover;
S2, two-way mirror cutting, cleaning, dry are smeared after mercury under the environment of sealing, and stopping off, obtains two-way mirror substrate;
S3, LED chip are arranged on circuit substrate by die bond, bonding wire;
S4, LED chip surface-coated fluorescent material;
S5, transparent cover are fixed on the top of two-way mirror substrate;
S6, extracting air are also filled inert gas.
As preferably, described two-way mirror is common two-way mirror.
As preferably, the concrete grammar cleaning in described step S2 is: the two-way mirror after cutting is put into pure water and soak, and use ultrasonic wave to carry out oscillation cleaning.
As preferably, in described step S2, air-dry mode is dried the glass substrate after cleaning.
The present invention has following beneficial effect:
(1) because two-way mirror has good reflective function; and the manufacturing process of two-way mirror substrate is at painting mercury on glass; and then stopping off; this process is carried out under sealed environment; can there is not the process of oxidation and sulfuration; the substrate becoming with this two-way mirror materials processing is packaged into LED light source and has the effect of obvious lifting light efficiency and brightness on this.
(2) with the LED light source of two-way mirror substrate package, because the material adopting is common two-way mirror, compare traditional aluminium substrate, there is feature with low cost;
(3) with the LED light source of two-way mirror substrate package, because substrate is glass material, glass itself just has good thermal diffusivity, so good with the LED light source heat radiation of two-way mirror substrate package.
Brief description of the drawings
Fig. 1 is the flow chart of the embodiment of the present invention.
embodiment
In order to make objects and advantages of the present invention clearer, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
A kind of LED method for packing, comprises the steps:
S1, preparation two-way mirror, LED chip, fluorescent material, transparent cover;
S2, two-way mirror cutting, cleaning, dry are smeared after mercury under the environment of sealing, and stopping off, obtains two-way mirror substrate;
S3, LED chip are arranged on circuit substrate by die bond, bonding wire;
S4, LED chip surface-coated fluorescent material;
S5, transparent cover are fixed on the top of two-way mirror substrate;
S6, extracting air are also filled inert gas.
As preferably, described two-way mirror is common two-way mirror.
As preferably, the concrete grammar cleaning in described step S2 is: the two-way mirror after cutting is put into pure water and soak, and use ultrasonic wave to carry out oscillation cleaning.
As preferably, in described step S2, air-dry mode is dried the glass substrate after cleaning.
This is specifically implemented because two-way mirror has good reflective function; and the manufacturing process of two-way mirror substrate is at painting mercury on glass; and then stopping off; this process is carried out under sealed environment; can there is not the process of oxidation and sulfuration; the substrate becoming with this two-way mirror materials processing is packaged into LED light source and has the effect of obvious lifting light efficiency and brightness on this.With the LED light source of two-way mirror substrate package, because the material adopting is common two-way mirror, compare traditional aluminium substrate, there is feature with low cost; With the LED light source of two-way mirror substrate package, because substrate is glass material, glass itself just has good thermal diffusivity, so good with the LED light source heat radiation of two-way mirror substrate package.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (4)
1. a LED method for packing, is characterized in that, comprises the steps: S1, prepares two-way mirror, LED chip, fluorescent material, transparent cover; S2, two-way mirror cutting, cleaning, dry are smeared after mercury under the environment of sealing, and stopping off, obtains two-way mirror substrate; S3, LED chip are arranged on circuit substrate by die bond, bonding wire; S4, LED chip surface-coated fluorescent material; S5, transparent cover are fixed on the top of two-way mirror substrate; S6, extracting air are also filled inert gas.
2. a kind of LED method for packing according to claim 1, is characterized in that, described two-way mirror is common two-way mirror.
3. a kind of LED method for packing according to claim 1, is characterized in that, the concrete grammar cleaning in described step S2 is: the two-way mirror after cutting is put into pure water and soak, and use ultrasonic wave to carry out oscillation cleaning.
4. a kind of LED method for packing according to claim 1, is characterized in that, in described step S2, air-dry mode is dried the glass substrate after cleaning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410341622.0A CN104064659A (en) | 2014-07-18 | 2014-07-18 | LED packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410341622.0A CN104064659A (en) | 2014-07-18 | 2014-07-18 | LED packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104064659A true CN104064659A (en) | 2014-09-24 |
Family
ID=51552283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410341622.0A Pending CN104064659A (en) | 2014-07-18 | 2014-07-18 | LED packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104064659A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163680A (en) * | 2010-02-19 | 2011-08-24 | 旭硝子株式会社 | Substrate for mounting light-emitting element and light-emitting device |
| CN103219448A (en) * | 2013-04-12 | 2013-07-24 | 杭州普朗克光电科技有限公司 | Method for welding light emitting diode (LED) on glass |
| CN103545424A (en) * | 2013-10-29 | 2014-01-29 | 路旺培 | LED encapsulation method |
| WO2014038506A1 (en) * | 2012-09-04 | 2014-03-13 | 株式会社ノリタケカンパニーリミテド | Led element mounting substrate, led light source and led display |
-
2014
- 2014-07-18 CN CN201410341622.0A patent/CN104064659A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163680A (en) * | 2010-02-19 | 2011-08-24 | 旭硝子株式会社 | Substrate for mounting light-emitting element and light-emitting device |
| WO2014038506A1 (en) * | 2012-09-04 | 2014-03-13 | 株式会社ノリタケカンパニーリミテド | Led element mounting substrate, led light source and led display |
| CN103219448A (en) * | 2013-04-12 | 2013-07-24 | 杭州普朗克光电科技有限公司 | Method for welding light emitting diode (LED) on glass |
| CN103545424A (en) * | 2013-10-29 | 2014-01-29 | 路旺培 | LED encapsulation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140924 |
|
| WD01 | Invention patent application deemed withdrawn after publication |